LTC3851AEUD-1#PBF [Linear]

LTC3851A-1 - Synchronous Step-Down Switching Regulator Controller; Package: QFN; Pins: 16; Temperature Range: -40°C to 85°C;
LTC3851AEUD-1#PBF
型号: LTC3851AEUD-1#PBF
厂家: Linear    Linear
描述:

LTC3851A-1 - Synchronous Step-Down Switching Regulator Controller; Package: QFN; Pins: 16; Temperature Range: -40°C to 85°C

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LTC3851A-1  
Synchronous  
Step-Down Switching  
Regulator Controller  
FeaTures  
DescripTion  
The LTC®3851A-1 is a high performance synchronous  
step-down switching regulator controller that drives  
an all N-channel synchronous power MOSFET stage. A  
constant frequency current mode architecture allows a  
n
Wide V Range: 4V to 38V Operation  
SENSE  
±±1 Output Voltage Accuracy  
Power Good Output Voltage Monitor  
IN  
n
R
or DCR Current Sensing  
n
n
n
n
n
n
n
n
n
n
Phase-Lockable Fixed Frequency: 250kHz to 750kHz phase-lockable frequency of up to 750kHz.  
Dual N-Channel MOSFET Synchronous Drive  
OPTI-LOOP compensation allows the transient response  
Very Low Dropout Operation: 99% Duty Cycle  
to be optimized over a wide range of output capacitance  
Adjustable Output Voltage Soft-Start or Tracking  
andESRvalues.TheLTC3851A-1featuresaprecision0.8V  
Output Current Foldback Limiting  
reference and a power good indicator. A wide 4V to 38V  
Output Overvoltage Protection  
(40Vabsolutemaximum)inputsupplyrangeencompasses  
OPTI-LOOP® Compensation Minimizes C  
OUT  
mostbatteryconfigurationsandintermediatebusvoltages.  
Selectable Continuous, Pulse-Skipping or  
Burst Mode® Operation at Light Loads  
TheTK/SSpinrampstheoutputvoltageduringstart-upand  
n
n
n
shutdown with coincident or ratiometric tracking. Current  
foldback limits MOSFET heat dissipation during short-  
circuit conditions. The MODE/PLLIN pin selects among  
Burst Mode operation, pulse-skipping mode or continu-  
ous inductor current mode at light loads and allows the IC  
to be synchronized to an external clock. The LTC3851A-1  
contains an improved PLL compared to the LTC3851-1.  
Low Shutdown I : 20µA  
Q
V
Range: 0.8V to 5.5V  
OUT  
Thermally Enhanced 16-Lead MSOP  
or 3mm × 3mm QFN Package  
applicaTions  
n
Automotive Systems  
The LTC3851A-1 is identical to the LTC3851A except that  
the I pin is replaced by PGOOD.  
n
Telecom Systems  
LIM  
n
Industrial Equipment  
Distributed DC Power Systems  
L, LT, LTC, LTM, Burst Mode, OPTI-LOOP, Linear Technology and the Linear logo are registered  
n
trademarks and No R , UltraFast are trademarks of Linear Technology Corporation. All other  
SENSE  
trademarks are the property of their respective owners. Protected by U.S. Patents including  
5408150, 5481178, 5705919, 5929620, 6304066, 6498466, 6580258, 6611131.  
Typical applicaTion  
Efficiency and Power Loss  
vs Load Current  
High Efficiency Synchronous Step-Down Converter  
100k  
V
IN  
4.5V TO 38V  
100  
95  
10000  
1000  
100  
PGO0D  
FREQ/PLLFLTR TG  
INTV  
V
CC  
IN  
V
V
= 12V  
IN  
OUT  
22µF  
= 3.3V  
0.68µH  
3.01k  
V
3.3V  
15A  
EFFICIENCY  
OUT  
0.1µF  
90  
82.5k  
RUN  
SW  
LTC3851A-1  
0.1µF  
85  
TK/SS  
BOOST  
330µF  
×2  
80  
75  
0.1µF  
POWER LOSS  
INTV  
CC  
2200pF  
70  
65  
60  
55  
50  
4.7µF  
BG  
I
TH  
GND  
15k  
330pF  
+
SENSE  
MODE/PLLIN  
SENSE  
0.047µF  
30.1k  
10  
154k  
10  
100  
1000  
10000  
100000  
V
FB  
LOAD CURRENT (mA)  
3851A1 TA01b  
48.7k  
3851A1 TA01a  
3851a1fa  
1
LTC3851A-1  
absoluTe MaxiMuM raTings (Note ±)  
Input Supply Voltage (V )......................... 40V to –0.3V  
INTV Peak Output Current..................................50mA  
IN  
CC  
Topside Driver Voltage (BOOST)................ 46V to –0.3V  
Switch Voltage (SW).....................................40V to –5V  
Operating Junction Temperature Range (Notes 2, 3)  
E-Grade, I-Grade................................40°C to 125°C  
H-Grade ............................................. –40°C to 150°C  
MP-Grade .......................................... –55°C to 150°C  
Storage Temperature Range ..................–65°C to 150°C  
Lead Temperature (Soldering, 10 sec)  
INTV , (BOOST – SW), RUN, PGOOD........ 6V to –0.3V  
CC  
TK/SS ...................................................INTV to –0.3V  
CC  
+
SENSE , SENSE .......................................... 6V to –0.3V  
MODE/PLLIN, FREQ/PLLFLTR ..............INTV to –0.3V  
CC  
I , V Voltages ......................................... 3V to –0.3V  
MSE..................................................................300°C  
TH FB  
pin conFiguraTion  
TOP VIEW  
TOP VIEW  
1
2
3
4
5
6
7
8
MODE/PLLIN  
FREQ/PLLFLTR  
RUN  
16 SW  
16 15 14 13  
15 TG  
14 BOOST  
RUN  
1
2
3
4
12 BOOST  
17  
GND  
TK/SS  
13 V  
IN  
TK/SS  
11  
10  
9
V
IN  
I
12 INTV  
11 BG  
TH  
CC  
17  
GND  
FB  
I
INTV  
BG  
TH  
CC  
SENSE  
10 GND  
+
SENSE  
9
PGOOD  
FB  
MSE PACKAGE  
16-LEAD PLASTIC MSOP  
5
6
7
8
T
= 125°C, θ = 35°C/W TO 40°C/W  
JA  
JMAX  
EXPOSED PAD (PIN 17) IS GND, MUST BE SOLDERED TO PCB  
UD PACKAGE  
16-LEAD (3mm × 3mm) PLASTIC QFN  
= 125°C, θ = 68°C/W, θ = 4.2°C/W  
T
JMAX  
JA  
JC  
EXPOSED PAD (PIN 17) IS GND, MUST BE SOLDERED TO PCB  
orDer inForMaTion  
LEAD FREE FINISH  
TAPE AND REEL  
PART MARKING*  
3851A1  
3851A1  
3851A1  
3851A1  
LFQB  
PACKAGE DESCRIPTION  
16-Lead Plastic MSOP  
TEMPERATURE RANGE  
LTC3851AEMSE-1#PBF  
LTC3851AIMSE-1#PBF  
LTC3851AHMSE-1#PBF  
LTC3851AEMSE-1#TRPBF  
LTC3851AIMSE-1#TRPBF  
LTC3851AHMSE-1#TRPBF  
–40°C to 125°C  
–40°C to 125°C  
–40°C to 150°C  
–55°C to 150°C  
–40°C to 125°C  
–40°C to 125°C  
16-Lead Plastic MSOP  
16-Lead Plastic MSOP  
LTC3851AMPMSE-1#PBF LTC3851AMPMSE-1#TRPBF  
16-Lead Plastic MSOP  
LTC3851AEUD-1#PBF  
LTC3851AIUD-1#PBF  
LTC3851AEUD-1#TRPBF  
LTC3851AIUD-1#TRPBF  
16-Lead (3mm × 3mm) Plastic QFN  
16-Lead (3mm × 3mm) Plastic QFN  
LFQB  
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.  
Consult LTC Marketing for information on non-standard lead based finish parts.  
For more information on lead free part marking, go to: http://www.linear.com/leadfree/  
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/  
3851a1fa  
2
LTC3851A-1  
elecTrical characTerisTics The l denotes the specifications which apply over the specified operating  
junction temperature range, otherwise specifications are at TA = 25°C (Note 2). VIN = ±5V, VRUN = 5V unless otherwise noted.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
Main Control Loops  
V
V
Input Operating Voltage Range  
Regulated Feedback Voltage  
4
38  
V
IN  
l
l
l
l
I
TH  
I
TH  
I
TH  
I
TH  
= 1.2V (Note 4) 0°C to 85°C  
0.792  
0.788  
0.788  
0.788  
0.800  
0.808  
0.812  
0.812  
0.812  
V
V
V
V
FB  
= 1.2V (Note 4) –40°C to 125°C  
= 1.2V (Note 4) –40°C to 150°C  
= 1.2V (Note 4) –55°C to 150°C  
I
Feedback Current  
(Note 4)  
= 6V to 38V (Note 4)  
–10  
–50  
nA  
FB  
V
V
Reference Voltage Line Regulation  
Output Voltage Load Regulation  
V
IN  
0.002  
0.02  
%/V  
REFLNREG  
(Note 4) Measured in Servo Loop,  
LOADREG  
l
l
I = 1.2V to 0.7V  
0.01  
0.1  
0.2  
%
%
TH  
(Note 4) Measured in Servo Loop,  
I = 1.2V to 0.7V (H-Grade, MP-Grade)  
TH  
(Note 4) Measured in Servo Loop,  
l
l
I = 1.2V to 1.6V  
–0.01  
–0.1  
–0.2  
%
TH  
(Note 4) Measured in Servo Loop,  
I = 1.2V to 1.6V (H-Grade, MP-Grade)  
%
mmho  
MHz  
TH  
g
g
Transconductance Amplifier g  
I
TH  
I
TH  
= 1.2V, Sink/Source = 5µA (Note 4)  
= 1.2V (Note 8)  
2
3
m
m
GBW  
Transconductance Amp Gain Bandwidth  
m
I
Input DC Supply Current  
Normal Mode  
Shutdown  
(Note 5)  
Q
V
V
= 5V  
= 0V  
1
25  
mA  
µA  
RUN  
RUN  
50  
UVLO  
Undervoltage Lockout on INTV  
UVLO Hysteresis  
V
Ramping Down  
INTVCC  
3.25  
0.4  
1
V
V
CC  
UVLO Hys  
I
I
SENSE Pins Current  
2
2
µA  
µA  
V
SENSE  
TK/SS  
Soft-Start Charge Current  
RUN Pin On—Threshold  
RUN Pin On—Hysteresis  
V
V
= 0V  
0.6  
1
TK/SS  
l
V
V
V
Rising  
RUN  
1.10  
1.22  
120  
53  
1.35  
RUN  
mV  
RUNHYS  
SENSE(MAX)  
l
l
Maximum Current Sense Threshold  
V
V
= 0.7V, V  
= 0.7V, V  
= 3.3V  
40  
35  
65  
70  
mV  
mV  
FB  
FB  
SENSE  
SENSE  
= 3.3V (H-Grade, MP-Grade)  
TG R  
TG R  
BG R  
BG R  
TG Driver Pull-Up On-Resistance  
TG Driver Pull-Down On-Resistance  
BG Driver Pull-Up On-Resistance  
BG Driver Pull-Down On-Resistance  
TG High  
TG Low  
BG High  
BG Low  
(Note 6)  
2.2  
1.2  
2.1  
1.1  
Ω
Ω
Ω
Ω
UP  
DOWN  
UP  
DOWN  
TG Transition Time  
Rise Time  
Fall Time  
TG t  
TG t  
C
C
= 3300pF  
= 3300pF  
25  
25  
ns  
ns  
r
f
LOAD  
LOAD  
BG Transition Time  
Rise Time  
Fall Time  
(Note 6)  
BG tr  
BG tf  
C
C
= 3300pF  
= 3300pF  
25  
25  
ns  
ns  
LOAD  
LOAD  
TG/BG t  
Top Gate Off to Bottom Gate On Delay  
Bottom Switch-On Delay Time  
C
= 3300pF Each Driver  
30  
30  
90  
ns  
ns  
ns  
1D  
2D  
LOAD  
(Note 6)  
BG/TG t  
Bottom Gate Off to Top Gate On Delay  
Top Switch-On Delay Time  
C
= 3300pF Each Driver  
LOAD  
(Note 6)  
t
Minimum On-Time  
(Note 7)  
ON(MIN)  
INTV Linear Regulator  
CC  
V
V
Internal V Voltage  
6V < V < 38V  
4.8  
5
5.2  
V
INTVCC  
CC  
IN  
INT  
INTV Load Regulation  
I = 0mA to 50mA  
CC  
0.5  
%
LDO  
CC  
3851a1fa  
3
LTC3851A-1  
elecTrical characTerisTics The l denotes the specifications which apply over the specified operating  
junction temperature range, otherwise specifications are at TA = 25°C (Note 2). VIN = ±5V, VRUN = 5V unless otherwise noted.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
Oscillator and Phase-Locked Loop  
f
f
f
Nominal Frequency  
R
R
R
= 60k  
= 160k  
= 36k  
460  
205  
690  
500  
235  
750  
100  
540  
265  
810  
kHz  
kHz  
kHz  
kΩ  
NOM  
LOW  
HIGH  
FREQ  
FREQ  
FREQ  
Lowest Frequency  
Highest Frequency  
R
MODE/PLLIN Input Resistance  
MODE/PLLIN  
MODE  
f
I
MODE/PLLIN Minimum Input Frequency  
MODE/PLLIN Maximum Input Frequency V  
V
MODE  
MODE  
= External Clock  
= External Clock  
250  
750  
kHz  
kHz  
Phase Detector Output Current  
Sinking Capability  
Sourcing Capability  
FREQ  
f
f
> f  
< f  
–90  
75  
µA  
µA  
MODE  
MODE  
OSC  
OSC  
PGOOD Output  
V
PGOOD Voltage Low  
PGOOD Leakage Current  
PGOOD Trip Level  
I
= 2mA  
= 5V  
0.1  
0.3  
1
V
PGL  
PGOOD  
I
V
V
µA  
PGOOD  
PGOOD  
V
PG  
with Respect to Set Regulated Voltage  
Ramping Negative (UV)  
Ramping Positive (OV)  
FB  
V
V
–12.5  
7.5  
–10  
10  
–7.5  
12.5  
%
%
FB  
FB  
Note ±: Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to any Absolute  
Maximum Rating condition for extended periods may affect device  
reliability and lifetime.  
