LTC3877 [Linear]

PolyPhase Step-Down Synchronous Slave Controller with Sub-Milliohm DCR Sensing;
LTC3877
型号: LTC3877
厂家: Linear    Linear
描述:

PolyPhase Step-Down Synchronous Slave Controller with Sub-Milliohm DCR Sensing

文件: 总22页 (文件大小:1006K)
中文:  中文翻译
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LTC3874-1  
PolyPhase Step-Down  
Synchronous Slave Controller with  
Sub-Milliohm DCR Sensing  
FeaTures  
DescripTion  
The LTC®3874-1 is a dual PolyPhase® current mode syn-  
chronous step-down slave controller. It enables high cur-  
rent,multiphaseapplicationswhenpairedwithacompanion  
master controller by extending the phase count. Compat-  
ible master controllers include the LTC3884-1, LTC3774,  
LTC3875,LTC3877andLTC3866.TheLTC3874-1employs  
a unique architecture that enhances the signal-to-noise  
ratio of the current sense signal, allowing the use of sub-  
milliohm DC resistance power inductors to maximize  
efficiency while reducing switching jitter. Its peak current  
mode architecture allows for accurate phase-to-phase  
current sharing even for dynamic loads.  
n
Phase Extender for High Phase Count Voltage Rails  
Operates with Power Blocks, DrMOS or External  
Gate Drivers and MOSFETs  
Accurate Phase-to-Phase Current Sharing  
Sub-Milliohm DCR Current Sensing  
n
n
n
n
n
n
n
n
Phase-Lockable Fixed Frequency 250kHz to 1MHz  
Immediate Response to Master IC's Fault  
Up to 12-Phase Operation  
Wide V Range: 4.5 to 38V  
IN  
V
Range : Up to 3.5V (LOWDCR Pin High)  
OUT  
Up to 5.5V (LOWDCR Pin Low)  
n
n
n
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Proprietary Current Mode Control Loop  
Programmable CCM/DCM Operation  
Programmable Phase Shift Control  
24-Lead (4mm × 4mm) QFN Package  
Effectivelyworkingwithamastercontroller,theLTC3874-1  
supports all the programmable features as well as fault  
protection.  
L, LT, LTC, LTM, Linear Technology, the Linear logo, PolyPhase and µModule are registered  
trademarks of Analog Devices, Inc. All other trademarks are the property of their respective  
owners. Protected by U.S. Patents, including 5481178, 5705919, 5929620, 6144194, 6177787,  
6580258, 5408150.  
applicaTions  
n
High Current Distributed Power Systems  
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Telecom, Datacom and Storage Systems  
n
Intelligent Energy Efficient Power Regulation  
Typical applicaTion  
High Efficiency, 4-Phase 1.8V/120A Step-Down Supply  
V
IN  
7V TO 14V  
4-Phase Efficiency and Power  
V
IN  
LTC3874-1  
PWM0  
PWM1  
Loss vs Output Current, Sub-  
(0.29mΩ DCR)  
0.215µH  
(0.29mΩ DCR)  
0.215µH  
V
OUT  
Milliohm DCR vs Traditional  
DCR  
1.8V  
DrMOS  
DrMOS  
120A  
649Ω  
649Ω  
100µF  
×3  
100µF  
×3  
470µF  
×2  
470µF  
×2  
100  
95  
90  
85  
80  
75  
70  
20  
17  
14  
11  
8
0.22µF  
0.22µF  
V
V
f
= 12V  
+
IN  
OUT  
= 425kHz  
+
= 1.8V  
+
+
SW  
I
I
I
I
SENSE0  
SENSE0  
SENSE1  
SENSE1  
CCM  
EFFICIENCY  
LTC3884-1  
RUN0  
RUN1  
RUN0  
INTV  
CC  
RUN1  
V
CC0  
4.7µF  
FAULT0  
FAULT1  
PGOOD0  
FAULT0  
FAULT1  
V
CC1  
PHASMD  
POWER LOSS  
1.8V  
MODE0 LDWDCR  
+
+
V
V
SENSE0  
SENSE1  
PGOOD1  
MODE1  
TH0  
ILIM  
0.29mΩ  
1.5mΩ  
0.29mΩ  
1.5mΩ  
I
I
TH0  
100k  
5
I
I
FREQ  
GND  
TH1  
SYNC  
TH1  
SYNC  
2
0
10 20 30 40 50 60 70 80 90 100 110 120  
LOAD CURRENT (A)  
38741 TA01a  
38741 TA01b  
REFER TO LTC3884-1 DATA SHEET  
FOR MASTER SETUP  
PIN NOT USED IN THIS CIRCUIT: EXTV  
CC  
38741f  
1
For more information www.linear/LTC3874-1  
LTC3874-1  
absoluTe MaxiMuM raTings  
pin conFiguraTion  
(Note 1)  
TOP VIEW  
V ............................................................. −0.3V to 40V  
IN  
V
, V .................................................... −0.3V to 6V  
CC0 CC1  
+
+
I
, I  
, I  
, I  
.....0.3V to INTV  
SENSE0 SENSE0 SENSE1 SENSE1 CC  
24 23 22 21 20 19  
+
EXTV , INTV , RUN0, RUN1 .................... −0.3V to 6V  
CC  
CC  
I
I
1
2
3
4
5
6
18  
17  
V
V
SENSE0  
CC0  
IN  
MODE0, MODE1, ILIM, LOWDCR,  
SENSE0  
PHASMD, FREQ .................................... −0.3V to INTVcc  
RUN0  
RUN1  
16 INTV  
CC  
25  
GND  
SYNC, FAULT0, FAULT1, I , I ......... −0.3V to INTVcc  
15 EXTV  
TH0 TH1  
CC  
I
I
INTV Peak Output Current................................100mA  
14  
13  
V
CC1  
SENSE1  
CC  
+
PWM1  
SENSE1  
Operating Junction Temperature Range  
7
8
9 10 11 12  
(Note 2).................................................. −40°C to 125°C  
Storage Temperature Range .................. −65°C to 150°C  
UF PACKAGE  
24-LEAD (4mm × 4mm) PLASTIC QFN  
T
= 125°C, θ = 46.9°C/W, θ = 4.5°C/W  
JMAX  
JA  
JC_BOT  
EXPOSED PAD (PIN 25) IS GND, MUST BE SOLDERED TO PCB  
orDer inForMaTion  
http://www.linear.com/product/LTC3874-1#orderinfo  
LEAD FREE FINISH  
LTC3874EUF-1#PBF  
LTC3874IUF-1#PBF  
TAPE AND REEL  
PART MARKING*  
38741  
PACKAGE DESCRIPTION  
TEMPERATURE RANGE  
–40°C to 125°C  
LTC3874EUF-1#TRPBF  
LTC3874IUF-1#TRPBF  
24-Lead (4mm × 4mm) Plastic QFN  
24-Lead (4mm × 4mm) Plastic QFN  
38741  
–40°C to 125°C  
Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container.  
For more information on lead free part marking, go to: http://www.linear.com/leadfree/  
For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/. Some packages are available in 500 unit reels through  
designated sales channels with #TRMPBF suffix.  
38741f  
2
For more information www.linear.com/LTC3874-1  
LTC3874-1  
elecTrical characTerisTics The l denotes the specifications which apply over the specified operating  
junction temperature range, otherwise specifications are at TA = 25°C (Note 2). VIN = 12V, VRUN0,1 = 3.3V unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
V
V
Input Voltage Range  
Output Voltage Range  
4.5  
38  
V
IN  
LOWDCR = INTV (Note 3)  
3.5  
5.5  
V
V
OUT  
CC  
LOWDCR = 0V  
I
Q
Input DC Supply Current  
Normal Operation  
Shutdown  
V
V
= 3.3V  
= 0V  
4.6  
1.8  
mA  
mA  
RUN0,1  
RUN0,1  
V
UVLO  
Undervoltage Lockout Threshold  
V
V
Falling  
Rising  
3.5  
3.8  
V
V
INTVCC  
INTVCC  
Control Loop  
l
I
I
Pins Bias Current  
V
V
< (V  
> (V  
– 3.3V)  
– 3.3V)  
0.15  
1
0.4  
3
µA  
µA  
ISENSE0,1  
SENSE  
ISENSE0,1  
ISENSE0,1  
INTVCC  
INTVCC  
V
Maximum Current Sense Threshold  
(Table 3)  
ILIM = INTV , LOWDCR = INTV  
ISENSE0,1  
ISENSE(MAX)  
l
l
l
l
,
CC  
26.8  
14.5  
65  
28.8  
16  
30.8  
17.5  
79  
mV  
mV  
mV  
mV  
CC  
V
= 1.2V, V = 2.18V  
ITH  
ILIM = 0V, LOWDCR = INTV  
ISENSE0,1  
,
CC  
V
= 1.2V, V = 2.18V  
ITH  
ILIM = INTV , LOWDCR = 0V,  
72  
CC  
V
= 1.2V, V = 2.18V  
ITH  
ISENSE0,1  
ILIM = 0V, LOWDCR = 0V,  
= 1.2V, V = 2.18V  
33  
40  
47  
V
ISENSE0,1  
ITH  
PWM Outputs  
l
l
PWM  
PWM Output High Voltage  
PWM Output Low Voltage  
PWM Output Current in Hi-Z State  
I
I
= 500µA  
= –500µA  
V
CC  
– 0.2  
V
V
µA  
LOAD  
LOAD  
0.2  
5
–5  
t
Minimum On-Time  
(Note 4)  
60  
ns  
ON(MIN)  
INTV Regulator  
CC  
V
V
V
V
V
Internal V Voltage No Load  
6V < V < 38V  
5.25  
4.5  
5.5  
0.5  
4.7  
50  
5.75  
2
V
%
INTVCC  
CC  
IN  
INT  
INTV Load Regulation  
I
= 0mA to 20mA  
CC  
LDO  
CC  
l
EXTV Switchover Voltage  
V Ramping Positive (Note 5)  
EXTVCC  
V
EXTVCC  
CC  
EXT  
EXTV Voltage Drop  
I
= 20mA, V = 5V  
EXTVCC  
100  
mV  
mV  
LDO  
CC  
CC  
EXTV Hysteresis  
300  
LDOHYS  
CC  
Oscillator and Phase-Locked Loop  
l
f
f
I
PLL SYNC Range  
250  
9
1000  
11  
kHz  
kHz  
µA  
RANGE  
NOM  
Nominal Frequency  
V
FREQ  
= 0.9V  
500  
10  
Frequency Setting Current  
FREQ  
-
-
SYNC to Ch0 Phase Relationship Based on  
PHASMD = 0  
180  
60  
Deg  
Deg  
Deg  
Deg  
θ
θ
θ
SYNC  
0
the Falling Edge of SYNC and Rising Edge of PHASMD = 1/3 INTV  
CC  
CC  
PWM0  
PHASMD = 2/3 INTV  
PHASMD = INTV  
120  
90  
CC  
SYNC to Ch1 Phase Relationship Based on  
PHASMD = 0  
0
Deg  
Deg  
Deg  
Deg  
θ
SYNC  
1
the Falling Edge of SYNC and Rising Edge of PHASMD = 1/3 INTV  
300  
240  
270  
CC  
CC  
PWM1  
PHASMD = 2/3 INTV  
PHASMD = INTV  
CC  
Digital Inputs RUN0, RUN1, MODE0, MODE1, FAULT0, FAULT1, LOWDCR  
l
l
V
IH  
V
IL  
Input High Threshold Voltage  
Input Low Threshold Voltage  
2.0  
V
V
1.4  
38741f  
3
For more information www.linear/LTC3874-1  
LTC3874-1  
elecTrical characTerisTics  
Note 1: Stresses beyond those listed under Absolute Maximum Ratings  
may cause permanent damage to the device. Exposure to any Absolute  
Maximum Rating condition for extended periods may affect device  
reliability and lifetime.  
