MLX92213ELD-AAA-000-RE [MELEXIS]

MAGNETIC SWITCH LATCH 6UTQFN;
MLX92213ELD-AAA-000-RE
型号: MLX92213ELD-AAA-000-RE
厂家: Melexis Microelectronic Systems    Melexis Microelectronic Systems
描述:

MAGNETIC SWITCH LATCH 6UTQFN

PC 光电二极管
文件: 总10页 (文件大小:1098K)
中文:  中文翻译
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MLX92213  
MicroPower & Low-Voltage  
Hall Effect Latch with Enable  
Features and Benefits  
Applications  
.
.
.
Operating Voltage from 1.6 to 3.6V  
Latching Output Behaviour  
Micro power Consumption 48uA@3V ;  
36uA@1.8V  
.
.
.
Battery-operated / Handheld Appliances  
Rotary or Linear Contact-Less Encoders  
Scroll/Jog Wheel, Trackball (Mobile Phones,  
Portable  
Media  
Players,  
Notebooks,  
.
Advanced Power Manageability through  
dedicated “Enable” pin  
Ultra High Sensitivity Hall Sensor  
Push-Pull Output  
Miniature & Ultra-Thin QFN package  
(2mm x 1.5mm ; 0.4mm thickness)  
“Green” and “Pb-Free” Compliant Package  
Computer Mice, Camcorders, Cameras,…)  
Home/Industrial Metering Equipment (Wafer  
Flow Meter)  
.
.
.
.
.
Ordering information  
Part No.  
MLX92213ELD-AAA-000-RE  
Temperature Code  
E (-40°C to 85°C)  
Package Code  
LD (UTQFN-6L)  
Comment  
BOP/BRP= ± 2mT  
Legend:  
Temperature Code:  
Package Code:  
E for Temperature Range -40°C to 85°C  
LD for UTQFN  
Packing Form:  
RE for Reel  
Ordering example:  
MLX92213ELD-AAA-000-RE  
1. Functional Diagram  
2. General Description  
The MLX92213 Micropower Low-Voltage Latch Hall effect sensor IC is fabricated in mixed signal CMOS  
technology. It incorporates advanced Correlated Double Sampling (CDS) techniques to provide accurate and  
stable magnetic switching points. In order to save power, the internal Timing Logic alternates Awake and Sleep  
modes, thus significantly reducing the power consumption. The magnetic flux density is periodically evaluated  
against predefined thresholds. If the flux density is above/below the BOP/BRP thresholds, then the Output  
changes its state accordingly. During the Sleep mode the Output is latched in its previous state. The design has  
been optimized for applications requiring extended operating lifetime in battery-powered systems. The EN pin  
adds flexibility by enabling external control of the Micropower Period and Duty Cycle. The Push-Pull Output of  
the MLX92213 will be latched in Low state in the presence of a sufficiently strong South magnetic field (B > B OP  
)
facing the marked side of the package. The Output will be latched in High state in the presence of a sufficiently  
strong North magnetic field (B < BRP).  
REVISION 004 - JAN 17, 2018  
390109221302  
Page 1 of 10  
 
 
MLX92213  
MicroPower & Low-Voltage  
Hall Effect Latch with Enable  
Contents  
1. Functional Diagram ................................................................................................................................1  
2. General Description................................................................................................................................1  
3. Glossary of Terms...................................................................................................................................3  
4. Absolute Maximum Ratings....................................................................................................................3  
5. Pinout.....................................................................................................................................................3  
6. Output Behavior vs. Magnetic Pole ........................................................................................................3  
7. General Electrical Specifications.............................................................................................................4  
8. Magnetic Specifications..........................................................................................................................5  
9. Application Section.................................................................................................................................5  
9.1. Application Schematics.......................................................................................................................5  
9.2. Recommendation / Comments..........................................................................................................5  
10. Principle of Operation ..........................................................................................................................6  
11. Performance Graphs ............................................................................................................................7  
11.1. Magnetic Threshold vs. Temperature .............................................................................................7  
11.2. Magnetic Threshold vs. Supply Voltage...........................................................................................7  
11.3. Average Supply Current vs. Temperature .......................................................................................7  
11.4. Average Supply Current vs. Supply Voltage ....................................................................................7  
11.5. Supply Current vs. Temperature......................................................................................................7  
11.6. Supply Current vs. Supply Voltage...................................................................................................7  
12. Standard information regarding manufacturability of Melexis products with different soldering  
processes...............................................................................................................................................8  
13. ESD Precautions ...................................................................................................................................8  
14. LD Package (UTQFN-6L)........................................................................................................................9  
15. Contact...............................................................................................................................................10  
16. Disclaimer...........................................................................................................................................10  
REVISION 004 - JAN 17, 2018  
390109221302  
Page 2 of 10  
MLX92213  
MicroPower & Low-Voltage  
Hall Effect Latch with Enable  
3. Glossary of Terms  
Gauss, milliTesla (mT),  
Units of magnetic flux density:  
10 Gauss = 1mT  
4. Absolute Maximum Ratings  
Parameter  
Symbol  
VDD  
IDD  
Value  
Units  
V
mA  
V
mA  
V
mA  
°C  
5
Supply Voltage  
±10  
Supply Current  
VIN  
IIN  
VOUT  
IOUT  
TA  
5
±10  
5
±10  
EN Input Voltage  
EN Input Current  
Output Voltage  
Output Current  
Operating Temperature Range  
Storage Temperature Range  
-40 to 85  
-50 to 150  
TS  
°C  
Table 1: Absolute maximum ratings  
Exceeding the absolute maximum ratings may cause permanent damage. Exposure to absolute-maximum-rated conditions for  
extended periods may affect device reliability.  