Note 3: T is calculated from the ambient temperature T and power  
J A  
dissipation P according to the following formulas:  
D
LTC3851AMSE-1: T = T + (P • 40°C/W)  
J
A
D
LTC3851AUD-1: T = T + (P • 68°C/W)  
J
A
D
Note 2: The LTC3851A-1 is tested under pulsed load conditions such that  
Note 4: The LTC3851A-1 is tested in a feedback loop that servos V to a  
ITH  
T ≈ T . The LTC3851AE-1 is guaranteed to meet performance  
A
J
specified voltage and measures the resultant V  
.
FB  
specifications from 0°C to 85°C junction temperature. Specifications over  
the –40°C to 125°C operating junction temperature range are assured by  
design, characterization and correlation with statistical process controls.  
The LTC3851AI-1 is guaranteed to meet specifications over the –40°C  
to 125°C operating junction temperature range, the LTC3851AH-1 is  
guaranteed over the –40°C to 150°C operating junction temperature range  
and the LTC3851AMP-1 is tested and guaranteed over the –55°C to 150°C  
operating junction temperature range. High junction temperatures degrade  
operating lifetimes; operating lifetime is derated for junction temperatures  
greater than 125°C. Note that the maximum ambient temperature  
consistent with these specifications is determined by specific operating  
conditions in conjunction with board layout, the rated package thermal  
impedance and other environmental factors.  
Note 5: Dynamic supply current is higher due to the gate charge being  
delivered at the switching frequency. See Applications Information.  
Note 6: Rise and fall times are measured using 10% and 90% levels. Delay  
times are measured using 50% levels. Rise and fall times are assured by  
design, characterization and correlation with statistical process controls.  
Note 7: The minimum on-time condition is specified for an inductor  
peak-to-peak ripple current ~40% of I  
(see Minimum On-Time  
MAX  
Considerations in the Applications Information section).  
Note 8: Guaranteed by design; not tested in production.  
3851a1fa  
4
LTC3851A-1  
Typical perForMance characTerisTics  
Efficiency vs Output Current  
and Mode  
Efficiency vs Output Current  
and Mode  
100  
90  
100  
90  
V
V
= 12V  
IN  
OUT  
= 1.5V  
BURST  
80  
80  
BURST  
70  
70  
PULSE  
SKIP  
60  
50  
60  
50  
PULSE  
SKIP  
CCM  
40  
30  
20  
10  
0
40  
30  
20  
10  
0
CCM  
V
V
= 12V  
IN  
OUT  
= 3.3V  
FIGURE 11 CIRCUIT  
10  
100  
1000  
10000 100000  
10  
100  
1000  
10000  
100000  
LOAD CURRENT (mA)  
LOAD CURRENT (mA)  
3851A1 G02  
3851A1 G01  
Efficiency vs Output Current  
and Mode  
Efficiency and Power Loss  
vs Input Voltage  
100  
90  
100  
95  
10000  
1000  
100  
EFFICIENCY,  
OUT  
I
= 5A  
POWER LOSS,  
= 5A  
80  
I
BURST  
OUT  
70  
90  
PULSE  
SKIP  
60  
50  
85  
80  
EFFICIENCY,  
= 0.5A  
CCM  
I
40  
30  
20  
10  
0
OUT  
POWER LOSS,  
I
= 0.5A  
OUT  
V
V
= 12V  
75  
70  
IN  
OUT  
V
V
= 12V  
OUT  
= 3.3V  
IN  
= 5V  
FIGURE 11 CIRCUIT  
10  
100  
1000  
10000  
100000  
4
8
12  
16  
20 28  
24 32  
LOAD CURRENT (mA)  
INPUT VOLTAGE (V)  
3851A1 G03  
3851A1 G04  
Load Step  
(Forced Continuous Mode)  
Load Step  
(Burst Mode Operation)  
I
I
LOAD  
LOAD  
5A/DIV  
5A/DIV  
0.2A TO 7.5A  
0.2A TO 7.5A  
I
L
I
L
5A/DIV  
5A/DIV  
V
OUT  
V
OUT  
100mV/DIV  
100mV/DIV  
AC-COUPLED  
AC-COUPLED  
3851A1 G05  
3851A1 G06  
V
V
= 1.5V  
100µs/DIV  
V
V
= 1.5V  
OUT  
100µs/DIV  
OUT  
IN  
= 12V  
= 12V  
IN  
FIGURE 11 CIRCUIT  
FIGURE 11 CIRCUIT  
3851a1fa  
5
LTC3851A-1  
Typical perForMance characTerisTics  
Load Step  
(Pulse-Skipping Mode)  
Inductor Current at Light Load  
I
LOAD  
FORCED  
CONTINOUS  
MODE  
5A/DIV  
0.2A TO 7.5A  
5A/DIV  
I
L
Burst Mode  
OPERATION  
5A/DIV  
5A/DIV  
V
OUT  
PULSE SKIP  
MODE  
100mV/DIV  
AC-COUPLED  
5A/DIV  
3851A1 G08  
3851A1 G07  
V
V
I
= 1.5V  
= 1mA  
1µs/DIV  
V
V
= 1.5V  
100µs/DIV  
OUT  
IN  
LOAD  
OUT  
IN  
= 12V  
= 12V  
FIGURE 11 CIRCUIT  
FIGURE 11 CIRCUIT  
Coincident Tracking with Master  
Supply  
Start-Up with Prebiased Output  
at 2V  
V
MASTER  
V
OUT  
0.5V/DIV  
V
OUT  
2V/DIV  
TK/SS  
0.5V/DIV  
2A LOAD  
0.5V/DIV  
V
FB  
0.5V/DIV  
3851A1 G09  
3851A1 G10  
20ms/DIV  
10ms/DIV  
Input DC Supply Current  
vs Input Voltage  
Ratiometric Tracking with Master  
Supply  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
V
MASTER  
0.5V/DIV  
V
OUT  
2A LOAD  
0.5V/DIV  
3851A1 G11  
10ms/DIV  
4
8
12 16 20 24 28 32 36 40  
INPUT VOLTAGE (V)  
3851A1 G12  
3851a1fa  
6
LTC3851A-1  
Typical perForMance characTerisTics  
Maximum Current Sense Threshold  
vs Common Mode Voltage  
Maximum Peak Current Sense  
Threshold vs ITH Voltage  
INTVCC Line Regulation  
5.3  
5.1  
4.9  
4.7  
4.5  
4.3  
4.1  
3.9  
3.7  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
DUTY CYCLE RANGE: 0% TO 100%  
I
= 0mA  
LOAD  
I
= 25mA  
LOAD  
–10  
–20  
3.5  
4
8
12 16 20 24  
INPUT VOLTAGE (V)  
40  
28 32 36  
0
0.5  
V
1
1.5  
2
2.5  
5
0
0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4  
(V)  
3
3.5 4 4.5  
V
COMMON MODE VOLTAGE (V)  
ITH  
SENSE  
3851A1 G13  
3851A1 G14  
3851A1 G15  
Maximum Current Sense  
Threshold vs Feedback Voltage  
(Current Foldback)  
Burst Mode Peak Current Sense  
Threshold vs ITH Voltage  
Maximum Current Sense  
Threshold vs Duty Cycle  
60  
50  
40  
30  
20  
10  
0
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
90  
80  
70  
60  
50  
40  
30  
20  
10  
MAXIMUIM  
MINIMUIM  
BURST COMPARATOR FALLING THESHOLD:  
V
= 0.4V  
ITH  
0
0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4  
(V)  
0.4 0.5  
FEEDBACK VOLTAGE (V)  
0
0.1 0.2 0.3  
0.6 0.7 0.8  
0
80  
100  
20  
40  
60  
V
ITH  
DUTY CYCLE (%)  
3851A1 G16  
3851A1 G18  
3851A1 G17  
TK/SS Pull-Up Current  
vs Temperature  
Shutdown (RUN) Threshold  
vs Temperature  
Regulated Feedback Voltage  
vs Temperature  
1.4  
1.3  
1.2  
1.1  
1.0  
0.9  
806  
804  
802  
800  
1.5  
1.4  
1.3  
1.2  
1.1  
1.0  
0.9  
0.8  
0.7  
0.6  
0.5  
RUN RISING THRESHOLD (ON)  
RUN FALLING THRESHOLD (OFF)  
798  
796  
794  
50  
TEMPERATURE (°C)  
100 125 150  
3851A1 G21  
–75 –50 –25  
0
25 50 75 100 125 150  
–75 –50 –25  
0
25  
75  
–75 –50  
0
25 50 75 100 125 150  
–25  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
3851A1 G20  
3851A1 G19  
3851a1fa  
7
LTC3851A-1  
Typical perForMance characTerisTics  
Oscillator Frequency  
vs Temperature  
Oscillator Frequency  
vs Input Voltage  
Undervoltage Lockout Threshold  
(INTVCC) vs Temperature  
900  
800  
5
4
3
2
1
0
420  
R
= 80k  
FREQ  
415  
410  
R
= 36k  
= 60k  
PLLLPF  
INTV RAMPING UP  
CC  
700  
600  
500  
400  
300  
405  
400  
395  
390  
385  
INTV RAMPING DOWN  
CC  
R
PLLLPF  
R
= 160k  
PLLLPF  
200  
380  
50  
100 125 150  
75  
–75 –50 –25  
0
25  
10  
15  
25  
30  
35  
40  
5
20  
–75 –50 –25  
0
25 50 75 100 125 150  
TEMPERATURE (°C)  
TEMPERATURE (°C)  
INPUT VOLTAGE (V)  
3851A1 G22  
3851A1 G23  
3851A1 G24  
Shutdown Input DC Supply  
Current vs Input Voltage  
Shutdown Input DC Supply  
Current vs Temperature  
40  
35  
30  
25  
20  
15  
10  
5
40  
35  
30  
25  
20  
15  
10  
5
0
0
–25  
0
50 75 100 125 150  
–75 –50  
25  
20 25  
10 15  
INPUT VOLTAGE (V)  
0
5
30 35 40  
TEMPERATURE (°C)  
3851A1 G26  
3851A1 G25  
Input DC Supply Current  
vs Temperature  
Maximum Current Sense  
Threshold vs INTVCC Voltage  
90  
80  
70  
60  
50  
40  
30  
20  
10  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
0
50  
100 125 150  
75  
–75 –50 –25  
0
25  
3.2 3.4 3.6 3.8 4.0 4.2  
5.0  
4.4 4.6 4.8  
TEMPERATURE (°C)  
INTV VOLTAGE(V)  
CC  
3851A1 G27  
3851A1 G28  
3851a1fa  
8
LTC3851A-1  
pin FuncTions (MSE/UD)  
MODE/PLLIN (Pin ±/Pin ±5): Forced Continuous Mode,  
Burst Mode or Pulse-Skipping Mode Selection Pin and  
External Synchronization Input to Phase Detector Pin.  