conditions in conjunction with board layout, the related package thermal  
impedance and other environmental factors. The junction temperature T  
J
is calculated from the ambient temperature T and power dissipation PD  
A
according to the following formula: T = T + (PD 46.9°C/W)  
J
A
Note 2: The LTC3874-1 is tested under pulsed load conditions such  
Note 3: Output voltage is set and controlled by master controller in  
multiphase operations.  
that T ≈ T . The LTC3874E-1 is guaranteed to meet specifications  
J
A
from 0°C to 85°C junction temperature. Specifications over the –40°Ç  
to 125°C operating junction temperature range are assured by design,  
characterization and correlation with statistical process controls. The  
LTC3874I-1 is guaranteed over the –40°C to 125°C operating junction  
temperature range. Note that the maximum ambient temperature  
consistent with these specifications is determined by specific operating  
Note 4: The minimum on-time condition corresponds to an inductor  
peak-to-peak ripple current ≥40% of I  
(see Minimum On-Time  
MAX  
Considerations in the Applications Information section).  
Note 5: EXTV is enabled only if V is higher than 6.5V.  
CC  
IN  
Typical perForMance characTerisTics (TA = 25°C unless otherwise specified)  
Efficiency vs Output Current  
and Mode (4-Phase with Master  
Controller LTC3884-1)  
Efficiency vs Output Current  
and Mode (4-Phase with Master  
Controller LTC3884-1)  
Efficiency and Power Loss vs  
Output Current (4-Phase with  
Master Controller LTC3884-1)  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
100  
95  
90  
85  
80  
75  
70  
20  
17  
14  
11  
8
V
V
f
= 12V  
= 1.8V  
= 425kHz  
IN  
OUT  
SW  
CCM  
EFFICIENCY  
V
= 12V  
IN  
V
V
V
f
= 12V  
IN  
OUT  
SW  
= 1.2V  
OUT  
SW  
= 1.8V  
f
= 425kHz  
= 425kHz  
POWER LOSS  
0.29mΩ  
1.5mΩ  
0.29mΩ  
1.5mΩ  
CCM  
DCM  
5
CCM  
DCM  
2
0
10 20 30 40 50 60 70 80 90 100 110 120  
0
10 20 30 40 50 60 70 80 90 100 110 120  
0
10 20 30 40 50 60 70 80 90 100 110 120  
LOAD CURRENT (A)  
LOAD CURRENT (A)  
LOAD CURRENT (A)  
38741 G1  
38741 G2  
38741 G3  
Load Step (Forced Continuous  
Mode) 4-Phase with Master  
Controller LTC3884-1  
Load Step (Discontinuous  
Conduction Mode) 4-Phase with  
Master Controller LTC3884-1  
I
I
LOAD  
LOAD  
50A/DIV  
50A/DIV  
I
I
L(MASTER0)  
10A/DIV  
(MASTER0)  
10A/DIV  
I
(SLAVE0)  
I
L(SLAVE0)  
10A/DIV  
10A/DIV  
V
V
OUT  
OUT  
AC-COUPLED  
AC-COUPLED  
50mV/DIV  
50mV/DIV  
38741 G04  
38741 G05  
50µs/DIV  
50µs/DIV  
V
= 12V  
IN  
V
= 12V  
IN  
V
= 1.2V  
OUT  
V
= 1.2V  
OUT  
I
0A TO 20A  
LOAD  
I
0A TO 20A  
LOAD  
38741f  
4
For more information www.linear.com/LTC3874-1  
LTC3874-1  
Typical perForMance characTerisTics (TA = 25°C unless otherwise specified)  
Start-Up Into a Prebiased Load  
2-Phase Operation LTC3884-1  
and LTC3874-1  
Inductor Current at Light Load  
RUN  
ALL RUN PINS  
TIED TOGETHER  
2V/DIV  
FORCED  
CONTINUOUS  
MODE  
5A/DIV  
V
OUT  
IN CCM  
DISCONTINUOUS  
CONDUCTION  
MODE  
500mV/DIV  
5A/DIV  
38741 G06  
38741 G07  
1µs/DIV  
2ms/DIV  
V
V
12V  
OUT  
V
OUT  
= 12V  
IN  
IN  
= 1.2V  
V
= 1.2V  
Current Sense Threshold vs  
Quiescent Current vs Temperature  
without EXTVCC  
INTVCC Line Regulation  
ITH Voltage  
6
5
4
3
100  
80  
6
5
4
3
2
1
0
LOWDCR = L, RANGE = H  
60  
LOWDCR = L,  
RANGE = L  
40  
20  
LOWDCR = H,  
RANGE = L  
0
LOWDCR = H,  
RANGE = H  
–20  
–40  
0
0.5  
1
1.5  
(V)  
2
2.5  
3
–50  
0
50  
100  
150  
0
10  
20  
INPUT VOLTAGE (V)  
30  
40  
TEMPERATURE (°C)  
V
ITH  
38741 G10  
38741 G8  
38741 G9  
Maximum Current Sense Threshold  
vs Common Mode Voltage  
(LOWDCR = INTVCC, VITH = 2.18V)  
Undervoltage Lockout Threshold  
(INTVCC vs Threshold)  
Quiescent Current vs Input  
Voltage without EXTVCC  
6
4.1  
30  
25  
20  
15  
10  
5
I
= INTV  
CC  
LIM  
RISING  
3.9  
3.7  
3.5  
3.3  
3.1  
2.9  
2.7  
2.5  
5
4
3
FALLING  
I
= GND  
LIM  
0
45  
125  
0
10  
20  
30  
40  
0.5 1.0 1.5 2.0  
–50  
–5  
95  
0
2.5 3.0 3.5  
INPUT VOLTAGE (V)  
TEMPERATURE (°C)  
V
COMMON MODE VOLTAGE (V)  
ISENSE  
38741 G13  
38741 G12  
38741 G11  
38741f  
5
For more information www.linear/LTC3874-1  
LTC3874-1  
pin FuncTions  
+
+
I
/I  
(Pin 1/Pin 6): Current Sense Compara-  
is a three-state compatible output. To support three-state  
mode, an external resistor divider is typically used from  
CC0 CC1  
SENSE0 SENSE1  
tor Inputs. The (+) inputs to the current comparators are  
normally connected to DCR sensing networks.  
V
/V  
to ground.  
I
/I  
(Pin 2/Pin 5): Current Sense Compara-  
V
/V (Pin 18/Pin 14): PWM Pin Driver Supplies.  
SENSE0 SENSE1  
CC0 CC1  
tor Inputs. The (−) inputs to the current comparators are  
Decouple this pin to GND with a capacitor (0.1μF) to an  
connected to the outputs.  
external supply or tie this pin to the INTV pin. PWM0/  
PWM1 signal swing is from ground to V /V  
CC  
.
CC0 CC1  
RUN0/RUN1 (Pin 3/Pin 4): Enable Run Inputs. Logic high  
on the RUN pin enables the corresponding channel.  
EXTV (Pin15):ExternalPowerInputtoanInternalSwitch  
CC  
Connected to INTV . The switch closes and supplies the  
CC  
MODE0/MODE1(Pin 24/Pin 7): DCM/CCM Mode Control  
Pins. Each channel runs in forced continuous mode if the  
modepinislogichigh. Thereisaninternal500kpull-down  
resistor on the mode pin. To select discontinuous conduc-  
tion mode, float or pull down the mode pin.  
IC power, bypassing the internal low dropout regulator,  
whenever EXTV is higher than 4.7V and V is greater  
CC  
IN  
than 7V. Do not exceed 6V on this pin.  
INTV (Pin16):Internal5.5VRegulatorOutput.Thecontrol  
CC  
circuits are powered from this voltage. Decouple this pin  
to GND with a minimum of 4.7μF low ESR tantalum or  
ceramic capacitor.  
I
/I (Pin 23/Pin 8): Current Control Threshold. Each  
TH0 TH1  
associatedchannel’scurrentcomparatortrippingthreshold  
increases with its I voltage. These pins must be con-  
nected to the master controller’s I pins.  
