APT45GR65B2DU30 [MICROSEMI]

Insulated Gate Bipolar Transistor, 118A I(C), 650V V(BR)CES, N-Channel, TO-247AD, ROHS COMPLIANT, T-MAX, TO-247, 3 PIN;
APT45GR65B2DU30
型号: APT45GR65B2DU30
厂家: Microsemi    Microsemi
描述:

Insulated Gate Bipolar Transistor, 118A I(C), 650V V(BR)CES, N-Channel, TO-247AD, ROHS COMPLIANT, T-MAX, TO-247, 3 PIN

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APT45GR65B2DU30  
650V, 45A, VCE(on)= 1.9V Typical  
Ultra Fast NPT - IGBT® with Ultra Soft Recovery Diode  
The Ultra Fast 650V NPT-IGBT® family of products is the newest generation  
of IGBTs optimized for outstanding ruggedness and best trade-off between  
conduction and switching losses.  
Features  
• Low Saturation Voltage  
• Short Circuit Withstand Rated  
• High Frequency Switching  
• Ultra Low Leakage Current  
• Snap-free Switching  
• Low Tail Current  
Combi (IGBT and Diode)  
• RoHS Compliant  
• Smooth Reverse Recovery  
Unless stated otherwise, Microsemi discrete IGBTs contain a single IGBT die. This device is recommended for  
applications such as induction heating (IH), motor control, general purpose inverters and uninterruptible power  
supplies (UPS).  
MAXIMUM RATINGS  
Symbol Parameter  
All Ratings: T = 25°C unless otherwise specied.  
C
Ratings  
Unit  
VCES  
Collector Emitter Voltage  
650  
V
VGE  
IC1  
Gate-Emitter Voltage  
±30  
118  
Continuous Collector Current @ TC = 25°C  
Continuous Collector Current @ TC = 110°C  
IC2  
56  
A
1
ICM  
Pulsed Collector Current  
224  
SCWT  
PD  
Short Circuit Withstand Time: VCE = 325V, VGE = 15V, TC=125°C  
Total Power Dissipation @ TC = 25°C  
10  
μs  
543  
W
TJ,TSTG  
TL  
Operating and Storage Junction Temperature Range  
Max. Lead Temp. for Soldering: 0.063" from Case for 10 Sec.  
-55 to 150  
300  
°C  
STATIC ELECTRICAL CHARACTERISTICS  
Symbol Parameter  
Min  
650  
3.5  
Typ  
Max  
Unit  
V(BR)CES  
VGE(TH)  
Collector-Emitter Breakdown Voltage (VGE = 0V, IC = 350A)  
Gate Threshold Voltage (VCE = VGE, IC = 2.5mA, Tj = 25°C)  
5.0  
6.5  
2.4  
Volts  
Collector-Emitter On Voltage (VGE = 15V, IC = 45A, Tj = 25°C)  
Collector-Emitter On Voltage (VGE = 15V, IC = 45A, Tj = 125°C)  
Collector-Emitter On Voltage (VGE = 15V, IC = 90A, Tj = 25°C)  
1.9  
2.4  
2.6  
20  
VCE(ON)  
2
Collector Cut-off Current (VCE = 650V, VGE = 0V, Tj = 25°C)  
350  
ICES  
IGES  
A  
2
Collector Cut-off Current (VCE = 650V, VGE = 0V, Tj = 125°C)  
200  
Gate-Emitter Leakage Current (VGE = ±20V)  
±250  
nA  
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.  
Microsemi Website - http://www.microsemi.com  
DYNAMIC CHARACTERISTICS  
APT45GR65B2DU30  
Symbol  
Cies  
Parameter  
Test Conditions  
Capacitance  
Min  
Typ  
2900  
548  
268  
7.5  
Max  
Unit  
Input Capacitance  
Coes  
Output Capacitance  
Reverse Transfer Capacitance  
Gate to Emitter Plateau Voltage  
Total Gate Charge  
VGE = 0V, VCE = 25V  
f = 1MHz  
pF  
Cres  
VGEP  
Gate Charge  
V
3
Qg  
150  
18  
203  
24  
V
GE = 15V  
Qge  
Qgc  
td(on)  
tr  
Gate-Emitter Charge  
Gate- Collector Charge  
Turn-On Delay Time  
Current Rise Time  
VCE= 325V  
IC = 45A  
nC  
74  
100  
Inductive Switching (25°C)  
VCC = 433V  
15  
32  
ns  
J  
ns  
J  
td(off)  
tf  
Turn-Off Delay Time  
Current Fall Time  
100  
50  
VGE = 15V  
IC = 45A  
5
RG = 4.3Ω 4  
Eon2  
Turn-On Switching Energy  
Turn-Off Switching Energy  
Turn-On Delay Time  
Current Rise Time  
1100  
540  
15  
1650  
870  
6
Eoff  