PGOOD(Pin9/Pin7):PowerGoodIndicatorOutput.Open-  
drain logic out that is pulled to ground when the output  
voltage exceeds the 10% regulation window, after the  
internal 17µs power bad mask timer expires.  
ConnectthispintoINTV toforcecontinuousconduction  
CC  
mode of operation. Connect to GND to enable pulse-skip-  
GND (Pin ±0/Pin 8, Exposed Pad Pin ±7): Ground. All  
small-signalcomponentsandcompensationcomponents  
shouldbeKelvinconnectedtothisground.The()terminal  
ping mode of operation. To select Burst Mode operation,  
tie this pin to INTV through a resistor no less than 50k,  
CC  
but no greater than 250k. A clock on the pin will force the  
controller into forced continuous mode of operation and  
synchronize the internal oscillator.  
of CV and the (–) terminal of C should be closely con-  
CC  
IN  
nected to this pin. The exposed pad should be soldered  
to ground for good thermal conductivity.  
FREQ/PLLFLTR (Pin 2/Pin ±6): The phase-locked loop’s  
lowpass filter is tied to this pin. Alternatively, a resistor  
can be connected between this pin and GND to vary the  
frequency of the internal oscillator.  
BG (Pin ±±/Pin 9): Bottom Gate Driver Output. This pin  
drives the gate of the bottom N-channel MOSFET between  
GND and INTV .  
CC  
INTV (Pin±2/Pin±0):Internal5VRegulatorOutput. The  
CC  
RUN (Pin 3/Pin ±): Run Control Input. A voltage above  
1.22V on this pin turns on the IC. However, forcing this  
pin below 1.1V causes the IC to shut down the IC. There  
is a 2μA pull-up current on this pin.  
control circuit is powered from this voltage. Decouple this  
pin to GND with a minimum 2.2μF low ESR tantalum or  
ceramic capacitor.  
V (Pin ±3/Pin ±±): Main Input Supply. Decouple this pin  
IN  
TK/SS(Pin4/Pin2):OutputVoltageTrackingandSoft-Start  
Input. A capacitor to ground at this pin sets the ramp rate  
for the output voltage. An internal soft-start current of of  
1μA charges this capacitor.  
to GND with a capacitor.  
BOOST (Pin ±4/Pin ±2): Boosted Floating Driver Supply.  
The (+) terminal of the boost-strap capacitor is connected  
to this pin. This pin swings from a diode voltage drop  
I
(Pin 5/Pin 3): Current Control Threshold and Error  
TH  
below INTV up to V + INTV .  
CC  
IN  
CC  
Amplifier Compensation Point. The current comparator  
TG (Pin ±5/Pin ±3): Top Gate Driver Output. This is the  
tripping threshold increases with its I control voltage.  
TH  
output of a floating driver with a voltage swing equal to  
FB (Pin 6/Pin 4): Error Amplifier Feedback Input. This pin  
receives the remotely sensed feedback voltage from an  
external resistive divider across the output.  
INTV superimposed on the switch node voltage.  
CC  
SW (Pin ±6/Pin ±4): Switch Node Connection to the In-  
ductor. Voltage swing at this pin is from a Schottky diode  
SENSE (Pin7/Pin5):CurrentSenseComparatorInverting  
(external) voltage drop below ground to V .  
IN  
Input.The()inputtothecurrentcomparatorisconnected  
to the output.  
+
SENSE (Pin 8/Pin 6): Current Sense Comparator Non-  
inverting Input. The (+) input to the current comparator  
is normally connected to the DCR sensing network or  
current sensing resistor.  
3851a1fa  
9
LTC3851A-1  
FuncTional DiagraM  
V
IN  
FREQ/PLLFLTR  
MODE/PLLIN  
V
IN  
+
C
IN  
100k  
5V REG  
0.8V  
MODE/SYNC  
DETECT  
PLL-SYNC  
+
BOOST  
BURSTEN  
C
B
TG  
OSC  
S
R
PULSE SKIP  
ON  
M1  
Q
I
SW  
SWITCH  
LOGIC  
AND  
ANTI-  
SHOOT  
THROUGH  
5k  
+
SENSE  
D
+
+
B
L1  
I
V
CMP  
REV  
OUT  
SENSE  
RUN  
OV  
+
INTV  
BG  
CC  
C
OUT  
M2  
C
VCC  
SLOPE COMPENSATION  
GND  
PGOOD  
INTV  
CC  
UVLO  
1
+
0.72V  
100k  
R2  
UV  
OV  
I
V
THB  
FB  
R1  
+
V
IN  
SLEEP  
0.88V  
RUN  
SS  
+
+
0.8V  
REF  
1µA  
EA  
+ –  
+
+
0.64V  
1.22V  
2µA  
0.4V  
3851A1 FD  
I
TH  
RUN  
TK/SS  
C
SS  
R
C
C
C1  
3851a1fa  
10  
LTC3851A-1  
operaTion  
Main Control Loop  
by logic. Be careful not to exceed the absolute maximum  
rating of 6V on this pin.  
The LTC3851A-1 is a constant frequency, current mode  
step-down controller. During normal operation, the top  
MOSFET is turned on when the clock sets the RS latch,  
The start-up of the controller’s output voltage, V , is  
OUT  
controlled by the voltage on the TK/SS pin. When the  
and is turned off when the main current comparator, I  
,
voltage on the TK/SS pin is less than the 0.8V internal  
CMP  
resets the RS latch. The peak inductor current at which  
resets the RS latch is controlled by the voltage on  
reference, the LTC3851A-1 regulates the V voltage to  
FB  
I
the TK/SS pin voltage instead of the 0.8V reference. This  
allows the TK/SS pin to be used to program a soft-start  
by connecting an external capacitor from the TK/SS pin to  
GND.Aninternal1µApull-upcurrentchargesthiscapacitor  
creating a voltage ramp on the TK/SS pin. As the TK/SS  
voltage rises linearly from 0V to 0.8V (and beyond), the  
CMP  
the I pin, which is the output of the error amplifier, EA.  
TH  
The V pin receives the voltage feedback signal, which is  
FB  
comparedtotheinternalreferencevoltagebytheEA.When  
the load current increases, it causes a slight decrease in  
V relative to the 0.8V reference, which in turn causes the  
FB  
TH  
I
voltage to increase until the average inductor current  
output voltage V  
rises smoothly from zero to its final  
OUT  
matches the new load current. After the top MOSFET has  
turned off, the bottom MOSFET is turned on until either  
the inductor current starts to reverse, as indicated by the  
value. Alternatively, the TK/SS pin can be used to cause  
the start-up of V to track another supply. Typically,  
OUT  
this requires connecting to the TK/SS pin an external  
resistor divider from the other supply to ground (see the  
Applications Information section). When the RUN pin  
reverse current comparator, I , or the beginning of the  
REV  
next cycle.  
is pulled low to disable the controller, or when INTV  
CC  
INTV Power  
drops below its undervoltage lockout threshold of 3.2V,  
the TK/SS pin is pulled low by an internal MOSFET. When  
in undervoltage lockout, the controller is disabled and the  
external MOSFETs are held off.  
CC  
Power for the top and bottom MOSFET drivers and most  
other internal circuitry is derived from the INTV pin. An  
CC  
internal 5V low dropout linear regulator supplies INTV  
CC  
power from V .  
IN  
Light Load Current Operation (Burst Mode Operation,  
Pulse-Skipping or Continuous Conduction)  
The top MOSFET driver is biased from the floating boot-  
strapcapacitor, C , whichnormallyrechargesduringeach  
B
The LTC3851A-1 can be enabled to enter high efficiency  
BurstMode operation, constantfrequency pulse-skipping  
mode or forced continuous conduction mode. To select  
forced continuous operation, tie the MODE/PLLIN pin to  
off cycle through an external diode when the top MOSFET  
turns off. If the input voltage, V , decreases to a voltage  
IN  
close to V , the loop may enter dropout and attempt  
OUT  
to turn on the top MOSFET continuously. The dropout  
detector detects this and forces the top MOSFET off for  
about 1/10 of the clock period every tenth cycle to allow  
INTV . To select pulse-skipping mode of operation, float  
CC  
the MODE/PLLIN pin or tie it to GND. To select Burst Mode  
operation, tie MODE/PLLIN to INTV through a resistor  
CC  
C to recharge. However, it is recommended that there is  
B
no less than 50k, but no greater than 250k.  
always a load present during the drop-out transition to  
ensure C is recharged.  
When the controller is enabled for Burst Mode operation,  
the peak current in the inductor is set to approximately  
one-forth of the maximum sense voltage even though  
B
Shutdown and Start-Up (RUN and TK/SS)  
the voltage on the I pin indicates a lower value. If the  
TH  
The LTC3851A-1 can be shut down using the RUN pin.  
Pulling this pin below 1.1V disables the controller and  
average inductor current is higher than the load current,  
the error amplifier, EA, will decrease the voltage on the I  
TH  
most of the internal circuitry, including the INTV regula-  
CC  
pin. When the I voltage drops below 0.4V, the internal  
TH  
tor. Releasing the RUN pin allows an internal 2µA current  
to pull up the pin and enable that controller. Alternatively,  
the RUN pin may be externally pulled up or driven directly  
sleep signal goes high (enabling “sleep” mode) and both  
external MOSFETs are turned off.  
3851a1fa  
11  
LTC3851A-1  
operaTion  
pin. If the MODE/PLLIN pin is not being driven by an ex-  
ternal clock source, the FREQ/PLLFLTR pin can be used  
to program the controller’s operating frequency from  
250kHz to 750kHz.  
In sleep mode, the load current is supplied by the output  
capacitor. Astheoutputvoltagedecreases, theEA’soutput  
begins to rise. When the output voltage drops enough, the  
sleep signal goes low, and the controller resumes normal  
operation by turning on the top external MOSFET on the  
next cycle of the internal oscillator. When a controller is  
enabled for Burst Mode operation, the inductor current is  
not allowed to reverse. The reverse current comparator,  
A phase-locked loop (PLL) is available on the LTC3851A-1  
to synchronize the internal oscillator to an external clock  
source that is connected to the MODE/PLLIN pin. The  
controlleroperatesinforcedcontinuousmodeofoperation  
when it is synchronized. A series RC should be connected  
between the FREQ/PLLFLTR pin and GND to serve as the  
PLLs loop filter.  
I
, turns off the bottom external MOSFET just before the  
REV  
inductor current reaches zero, preventing it from revers-  
ing and going negative. Thus, the controller operates in  
discontinuous operation. In forced continuous operation,  
the inductor current is allowed to reverse at light loads or  
under large transient conditions. The peak inductor cur-  
It is suggested that the external clock be applied before  
enabling the controller unless a second resistor is con-  
nected in parallel with the series RC loop filter network.  