TH  
V (Pin 17): Main Input Supply. Decouple this pin to GND  
TH  
IN  
with a capacitor (0.1μF to 1μF).  
FREQ(Pin 9): Frequency Set Pin. There is a precision  
10µA current flowing out of this pin. A resistor to ground  
sets a voltage which in turn programs the frequency. This  
pin sets the default switching frequency when there is no  
externalclockontheSYNCpin.Seetheapplicationsection  
for detailed information.  
FAULT0/FAULT1 (Pin 21/Pin 20): Master Controller Fault  
Inputs. Connect these pins to the master chip fault indica-  
tor pins to respond to the fault signals from the master  
controller. When a FAULT pin is floating or low, the PWM  
pin of the corresponding channel is in three-state. There  
is an internal 500k pull-down resistor on each FAULT pin.  
ILIM(Pin 10): Current Comparators Sense Voltage Limit.  
Program a DC voltage at this pin to set the maximum cur-  
rent sense threshold for the current comparators.  
LOWDCR(Pin 22): Sub-milliohm DCR Current Sensing  
Enable Pin. There is an internal 500k pull-up resistor  
between the LOWDCR pin and INTV . Floating or pull-  
CC  
SYNC(Pin11):ExternalClockSynchronizationInput.Ifan  
externalclockispresentatthispin,theswitchingfrequency  
will be synchronized to the falling edge of external clock.  
Tie this pin to GND if not used.  
ing this pin logic high will enable the sub-milliohm DCR  
current sensing. Pulling this pin logic low will disable the  
sub-milliohm DCR current sensing.  
GND(Exposed Pad Pin 25): Ground. Connect this pad,  
through vias, to a solid ground plane under the circuit.  
The sources of the bottom N-channel MOSFETs, the (–)  
PHASMD (Pin 12): Phase Set Pin. This pin determines the  
relative phases between the external clock on pin SYNC  
and the internal controllers. See Table 1 in the Operation  
section for details.  
terminal of C  
, and the (–) terminal of C should  
INTVCC  
IN  
connect to this ground plane as closely as possible to  
the IC. All small-signal components and compensation  
components should also connect to this ground plane.  
PWM0/PWM1(Pin 19/Pin 13): (Top) Gate Signal Outputs.  
This signal goes to the PWM or top gate input of the exter-  
nal driver, integrated driver MOSFET or power block. This  
38741f  
6
For more information www.linear.com/LTC3874-1  
LTC3874-1  
One of Two Channels (CH0) Shown  
FuncTional block DiagraM  
10µA  
SYNC  
PHASMD  
EXTV  
CC  
4.7V  
V
IN  
FREQ  
SYNC/PHASE  
DETECT  
V
IN  
+
C
IN  
PLL-SYNC  
5.5V  
REG  
OSC  
S
R
INTV  
CC  
Q
I
I
5K  
CMP  
REV  
+
+
V
CC0  
ON  
SWITCH  
LOGIC  
AND  
ANTI-  
SHOOT-  
THROUGH  
REV  
UVLO  
FAULTB  
FCNT  
PWM0  
I
DrMOS  
LIM  
I
RANGE SELECT  
HI: 1:1  
LO: 1:1.8  
LIM  
1
5k  
+
C
OUT0  
DC  
AMP  
RUN  
SLOPE  
COMPENSATION  
+
I
I
SENSE0  
SENSE0  
INTV  
CC  
UVLO  
38741 BD  
1
60k  
INTV  
CC  
1.7V  
REF  
I
TH0  
SGND  
LOWDCR MODE0  
RUN0  
FAULT0  
38741f  
7
For more information www.linear/LTC3874-1  
LTC3874-1  
operaTion  
Main Control Loop  
current mode architectures, the current limit threshold is  
still a function of the inductor peak current and the DCR  
The LTC3874-1 is a constant frequency, LTC proprietary  
currentmodestep-downslavecontrollerforparallelopera-  
tionwithmastercontrollers.Duringnormaloperation,each  
top MOSFET is turned on when the clock for that channel  
sets the RS latch, and turned off when the main current  
value, andcanbeaccuratelysetwiththeILIMandI pins.  
TH  
INTV /EXTV Power  
CC  
CC  
PowerformostinternalcircuitryisderivedfromtheINTV  
CC  
pin. When the EXTV pin is left open or tied to a voltage  
comparator, I  
, resets the RS latch. The peak inductor  
CMP  
TH  
CC  
CMP  
less than 4.7V, an internal 5.5V linear regulator supplies  
INTV power from V . If EXTV is taken above 4.7V  
current at which I  
resets the RS latch is controlled by  
thevoltageontheI pin, whichistheoutputofthemaster  
CC  
IN  
CC  
and V is higher than 7V, the 5.5V regulator is turned off  
controller. When the load current increases, the master  
IN  
and an internal switch is turned on connecting EXTV .  
controller increases the I voltage, which in turn causes  
CC  
TH  
EXTV canbeappliedbeforeV .UsingtheEXTV allows  
the peak current in the corresponding slave channels to  
increase, until the average inductor current matches the  
new load current. After the top MOSFET has turned off,  
the bottom MOSFET is turned on until the beginning of  
the next cycle in Continuous Conduction Mode (CCM) or  
until the inductor current starts to reverse, as indicated  
CC  
IN  
CC  
the INTV power to be drawn from an external source.  
CC  
Start-Up and Shutdown (RUN0, RUN1)  
The two channels of the LTC3874-1 can be independently  
shut down using the RUN0 and RUN1 pins. Pulling either  
of these pins below 1.4V shuts down the main control  
circuitsforthatchannel. Duringshutdown, thePWMpinis  
in three-state mode. Pulling either of these pins above 2V  
enables the controller. The RUN0/1 pins are actively pulled  
by the reverse current comparator I , in Discontinuous  
REV  
ConductionMode(DCM).TheLTC3874-1slavecontrollers  
DO NOT regulate the output voltage but regulate the cur-  
rent in each channel for current sharing with the master  
controllers. Output voltage regulation is achieved through  
thevoltagefeedbackcontrolloopinthemastercontrollers.  
down until the INTV voltage passes the undervoltage  
CC  
lockout threshold of 3.8V. For multiphase operation, the  
RUN0/1 pins must be connected together and driven by  
the RUN pins on the master controller. Because a large  
RC filter in the LTC3874-1 needs to settle during initializa-  
Sub-Milliohm DCR Current Sensing  
The LTC3874-1 employs a unique architecture to enhance  
the signal-to-noise ratio that enables it to operate with  
a small sense signal of a sub-milliohm value inductor  
DCR to improve power efficiency and reduce jitter due to  
switching noise.  
tion, the RUN pins can only be pulled up 4ms after V  
IN  
is ready. Do not exceed the Absolute Maximum Rating of  
6V on these pins.  
The start-up of each channel’s output voltage V  
is  
OUT  
controlled by the master controller. After the RUN pins are  
released, the master controller drives the output based on  
the programmed delay time and rise time. The slave con-  
Floating or pulling the LOWDCR pin high will enable sub-  
milliohm DCR current sensing. The LTC3874-1 can sense  
a DCR value as low as 0.2mΩ with careful PCB layout.  
The proprietary signal processing circuit provides a 14dB  
signal-to-noise ratio improvement. As with conventional  
trollerLTC3874-1followstheI voltagesetbythemaster  
TH  
to supply the same current to the output during startup.  
38741f  
8
For more information www.linear.com/LTC3874-1  
LTC3874-1  
operaTion  
Light Load Current Operation (Discontinuous  
Conduction Mode, Continuous Conduction Mode)  
The SYNC pin is used to synchronize switching frequency  
betweenthemasterandslavecontrollers.Inputcapacitance  
ESR requirements and efficiency losses are substantially  
reduced because the peak current drawn from the input  
capacitor is effectively divided by the number of phases  
used and power loss is proportional to the RMS current  
squared. A two stage, single output voltage implementa-  
tion can reduce input path power loss by 75% and radi-  
cally reduce the required RMS current rating of the input  
capacitor(s).  
The LTC3874-1 can operate either in discontinuous con-  
duction mode or forced continuous conduction mode.  
To select forced continuous mode, tie the MODE pin to a  
DC voltage above 2V (e.g., INTV ). To select discontinu-  
CC  
ous conduction mode, tie the MODE pin to a DC voltage  
below 1.4V (e.g., GND).In forced continuous mode,  
the inductor current is allowed to reverse at light loads  
or under large transient conditions. The peak inductor  
current is determined by the voltage on the I pin. In  
TH  
Single Output Multiphase Operation  
this mode, the efficiency at light loads is lower than in  
discontinuous mode. However, continuous mode has the  
advantages of lower output ripple and less interference  
with audio circuitry. When the MODE pin is connected to  
GND, the LTC3874-1 operates in discontinuous mode at  
light loads. At very light loads, the current comparator  
The LTC3874-1 is configured for single output multiphase  
converters with a master controller by making these con-  
nections  
Tie all the I pins of paralleled channels together for  
TH  
current sharing between masters and slaves;  
I
may remain tripped for several cycles and force the  
CMP  
Tie all SYNC or PLLIN pins of paralleled channels to-  
gether or tie the master chip’s CLKOUT pin to the slave  
chip’sSYNCpinforswitchingfrequencysynchronization  
among channels.  
external top MOSFET to stay off for the same number of  
cycles (i.e., skipping pulses). This mode provides higher  
light load efficiency than forced continuous mode and the  
inductor current is not allowed to reverse. There is a 500k  
pull-down resistor internally connected to the MODE pin.  
If the MODE0/1 pins are left floating, both channels are in  
discontinuous conduction mode by default.  
Tie all the RUN pins of paralleled channels together for  
startup and shutdown at the same time.  
Tie the fault indictor pin of the master controller if avail-  
able to the FAULT pin of the slave controller for fault  
protection.  