5. Pinout  
Pin Name  
VDD  
GND  
OUT  
EN  
Function  
Power Supply  
Ground  
Pin №  
3
4, E-pad  
1
(1)  
Push-Pull Output  
Enable(2)  
6
NC  
Not Connected  
2, 5  
Table 2: Pin definitions and descriptions  
6. Output Behavior vs. Magnetic Pole  
o
o
DC Operating Parameters T = -40 C to 85 C, V = 1.6V to 3.6V  
A
DD  
Test  
Conditions  
Parameter  
OUT  
South pole  
North pole  
B > BOP  
B < BRP  
Low  
High  
Table 3: Output behavior versus magnetic pole (3)  
1 Exposed Pad on LD package is connected to Ground.  
2 EN has to be connected to VDD when external Micropower control is not used.  
3 The magnetic pole is applied facing the package top  
REVISION 004 - JAN 17, 2018  
Page 3 of 10  
390109221302  
MLX92213  
MicroPower & Low-Voltage  
Hall Effect Latch with Enable  
7. General Electrical Specifications  
Operating Parameters: TA = -40 to 85oC, VDD = 1.6V to 3.6V, unless otherwise specified  
Parameter  
Supply Voltage  
Symbol  
Test Conditions  
Operating  
EN = VDD, VDD=3V  
EN = VDD, VDD=1.8V  
EN = VDD, IOUT = 0mA  
EN = VDD, IOUT = 0mA  
EN = 0  
Min  
1.6  
-
-
-
-
-
Typ  
Max  
3.6  
86  
70  
4
Units  
V
µA  
µA  
mA  
µA  
VDD  
-
48  
36  
-
-
-
Average Supply Current  
IDDav  
Awake Supply Current  
Sleep Supply Current  
Standby Supply Current  
IDDaw  
IDDsl  
IDDsb  
4.5  
1
µA  
Output Characteristics  
B < BRP, IOUT = -1mA  
B > BOP, IOUT = 1mA  
High Level Output Voltage  
Low Level Output Voltage  
Power-On Output State(1)  
VOH  
VOL  
VPO  
VDD-0.4  
-
VDD-0.2  
0.2  
High  
-
V
V
0.4  
Enable Pin Characteristics  
EN Input High Voltage  
EN Input Low Voltage  
EN Input Current  
EN Input Delay  
EN Pulse Width  
EN Period  
VIH  
VIL  
IIN  
tID  
TE1  
TE2  
0.1*VDD+1  
-
-
-
-
-
-
-
V
V
µA  
µs  
µs  
µs  
-
-1  
-
5
0.1*VDD+0.1  
1
5
-
TAW + 0.1  
-
Timing Characteristics  
Disabled -> Enabled  
Enabled -> Disabled  
EN = VDD  
(2)  
Enable Transition Time  
Disable Transition Time  
Power-On Time(4)  
tET  
tDT  
-
-
-
-
-
-
-
-
31  
31  
-
27  
30  
1.30  
-
tID + TAW  
tID + TAW  
µs  
µs  
µs  
µs  
µs  
µs  
µs  
ms  
ms  
Hz  
(3)  
80  
52  
60  
40  
45  
tON  
EN = VDD, TA=25oC, VDD=3V  
EN = VDD  
Awake Time  
TAW  
EN = VDD, TA=25oC, VDD=3V  
EN = VDD, TA=25oC, VDD=1.8V  
EN = VDD  
-
0.70  
-
Period  
TPER  
tRES  
fB  
1.90  
TPER  
]
Response Time(5)  
Magnetic Signal Frequency  
EN = VDD  
EN = VDD  
1 / [ 2 * TPER  
Table 4: Electrical specification  
1 Defined output state after Power-On Time is high until the first BOP threshold is reached (B>BOP)  
2 Enable transition time defined from EN command to the update of the Output driver state (ref. to Diagrams, p.6)  
3 Disable transition time defined from EN command to entering Standby (ref. to Diagrams, p. 6)  
4 Power-On Time represents the time from reaching VDD = 1.6V to the update of the Output driver state  
5 Response Time is the time from the magnetic field change to the according update of the Output driver state, guaranteed  
by design  
REVISION 004 - JAN 17, 2018  
Page 4 of 10  
390109221302  
MLX92213  
MicroPower & Low-Voltage  
Hall Effect Latch with Enable  
8. Magnetic Specifications  
DC Operating Parameters: VDD = 1.6V to 3.6V  
Parameter  
Operating Point  
Release Point  
Hysteresis  
Operating Point  
Release Point  
Hysteresis  
Symbol  
BOP  
BRP  
BHYST  
BOP  
BRP  
Test Conditions  
Min  
0.5  
-4  
1.5  
0.1  
-5  
Typ  
2
-2  
4
2
-2  
4
Max  
4
-0.5  
7
5
-0.1  
7
Units  
mT  
mT  
mT  
mT  
TA = 25°C  
TA = -40 to 85oC  
mT  
mT  
BHYST  
1.5  
Table 5: Magnetic specifications  
9. Application Section  
9.1. Application Schematics  
9.2. Recommendation / Comments  