The second resistor prevents low switching frequency  
operation if the controller is enabled before the clock.  
rent is determined by the voltage on the I pin, just as in  
TH  
normal operation. In this mode the efficiency at light loads  
is lower than in Burst Mode operation. However, continu-  
ous mode has the advantages of lower output ripple and  
less interference to audio circuitry.  
Output Overvoltage Protection  
An overvoltage comparator, OV, guards against transient  
overshoots (>10%) as well as other more serious con-  
ditions that may overvoltage the output. In such cases,  
the top MOSFET is turned off and the bottom MOSFET is  
turned on until the overvoltage condition is cleared.  
When the MODE/PLLIN pin is connected to GND, the  
LTC3851A-1 operates in PWM pulse-skipping mode at  
light loads. At very light loads the current comparator,  
I
, may remain tripped for several cycles and force the  
CMP  
external top MOSFET to stay off for the same number of  
cycles (i.e., skipping pulses). The inductor current is not  
allowed to reverse (discontinuous operation). This mode,  
likeforcedcontinuousoperation,exhibitslowoutputripple  
as well as low audio noise and reduced RF interference  
as compared to Burst Mode operation. It provides higher  
low current efficiency than forced continuous mode, but  
not nearly as high as Burst Mode operation.  
Power Good (PGOOD) Pin  
ThePGOODpinisconnectedtoanopendrainofaninternal  
N-channel MOSFET. The MOSFET turns on and pulls the  
pin voltage is not within  
PGOOD pin low when the V  
FB  
10% of the 0.8V reference voltage. The PGOOD pin is  
also pulled low when the RUN pin is low (shut down) or  
whentheLTC3851A-1isinthesoft-startortrackingphase.  
Frequency Selection and Phase-Locked Loop  
(FREQ/PLLFLTR and MODE/PLLIN Pins)  
When the V pin voltage is within the 10% requirement,  
FB  
the MOSFET is turned off and the pin is allowed to be  
pulled up by an external resistor to a source of up to 6V.  
The PGOOD pin will flag power good immediately when  
Theselectionofswitchingfrequencyisatrade-offbetween  
efficiency and component size. Low frequency operation  
increasesefficiencybyreducingMOSFETswitchinglosses,  
butrequireslargerinductanceand/orcapacitancetomain-  
tain low output ripple voltage. The switching frequency of  
the LTC3851A-1 can be selected using the FREQ/PLLFLTR  
the V pin is within the 10% window. However, there is  
FB  
an internal 17µs power bad mask when V goes out of  
FB  
the 10% window.  
3851a1fa  
12  
LTC3851A-1  
applicaTions inForMaTion  
The Typical Application on the first page of this data sheet  
isabasicLTC3851A-1applicationcircuit.TheLTC3851A-1  
can be configured to use either DCR (inductor resistance)  
sensing or low value resistor sensing. The choice of the  
two current sensing schemes is largely a design trade-off  
between cost, power consumption and accuracy. DCR  
sensing is becoming popular because it saves expensive  
current sensing resistors and is more power efficient,  
especially in high current applications. However, current  
sensing resistors provide the most accurate current limits  
for the controller. Other external component selection  
is driven by the load requirement, and begins with the  
V
V
IN  
IN  
INTV  
CC  
BOOST  
TG  
R
SENSE  
V
SW  
OUT  
LTC3851A-1  
BG  
GND  
+
SENSE  
SENSE  
3851A1 F01  
FILTER COMPONENTS  
PLACED NEAR SENSE PINS  
selection of R  
(if R  
is used) and the inductor  
SENSE  
SENSE  
value. Next, the power MOSFETs and Schottky diodes are  
selected. Finally, input and output capacitors are selected.  
The circuit shown on the first page can be configured for  
Figure ±. Using a Resistor to Sense Current with the LTC385±A-±  
of 20% for variations in the IC and external component  
values yields:  
operation up to 38V at V .  
IN  
+
SENSE and SENSE Pins  
VMAX  
MAX + ∆IL/2  
RSENSE = 0.8 •  
+
I
The SENSE and SENSE pins are the inputs to the current  
comparators. The common mode input voltage range of  
the current comparators is 0V to 5.5V. Both SENSE pins  
are high impedance inputs with small base currents of  
less than 1μA. When the SENSE pins ramp up from 0V  
to 1.4V, the small base currents flow out of the SENSE  
pins. When the SENSE pins ramp down from 5V to 1.1V,  
the small base currents flow into the SENSE pins. The  
high impedance inputs to the current comparators allow  
accurate DCR sensing. However, care must be taken not  
to float these pins during normal operation.  
Inductor DCR Sensing  
Forapplicationsrequiringthehighestpossibleefficiency,  
the LTC3851A-1 is capable of sensing the voltage drop  
across the inductor DCR, as shown in Figure 2. The  
DCR of the inductor represents the small amount of  
DC winding resistance of the copper, which can be less  
than 1mΩ for today’s low value, high current inductors.  
If the external R1||R2 • C1 time constant is chosen to  
be exactly equal to the L/DCR time constant, the voltage  
drop across the external capacitor is equal to the voltage  
dropacrosstheinductorDCRmultipliedbyR2/(R1+R2).  
Therefore,R2maybeusedtoscalethevoltageacrossthe  
sense terminals when the DCR is greater than the target  
sense resistance. Check the manufacturer’s data sheet  
for specifications regarding the inductor DCR, in order  
to properly dimension the external filter components.  
The DCR of the inductor can also be measured using a  
good RLC meter.  
Low Value Resistors Current Sensing  
A typical sensing circuit using a discrete resistor is shown  
in Figure 1. R  
current.  
is chosen based on the required output  
SENSE  
The current comparator has a maximum threshold,  
= 53mV. The current comparator threshold sets the  
maximumpeakoftheinductorcurrent,yieldingamaximum  
average output current, I , equal to the peak value less  
halfthepeak-to-peakripplecurrent,I .Allowingamargin  
V
MAX  
MAX  
L
3851a1fa  
13  
LTC3851A-1  
applicaTions inForMaTion  
Accepting larger values of I allows the use of low  
L
V
IN  
V
IN  
inductances, but results in higher output voltage ripple  
INTV  
CC  
and greater core losses. A reasonable starting point for  
setting ripple current is I = 0.3(I  
). The maximum  
MAX  
BOOST  
TG  
L
INDUCTOR  
I occurs at the maximum input voltage.  
L
L
DCR  
SW  
The inductor value also has secondary effects. The tran-  
sition to Burst Mode operation begins when the average  
inductor current required results in a peak current below  
V
OUT  
LTC3851A-1  
BG  
GND  
R1  
R2  
+
≈10% of the current limit determined by R  
. Lower  
SENSE  
SENSE  
inductor values (higher I ) will cause this to occur at  
C1*  
L
SENSE  
lower load currents, which can cause a dip in efficiency in  
the upper range of low current operation. In Burst Mode  
operation, lower inductance values will cause the burst  
frequency to increase.  
L
DCR  
+
3851A1 F02  
R1||R2 • C1 =  
*PLACE C1 NEAR SENSE , SENSE PINS  
R2  
R1 + R2  
R
= DCR  
SENSE(EQ)  
Figure 2. Current Mode Control Using the Inductor DCR  
Inductor Core Selection  
Slope Compensation and Inductor Peak Current  
Once the value for L is known, the type of inductor must  
be selected. High efficiency converters generally cannot  
affordthecorelossfoundinlowcostpowderedironcores,  
forcingtheuseofmoreexpensiveferriteormolypermalloy  
cores. Actual core loss is independent of core size for a  
fixedinductorvalue,butitisverydependentoninductance  
selected. As inductance increases, core losses go down.  
Unfortunately, increased inductance requires more turns  
of wire and therefore copper losses will increase.  
Slope compensation provides stability in constant fre-  
quency architectures by preventing sub-harmonic oscil-  
lations at high duty cycles. It is accomplished internally  
by adding a compensating ramp to the inductor current  
signal. Normally, this results in a reduction of maximum  
inductor peak current for duty cycles >40%. However, the  
LTC3851A-1usesanovelschemethatallowsthemaximum  
inductor peak current to remain unaffected throughout all  
duty cycles.  
Ferrite designs have very low core loss and are preferred  
at high switching frequencies, so design goals can con-  
centrate on copper loss and preventing saturation. Ferrite  
core material saturates hard, which means that induc-  
tance collapses abruptly when the peak design current is  
exceeded. This results in an abrupt increase in inductor  
ripple current and consequent output voltage ripple. Do  
not allow the core to saturate!  
Inductor Value Calculation  
The operating frequency and inductor selection are inter-  
relatedinthathigheroperatingfrequenciesallowtheuseof  
smaller inductor and capacitor values. A higher frequency  
generally results in lower efficiency because of MOSFET  
gate charge losses. In addition to this basic trade-off, the  
effect of inductor value on ripple current and low current  
operation must also be considered.  
Power MOSFET and Schottky Diode (Optional)  
Selection  
The inductor value has a direct effect on ripple current.  
Two external power MOSFETs must be selected for the  
LTC3851A-1 controller: one N-channel MOSFET for the  
top (main) switch, and one N-channel MOSFET for the  
bottom (synchronous) switch.  
The inductor ripple current I decreases with higher  
L
inductance or frequency and increases with higher V :  
IN  
VOUT  
1
f L  
∆IL =  
VOUT 1–  
V
IN  
3851a1fa  
14  
LTC3851A-1  
applicaTions inForMaTion  
2
BothMOSFETshaveI RlosseswhilethetopsideN-channel  
equation includes an additional term for transition losses,  
Thepeak-to-peakdrivelevelsaresetbytheINTV voltage.  
CC  
This voltage is typically 5V during start-up. Consequently,  
logic-level threshold MOSFETs must be used in most ap-  
plications. The only exception is if low input voltage is ex-  
which are highest at high input voltages. For V < 20V,  
IN  
the high current efficiency generally improves with larger  
MOSFETs, while for V > 20V, the transition losses rapidly  
pected(V <5V);then,sub-logiclevelthresholdMOSFETs  
IN  
IN  
increasetothepointthattheuseofahigherR  
device  
(V  
< 3V) should be used. Pay close attention to the  
DS(ON)  
GS(TH)  
withlowerC  
actuallyprovideshigherefficiency.The  
BV  
specification for the MOSFETs as well; most of the  
MILLER  
DSS  
synchronous MOSFET losses are greatest at high input  
voltage when the top switch duty factor is low or during  
short-circuit when the synchronous switch is on close to  
100% of the period.  
logic-level MOSFETs are limited to 30V or less.  
Selection criteria for the power MOSFETs include the on-  
resistance, R , Miller capacitance, C  
DS(ON)  
, input  
MILLER  
voltage and maximum output current. Miller capacitance,  
, can be approximated from the gate charge curve  
The term (1 + δ) is generally given for a MOSFET in the  
C
MILLER  
form of a normalized R  
vs Temperature curve, but  
usually provided on the MOSFET manufacturers’ data  
sheet. C is equal to the increase in gate charge  
DS(ON)  
δ = 0.005/°C can be used as an approximation for low  
MILLER  
voltage MOSFETs.  
along the horizontal axis while the curve is approximately  
flat divided by the specified change in V . This result is  
DS  
TheoptionalSchottkydiodeconductsduringthedeadtime  
between the conduction of the two power MOSFETs. This  
preventsthebodydiodeofthebottomMOSFETfromturn-  
ing on, storing charge during the dead time and requiring  
a reverse recovery period that could cost as much as 3%  
then multiplied by the ratio of the application applied V  
DS  
to the gate charge curve specified V . When the IC is  
DS  
operating in continuous mode, the duty cycles for the top  
and bottom MOSFETs are given by:  
in efficiency at high V . A 1A to 3A Schottky is generally  
VOUT  
IN  
Main Switch Duty Cycle =  
a good size due to the relatively small average current.  