Multichip Operations (PHASMD and SYNC Pins)  
The PHASMD pin determines the relative phases between  
theinternalchannelsaswellastheexternalclocksignalon  
SYNC pin as shown in Table 1. The phases tabulated are  
relative to zero degree phase being defined as the falling  
edge of the clock on SYNC pin.  
TheLTC3874-1MODEpincanbetiedtothemasterchip  
PGOOD pin for start-up control. During soft-start, the  
LTC3874-1operatesinDCMmode. Whenthesoft-start  
intervalisdone, theLTC3874-1operatesinCCMmode.  
Examples of single output multiphase converters are  
shown in Figure 1.  
Table 1  
PHASMD  
CHANNEL 0 PHASE  
CHANNEL 1 PHASE  
GND  
180°  
60°  
0°  
The Typical Application on the first page of this data sheet  
is a basic LTC3874-1 application circuit configured as a  
slavecontroller.Inparalleledoperation,thecurrentsensing  
scheme and circuit parameters in the LTC3874-1 have to  
be the same as the master controller to achieve balanced  
current sharing between masters and slaves. Input and  
output capacitors are selected based on RMS current  
rating, ripple and transient specs.  
1/3 INTV  
300°  
240°  
270°  
CC  
2/3 INTV or Float  
120°  
90°  
CC  
INTV  
CC  
38741f  
9
For more information www.linear/LTC3874-1  
LTC3874-1  
operaTion  
3 PHASE OPERATION  
3 PHASE + 1 PHASE OPERATION  
CH0  
CH1  
120°  
CH1  
CH2  
180°  
LTC3884-1  
SYNC  
CH0  
60°  
LTC3874-1  
SYNC  
CH1  
0°  
240°  
0°  
300°  
LTC3866  
CLKOUT  
LTC3874-1  
SYNC  
PHASMD = 1/3 INTV  
PHASMD = 1/3 INTV  
CC  
CC  
4 PHASE OPERATION  
4 PHASE OPERATION  
CH1  
CH2  
180°  
CH0  
90°  
LTC3874-1  
SYNC  
CH1  
CH1  
CH2  
180°  
LTC3884-1  
SYNC  
CH0  
90°  
LTC3874-1  
SYNC  
CH1  
0°  
270°  
0°  
270°  
LTC3774  
CLKOUT  
PHASMD = FLOAT  
PHASMD = GND  
PHASMD = INTV  
CC  
6 PHASE OPERATION  
6 PHASE OPERATION  
CH1  
CH2  
120°  
LTC3774  
CLKOUT  
CH0  
240°  
LTC3874-1  
SYNC  
CH1  
CH0  
180°  
CH1  
300°  
CH1  
CH2  
180°  
LTC3884-1  
SYNC  
CH0  
60°  
LTC3874-1  
SYNC  
CH1  
CH0  
120°  
LTC3874-1  
SYNC  
CH1  
0°  
60°  
0°  
300°  
240°  
LTC3874-1  
SYNC  
PHASMD = INTV  
PHASMD = GND  
PHASMD = 2/3 INTV  
PHASMD = 1/3 INTV  
PHASMD = 2/3 INTV  
CC  
CC  
CC  
CC  
38741 F01  
Figure 1. Multiphase Operation  
Frequency Selection and Phase-Locked Loop  
(FREQ and SYNC Pins)  
flowing out of the FREQ pin, so the user can program the  
controller’s switching frequency with a single resistor to  
GND. A curve is provided later in the application section  
showing the relationship between the voltage on the FREQ  
pin and switching frequency (Figure 5). A phase-locked  
loop (PLL) is integrated in the LTC3874-1 to synchronize  
the internal oscillator to an external clock source on the  
SYNC pin. The PLL loop filter network is integrated inside  
the LTC3874-1. The phase-locked loop is capable of lock-  
ing to any frequency within the range of 250kHz to 1MHz.  
The frequency setting resistor should always be present  
to set the controller’s initial switching frequency before  
locking to the external clock.  
The selection of switching frequency is a trade-off be-  
tween efficiency and component size. Low frequency  
operation increases efficiency by reducing MOSFET  
switching losses, but requires larger inductance and/or  
capacitance to maintain low output ripple voltage. The  
switching frequency of the LTC3874-1 controllers can be  
selected using the FREQ pin. If the SYNC pin is not be-  
ing driven by an external clock source, the FREQ pin can  
be used to program the controller’s operating frequency  
from 250kHz to 1MHz. There is a precision 10µA current  
38741f  
10  
For more information www.linear.com/LTC3874-1  
LTC3874-1  
applicaTions inForMaTion  
Current Limit Programming  
Table 3. Current Sense Threshold vs ITH Voltage (continued)  
CURRENT SENSE THRESHOLD (mV)  
To match the master controller current limit, each channel  
of the LTC3874-1 can be programmed separately with  
the ILIM and LOWDCR pins. The 4-level logic input pin  
ILIM setup summary is shown in Table 2. When ILIM is  
grounded, both channels are set to be low current range.  
LOWDCR = H  
LOWDCR = L  
I
(V)  
RANGE = H  
RANGE = L  
10.5  
RANGE = H  
RANGE = L  
26.2  
TH  
1.58  
1.51  
1.45  
1.38  
18.9  
17.7  
16.6  
15.5  
47.2  
44.3  
41.5  
38.6  
9.9  
24.6  
9.2  
23.0  
When ILIM is tied to INTV , both channels are set to be  
CC  
8.6  
21.4  
high current range.  
Which setting should be used? For balanced load current  
sharing, use the same current range setting as in the  
master controller. Note, the LTC3874-1 does not have  
+
I
and I  
Pins  
SENSE  
SENSE  
+
I
and I  
are the inputs to the current com-  
SENSE  
SENSE  
active clamping circuit on I pin for peak current limit  
TH  
parators. When the LOWDCR pin is high, their common  
and over current protection. Over current protection relies  
mode input voltage range is 0V to 3.5V. I  
should  
SENSE  
on the master controller to drive the I pin not to exceed  
TH  
be connected directly to V  
of the master controller.  
OUT  
+
the clamped voltage. The relationship between the current  
I
is connected to an R C filter with time constant  
SENSE  
sense threshold and I voltage can be found in Table 3.  
TH  
one-fifth of L/DCR of the output inductor. Care must be  
takennottofloatthesepinsduringnormaloperation.Filter  
components, especially capacitors, must be placed close  
to the LTC3874-1, and the sense lines should run close  
together to a Kelvin connection underneath the current  
senseelement.TheLTC3874-1isdesignedtobeusedwith  
a sub-milliohm DCR value; without proper care, parasitic  
resistance, capacitance and inductance will degrade the  
current sense signal integrity, making the programmed  
current limit unpredictable. In Figure 2, resistor R must be  
placedclosetotheoutputinductorandcapacitorCcloseto  
the IC pins to prevent noise coupling to the sense signal.  
Table 2. ILIM vs Range  
CHANNEL 0  
CURRENT LIMIT  
CHANNEL 1  
CURRENT LIMIT  
ILIM  
GND  
Range Low  
Range High  
Range Low  
Range High  
Range Low  
Range Low  
Range High  
Range High  
1/3 INTV  
CC  
2/3 INTV or Float  
CC  
INTVcc  
Table 3. Current Sense Threshold vs ITH Voltage  
CURRENT SENSE THRESHOLD (mV)  
LOWDCR = H  
LOWDCR = L  
The LTC3874-1 can also be used like any conventional  
current mode controller by disabling the LOWDCR pin,  
I
(V)  
RANGE = H  
RANGE = L  
18.1  
RANGE = H  
81.3  
RANGE = L  
45.1  
TH  
2.40  
2.33  
2.26  
2.20  
2.18  
2.13  
2.06  
1.99  
1.92  
1.85  
1.79  
1.72  
1.68  
32.5  
31.4  
30.2  
29.1  
28.8  
28.0  
26.8  
25.7  
24.6  
23.4  
22.3  
21.1  
20.4  
connecting it to ground. An RC filter can be used to sense  
17.4  
78.4  
43.6  
+
the output inductor signal and connects to the I  
16.8  
75.6  
42.0  
SENSE  
pin. Its time constant, R C, should equal to L/DCR of  
the output inductor. By pulling down the LOWDCR pin,  
the current limit increases by 2.5 times. See Table 3 for  
details. In these applications, the common mode operat-  
16.2  
72.7  
40.4  
16.0  
72.0  
40.0  
15.5  
69.9  
38.8  
14.9  
67.1  
37.3  
+
ing voltage range of I  
, I  
is from 0V to 5.5V.  
SENSE SENSE  
14.3  
64.2  
35.7  
13.6  
61.4  
34.1  
Table 4. Output Voltage Range vs LOWDCR Pin  
13.0  
58.5  
32.5  
LOWDCR  
Low  
OUTPUT VOLTAGE  
12.4  
55.7  
30.9  
0V to 5.5V  
0V to 3.5V  
11.7  
52.8  
29.4  
High  
11.3  
51.0  
28.4  
38741f  
11  
For more information www.linear/LTC3874-1  
LTC3874-1  
applicaTions inForMaTion  
V
IN  
Toensurethattheloadcurrentwillbedeliveredoverthefull  
operating temperature range, the temperature coefficient  
of the DCR resistance, approximately 0.4%/°C, should be  
taken into consideration.  
V
IN  
INDUCTANCE  
DCR  
LTC3874-1  
PWM  
L
DrMOS  
V
OUT  
Typically, C is selected in the range of 0.047µF to 0.47µF.  
This forces R to around 2kΩ, reducing error that might  
have been caused by the I  
pins’ 1uA current.  
SENSE  
R
+
I
I
SENSE  
SENSE  
There will be some power loss in R that relates to the duty  
cycle. It will be highest in continuous mode at maximum  
input voltage:  
C
38741 F02  
V
IN(MAX) VOUT V  
Figure 2 Inductor DCR Current Sensing  
(
LOSS (R)=  
)
OUT  
P
R
Inductor DCR Current Sensing  
Ensure that R has a power rating higher than this value.  
