LSBI3333-H0 [LIGITEK]
ROUND TYPE LED LAMPS; ROUND型LED灯型号: | LSBI3333-H0 |
厂家: | LIGITEK ELECTRONICS CO., LTD. |
描述: | ROUND TYPE LED LAMPS |
文件: | 总6页 (文件大小:126K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
ROUND TYPE LED LAMPS
Pb
Lead-Free Parts
LSBI3333/H0
DATA SHEET
DOC. NO : QW0905-LSBI3333/H0A
REV
: A
DATE
: 27 - Jun. - 2006
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSBI3333/H0
Page 1/5
Package Dimensions
5.0
7.6
5.9
8.6
1.5MAX
□0.5
TYP
25.0MIN
1.0MIN
2.54TYP
+
-
Note : 1.All dimension are in millimeter tolerance is ±0.25mm unless otherwise noted.
2.Specifications are subject to change without notice.
Directivity Radiation
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSBI3333/H0
Page 2/5
Absolute Maximum Ratings at Ta=25 ℃
Ratings
SBI
Symbol
Parameter
UNIT
30
IF
IFP
Forward Current
mA
mA
Peak Forward Current
Duty 1/10@10KHz
70
mW
μA
120
Power Dissipation
PD
Ir
Reverse Current @5V
Electrostatic Discharge( * )
Operating Temperature
Storage Temperature
50
ESD
Topr
Tstg
500
V
-20 ~ +80
-30 ~ +100
℃
℃
Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic
glove is recommended when handing these LED. All devices, equipment and machinery must be properly
grounded.
*
Typical Electrical & Optical Characteristics (Ta=25 ℃)
Forward
voltage
@20mA(V)
Luminous
intensity
@20mA(mcd)
Spectral
halfwidth
△λnm
Viewing
angle
2θ 1/2
(deg)
Peak
wave
length
λPnm
Dominant
wave
length
COLOR
MATERIAL
InGaN/SiC
PART NO
λDnm
Typ.
3.8
Typ.
Min.
Max.
4.7
Lens
Emitted
Blue
65
LSBI3333/H0
Water Clear
65 120
30
465
430
Note : 1.The forward voltage data did not including ±0.1V testing tolerance.
2. The luminous intensity data did not including ±15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSBI3333/H0
Page 3/5
Typical Electro-Optical Characteristics Curve
SBI CHIP
Fig.2 Relative Intensity vs. Wavelength
Fig.1 Forward current vs. Forward Voltage
30
25
20
15
10
5
1.0
0.5
0
0
1
2
3
4
5
680
380 430 480 530 580 630
Wavelength (nm)
Forward Voltage(V)
Fig.3 Relative Intensity vs. Forward Current
125
Fig.4 Relative Intensity vs. Lead Temperature
10
100
75
50
25
0
1
0
25 30
45
15 20
35 40
0
10
5
0
25
50
75
100
Lead Temperature (℃)
Forward Current (mA DC)
Fig.5 Forward Current vs. Ambient Temperature
40
30
20
10
0
25
50
75
100
0
Ambient Temperature (℃)
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSBI3333/H0
Page 4/5
Soldering Condition(Pb-Free)
1.Iron:
Soldering Iron:30W Max
Temperature 350 °C Max
Soldering Time:3 Seconds Max(One Time)
Distance:2mm Min(From solder joint to body)
2.Wave Soldering Profile
Dip Soldering
Preheat: 120°C Max
Preheat time: 60seconds Max
Ramp-up
2°C/sec(max)
Ramp-Down:-5°C/sec(max)
Solder Bath:260°C Max
Dipping Time:3 seconds Max
Distance:2mm Min(From solder joint to body)
Temp(°C)
260°C3sec Max
260°
120°
5°/sec
max
2°/sec
25°
0°
max
0
50
150
Time(sec)
100
Preheat
60 Seconds Max
LIGITEK ELECTRONICS CO.,LTD.
Property of Ligitek Only
PART NO. LSBI3333/H0
5/5
Page
Reliability Test:
Reference
Description
Test Item
Test Condition
Standard
1.Under Room Temperature
2.If=20mA
3.t=1000 hrs (-24hrs, +72hrs)
This test is conducted for the purpose
of detemining the resistance of a part
in electrical and themal stressed.
MIL-STD-750: 1026
MIL-STD-883: 1005
JIS C 7021: B-1
Operating Life Test
The purpose of this is the resistance of
the device which is laid under condition
of high temperature for hours.
High Temperature
Storage Test
1.Ta=105℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
MIL-STD-883:1008
JIS C 7021: B-10
The purpose of this is the resistance
of the device which is laid under
condition of low temperature for hours.
Low Temperature
Storage Test
1.Ta=-40℃±5℃
2.t=1000 hrs (-24hrs, +72hrs)
JIS C 7021: B-12
1.Ta=65℃±5℃
2.RH=90%~95%
3.t=240hrs ±2hrs
High Temperature
High Humidity Test
The purpose of this test is the resistance
of the device under tropical for hours.
MIL-STD-202:103B
JIS C 7021: B-11
The purpose of this is the resistance of
the device to sudden extreme changes
in high and low temperature.
1.Ta=105℃±5℃&-40℃±5℃
(10min) (10min)
2.total 10 cycles
MIL-STD-202: 107D
MIL-STD-750: 1051
MIL-STD-883: 1011
Thermal Shock Test
This test intended to determine the
thermal characteristic resistance
of the device to sudden exposures
at extreme changes in temperature
when soldering the lead wire.
MIL-STD-202: 210A
MIL-STD-750: 2031
JIS C 7021: A-1
Solder Resistance
Test
1.T.Sol=260 ℃±5℃
2.Dwell time= 10 ±1sec.
MIL-STD-202: 208D
MIL-STD-750: 2026
MIL-STD-883: 2003
JIS C 7021: A-2
This test intended to see soldering well
performed or not.
1.T.Sol=230 ℃±5℃
2.Dwell time=5 ±1sec
Solderability Test
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