Larger diodes result in additional transition losses due to  
their larger junction capacitance.  
V
IN  
V – V  
IN  
OUT  
Synchronous Switch Duty Cycle =  
V
IN  
Soft-Start and Tracking  
The MOSFET power dissipations at maximum output  
current are given by:  
The LTC3851A-1 has the ability to either soft-start by itself  
with a capacitor or track the output of another channel  
or external supply. When the LTC3851A-1 is configured  
to soft-start by itself, a capacitor should be connected to  
the TK/SS pin. The LTC3851A-1 is in the shutdown state if  
the RUN pin voltage is below 1.10V. TK/SS pin is actively  
pulled to ground in this shutdown state.  
VOUT  
2
PMAIN  
=
I
1+ δ R  
+
)
(
MAX ) (  
)
DS(ON)  
V
IN  
IMAX  
2
2
V
R
C
)
(
(
)
(
IN  
DR  
MILLER  
1
1
Once the RUN pin voltage is above 1.22V, the LTC3851A-1  
powersup.Asoft-startcurrentof1μAthenstartstocharge  
its soft-start capacitor. Note that soft-start or tracking is  
achieved not by limiting the maximum output current of  
the controller but by controlling the output ramp voltage  
according to the ramp rate on the TK/SS pin. Current  
foldback is disabled during this phase to ensure smooth  
soft-start or tracking. The soft-start or tracking range is  
+
(f)  
V
– VTH(MIN) VTH(MIN)  
INTVCC  
V – V  
2
IN  
OUT  
P
=
I
1+ δ R  
DS(ON)  
(
MAX ) (  
)
SYNC  
V
IN  
where δ is the temperature dependency of R  
DR  
and  
DS(ON)  
R
(approximately 2Ω) is the effective driver resistance  
at the MOSFET’s Miller threshold voltage. V  
is the  
TH(MIN)  
typical MOSFET minimum threshold voltage.  
3851a1fa  
15  
LTC3851A-1  
applicaTions inForMaTion  
0V to 0.8V on the TK/SS pin. The total soft-start time can  
be calculated as:  
Output Voltage Tracking  
The LTC3851A-1 allows the user to program how its  
output ramps up and down by means of the TK/SS pins.  
Through this pin, the output can be set up to either co-  
incidentally or ratiometrically track with another supply’s  
output, as shown in Figure 3. In the following discussions,  
CSS  
1.0µA  
tSOFT-START = 0.8 •  
Regardless of the mode selected by the MODE/PLLIN pin,  
the regulator will always start in pulse-skipping mode up  
to TK/SS = 0.64V. Between TK/SS = 0.64V and 0.72V, it  
will operate in forced continuous mode and revert to the  
selected mode once TK/SS > 0.72V. The output ripple  
is minimized during the 80mV forced continuous mode  
window.  
V
refers to a master supply and V  
refers to the  
MASTER  
OUT  
LTC3851A-1’s output as a slave supply. To implement the  
coincident tracking in Figure 3a, connect a resistor divider  
to V  
and connect its midpoint to the TK/SS pin of  
MASTER  
theLTC3851A-1.Theratioofthisdividershouldbeselected  
the same as that of the LTC3851A-1’s feedback divider as  
shown in Figure 4a. In this tracking mode, V  
must  
MASTER  
When the regulator is configured to track another supply,  
the feedback voltage of the other supply is duplicated by a  
resistordividerandappliedtotheTK/SSpin.Therefore,the  
voltageramprateonthispinisdeterminedbytheramprate  
of the other supply’s voltage. Note that the small soft-start  
capacitor charging current is always flowing, producing a  
small offset error. To minimize this error, one can select  
the tracking resistive divider value to be small enough to  
make this error negligible.  
be higher than V . To implement ratiometric tracking,  
OUT  
the ratio of the resistor divider connected to V  
determined by:  
is  
MASTER  
VOUT  
R2 R3+R4  
=
VMASTER R4 R1+R2  
So which mode should be programmed? While either  
mode in Figure 4 satisfies most practical applications,  
the coincident mode offers better output regulation.  
This concept can be better understood with the help of  
Figure 5. At the input stage of the LTC3851A-1’s error  
amplifier, two common anode diodes are used to clamp  
In order to track down another supply after the soft-start  
phase expires, the LTC3851A-1 must be configured for  
forced continuous operation by connecting MODE/PLLIN  
to INTV .  
CC  
V
V
V
MASTER  
OUT  
MASTER  
V
OUT  
3851A1  
3851A1 F03  
TIME  
TIME  
(3a) Coincident Tracking  
(3b) Ratiometric Tracking  
Figure 3. Two Different Modes of Output Voltage Tracking  
3851a1fa  
16  
LTC3851A-1  
applicaTions inForMaTion  
V
V
V
OUT  
V
OUT  
MASTER  
MASTER  
R3  
R3  
R1  
R2  
R3  
R4  
TO  
TK/SS  
PIN  
TO  
FB  
PIN  
TO  
TK/SS  
PIN  
TO  
FB  
PIN  
V
V
R4  
R4  
3851A1 F04  
(4a) Coincident Tracking Setup  
(4b) Ratiometric Tracking Setup  
Figure 4. Setup for Coincident and Ratiometric Tracking  
The LDO can supply a peak current of 50mA and must  
be bypassed to ground with a minimum of 2.2μF ceramic  
capacitor or low ESR electrolytic capacitor. No matter  
what type of bulk capacitor is used, an additional 0.1μF  
I
I
+
D1  
D2  
EA  
ceramic capacitor placed directly adjacent to the INTV  
CC  
TK/SS  
0.8V  
and GND pins is highly recommended. Good bypassing  
is needed to supply the high transient currents required  
by the MOSFET gate drivers.  
D3  
3851A1 F05  
V
FB  
Figure 5. Equivalent Input Circuit of Error Amplifier  
High input voltage applications in which large MOSFETs  
are being driven at high frequencies may cause the maxi-  
mum junction temperature rating for the LTC3851A-1 to  
the equivalent reference voltage and an additional diode  
is used to match the shifted common mode voltage. The  
top two current sources are of the same amplitude. In the  
coincidentmode, theTK/SSvoltageissubstantiallyhigher  
than 0.8V at steady state and effectively turns off D1. D2  
and D3 will therefore conduct the same current and offer  
be exceeded. The INTV current, which is dominated by  
CC  
the gate charge current, is supplied by the 5V LDO.  
Power dissipation for the IC in this case is highest and  
is approximately equal to V • I  
. The gate charge  
IN  
INTVCC  
current is dependent on operating frequency as discussed  
intheEfficiencyConsiderationssection. Thejunctiontem-  
perature can be estimated by using the equations given in  
Note 3 of the Electrical Characteristics. For example, the  
tight matching between V and the internal precision  
FB  
0.8V reference. In the ratiometric mode, however, TK/SS  
equals 0.8V at steady state. D1 will divert part of the bias  
current to make V slightly lower than 0.8V.  
FB  
LTC3851A-1 INTV current is limited to less than 17mA  
CC  
Although this error is minimized by the exponential I-V  
characteristic of the diode, it does impose a finite amount  
ofoutputvoltagedeviation.Furthermore,whenthemaster  
supply’s output experiences dynamic excursion (under  
load transient, for example), the slave channel output will  
be affected as well. For better output regulation, use the  
coincident tracking mode instead of ratiometric.  
from a 36V supply in the GN package:  
T = 70°C + (17mA)(36V)(90°C/W) = 125°C  
J
To prevent the maximum junction temperature from being  
exceeded, the input supply current must be checked while  
operating in continuous conduction mode (MODE/PLLIN  
= INTV ) at maximum V .  
CC  
IN  
INTV Regulator  
CC  
Topside MOSFET Driver Supply (C , D )  
B
B
The LTC3851A-1 features a PMOS low dropout linear  
An external bootstrap capacitor, C , connected to the  
B
regulator (LDO) that supplies power to INTV from the  
CC  
BOOST pin supplies the gate drive voltage for the topside  
V supply. INTV powers the gate drivers and much of  
IN  
CC  
MOSFET.CapacitorC intheFunctionalDiagramischarged  
B
the LTC3851A-1 ’s internal circuitry. The LDO regulates  
the voltage at the INTV pin to 5V.  
though external diode D from INTV when the SW pin  
B
CC  
CC  
3851a1fa  
17  
LTC3851A-1  
applicaTions inForMaTion  
required.Severalcapacitorsmayalsobeparalleledtomeet  
size or height requirements in the design. Always consult  
the manufacturer if there is any question.  
is low. When the topside MOSFET is to be turned on, the  
driver places the C voltage across the gate source of the  
B
MOSFET. This enhances the MOSFET and turns on the  
topside switch. The switch node voltage, SW, rises to V  
IN  
C
OUT  
Selection  
and the BOOST pin follows. With the topside MOSFET on,  
The selection of C  
is primarily determined by the effec-  
OUT  
the boost voltage is above the input supply:  
tiveseriesresistance, ESR, tominimizevoltageripple. The  
outputripple,V ,incontinuousmodeisdeterminedby:  
V
= V + V  
IN INTVCC  
BOOST  
OUT  
The value of the boost capacitor, C , needs to be 100 times  
B
1
that of the total input capacitance of the topside MOSFET.  
VOUT ∆I ESR+  
L
8fCOUT  
The reverse breakdown of the external Schottky diode  
must be greater than V  
.
IN(MAX)  
where f = operating frequency, C  
= output capacitance  
OUT  
Undervoltage Lockout  
and I = ripple current in the inductor. The output ripple  
L
is highest at maximum input voltage since I increases  
The LTC3851A-1 has two functions that help protect the  
controller in case of undervoltage conditions. A precision  
L
with input voltage. Typically, once the ESR requirement  
for C  
has been met, the RMS current rating gener-  
UVLOcomparatorconstantlymonitorstheINTV voltage  
OUT  
CC  
ally far exceeds the I  
requirement. With I =  
to ensure that an adequate gate-drive voltage is present.  
RIPPLE(P-P)  
L
0.3I  
and allowing 2/3 of the ripple to be due to  
It locks out the switching action when INTV is below  
OUT(MAX)  
CC  
ESR, the output ripple will be less than 50mV at maximum  
3.2V. To prevent oscillation when there is a disturbance  
V and:  
IN  
on the INTV , the UVLO comparator has 400mV of preci-  
CC  
sion hysteresis.  
COUT Required ESR < 2.2RSENSE  
1
Anotherwaytodetectanundervoltageconditionistomoni-  
COUT  
>
tor the V supply. Because the RUN pin has a precision  
IN  
8fRSENSE  
turn-on reference of 1.22V, one can use a resistor divider  
to V to turn on the IC when V is high enough.  
IN  
IN  
TherstconditionrelatestotheripplecurrentintotheESR  
oftheoutputcapacitancewhilethesecondtermguarantees  
thattheoutputcapacitancedoesnotsignificantlydischarge  
duringtheoperatingfrequencyperiodduetoripplecurrent.  
The choice of using smaller output capacitance increases  
the ripple voltage due to the discharging term but can be  
compensated for by using capacitors of very low ESR to  
C Selection  
IN  
Incontinuousmode, thesourcecurrentofthetopN-chan-  
nel MOSFET is a square wave of duty cycle V /V . To  
OUT IN  
preventlargevoltagetransients, alowESRinputcapacitor  
sized for the maximum RMS current must be used. The  
maximum RMS capacitor current is given by:  
maintain the ripple voltage at or below 50mV. The I pin  
TH  
OPTI-LOOP compensation components can be optimized  
to provide stable, high performance transient response  
regardless of the output capacitors selected.  
1/2  
VOUT  
V
V
OUT  
IN  
IRMS IO(MAX)  
– 1  
V
IN  
The selection of output capacitors for applications with  
largeloadcurrenttransientsisprimarilydeterminedbythe  
voltage tolerance specifications of the load. The resistive  
component of the capacitor, ESR, multiplied by the load  
current change, plus any output voltage ripple must be  
within the voltage tolerance of the load.  