However, DCR sensing eliminates the conduction loss  
of a sense resistor; it will provide a better efficiency at  
heavy loads. To maintain a good signal-to-noise ratio for  
the current sense signal, using a minimum ∆V  
2mV for duty cycles less than 40% is desirable when the  
LOWDCR pin is high; use a minimum ∆V of 10mV  
for duty cycles less than 40% when the LOWDCR pin is  
low. The actual ripple voltage will be determined by the  
following equation:  
TheLTC3874-1isspecificallydesignedforhighloadcurrent  
applications requiring the highest possible efficiency; it is  
capable of sensing the signal of an inductor DCR in the  
sub-milliohm range (Figure 2). The DCR is the DC winding  
resistance of the inductor’s copper, which is often less  
than 1mΩ for high current inductors. In high current and  
low output voltage applications, conduction loss of a high  
DCR or a sense resistor will cause a significant reduction  
in power efficiency. For a specific output requirement,  
choose the inductor with the DCR that satisfies the maxi-  
mum desirable sense voltage, and use the relationship of  
the sense pin filters to output inductor characteristics as  
depicted below.  
of  
ISENSE  
ISENSE  
VOUT V V  
IN  
OUT  
ΔV  
=
ISENSE  
V
R CfOSC  
IN  
V
Inductor Value Calculation  
ISENSE(MAX)  
DCR=  
ΔIL  
Given the desired input and output voltages, the inductor  
IMAX  
+
2
value and operating frequency, f , directly determine  
OSC  
the inductor’s peak-to-peak ripple current:  
RC = L/(5 DCR) when the LOWDCR pin is high  
VOUT V – V  
RC = L/DCR when the LOWDCR pin is low  
IN  
OUT  
IRIPPLE  
=
V
fOSC L  
IN  
where:  
V
: Maximum sense voltage for a given I  
TH  
Lower ripple current reduces core losses in the inductor,  
ESR losses in the output capacitors, and output voltage  
ripple. Thus, highest efficiency operation is obtained at  
low frequency with a small ripple current. Achieving this,  
however, requires a large inductor.  
ISENSE(MAX)  
voltage  
I
: Maximum load current  
MAX  
∆I : Inductor ripple current  
L
L, DCR: Output inductor characteristics  
R, C: Filter time constant  
A reasonable starting point is to choose a ripple current  
that is about 40% of I  
. Note that the largest ripple  
OUT(MAX)  
38741f  
12  
For more information www.linear.com/LTC3874-1  
LTC3874-1  
applicaTions inForMaTion  
current occurs at the highest input voltage. To guarantee  
that ripple current does not exceed a specified maximum,  
the inductor should be chosen according to:  
The peak-to-peak MOSFET gate drive levels are set by the  
internal regulator voltage, V  
, requiring the use of  
INTVCC  
logic-level threshold MOSFETs in most applications. Pay  
closeattentiontotheBV specificationfortheMOSFETs  
DSS  
V – V  
fOSC IRIPPLE  
VOUT  
V
IN  
IN  
OUT  
L ≥  
as well; many of the logic-level MOSFETs are limited to  
30V or less. Selection criteria for the power MOSFETs  
include the on-resistance, R , input capacitance,  
DS(ON)  
Inductor Core Selection  
inputvoltageandmaximumoutputcurrent.MOSFETinput  
capacitance is a combination of several components but  
can be taken from the typical gate charge curve included  
on most data sheets (Figure 3). The curve is generated by  
forcing a constant input current into the gate of a common  
source, current source loaded stage and then plotting the  
gate voltage versus time.  
Once the inductance value is determined, the type of in-  
ductor must be selected. Core loss is independent of core  
size for a fixed inductor value, but it is very dependent on  
inductanceselected. Asinductanceincreases, corelosses  
go down. Unfortunately, increased inductance requires  
moreturnsofwireandthereforecopperlosseswillincrease.  
Ferrite designs have very low core loss and are preferred  
at high switching frequencies, so design goals can  
concentrate on copper loss and preventing saturation.  
Ferrite core material saturates “hard,” which means that  
inductancecollapsesabruptlywhenthepeakdesigncurrent  
is exceeded. This results in an abrupt increase in inductor  
ripple current and consequent output voltage ripple. Do  
not allow the core to saturate!  
V
IN  
MILLER EFFECT  
V
V
GS  
a
b
+
V
DS  
+
Q
IN  
V
GS  
C
= (Q – Q )/V  
B A DS  
MILLER  
38741 F03  
Figure 3. Gate Charge Characteristic  
Power MOSFET and Schottky Diode  
(Optional) Selection  
The initial slope is the effect of the gate-to-source and  
the gate-to-drain capacitance. The flat portion of the  
curve is the result of the Miller multiplication effect of the  
drain-to-gate capacitance as the drain drops the voltage  
across the current source load. The upper sloping line is  
due to the drain-to-gate accumulation capacitance and  
the gate-to-source capacitance. The Miller charge (the  
increase in coulombs on the horizontal axis from a to b  
When we use discrete gate driver and MOSFETs, at least  
two external power MOSFETs need to be selected: One  
N-channel MOSFET for the top (main) switch and one or  
moreN-channelMOSFET(s)forthebottom(synchronous)  
switch.Thenumber,typeandon-resistanceofallMOSFETs  
selected take into account the voltage step-down ratio  
as well as the actual position (main or synchronous) in  
whichtheMOSFETwillbeused. Amuchsmallerandmuch  
lower input capacitance MOSFET should be used for the  
top MOSFET in applications that have an output voltage  
that is less than one-third of the input voltage. In applica-  
tions where V >> V , the top MOSFETs’ on-resistance  
while the curve is flat) is specified for a given V drain  
DS  
voltage, but can be adjusted for different V voltages by  
DS  
multiplying the ratio of the application V to the curve  
DS  
specified V values. A way to estimate the C  
term  
DS  
MILLER  
is to take the change in gate charge from points a and b  
IN  
OUT  
is normally less important for overall efficiency than its  
input capacitance at operating frequencies above 300kHz.  
MOSFET manufacturers have designed special purpose  
devices that provide reasonably low on-resistance with  
significantlyreducedinputcapacitanceforthemainswitch  
application in switching regulators.  
on a manufacturer’s data sheet and divide by the stated  
V
voltage specified. C  
is the most important se-  
MILLER  
DS  
lection criteria for determining the transition loss term in  
the top MOSFET but is not directly specified on MOSFET  
data sheets. C  
and C are specified sometimes but  
RSS  
OS  
38741f  
13  
For more information www.linear/LTC3874-1  
LTC3874-1  
applicaTions inForMaTion  
definitionsoftheseparametersarenotincluded.Whenthe  
controller is operating in continuous mode the duty cycles  
for the top and bottom MOSFETs are given by:  
The term (1 + δ ) is generally given for a MOSFET in the  
form of a normalized R  
vs temperature curve, but  
DS(ON)  
δ = 0.005/°C can be used as an approximation for low  
voltage MOSFETs.  
VOUT  
MainSwitchDuty Cycle =  
An optional Schottky diode across the synchronous  
MOSFET conducts during the dead time between the con-  
ductionofthetwolargepowerMOSFETs.Thispreventsthe  
bodydiodeofthebottomMOSFETfromturningon,storing  
chargeduringthedeadtimeandrequiringareverse-recov-  
ery period which could cost as much as several percent in  
efficiency. A 2A to 8A Schottky is generally a good com-  
promise for both regions of operation due to the relatively  
small average current. Larger diodes result in additional  
transition loss due to their larger junction capacitance.  
V
IN  
V – V  
IN  
OUT  
Synchronous SwitchDuty Cycle =  
V
IN  
The power dissipation for the main and synchronous  
MOSFETs at maximum output current are given by:  
2
)
VOUT  
PMAIN  
=
I
(
1+ δ R  
+
(
)
MAX  
DS(ON)  
V
IN  
I
MAX  
2
V
R
C
(
)
(
DR)(  
)
INTV Regulators and EXTV  
IN  
MILLER  
CC  
CC  
2
The LTC3874-1 features a PMOS LDO that supplies power  
to INTV from the V supply. INTV powers most of  
1
1
CC  
IN  
CC  
+
f  
V
INTVCC – VTH(MIN) VTH(MIN) ⎥  
the LTC3874-1’s internal circuitry. The linear regulator  
regulates the voltage at the INTV pin to 5.5V when V  
CC  
IN  
2
)
V – V  
IN  
OUT  
is greater than 6V. EXTV connects to INTV through  
PSYNC  
=
I
(
1+ δ R  
( )  
DS(ON)  
CC  
CC  
MAX  
V
IN  
another P-channel MOSFET and can supply the needed  
power when its voltage is higher than 4.7V and V is  
IN  
where δ is the temperature dependency of R  
, R  
DS(ON) DR  
higher than 7V. Each of these can supply a peak current of  
100mA and must be bypassed to ground with a minimum  
value of 4.7µF ceramic capacitor or low ESR electrolytic  
capacitor. No matter what type of bulk capacitor is used,  
anadditional0.1µFceramiccapacitorplaceddirectlyadja-  
is the effective top driver resistance (approximately 2Ω at  
= V ), V is the drain potential and the change  
V
GS  
MILLER  
IN  
in drain potential in the particular application. V  
TH(MIN)  
is the data sheet specified typical gate threshold voltage  
specified in the power MOSFET data sheet at the specified  
cent to the INTV and GND pins is highly recommended.  
CC  
drain current. C  
is the calculated capacitance using  
MILLER  
Good bypassing is needed to prevent interaction between  
the gate charge curve from the MOSFET data sheet and  
the channels.  
the technique described above.  