A bypass capacitor C1 of 10nF is recommended to ensure supply voltage stability in application. It should be placed  
between the VDD and GND pin, as close as possible to the MLX92213.  
The MLX92213 provides a direct push-pull output, hence aiming to reduce external component count like output pull-up  
resistor or capacitor. The use of the output capacitor C2 connected in parallel to the output is optional. If connected  
between OUT and GND in such a push-pull configuration, the current sinked by the charge of the capacitor when the  
output switches from “0” to “1” leads to an small increase of the average current consumption of the whole module (IC +  
capacitor).  
Using small capacitor value C2 (less than 50pF) would avoid having such small increase of the module a verage current  
consumption.  
For enhanced power management, the EN (Enable) signal can be driven by an external MCU. It basically allows controlling  
the state IC and therefore its current consumption according the application requirements:  
.
.
.
Standby mode for minimal current consumption (EN = “0”)  
Default Micropower (EN = 1)  
Faster or slower sampling rate through EN signal  
For more details on the different mode, please refer to the Principle of Operation section.  
For application where standard power management is enough (default “Micropower” mode, Standby unused), the EN pin  
should be tied to VDD  
REVISION 004 - JAN 17, 2018  
390109221302  
Page 5 of 10  
MLX92213  
MicroPower & Low-Voltage  
Hall Effect Latch with Enable  
10. Principle of Operation  
Note: The diagrams are not-to-scale, for exact values refer to General Electrical Specification  
Note: The Output is assumed to have only a low capacitive load, which results in fast rise / fall times  
REVISION 004 - JAN 17, 2018  
390109221302  
Page 6 of 10  
MLX92213  
MicroPower & Low-Voltage  
Hall Effect Latch with Enable  
11. Performance Graphs  
11.1. Magnetic Threshold vs. Temperature  
11.2. Magnetic Threshold vs. Supply Voltage  
11.3. Average  
Supply  
Current  
vs.  
11.4. Average Supply Current vs. Supply  
Temperature  
Voltage  
11.5. Supply Current vs. Temperature  
11.6. Supply Current vs. Supply Voltage  
REVISION 004 - JAN 17, 2018  
390109221302  
Page 7 of 10  
MLX92213  
MicroPower & Low-Voltage  
Hall Effect Latch with Enable  
12. Standard information regarding manufacturability of Melexis products  
with different soldering processes  
Our products are classified and qualified regarding soldering technology, solderability and moisture sensitivity level  
according to following test methods:  
Reflow Soldering SMD’s (Surface Mount Devices)  
IPC/JEDEC J-STD-020  
Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State Surface Mount Devices  
(classification reflow profiles according to table 5-2)  
EIA/JEDEC JESD22-A113  
Preconditioning of Nonhermetic Surface Mount Devices Prior to Reliability Testing  
(reflow profiles according to table 2)  
Wave Soldering SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)  
EN60749-20  
Resistance of plastic- encapsulated SMD’s to combined effect of moisture and soldering heat  
EIA/JEDEC JESD22-B106 and EN60749-15  
Resistance to soldering temperature for through-hole mounted devices  
Iron Soldering THD’s (Through Hole Devices)  
EN60749-15  
Resistance to soldering temperature for through-hole mounted devices  
Solderability SMD’s (Surface Mount Devices) and THD’s (Through Hole Devices)  
EIA/JEDEC JESD22-B102 and EN60749-21  
Solderability  
For all soldering technologies deviating from above mentioned standard conditions (regarding peak temperature,  
temperature gradient, temperature profile etc) additional classification and qualification tests have to be agreed upon with  
Melexis.  