This formula has a maximum at V = 2V , where I =  
RMS  
O(MAX)  
IN  
OUT  
I
/2. This simple worst-case condition is commonly  
usedfordesignbecauseevensignificantdeviationsdonot  
offermuchrelief.Notethatcapacitormanufacturersripple  
current ratings are often based on only 2000 hours of life.  
This makes it advisable to further derate the capacitor or  
to choose a capacitor rated at a higher temperature than  
3851a1fa  
18  
LTC3851A-1  
applicaTions inForMaTion  
The required ESR due to a load current step is:  
∆V  
AVX TPSV or the KEMET T510 series of surface mount  
tantalums, available in case heights ranging from 1.5mm  
to 4.1mm. Aluminum electrolytic capacitors can be used  
in cost-driven applications, provided that consideration is  
given to ripple current ratings, temperature and long-term  
reliability. Atypicalapplicationwillrequireseveraltomany  
aluminum electrolytic capacitors in parallel. A combina-  
tion of the above mentioned capacitors will often result  
in maximizing performance and minimizing overall cost.  
Other capacitor types include Nichicon PL series, NEC  
Neocap, Panasonic SP and Sprague 595D series. Consult  
manufacturers for other specific recommendations.  
RESR  
∆I  
where  
(or minimum load) and  
Iisthechangeincurrentfromfullloadtozeroload  
V is the allowed voltage devia-  
tion (not including any droop due to finite capacitance).  
The amount of capacitance needed is determined by the  
maximum energy stored in the inductor. The capacitance  
must be sufficient to absorb the change in inductor  
current when a high current to low current transition  
occurs. The opposite load current transition is generally  
determined by thecontrolloop OPTI-LOOPcomponents,  
so make sure not to over compensate and slow down  
the response. The minimum capacitance to assure the  
inductors’ energy is adequately absorbed is:  
Like all components, capacitors are not ideal. Each  
capacitor has its own benefits and limitations. Combina-  
tions of different capacitor types have proven to be a very  
cost effective solution. Remember also to include high  
frequency decoupling capacitors. They should be placed  
as close as possible to the power pins of the load. Any  
inductance present in the circuit board traces negates  
their usefulness.  
2
L ∆I  
( )  
C
>
OUT  
2 ∆V V  
(
)
OUT  
where I is the change in load current.  
Setting Output Voltage  
Manufacturers such as Nichicon, United Chemi-Con and  
Sanyo can be considered for high performance through-  
hole capacitors. The OS-CON semiconductor electrolyte  
capacitor available from Sanyo has the lowest (ESR)(size)  
product of any aluminum electrolytic at a somewhat  
higher price. An additional ceramic capacitor in parallel  
with OS-CON capacitors is recommended to reduce the  
inductance effects.  
The LTC3851A-1 output voltage is set by an external feed-  
back resistive divider carefully placed across the output,  
as shown in Figure 6. The regulated output voltage is  
determined by:  
RB  
RA  
VOUT = 0.8V 1+  
Insurfacemountapplications,ESR,RMScurrenthandling  
and load step specifications may require multiple capaci-  
tors in parallel. Aluminum electrolytic, dry tantalum and  
special polymer capacitors are available in surface mount  
packages.Specialpolymersurfacemountcapacitorsoffer  
very low ESR but have much lower capacitive density per  
unit volume than other capacitor types. These capacitors  
offeraverycost-effectiveoutputcapacitorsolutionandare  
an ideal choice when combined with a controller having  
highloopbandwidth.Tantalumcapacitorsofferthehighest  
capacitance density and are often used as output capaci-  
tors for switching regulators having controlled soft-start.  
Several excellent surge-tested choices are the AVX TPS,  
To improve the transient response, a feed-forward  
capacitor, C , may be used. Great care should be taken  
FF  
to route the V line away from noise sources, such as  
FB  
the inductor or the SW line.  
V
OUT  
R
B
C
FF  
LTC3851A-1  
V
FB  
R
A
3851A1 F06  
Figure 6. Settling Output Voltage  
3851a1fa  
19  
LTC3851A-1  
applicaTions inForMaTion  
Fault Conditions: Current Limit and Current Foldback  
Phase-Locked Loop and Frequency Synchronization  
The LTC3851A-1 includes current foldback to help limit  
load current when the output is shorted to ground. If the  
output falls below 40% of its nominal output level, the  
maximum sense voltage is progressively lowered from  
its maximum programmed value to about 25% of the  
that value. Foldback current limiting is disabled during  
soft-start or tracking. Under short-circuit conditions  
with very low duty cycles, the LTC3851A-1 will begin  
cycle skipping in order to limit the short-circuit current.  
In this situation the bottom MOSFET will be dissipating  
most of the power but less than in normal operation. The  
short-circuitripplecurrentisdeterminedbytheminimum  
on-time, tON(MIN), of the LTC3851A-1 (≈90ns), the input  
voltage and inductor value:  
TheLTC3851A-1hasaphase-lockedloop(PLL)comprised  
of an internal voltage-controlled oscillator (V ) and a  
CO  
phase detector. This allows the turn-on of the top MOSFET  
to be locked to the rising edge of an external clock signal  
applied to the MODE/PLLIN pin. This phase detector is  
an edge sensitive digital type that provides zero degrees  
phase shift between the external and internal oscillators.  
This type of phase detector does not exhibit false lock to  
harmonics of the external clock.  
The output of the phase detector is a pair of complemen-  
tary current sources that charge or discharge the external  
filter network connected to the FREQ/PLLFLTR pin. Note  
that the LTC3851A-1 can only be synchronized to an  
external clock whose frequency is within range of the  
V
L
LTC3851A-1’s internal V .This is guaranteed to be be-  
CO  
IN  
∆IL(SC) = tON(MIN)  
tween 250kHz and 750kHz. A simplified block diagram is  
shown in Figure 8.  
The resulting short-circuit current is:  
If the external clock frequency is greater than the internal  
1/4MaxVSENSE  
RSENSE  
1
2
oscillator’s frequency, f , then current is sunk con-  
ISC =  
– ∆IL(SC)  
OSC  
tinuouslyfromthephasedetectoroutput,pullingdownthe  
FREQ/PLLFLTR pin. When the external clock frequency is  
Programming Switching Frequency  
less than f  
, current is sourced continuously, pulling up  
OSC  
theFREQ/PLLFLTRpin.Iftheexternalandinternalfrequen-  
ciesarethesamebutexhibitaphasedifference,thecurrent  
sourcesturnonforanamountoftimecorrespondingtothe  
phase difference. The voltage on the FREQ/PLLFLTR pin is  
adjusted until the phase and frequency of the internal and  
external oscillators are identical. At the stable operating  
point, the phase detector output is high impedance and  
TosettheswitchingfrequencyoftheLTC3851A-1,connect  
a resistor, R  
, between FREQ/PLLFLTR and GND. The  
FREQ  
relationship between the oscillator frequency and R  
FREQ  
is shown in Figure 7. A 0.1µF bypass capacitor should be  
connected in parallel with R  
.
FREQ  
750  
700  
650  
600  
550  
500  
450  
400  
350  
300  
250  
the filter capacitor C holds the voltage.  
LP  
R
LP  
2.7V  
C
LP  
FREQ/PLLFLTR  
VCO  
MODE/  
PLLIN  
DIGITAL  
PHASE/  
FREQUENCY  
DETECTOR  
EXTERNAL  
OSCILLATOR  
20  
60  
80 100 120 140 160  
(kΩ)  
40  
R
FREQ  
3851A1 F07  
3851A1 F08  
Figure 7. Relationship Between Oscillator Frequency  
and Resistor Connected Between FREQ/PLLFLTR and GND  
Figure 8. Phase-Locked Loop Block Diagram  
3851a1fa  
20  
LTC3851A-1  
applicaTions inForMaTion  
minimum on-time gradually increases. This is of particu-  
lar concern in forced continuous applications with low  
ripple current at light loads. If the duty cycle drops below  
the minimum on-time limit in this situation, a significant  
amount of cycle skipping can occur with correspondingly  
larger current and voltage ripple.  
The loop filter components, C and R , smooth out  
LP  
LP  
the current pulses from the phase detector and provide  
a stable input to the voltage-controlled oscillator. The  
filter components C and R determine how fast the  
LP  
LP  
loop acquires lock. Typically R is 1k to 10k and C is  
LP  
LP  
2200pF to 0.01μF.  
When the external oscillator is active before the LTC3851  
is enabled, the internal oscillator frequency will track the  
externaloscillatorfrequencyasdescribedinthepreceding  
paragraphs. In situations where the LTC3851 is enabled  
before the external oscillator is active, a low free-running  
oscillatorfrequencyofapproximately50kHzwillresult.Itis  
possibletoincreasethefree-running,pre-synchronization  
Efficiency Considerations  
The percent efficiency of a switching regulator is equal to  
the output power divided by the input power times 100%.  
It is often useful to analyze individual losses to determine  
what is limiting the efficiency and which change would  
produce the most improvement. Percent efficiency can  
be expressed as:  
frequency by adding a second resistor, R  
, in parallel  
FREQ  
with R and C . R  
will also cause a phase difference  
LP  
LP FREQ  
%Efficiency = 100% – (L1 + L2 + L3 + ...)  
between the internal and external oscillator signals. The  
where L1, L2, etc. are the individual losses as a percent-  
age of input power.  
magnitudeofthephasedifferenceisinverselyproportional  
to the value R  
. The free-running frequency may be  
FREQ  
programmed by using Figure 7 to determine the appropri-  
Although all dissipative elements in the circuit produce  
losses, four main sources usually account for most of  
ate value of R  
. In order to maintain adequate phase  
FREQ  
margin for the PLL, the typical value for C is 0.01µF and  
the losses in LTC3851A-1 circuits: 1) IC V current, 2)  
LP  
IN  
2
the typical value for R is 1k.  
INTV regulatorcurrent,3)I Rlosses,4)topsideMOSFET  
LP  
CC  
transition losses.  
The external clock (on MODE/PLLIN pin) input high  
threshold is nominally 1.6V, while the input low threshold  
is nominally 1.2V.  
1. The V current is the DC supply current given in the  
IN  
ElectricalCharacteristicstable,whichexcludesMOSFET  
driver current. V current typically results in a small  
IN  
Minimum On-Time Considerations  
(<0.1%) loss.  
Minimum on-time, t  
, is the smallest time dura-  
ON(MIN)  
2. INTVCC current is the sum of the MOSFET driver and  
control currents. The MOSFET driver current results  
from switching the gate capacitance of the power  
MOSFETs. Each time a MOSFET gate is switched from  
low to high to low again, a packet of charge dQ moves  
fromINTVCC toground. TheresultingdQ/dtisacurrent  
out of INTVCC that is typically much larger than the  
control circuit current. In continuous mode, IGATECHG  
= f(QT + QB), where QT and QB are the gate charges of  
the topside and bottom side MOSFETs.  
tion that the LTC3851A-1 is capable of turning on the top  
MOSFET. It isdetermined by internaltiming delays and the  
gate charge required to turn on the top MOSFET. Low duty  
cycle applications may approach this minimum on-time  
limit and care should be taken to ensure that:  
VOUT  
tON(MIN)  
<
V (f)  
IN  
If the duty cycle falls below what can be accommodated  
by the minimum on-time, the controller will begin to skip  
cycles. The output voltage will continue to be regulated,  
but the ripple voltage and current will increase.  
2
3. I R losses are predicted from the DC resistances of  
the fuse (if used), MOSFET, inductor and current sense  
resistor.Incontinuousmode,theaverageoutputcurrent  
flows through L and R  
, but is chopped between  
SENSE  
Theminimumon-timefortheLTC3851A-1isapproximately  
90ns. However, as the peak sense voltage decreases the  
the topside MOSFET and the synchronous MOSFET.  