When the voltage applied to EXTV rises above 4.7V and  
2
CC  
BothMOSFETshaveI RlosseswhilethetopsideN-channel  
V above 7V, the INTV linear regulator is turned off and  
IN  
CC  
equation includes an additional term for transition losses,  
the EXTV is connected to INTV . Using the EXTV al-  
CC  
CC  
CC  
which peak at the highest input voltage. For V < 20V,  
IN  
lows the MOSFET driver and control power to be derived  
the high current efficiency generally improves with larger  
from other high efficiency sources such as +5V rails in  
MOSFETs, whileforV >20V, thetransitionlossesrapidly  
IN  
the system. Do not apply more than 6V to the EXTV pin.  
CC  
increasetothepointthattheuseofahigherR  
device  
DS(ON)  
withlowerC  
actuallyprovideshigherefficiency.The  
For applications where the main input power is 5V, tie  
MILLER  
synchronous MOSFET losses are greatest at high input  
voltage when the top switch duty factor is low or during  
a short-circuit when the synchronous switch is on close  
to 100% of the period.  
the V and INTV pins together and tie the combined  
IN  
CC  
pins to the 5V input with a 1Ω or 2.2Ω resistor as shown  
in Figure 4 to minimize the voltage drop caused by the  
gate charge current. This will override the INTV linear  
CC  
38741f  
14  
For more information www.linear.com/LTC3874-1  
LTC3874-1  
applicaTions inForMaTion  
regulator and will prevent INTV from dropping too low  
The relationship between the voltage on the FREQ pin and  
the operating frequency is shown in Figure 5 and specified  
in the Electrical Characteristic table. If an external clock is  
detected on the SYNC pin, the internal switch mentioned  
above will turn off and isolate the influence of the FREQ  
pin. Note that the LTC3874-1 can only be synchronized  
to an external clock whose frequency is within the range  
of the LTC3874-1’s internal VCO. This is guaranteed to be  
between 250kHz and 1MHz. A simplified block diagram  
is shown in Figure 6.  
CC  
due to the dropout voltage. Make sure the INTV voltage  
CC  
is at or exceeds the R  
test voltage for the MOSFET,  
DS(ON)  
which is typically 4.5V for logic-level devices.  
LTC3874-1  
V
R
IN  
VIN  
1Ω  
INTV  
5V  
CC  
+
C
INTVCC  
C
IN  
4.7µF  
38741 F04  
Figure 4. Setup for a 5V Input  
1600  
1400  
1200  
1000  
800  
600  
400  
200  
0
Undervoltage Lockout  
The LTC3874-1 has a precision UVLO comparator con-  
stantly monitoring the INTV voltage. It locks out the  
CC  
switching action and pulls down RUN pins when INTV is  
CC  
below3.5V.Inmultiphaseoperation,whentheLTC3874-1  
is in undervoltage lockout, the RUN pin is pulled down to  
disable the master’s switching action. To prevent oscilla-  
tion when there is a disturbance on the INTV , the UVLO  
CC  
comparator has 300mV of precision hysteresis.  
0
0.5  
1
1.5  
2
2.5  
FREQ PIN VOLTAGE (V)  
38741 F05  
Phase-Locked Loop and Frequency Synchronization  
Figure 5. Relationship Between Oscillator Frequency  
and Voltage at the FREQ Pin  
The LTC3874-1 has a phase-locked loop (PLL) comprised  
of an internal voltage-controlled oscillator (VCO) and a  
phase detector. This allows the internal clock to be locked  
to the falling edge of an external clock signal applied to the  
SYNC pin. The turn-on of the top MOSFET is synchronized  
or out-of-phase with the falling edge of external clock.  
The phase detector is an edge sensitive digital type that  
provides zero degrees phase shift between the external  
and internal oscillators. This type of phase detector does  
not exhibit false lock to harmonics of the external clock.  
2.4V 5.5V  
R
SET  
10µA  
FREQ  
DIGITAL  
PHASE/  
SYNC  
SYNC  
EXTERNAL  
OSCILLATOR  
FREQUENCY  
DETECTOR  
VCO  
The output of the phase detector is a pair of complemen-  
tary current sources that charge or discharge the internal  
filter network. There is a precision 10µA of current flowing  
out of the FREQ pin. This allows the user to use a single  
resistor to GND to set the switching frequency when no  
external clock is applied to the SYNC pin. The internal  
switch between the FREQ pin and the integrated PLL  
filter network is ON, allowing the filter network to be pre-  
charged to the same voltage potential as the FREQ pin.  
38741 F06  
Figure 6. Phase-Locked Loop Block Diagram  
38741f  
15  
For more information www.linear/LTC3874-1  
LTC3874-1  
applicaTions inForMaTion  
If the external clock frequency is greater than the inter-  
Transient Response and Loop Stability  
nal oscillator’s frequency, f , then current is sourced  
OSC  
In a typical parallel operation, the LTC3874-1 cooperates  
withmastercontrollerstosupplymorecurrent. Toachieve  
balanced current sharing between master and slave, it is  
recommended that each slave channel copies the power  
stage design from the master channel. Select the same  
inductors, same MOSFET driver, same power MOSFETs,  
and same output capacitors between the master and slave  
channels. Control loop and compensation design on the  
continuously from the phase detector output, pulling up  
the filter network. When the external clock frequency is  
less than f , current is sunk continuously, pulling down  
OSC  
the filter network. If the external and internal frequencies  
are the same but exhibit a phase difference, the current  
sources turn on for an amount of time corresponding to  
the phase difference. The voltage on the filter network is  
adjusted until the phase and frequency of the internal and  
external oscillators are identical. At the stable operating  
point, the phase detector output is high impedance and  
the filter capacitor holds the voltage.  
I
pin should start with the single phase operation of the  
TH  
master controller. The multiphase transient response and  
loopstabilityisalmostthesameasthesinglephaseopera-  
tion of the master by tying the I pins together between  
TH  
Typically, the external clock (on the SYNC pin) input high  
threshold is 2V, while the input low threshold is 1.4V.  
master and slaves. For example, design the compensation  
for a single phase 1.8V/20A output using LTC3884-1 with  
a 0.33μH inductor and 530μF output capacitors. To extend  
the output to 1.8V/40A, simply parallel one channel of  
LTC3874-1 with the same inductor and output capacitors  
Fault Protection and Response  
Master controllers monitor system voltage, current, tem-  
perature and provide many protection features during all  
kinds of fault conditions. The LTC3874-1 slave control-  
lers do not provide as many fault protections as master  
controllers but respond to the fault signal from the master  
controller. FAULT0 and FAULT1 pins are designed to share  
the fault signal between masters and slaves. In a typical  
parallel application, connect the fault pins on LTC3874-1  
to the master fault indictor pins, so that the slave control-  
ler can respond to all fault signals from the master. When  
the FAULT pin is pulled below 1.4V, the PWM pin in the  
corresponding channel is in three-state. When the FAULT  
pinvoltageisabove2V, thecorrespondingchannelisback  
to normal operation. During fault conditions, all internal  
circuits in the LTC3874-1 are still running so the slave  
controllers can immediately return to normal operation  
when the FAULT pin is released.  
(total output capacitors are 1060μF) and tie the I pin of  
TH  
LTC3874-1tothemasterI .Theloopstabilityandtransient  
TH  
responses of the two phase converter are very similar to  
the single phase design without any extra compensator  
on the I pin of the slave controller. Furthermore, LTpow-  
TH  
erCAD is provided on the LTC website as a free download  
for transient and stability analysis.  
To minimize the high frequency noise on the I trace  
TH  
between master and slave I pins, a small filter capacitor  
TH  
in the range of tens of pF can be placed closely at each I  
TH  
pin of the slave controller. This small capacitor normally  
does not significantly affect the closed-loop bandwidth  
but increases the gain margin at high frequency.  
Mode Selection and Pre-Biased Startup  
There may be situations that require the power supply to  
start up with a pre-bias on the output capacitors. In this  
case, it is desirable to start up without discharging the  
output capacitors. The LTC3874-1 can be configured to  
operate in DCM mode for pre-biased start-up. The master  
chip’s PGOOD pin can be connected to the MODE pins of  
the LTC3874-1 to ensure the DCM operation at startup  
and CCM operation in steady state.  
The LTC3874-1 has internal thermal shutdown protection  
which forces the PWM pin three-state when the junction  
temperature is higher than 160°C. The thermal shutdown  
has 10°C of hysteresis. In thermal shutdown, the FAULT0  
and FAULT1 pins are also pulled low. The RUN pins are not  
internally pulled low. There is a 500k pull-down resistor  
on each FAULT pin which sets the default voltage on the  
FAULT pins low if the FAULT pins are floating.  
38741f  
16  
For more information www.linear.com/LTC3874-1  
LTC3874-1  
applicaTions inForMaTion  
Minimum On-Time Considerations  
MOSFET Driver Selection  
Gate driver ICs, DrMOSs and power blocks with an inter-  
face compatible with the LTC3874-1’s three-state PWM  
outputs should be used.  
Minimumon-timet  
isthesmallesttimedurationthat  
ON(MIN)  
the LTC3874-1 is capable of turning on the top MOSFET.  
It is determined by internal timing delays and the gate  
charge required to turn on the top MOSFET. Low duty  
cycle applications may approach this minimum on-time  
limit and care should be taken to ensure that:  
PC Board Layout Checklist  
When laying out the printed circuit board, the following  
checklist should be used to ensure proper operation of  
the IC. Figure 7 illustrates the current waveforms pres-  
ent in the various branches of the 2-phase synchronous  
regulators operating in the continuous mode. Check the  
following in the PC layout:  
VOUT  
tON(MIN)  
<
V f  
IN  
If the duty cycle falls below what can be accommodated  
by the minimum on-time, the controller will begin to skip  
cycles.Theoutputvoltagewillcontinuetoberegulated,but  
the ripple voltage and current will increase. The minimum  
on-time for the LTC3874-1 is approximately 60ns, with  
reasonably good PCB layout, minimum 30% inductor cur-  
rent ripple and at least 2mV – 3mV (10mV – 15mV when  
theLOWDCRpinislow)rippleonthecurrentsensesignal.  