The application of Wave Soldering for SMD’s is allowed only after consulting Melexis regarding assurance of adhesive  
strength between device and board.  
Melexis is contributing to global environmental conservation by promoting lead free solutions. For more information on  
qualifications of RoHS compliant products (RoHS = European directive on the Restriction Of the use of certain Hazardous  
Substances) please visit the quality page on our website: http://www.melexis.com/quality.aspx  
13. ESD Precautions  
Electronic semiconductor products are sensitive to Electro Static Discharge (ESD).  
Always observe Electro Static Discharge control procedures whenever handling semiconductor products.  
REVISION 004 - JAN 17, 2018  
390109221302  
Page 8 of 10  
MLX92213  
MicroPower & Low-Voltage  
Hall Effect Latch with Enable  
14. LD Package (UTQFN-6L)  
This table in mm  
D x E  
N
e
A
A1  
A3  
D2  
E2  
G
L
K
b
min  
max  
0.31  
0.40  
0.00  
0.05  
0.95  
1.20  
0.55  
0.90  
1.20  
1.30  
0.22  
0.43  
0.20 0.18  
0.30  
0.13  
REF  
1.5 x 2  
6
0.50  
Note:  
1. General tolerance of D and E is ±0.1mm.  
2. Bottom pin1 identification is may vary depends on the suppliers.  
REVISION 004 - JAN 17, 2018  
390109221302  
Page 9 of 10  
MLX92213  
MicroPower & Low-Voltage  
Hall Effect Latch with Enable  
15. Contact  
For the latest version of this document, go to our website at www.melexis.com.  
For additional information, please contact our Direct Sales team and get help for your specific needs:  
Europe, Africa  
Telephone: +32 13 67 04 95  
Email : sales_europe@melexis.com  
Telephone: +1 603 223 2362  
Email : sales_usa@melexis.com  
Email : sales_asia@melexis.com  
Americas  
Asia  
16. Disclaimer  
The information furnished by Melexis herein (“Information”) is believed to be correct and accurate. Melexis disclaims (i) any and all liability in connection with or arising out of the  
furnishing, performance or use of the technical data or use of the product(s) as described herein (“Product”) (ii) any and all liability, including without limitation, special,  
consequential or incidental damages, and (iii) any and all warranties, express, statutory, implied, or by description, including warranties of fitness for particular purpose, non-  
infringement and merchantability. No obligation or liability shall arise or flow out of Melexis’ rendering of technical or other services.  
The Information is provided "as is” and Melexis reserves the right to change the Information at any time and without notice. Therefore, before placing orders and/or prior to  
designing the Product into a system, users or any third party should obtain the latest version of the relevant information to verify that the information being relied upon is current.  
Users or any third party must further determine the suitability of the Product for its application, including the level of reliability required and determine whether it is fit for a  
particular purpose.  
The Information is proprietary and/or confidential information of Melexis and the use thereof or anything described by the Information does not grant, explicitly or implicitly, to  
any party any patent rights, licenses, or any other intellectual property rights.  
This document as well as the Product(s) may be subject to export control regulations. Please be aware that export might require a prior authorization from competent authorities.  
The Product(s) are intended for use in normal commercial applications. Unless otherwise agreed upon in writing, the Product(s) are not designed, authorized or warranted to be  
suitable in applications requiring extended temperature range and/or unusual environmental requirements. High reliability applications, such as medical life-support or life-  
sustaining equipment are specifically not recommended by Melexis.  
The Product(s) may not be used for the following applications subject to export control regulations: the development, production, processing, operation, maintenance, storage,  
recognition or proliferation of 1) chemical, biological or nuclear weapons, or for the development, production, maintenance or storage of missiles for such weapons: 2) civil  
firearms, including spare parts or ammunition for such arms; 3) defense related products, or other material for military use or for law enforcement; 4) any applications that, alone  
or in combination with other goods, substances or organisms could cause serious harm to persons or goods and that can be used as a means of violence in an armed conflict or any  
similar violent situation.  
The Products sold by Melexis are subject to the terms and conditions as specified in the Terms of Sale, which can be found at https://www.melexis.com/en/legal/terms-and-  
conditions.  
This document supersedes and replaces all prior information regarding the Product(s) and/or previous versions of this document.  
Melexis NV © - No part of this document may be reproduced without the prior written consent of Melexis. (2016)  
ISO/TS 16949 and ISO14001 Certified  
REVISION 004 - JAN 17, 2018  
390109221302  
Page 10 of 10  

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