3851a1fa  
21  
LTC3851A-1  
applicaTions inForMaTion  
time V  
can be monitored for excessive overshoot or  
If the two MOSFETs have approximately the same  
OUT  
ringing, which would indicate a stability problem. The  
R
, then theresistance ofoneMOSFETcan simply  
DS(ON)  
availability of the I pin not only allows optimization of  
be summed with the resistances of L and R  
to  
TH  
SENSE  
=10mΩ,  
2
control loop behavior but also provides a DC-coupled and  
AC-filtered closed-loop response test point. The DC step,  
rise time and settling at this test point truly reflects the  
closed-loop response. Assuming apredominantly second  
ordersystem, phasemarginand/ordampingfactorcanbe  
estimated using the percentage of overshoot seen at this  
pin.Thebandwidthcanalsobeestimatedbyexaminingthe  
obtainI Rlosses.Forexample,ifeachR  
DS(ON)  
DCR = 10mΩ and R  
= 5mΩ, then the total resis-  
SENSE  
tance is 25mΩ. This results in losses ranging from 2%  
to 8% as the output current increases from 3A to 15A  
for a 5V output, or a 3% to 12% loss for a 3.3V output.  
Efficiency varies as the inverse square of V  
for the  
OUT  
sameexternalcomponentsandoutputpowerlevel. The  
combined effects of increasingly lower output voltages  
andhighercurrentsrequiredbyhighperformancedigital  
systemsisnotdoublingbutquadruplingtheimportance  
of loss terms in the switching regulator system!  
rise time at the pin. The I external components shown  
TH  
in the Typical Application circuit will provide an adequate  
starting point for most applications.  
The I series R -C filter sets the dominant pole-zero  
TH  
C
C
loop compensation. The values can be modified slightly  
(from 0.5 to 2 times their suggested values) to optimize  
transient response once the final PC layout is done and  
the particular output capacitor type and value have been  
determined. The output capacitors need to be selected  
because the various types and values determine the loop  
gain and phase. An output current pulse of 20% to 80%  
of full-load current having a rise time of 1μs to 10μs will  
4. Transition losses apply only to the topside MOSFET(s),  
and become significant only when operating at high  
input voltages (typically 15V or greater). Transition  
losses can be estimated from:  
2
Transition Loss = (1.7)V • I  
• C  
• f  
IN  
O(MAX)  
RSS  
Other hidden losses such as copper trace and the battery  
internal resistance can account for an additional 5% to  
10% efficiency degradation in portable systems. It is very  
important to include these system level losses during the  
design phase. The internal battery and fuse resistance  
produce output voltage and I pin waveforms that will  
TH  
give a sense of the overall loop stability without breaking  
the feedback loop. Placing a power MOSFET directly  
across the output capacitor and driving the gate with an  
appropriate signal generator is a practical way to produce  
a realistic load step condition. The initial output voltage  
step resulting from the step change in output current may  
not be within the bandwidth of the feedback loop, so this  
signal cannot be used to determine phase margin. This  
losses can be minimized by making sure that C has ad-  
IN  
equate charge storage and very low ESR at the switching  
frequency.A25Wsupplywilltypicallyrequireaminimumof  
20μF to 40μF of capacitance having a maximum of 20mΩ  
to 50mΩ of ESR. Other losses including Schottky con-  
duction losses during dead time and inductor core losses  
generally account for less than 2% total additional loss.  
is why it is better to look at the I pin signal which is in  
TH  
the feedback loop and is the filtered and compensated  
Checking Transient Response  
control loop response. The midband gain of the loop will  
be increased by increasing R and the bandwidth of the  
C
The regulator loop response can be checked by looking at  
the load current transient response. Switching regulators  
take several cycles to respond to a step in DC (resistive)  
loop will be increased by decreasing C . If R is increased  
C
C
bythesamefactorthatC isdecreased,thezerofrequency  
C
will be kept the same, thereby keeping the phase shift the  
same in the most critical frequency range of the feedback  
loop. The output voltage settling behavior is related to the  
stability of the closed-loop system and will demonstrate  
the actual overall supply performance.  
load current. When a load step occurs, V  
shifts by an  
OUT  
amount equal to I  
(ESR), where ESR is the effective  
LOAD  
series resistance of C . I  
also begins to charge or  
generating the feedback error signal that  
OUT  
LOAD  
discharge C  
OUT  
forces the regulator to adapt to the current change and  
return V  
to its steady-state value. During this recovery  
OUT  
3851a1fa  
22  
LTC3851A-1  
applicaTions inForMaTion  
A second, more severe transient is caused by switching  
in loads with large (>1μF) supply bypass capacitors. The  
dischargedbypasscapacitorsareeffectivelyputinparallel  
PC Board Layout Checklist  
When laying out the printed circuit board, the following  
checklist should be used to ensure proper operation of the  
LTC3851A-1. These items are also illustrated graphically  
in the layout diagram of Figure 9. Check the following in  
your layout:  
with C , causing a rapid drop in V . No regulator can  
OUT  
OUT  
alter its delivery of current quickly enough to prevent this  
sudden step change in output voltage if the load switch  
resistance is low and it is driven quickly. If the ratio of  
1. Are the board signal and power grounds segregated?  
TheLTC3851A-1GNDpinshouldtietothegroundplane  
closetotheinputcapacitor(s).Thelowcurrentorsignal  
ground lines should make a single point tie directly to  
the GND pin. The synchronous MOSFET source pins  
should connect to the input capacitor(s) ground.  
C
LOAD  
to C  
is greater than 1:50, the switch rise time  
OUT  
should be controlled so that the load rise time is limited  
to approximately 25 • C . Thus a 10μF capacitor would  
LOAD  
require a 250μs rise time, limiting the charging current  
to about 200mA.  
+
0.1mF  
1
2
3
4
5
6
7
8
16  
15  
14  
13  
12  
11  
10  
9
MODE/PLLIN  
SW  
TG  
R
FREQ  
C
IN  
M1  
FREQ/PLLFLTR  
RUN  
BOOST  
V
IN  
LTC3851A-1  
C
SS  
D1  
TK/SS  
V
IN  
C
C2  
C
C
D
B
B
C
R
C
M2  
I
TH  
INTV  
CC  
47pF  
+
V
BG  
GND  
4.7µF  
FB  
+
SENSE  
SENSE  
1000pF  
R
PGOOD  
PGOOD  
V
PULL-UP  
L1  
R1  
R2  
C
OUT  
V
OUT  
+
+
R
SENSE  
3851A1 F09  
Figure 9. LTC385±A-± Layout Diagram  
3851a1fa  
23  
LTC3851A-1  
applicaTions inForMaTion  
2. Does the V pin connect directly to the feedback resis-  
PC Board Layout Debugging  
FB  
tors? The resistive divider R1, R2 must be connected  
It is helpful to use a DC-50MHz current probe to monitor  
thecurrentintheinductorwhiletestingthecircuit.Monitor  
the output switching node (SW pin) to synchronize the  
oscilloscope to the internal oscillator and probe the actual  
outputvoltageaswell. Checkforproperperformanceover  
the operating voltage and current range expected in the  
application. The frequency of operation should be main-  
tained over the input voltage range down to dropout and  
until the output load drops below the low current opera-  
tion threshold—typically 10% of the maximum designed  
current level in Burst Mode operation.  
between the (+) plate of C  
and signal ground. The  
OUT  
47pF to 100pF capacitor should be as close as possible  
to the LTC3851A-1. Be careful locating the feedback  
resistors too far away from the LTC3851A-1. The V  
FB  
line should not be routed close to any other nodes with  
high slew rates.  
+
3. Are the SENSE and SENSE leads routed together  
with minimum PC trace spacing? The filter capacitor  
+
between SENSE and SENSE should be as close as  
possible to the LTC3851A-1. Ensure accurate current  
sensingwithKelvinconnectionsasshowninFigure 10.  
Series resistance can be added to the SENSE lines to  
increase noise rejection and to compensate for the ESL  
Thedutycyclepercentageshouldbemaintainedfromcycle  
tocycleinawelldesigned, lownoisePCBimplementation.  
Variation in the duty cycle at a subharmonic rate can sug-  
gest noise pick-up at the current or voltage sensing inputs  
or inadequate loop compensation. Overcompensation of  
the loop can be used to tame a poor PC layout if regulator  
bandwidth optimization is not required.  
of R  
.
SENSE  
4. Does the (+) terminal of C connect to the drain of  
IN  
the topside MOSFET(s) as closely as possible? This  
capacitor provides the AC current to the MOSFET(s).  
5. Is the INTV decoupling capacitor connected closely  
Reduce V from its nominal level to verify operation  
CC  
IN  
between INTV and GND? This capacitor carries the  
of the regulator in dropout. Check the operation of the  
CC  
MOSFETdriverpeakcurrents.Anadditional1μFceramic  
undervoltage lockout circuit by further lowering V while  
IN  
capacitor placed immediately next to the INTV and  
monitoring the outputs to verify operation.  
CC  
GND pins can help improve noise performance.  
Investigate whether any problems exist only at higher out-  
put currents or only at higher input voltages. If problems  
coincide with high input voltages and low output currents,  
look for capacitive coupling between the BOOST, SW, TG  
and possibly BG connections and the sensitive voltage  
and current pins. The capacitor placed across the current  
sensing pins needs to be placed immediately adjacent to  
the pins of the IC. This capacitor helps to minimize the  
effects of differential noise injection due to high frequency  
capacitive coupling. If problems are encountered with  
high current output loading at lower input voltages, look  
6. Keep the switching node (SW), top gate node (TG) and  
boost node (BOOST) away from sensitive small-signal  
nodes, especially from the voltage and current sensing  
feedback pins. All of these nodes have very large and  
fast moving signals and therefore should be kept on  
the “output side” (Pin 9 to Pin 16) of the LTC3851A-1  
and occupy minimum PC trace area.  
HIGH CURRENT PATH  
for inductive coupling between C , the Schottky and the  
IN  
top MOSFET to the sensitive current and voltage sens-  
ing traces. In addition, investigate common ground path  
voltage pickup between these components and the GND  
pin of the IC.  
3851A1 F10  
CURRENT SENSE  
RESISTOR  
(R  
)
SENSE  
+
SENSE SENSE  
Figure ±0. Kelvin Sensing RSENSE  
3851a1fa  
24  
LTC3851A-1  
applicaTions inForMaTion  
ThepowerdissipationonthetopsideMOSFETcanbeeasily  
estimated. Choosing a Fairchild FDS6982S dual MOSFET  
Design Example  
As a design example, assume V = 12V (nominal), V =  
22V (maximum), V  
(refer to Figure 12).  
IN  
MAX  
IN  
results in: R  
= 0.035Ω/0.022Ω, C  
= 215pF.  
DS(ON)  
MILLER  
= 1.8V, I  
= 5A, and f = 250kHz  
OUT  
At maximum input voltage with T (estimated) = 50°C:  
1.8V  
22V  
2
The inductance value is chosen first based on a 30%  
ripple current assumption. The highest value of ripple  
current occurs at the maximum input voltage. Connect a  
160k resistor between the FREQ/PLLFLTR and GND pins,  
generating 250kHz operation. The minimum inductance  
for 30% ripple current is:  
PMAIN  
=
5
( )  
1+ 0.005 50°C 25°C •  
(
)
(
)
⎣ ⎦  
5A  
2
2
0.035Ω + 22V  
) (  
2Ω 215pF •  
)(  
(
)
(
)
1
1
+
250kHz = 185mW  
(
)
52.3 2.3  
VOUT  
1
∆IL =  
VOUT 1−  
A short-circuit to ground will result in a folded back cur-  
rent of:  
f L  
( )( )  
V
IN  
A 4.7µH inductor will produce 28% ripple current and  
a 3.3µH will result in 40%. The peak inductor current  
will be the maximum DC value plus one-half the ripple  
current, or 6A, for the 3.3µH value. Increasing the ripple  
current will also help ensure that the minimum on-time  
of 90ns is not violated. The minimum on-time occurs at  
90ns 22V  
29mV  
0.0125Ω  
1
2
(
)
ISC =  
= 2.02A  
3.3µH  
with a typical value of R  
= 0.125. The resulting power dissipated in the bottom  
and δ = (0.005/°C)(25°C)  
DS(ON)  
MOSFET is:  
maximum V :  
IN  
22V  
22V  
2
P
=
2.02A 1.125 0.022Ω = 101.0mW  
VOUT  
1.8V  
22V 250kHz  
(
) (  
)(  
)
SYNC  
tON(MIN)  
=
=
= 327ns  
V
f
IN(MAX)( )  
(
)
which is less than under full-load conditions.  