The minimum on-time can be affected by PCB switch-  
ing noise in the current loop. As the peak sense voltage  
decreases the minimum on-time gradually increases to  
100ns. This is of particular concern in forced continuous  
applications with low ripple current at light loads. If the  
duty cycle drops below the minimum on-time limit in this  
situation, a significant amount of cycle skipping can occur  
with correspondingly larger current and voltage ripple.  
1. Are the signal and power grounds kept separate? The  
combined IC signal ground pin and the ground return  
of C  
must return to the combined C  
TH  
(–) ter-  
INTVCC  
OUT  
minals. The I traces should be as short as possible.  
The C capacitor should have short leads and PC trace  
IN  
lengths. The output capacitor (–) terminals should be  
connected as close as possible to the (–) terminals of  
the input capacitor by placing the capacitors next to  
each other.  
+
2. Are the I  
and I  
leads routed together with  
SENSE  
SENSE  
minimumPCtracespacing?Thefiltercapacitorbetween  
+
I
and I  
should be as close as possible to  
SENSE  
SENSE  
the IC. Ensure accurate current sensing with Kelvin  
connectionsatthesenseresistororinductor,whichever  
is used for current sensing.  
PWM Pins  
The PWM output pins are three-state compatible outputs,  
designedtodriveMOSFETdrivers, DrMOSs, etc. whichdo  
not represent a heavy capacitive load. An external resistor  
divider may be used on the PWM pins to set the voltage  
to mid-rail while in the high impedance state.  
3. Is the INTV decoupling capacitor connected close to  
CC  
the IC, between the INTV and the ground pins? This  
CC  
capacitorcarriestheMOSFETdriverscurrentpeaks. An  
additional 1μF ceramic capacitor placed immediately  
next to the INTV and GND pins can help improve  
CC  
noise performance substantially.  
The V pin is the corresponding PWM pin driver supply.  
CC  
Decouple this pin to GND with a capacitor (0.1μF) or tie  
4. Keep the switching nodes (SW1, SW0), away from  
sensitive small-signal nodes, especially from the op-  
posite channel’s current sensing feedback pins. All of  
these nodes have very large and fast moving signals  
and therefore should be kept on the output side of the  
LTC3874-1 and occupy minimum PC trace area. If DCR  
sensing is used, place the resistor (Figure 2, “R”) close  
to the switching node.  
this pin to the INTV pin. If the V pin is connected to  
CC  
CC  
an external supply, make sure it comes first before the  
RUN pin goes high.  
38741f  
17  
For more information www.linear/LTC3874-1  
LTC3874-1  
applicaTions inForMaTion  
SW1  
L1  
V
OUT1  
D1  
C
OUT1  
R
L1  
V
IN  
R
IN  
C
IN  
SW0  
L0  
V
OUT0  
D0  
C
OUT0  
R
L0  
BOLD LINES INDICATE  
HIGH SWITCHING  
CURRENT. KEEP LINES  
TO A MINIMUM LENGTH.  
38741 F07  
Figure 7. Recommended Printed Circuit Layout Diagram  
5. Useamodifiedstargroundtechnique:alowimpedance,  
large copper area central grounding point on the same  
side of the PC board as the input and output capacitors  
as well. Check for proper performance over the operating  
voltage and current range expected in the application. The  
frequencyofoperationshouldbemaintainedovertheinput  
voltage range down to dropout and until the output load  
drops below the low current operation threshold.  
with tie-ins for the bottom of the INTV decoupling  
CC  
capacitor, the bottom of the voltage feedback resistive  
divider and the GND pin of the IC.  
Thedutycyclepercentageshouldbemaintainedfromcycle  
tocycleinawell-designed,lownoisePCBimplementation.  
Variation in the duty cycle at a subharmonic rate can sug-  
gest noise pickup at the current or voltage sensing inputs  
or inadequate loop compensation. Overcompensation of  
the loop can be used to tame a poor PC layout if regulator  
bandwidth optimization is not required. Only after each  
controllerischeckedforitsindividualperformanceshould  
PC Board Layout Debugging  
Start with one controller at a time. It is helpful to use a  
DC-50MHz current probe to monitor the current in the  
inductor while testing the circuit. Monitor the output  
switching node (SW pin) to synchronize the oscilloscope  
totheinternaloscillatorandprobetheactualoutputvoltage  
38741f  
18  
For more information www.linear.com/LTC3874-1  
LTC3874-1  
applicaTions inForMaTion  
bothcontrollersbeturnedonatthesametime.Aparticularly  
difficultregionofoperationiswhenonecontrollerchannel  
is nearing its current comparator trip point when the other  
channel is turning on its top MOSFET. This occurs around  
50% duty cycle on either channel due to the phasing of  
the internal clocks and may cause minor duty cycle jitter.  
The master chip LTC3884-1 design can be found in the  
LTC3884-1 data sheet (Design Example section).  
The LTC3884-1 SYNC pin is connected to the LTC3874-1  
SYNC pin for switching frequency synchronization. The  
LTC3874-1 PHASMD pin is tied to INTV to form a  
CC  
PolyPhase configuration.  
Reduce V from its nominal level to verify operation of  
IN  
The slave chip LTC3874-1 should use the same inductor,  
the regulator in dropout. Check the operation of the un-  
DrMOS, C , and C  
as the master chip. DCR sensing  
IN  
OUT  
dervoltage lockout circuit by further lowering V while  
IN  
is also used for the slave chip. The LTC3884-1 I pins  
TH  
monitoring the outputs to verify operation.  
and the LTC3874-1 I pins are connected together. The  
TH  
Investigate whether any problems exist only at higher out-  
put currents or only at higher input voltages. If problems  
coincide with high input voltages and low output currents,  
look for capacitive coupling between the BOOST, SW, TG,  
and possibly BG connections and the sensitive voltage  
and current pins. The capacitor placed across the current  
sensing pins needs to be placed immediately adjacent to  
the pins of the IC. This capacitor helps to minimize the  
effects of differential noise injection due to high frequency  
capacitive coupling. If problems are encountered with  
high current output loading at lower input voltages, look  
LTC3874-1 LOWDCR pin is pulled high and the ILIM pin  
is forced to INTV to obtain the same current limit as  
CC  
LTC3884-1.  
The LTC3884-1 RUN pins and the LTC3874-1 RUN pins  
are connected together. The LTC3884-1 FAULT pins are  
connected to LTC3874-1 FAULT pins so the LTC3874-1  
will be disabled if the LTC3884-1 is under any fault event.  
The LTC3874-1 MODE pins are tied to the LTC3884-1  
PGOOD pins for start-up control. During soft-start, the  
LTC3874-1 operates in DCM mode. When the soft-start  
interval is done, the LTC3874-1 operates in CCM mode.  
for inductive coupling between C , Schottky and the top  
IN  
MOSFET components to the sensitive current and voltage  
sensing traces. In addition, investigate common ground  
path voltage pickup between these components and the  
GND pin of the IC.  
Design Example  
Using master controller LTC3884-1 and slave controller  
LTC3874-1 for a single-output, 4-phase high current  
regulator, assume V = 12V (nominal), and V = 15V  
IN  
IN  
(maximum), V  
(see Figure 8).  
= 1.05V, I  
= 120A, and f = 500kHz  
OUT  
MAX  
38741f  
19  
For more information www.linear/LTC3874-1  
LTC3874-1  
applicaTions inForMaTion  
0.47µF  
1mΩ  
0Ω  
V
IN1  
649Ω  
BOOT  
1Ω  
V
IN  
7V TO 14V  
V
IN1  
V
IN  
PHASE  
4.7µF  
0.215µH, L1  
V
OUT  
220nF  
22µF  
×4  
TDA21470  
1.05 V  
120A  
EN  
SW  
2.2µF  
C
C
OUT2  
OUT1  
+
+
V
IN  
I
I
IN  
INTV  
CC  
IN  
V
100µF  
×3  
470µF  
×2  
OS  
+
+
PWM  
T
/FLT  
V
V
V
V
V
PWM0  
OUT  
OUT  
SENSE0  
SENSE1  
SENSE0  
SENSE1  
6.3V  
2.5V  
+
V
PGND  
I
I
I
I
DRV  
SENSE0  
V
DR  
5V  
V
CC  
SENSE0  
4.7µF  
LGND  
330pF  
SENSE1  
4.7µF  
10nF  
10nF  
+
WP  
220nF  
SENSE1  
PWM1  
TSNS0  
TSNS1  
LTC3884-1  
I
I
I
TH0  
5k  
5k  
TH  
SDA  
SCL  
330pF  
6.8nF  
TH1  
0.47µF  
0Ω  
I
I
THR0  
THR1  
DD25  
5k  
5k  
649Ω  
SHARE_CLK  
BOOT  
ALERT  
V
V
V
PHASE  
IN1  
IN  
0.215µH, L2  
V
V
V
V
0_CFG  
1_CFG  
DD33  
DD33  
22µF  
×4  
OUT  
TDA21470  
24.9k  
7.32k  
20k  
24.9k  
EN  
SW  
1µF  
V
V
CC0  
C
C
OUT3  
OUT4  
OUT  
+
V
100µF  
×3  
470µF  
×2  
OS  
CC1  
4.7µF  
5k  
5k  
5k  
PWM  
T
/FLT  
FAULT0  
17.8k  
5.76k  
OUT  
6.3V  
2.5V  
V
PGND  
FAULT1  
RUN0  
DRV  
V
DR  
5V  
V
CC  
ASEL0  
4.7µF  
LGND  
RUN1  
330pF  
FREQ_CFG  
4.7µF  
SYNC  
PGOOD0  
EXTV  
CC  
5k  
PGOOD1  
PHAS_CFG  
GND  
0.47µF  
0Ω  
2Ω  
V
IN  
7V TO 14V  
BOOT  
V
INTV  
PHASM0  
LTC3874-1  
IN  
CC  
V
IN1  
V
PHASE  
4.7µF  
IN  
0.1µF  
0.215µH, L3  
RUN0  
22µF  
×4  
TDA21470  
EN  
SW  
RUN1  
ILIM  
C
C
OUT6  
OUT5  
+
V
100µF  
×3  
470µF  
×2  
OS  
SYNC  
LOWDCR  
PWM  
T
/FLT  
MODE0  
MODE1  
PWM0  
+
OUT  
6.3V  
2.5V  
I
V
PGND  
SENSE0  
DRV  
V
DR  
5V  
I
SENSE0  
V
220nF  
CC  
4.7µF  
LGND  
FAULT0  
FAULT1  
330pF  
4.7µF  
PWM1  
+
V
V
I
I
CC0  
CC1  
SENSE1  
I
SENSE1  
649Ω  
V
DD33  
I
TH  
TH0  
TH1  
100k  
1µF  
47pF  
I
FREQ  
GND  
0.47µF  
0Ω  
BOOT  
V
IN1  
V
PHASE  
IN  
PIN NOT USED IN CIRCUIT LTC3884-1: ASEL1  
PIN NOT USED IN CIRCUIT LTC3874-1: EXTV  
0.215µH, L4  
22µF  
×4  
TDA21470  
EN  
SW  
C
C
OUT8  
OUT7  
CC  
+
V
100µF  
×3  
470µF  
×2  
OS  
PINS NOT USED IN CIRCUITS TDA21470: REFIN , GATEL, I , OCSET  
OUT  
PWM  
T
/FLT  
OUT  
6.3V  
2.5V  
COUT1, 3, 5, 7: MURATA GRM32ER60J107ME20L (100µF, 6.3V, X5R, 1210)  
COUT2, 4, 6, 8: PANASONIC ETPF470M5H (470µF, 2.5V)  
V
V
PGND  
DRV  
CC  
V
DR  
5V  
L1, L2, L3, L4: EATON FP1007R3-R22-R (0.215µH, DCR = 0.29mΩ)  
220nF  
3874 F08  
V
IS FROM EXTERNAL 5V POWER SUPPLY  
4.7µF  
DR  
LGND  
330pF  
4.7µF  
649Ω  
Figure 8. High Efficiency 500kHz 4-Phase 1.05V Step-Down Converter  
38741f  
20  
For more information www.linear.com/LTC3874-1  
LTC3874-1  
package DescripTion  
Please refer to http://www.linear.com/product/LTC3874-1#packaging for the most recent package drawings.  