C is chosen for an RMS current rating of at least 3A at  
The R  
resistor value can be calculated by using the  
SENSE  
IN  
maximum current sense voltage specification with some  
accommodation for tolerances.  
temperature. C  
is chosen with an ESR of 0.02Ω for  
OUT  
low output ripple. The output ripple in continuous mode  
will be highest at the maximum input voltage. The output  
voltage ripple due to ESR is approximately:  
50mV  
6A  
RSENSE  
= 0.0083Ω  
V
= R (I ) = 0.02Ω (2A) = 40mV  
ESR L P-P  
ORIPPLE  
Choosing 1% resistors: R1 = 25.5k and R2 = 32.4k yields  
an output voltage of 1.816V.  
3851a1fa  
25  
LTC3851A-1  
Typical applicaTions  
V
IN  
4.5V TO 32V  
MODE/PLLIN  
V
IN  
+
C
R
IN  
FREQ  
22µF  
82.5k  
M1  
FREQ/PLLFLTR  
TG  
BOOST  
SW  
HAT2170H  
C
B
0.1µF  
RUN  
C20  
0.1µF  
C
SS  
L1  
0.68µH  
LTC3851A-1  
0.1µF  
V
3.3V  
15A  
OUT  
TK/SS  
C
C
D
C
B
R
C2  
R2  
154k  
1%  
C
C15  
47pF  
2200pF  
R27  
3.01k  
CMDSH05-4  
330pF  
15k  
I
INTV  
CC  
+
C
TH  
OUT  
330µF  
4.7µF  
×2  
R1  
48.7k  
1%  
M2  
HAT2170H  
V
BG  
GND  
FB  
+
SENSE  
SENSE  
C5  
0.047µF  
R
PG  
30.1k  
C
C
: SANYO 6TPE330MIL  
OUT  
IN  
V
PGOOD  
PULL-UP  
: SANYO 63HVH22M  
L1: VISHAY IHLP5050-EZERR68M01  
3851A1 F11  
Figure ±±. High Efficiency 3.3V/±5A Step-Down Converter  
V
IN  
4.5V TO 22V  
MODE/PLLIN  
V
IN  
C
22µF  
25V  
+
IN  
R
FREQ  
160k  
M1  
FREQ/PLLFLTR  
TG  
BOOST  
SW  
FDS6982S  
C
B
0.1µF  
0.1µF  
RUN  
C
SS  
L1  
3.3µH  
R
SENSE  
0.01Ω  
LTC3851A-1  
0.1µF  
V
1.8V  
5A  
OUT  
TK/SS  
C
C
R2  
32.4k  
1%  
D
B
R
C
C
470pF  
C2  
CMDSH-3  
C
OUT  
33k  
220pF  
+
150µF  
I
TH  
INTV  
CC  
6.3V  
×2  
PANASONIC SP  
R1  
25.5k  
1%  
4.7µF  
M2  
FDS6982S  
V
BG  
GND  
FB  
+
SENSE  
SENSE  
1000pF  
R
PG  
PGOOD  
V
PULL-UP  
C
C
: PANASONIC EEFUEOG151R  
OUT  
IN  
: MARCON THCR70LE1H226ZT  
L1: PANASONIC ETQP6F3R3HFA  
: IRC LR 2010-01-R010F  
R
SENSE  
3851A1 F12  
Figure ±2. ±.8V/5A Converter from Design Example with Pulse Skip Operation  
3851a1fa  
26  
LTC3851A-1  
package DescripTion  
UD Package  
±6-Lead Plastic QFN (3mm × 3mm)  
(Reference LTC DWG # 05-08-1691)  
0.70 ±0.05  
3.50 ± 0.05  
2.10 ± 0.05  
1.45 ± 0.05  
(4 SIDES)  
PACKAGE  
OUTLINE  
0.25 ±0.05  
0.50 BSC  
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS  
BOTTOM VIEW—EXPOSED PAD  
PIN 1 NOTCH R = 0.20 TYP  
OR 0.25 × 45° CHAMFER  
R = 0.115  
TYP  
0.75 ± 0.05  
3.00 ± 0.10  
(4 SIDES)  
15 16  
PIN 1  
TOP MARK  
(NOTE 6)  
0.40 ± 0.10  
1
2
1.45 ± 0.10  
(4-SIDES)  
(UD16) QFN 0904  
0.200 REF  
0.25 ± 0.05  
0.50 BSC  
0.00 – 0.05  
NOTE:  
1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WEED-2)  
2. DRAWING NOT TO SCALE  
3. ALL DIMENSIONS ARE IN MILLIMETERS  
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE  
5. EXPOSED PAD SHALL BE SOLDER PLATED  
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION  
ON THE TOP AND BOTTOM OF PACKAGE  
3851a1fa  
27  
LTC3851A-1  
package DescripTion  
MSE Package  
±6-Lead Plastic MSOP, Exposed Die Pad  
(Reference LTC DWG # 05-08-1667 Rev C)  
BOTTOM VIEW OF  
EXPOSED PAD OPTION  
2.845 ± 0.102  
(.112 ± .004)  
2.845 ± 0.102  
(.112 ± .004)  
0.889 ± 0.127  
(.035 ± .005)  
1
8
0.35  
REF  
5.23  
(.206)  
MIN  
1.651 ± 0.102  
(.065 ± .004)  
1.651 ± 0.102  
(.065 ± .004)  
3.20 – 3.45  
(.126 – .136)  
0.12 REF  
DETAIL “B”  
CORNER TAIL IS PART OF  
THE LEADFRAME FEATURE.  
FOR REFERENCE ONLY  
DETAIL “B”  
16  
9
0.305 ± 0.038  
0.50  
(.0197)  
BSC  
NO MEASUREMENT PURPOSE  
4.039 ± 0.102  
(.159 ± .004)  
(NOTE 3)  
(.0120 ± .0015)  
TYP  
0.280 ± 0.076  
(.011 ± .003)  
RECOMMENDED SOLDER PAD LAYOUT  
16151413121110  
9
REF  
DETAIL “A”  
0° – 6° TYP  
0.254  
(.010)  
3.00 ± 0.102  
(.118 ± .004)  
(NOTE 4)  
4.90 ± 0.152  
(.193 ± .006)  
GAUGE PLANE  
0.53 ± 0.152  
(.021 ± .006)  
1 2 3 4 5 6 7 8  
DETAIL “A”  
0.86  
(.034)  
REF  
1.10  
(.043)  
MAX  
0.18  
(.007)  
SEATING  
PLANE  
0.17 – 0.27  
(.007 – .011)  
TYP  
0.1016 ± 0.0508  
(.004 ± .002)  
MSOP (MSE16) 0910 REV C  
0.50  
(.0197)  
BSC  
NOTE:  
1. DIMENSIONS IN MILLIMETER/(INCH)  
2. DRAWING NOT TO SCALE  
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.  
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE  
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.  
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE  
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX  
3851a1fa  
28  
LTC3851A-1  
revision hisTory  
REV  
DATE  
DESCRIPTION  
PAGE NUMBER  
A
5/11  
Added H-Grade and MP-Grade parts. Reflected througout the data sheet.  
1-30  
3851a1fa  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-  
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.  
29  
LTC3851A-1  
Typical applicaTion  
±.5V/±5A Synchronized at 350kHz  
V
IN  
6V TO 14V  
PLLIN  
350kHz  
MODE/PLLIN  
V
IN  
C2  
+
R5  
1k  
C
0.01µF  
IN  
180µF  
M1  
FREQ/PLLFLTR  
TG  
BOOST  
SW  
RJK0305DPB  
C
B
C1  
1000pF  
0.1µF  
RUN  
C
SS  
L1  
0.68µH  
R
SENSE  
0.002Ω  
LTC3851A-1  
0.1µF  
V
1.5V  
15A  
OUT  
TK/SS  
C
C
R2  
43.2k  
1%  
D
R
B
C
7.5k  
C10  
33pF  
C
1000pF  
C2  
CMDSH-3  
100pF  
+
C
OUT  
I
INTV  
CC  
TH  
330µF  
R1  
20k  
1%  
×2  
4.7µF  
M2  
RJK0301DPB  
V
BG  
GND  
FB  
+
SENSE  
SENSE  
C
: SANYO 2R5TPE330M9  
1000pF  
OUT  
R
PG  
L1: SUMIDA CEP125-OR6MC  
PGOOD  
V
PULL-UP  
R22 10Ω  
R20 10Ω  
3851A1 TA03  
relaTeD parTs  
PART NUMBER  
DESCRIPTION  
COMMENTS  
LTC3854  
Small Footprint Wide V Range Synchronous Step-Down Fixed 400kHz Operating Frequency, 4.5V≤ V ≤ 38V,  
IN  
IN  
DC/DC Controller  
0.8V ≤ V  
≤ 5.25V, 2mm × 3mm QFN-12  
OUT  
LTC3878  
LTC3879  
No R ™ Constant On-Time Synchronous Step-Down  
Very Fast Transient Response, t  
= 43ns, 4V≤ V ≤ 38V,  
IN  
SENSE  
ON(MIN)  
DC/DC Controller  
0.8V ≤ V  
≤ 0.9V , SSOP-16  
OUT IN  
No R Constant On-Time Synchronous Step-Down  
Very Fast Transient Response, t  
0.6V ≤ V  
= 43ns, 4V≤ V ≤ 38V,  
IN  
SENSE  
ON(MIN)  
DC/DC Controller  
≤ 0.9V , MSOP-16E, 3mm × 3mm QFN-16  
IN  
OUT  
LTC3850/LTC3850-1 Dual 2-Phase, High Efficiency Synchronous Step-Down  
Phase-Lockable Fixed Operating Frequency 250kHz to 780kHz,  
4V≤ V ≤ 30V, 0.8V ≤ V ≤ 5.25V  
LTC3850-2  
DC/DC Controllers, R  
Tracking  
or DCR Current Sensing and  
SENSE  
IN  
OUT  
LTC3853  
Triple Output, Multiphase Synchronous Step-Down DC/DC Phase-Lockable Fixed Operating Frequency 250kHz to 750kHz,  
Controller, R or DCR Current Sensing and Tracking 4V≤ V ≤ 24V, V Up to 13.5V  
SENSE  
IN  
OUT  
LTC3834/LTC3834-1 Low I , Synchronous Step-Down DC/DC Controller  
Phase-Lockable Fixed Operating Frequency 140kHz to 650kHz,  
4V≤ V ≤ 36V, 0.8V ≤ V ≤ 10V, I = 30µA,  
Q
IN  
OUT  
Q
LT®3845A  
LTC3775  
Low I , High Voltage Synchronous Step-Down DC/DC  
Adjustable Fixed Operating Frequency 100kHz to 500kHz,  
4V≤ V ≤ 60V, 1.23V ≤ V ≤ 36V, I = 30µA, TSSOP-16  
Q
Controller  
IN  
OUT  
Q
High Frequency Synchronous Voltage Mode Step-Down  
DC/DC Controller  
Synchronizable Fixed Frequency 250kHz to 1MHz, t  
= 30ns,  
ON(MIN)  
4V ≤ V ≤ 38V, 0.6V ≤ V  
≤ 0.8V , MSOP-16E, 3mm × 3mm  
IN  
IN  
OUT  
QFN-16  
3851a1fa  
LT 0511 REV A • PRINTED IN USA  
LinearTechnology Corporation  
1630 McCarthy Blvd., Milpitas, CA 95035-7417  
30  
LINEAR TECHNOLOGY CORPORATION 2010  
(408)432-1900 FAX: (408) 434-0507 www.linear.com  

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