UF Package  
24-Lead Plastic QFN (4mm × 4mm)  
(Reference LTC DWG # 05-08-ꢀ697 Rev B)  
0.70 0.05  
4.50 0.05  
3.ꢀ0 0.05  
2.45 0.05  
(4 SIDES)  
PACKAGE OUTLINE  
0.25 0.05  
0.50 BSC  
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS  
BOTTOM VIEW—EXPOSED PAD  
PIN ꢀ NOTCH  
R = 0.20 TYP OR  
0.35 × 45° CHAMFER  
R = 0.ꢀꢀ5  
TYP  
0.75 0.05  
4.00 0.ꢀ0  
(4 SIDES)  
23 24  
PIN ꢀ  
TOP MARK  
(NOTE 6)  
0.40 0.ꢀ0  
2
2.45 0.ꢀ0  
(4-SIDES)  
(UF24) QFN 0ꢀ05 REV B  
0.200 REF  
0.25 0.05  
0.50 BSC  
0.00 – 0.05  
NOTE:  
ꢀ. DRAWING PROPOSED TO BE MADE A JEDEC PACKAGE OUTLINE MO-220 VARIATION (WGGD-X)—TO BE APPROVED  
2. DRAWING NOT TO SCALE  
3. ALL DIMENSIONS ARE IN MILLIMETERS  
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE  
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.ꢀ5mm ON ANY SIDE, IF PRESENT  
5. EXPOSED PAD SHALL BE SOLDER PLATED  
6. SHADED AREA IS ONLY A REFERENCE FOR PIN ꢀ LOCATION  
ON THE TOP AND BOTTOM OF PACKAGE  
38741f  
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.  
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-  
21  
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.  
LTC3874-1  
Typical applicaTion  
High Efficiency Dual 1.0V/1.5V Step-Down Converter  
V
IN  
7V TO 14V  
V
IN  
LTC3874-1  
PWM0  
PWM1  
(0.29mΩ DCR)  
0.215µH  
(0.29mΩ DCR)  
0.215µH  
V
V
1.5V  
60A  
OUT0  
1V  
60A  
OUT1  
DrMOS  
DrMOS  
649Ω  
649Ω  
100µF  
×3  
100µF  
×3  
470µF  
×2  
470µF  
×2  
0.22µF  
0.22µF  
+
+
+
+
I
I
I
I
SENSE0  
SENSE0  
SENSE1  
SENSE1  
LTC3884-1  
RUN0  
RUN1  
FAULT0  
FAULT1  
RUN0  
RUN1  
INTV  
CC  
V
CC0  
4.7µF  
FAULT0  
FAULT1  
MODE0  
MODE1  
V
CC1  
PHASMD  
LDWDCR  
ILIM  
PGOOD0  
1V  
+
+
V
V
SENSE0  
PGOOD1  
1.5V  
I
I
TH0  
TH0  
100k  
SENSE1  
V
OUT1  
I
I
FREQ  
GND  
REFER TO LTC3884-1 DATA SHEET  
FOR MASTER SETUP  
TH1  
TH1  
SYNC  
SYNC  
PIN NOT USED IN THIS CIRCUIT: EXTV  
CC  
3874 TA02  
relaTeD parTs  
PART NUMBER DESCRIPTION  
COMMENTS  
2
LTM4676A  
LTM4675  
LTM4677  
Dual 13A or Single 26A Step-Down DC/DC µModule® Regulator 4.5V ≤ V ≤17V; 0.5V ≤ V  
( 0.5%) ≤ 5.5V, I C/PMBus Interface,  
OUT  
IN  
with Digital Power System Management  
16mm × 16mm × 5mm, BGA Package  
2
Dual 9A or Single 18A μModule Regulator with Digital Power  
System Management  
4.5V ≤ V ≤17V; 0.5V ≤ V ( 0.5%) ≤ 5.5V, I C/PMBus Interface,  
IN  
OUT  
11.9mm × 16mm × 5mm, BGA Package  
2
Dual 18A or Single 36A μModule Regulator with Digital Power  
System Management  
4.5V ≤ V ≤16V; 0.5V ≤ V ( 0.5%) ≤ 1.8V, I C/PMBus Interface,  
IN  
OUT  
16mm × 16mm × 5.01mm, BGA Package  
4.5V ≤ V ≤ 38V, 0.5V ≤ V ( 0.5%) ≤ 5.5V, 70ms Start-Up, I C/  
OUT  
2
LTC3884/  
LTC3884-1  
Dual Output Multiphase Step-Down Controller with Sub mΩ  
DCR Sensing Current Mode Control and Digital Power System  
Management  
IN  
PMBus Interface, Programmable Analog Loop Compensation, Input  
Current Sense  
2
LTC3887/  
LTC3887-1  
Dual Output Multiphase Step-Down DC/DC Controller with  
Digital Power System Management, 70ms Start-Up  
4.5V ≤ V ≤ 24V, 0.5V ≤ V  
, ( 0.5%) ≤ 5.5V, 70ms Start-Up, I C/  
IN  
OUT0 1  
PMBus Interface, -1 Version Uses DrMOS or Power Blocks  
2
LTC3882/  
Dual Output Multiphase Step-Down DC/DC Voltage Mode  
Controller with Digital Power System Management  
3V ≤ V ≤ 38V, 0.5V ≤ V ≤ 5.25V, 0.5% V Accuracy I C/  
IN  
OUT1,2  
OUT  
LTC3882-1  
PMBus Interface, Uses DrMOS or Power Blocks  
4.5V ≤ V ≤ 38V, 0.6V ≤ V ≤ 3.5V, with Remote V Sense, 4mm  
OUT  
LTC3866  
Single Output Current Mode Synchronous Step-Down  
Controller with Sub-Milliohm DCR Sensing  
IN  
OUT  
× 4mm, QFN-24, TSSOP-24 Packages  
2
LTC3883/  
LTC3883-1  
Single Phase Step-Down DC/DC Controller with Digital Power  
System Management  
V
Up to 24V, 0.5V ≤ V  
≤ 5.5V, Input Current Sense Amplifier, I C/  
IN  
OUT  
PMBus Interface with EEPROM and 16-Bit ADC, 0.5% V  
Accuracy  
OUT  
LTC3875  
Dual, Multiphase Current Mode Synchronous Step-Down  
Controller with Sub-Milliohm DCR Sensing, Up to 12 Phases  
4.5V ≤ V ≤ 38V, 0.6V ≤ V  
≤ 3.5V, with Remote Sense  
IN  
OUT  
LTC3774  
Dual, Multiphase Current Mode Synchronous Step-Down  
Controller with Sub-Milliohm DCR Sensing, Up to 12 Phases  
V
Up to 40V, 0.6V ≤ V  
≤ 3.5V, Very High Output Current  
IN  
OUT  
Applications with Accurate Current Share Between Phases  
Supporting LTC3880/-1, LTC3883/-1, LTC3886, LTC3887/-1  
LTC3877  
Dual Phase Step-Down Synchronous Controller with 6-Bit V  
Output Voltage Programming and Low Value DCR Sensing  
4.5V ≤ V ≤ 38V, 0.6V ≤ V  
OUT  
≤ 1.23V with V in 10mV Steps, 0.6V ≤  
ID  
IN  
OUT ID  
V
≤ 5V without V , Up to 12-Phase Operation  
ID  
38741f  
LT 0917 • PRINTED IN USA  
www.linear.com/LTC3874-1  
22  
LINEAR TECHNOLOGY CORPORATION 2017  

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