TJ = +25°C  
td(on)  
tr  
td(off)  
tf  
Inductive Switching (125°C)  
VCC = 433V  
32  
Turn-Off Delay Time  
Current Fall Time  
123  
52  
VGE = 15V  
IC = 45A  
5
RG = 4.3Ω 4  
Eon2  
Turn-On Switching Energy  
Turn-Off Switching Energy  
1600  
800  
2400  
1160  
6
Eoff  
TJ = +125°C  
THERMAL AND MECHANICAL CHARACTERISTICS  
Symbol Characteristic  
Min  
Typ  
Max  
0.23  
0.80  
40  
Unit  
Junction to Case Thermal Resistance (IGBT)  
RθJC  
°C/W  
Junction to Case Thermal Resistance (Diode)  
RθJA  
WT  
Junction to Ambient Thermal Resistance  
0.22  
6.2  
oz  
g
Package Weight  
1
2
3
4
5
6
Repetitive Rating: Pulse width and case temperature limited by maximum junction temperature.  
Pulse test: Pulse Width < 380μs, duty cycle < 2%.  
See Mil-Std-750 Method 3471.  
R
G is external gate resistance, not including internal gate resistance or gate driver impedance. (MIC4452)  
on2 is the energy loss at turn-on and includes the charge stored in the freewheeling diode.  
Eoff is the clamped inductive turn-off energy measured in accordance with JEDEC standard JESD24-1.  
E
Microsemi reserves the right to change, without notice, the specications and information contained herein.  
TYPICAL PERFORMANCE CURVES  
0.25  
D = 0.9  
0.20  
0.5  
0.15  
0.3  
Note:  
0.10  
0.1  
t
1
t
2
0.05  
0.02  
0.05  
0
t
1
t
/
2
Duty Factor D =  
Peak T = P x Z  
+ T  
C
J
DM  
θJC  
SINGLE PULSE  
10-4  
10-5  
10-2  
RECTANGULAR PULSE DURATION (SECONDS)  
FIGURE 1, Maximum Effective Transient Thermal Impedance, Junction-To-Case vs Pulse Duration  
10-3  
0.1  
1
TYPICAL PERFORMANCE CURVES  
APT45GR65B2DU30  
180  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
V
= 15V  
GE  
160  
140  
120  
100  
80  
TJ= - 55°C  
TJ= 25°C  
TJ= 125°C  
TJ= 150°C  
60  
40  
20  
0
0
10 20 30 40 50 60 70 80 90  
0
1
2
3
4
5
V
, COLLECTOR-TO-EMITTER VOLTAGE (V)  
I (A)  
C
CE  
FIGURE 3, Saturation Voltage Characteristics  
FIGURE 2, Max Frequency vs Current (T  
= 75°C)  
case  
150  
4
15V 13V  
I
= 90A  
C
I
125  
100  
75  
50  
25  
0
10V  
9.0V  
3
2
1
0
= 45A  
C
8.0V  
I
= 22.5A  
C
7.5V  
7V  
6.5V  
VGE = 15V.  
250s PULSE TEST  
<0.5 % DUTY CYCLE  
-50 -25  
0
25  
50  
75  
100 125  
0
2
4
6
8
10 12 14 16 18 20  
V
, COLLECTOR-TO-EMITTER VOLTAGE (V)  
T , Junction Temperature (°C)  
CE  
J
FIGURE 4, Output Characteristics (T = 25°C)  
FIGURE 5, On State Voltage vs Junction Temperature  
J
4
200  
150  
100  
50  
TJ = 25°C.  
250s PULSE TEST  
250s PULSE TEST  
<0.5 % DUTY CYCLE  
<0.5 % DUTY CYCLE  
TJ= -55°C  
3
I
= 90A  
= 45A  
C
I
C
2
1
I
= 22.5A  
C
TJ= 150°C  
TJ= 125°C  
TJ= 25°C  
0
0
2
4
6
8
10  
12  
8
10  
12  
14  
16  
18  
V
, GATE-TO-EMITTER VOLTAGE (V)  
V
, GATE-TO-EMITTER VOLTAGE (V)  
GE  
GE  
FIGURE 6, Transfer Characteristics  
FIGURE 7, On State Voltage vs Gate-to-Emitter Voltage  
160  
1.15  
1.10  
140  
120  
100  
80  
1.05  
1.00  
0.95  
60  
40  
0.90  
0.85  
20  
0
50 25  
0
25 50 75 100 125 150  
-50 -25  
0
25  
50  
75  
100 125  
T , JUNCTION TEMPERATURE  
T , CASE TEMPERATURE (°C)  
J
C
FIGURE 8, Breakdown Voltage vs Junction Temperature  
FIGURE 9, DC Collector Current vs Case Temperature  
TYPICAL PERFORMANCE CURVES  
APT45GR65B2DU30  
1.0E8  
18  
16  
14  
12  
10  
I
= 45A  
C
T
= 25°C  
Cies  
J
V
= 130V  
CE  
1.0E9  
1.0E10  
1.0E11  
V
= 325V  
CE  
Coes  
8
V
= 520V  
CE  
Cres  
6
4
2
0
0
20 40 60 80 100 120 140 160 180  
GATE CHARGE (nC)  
0
10  
20  
30  
40  
50  
V
, COLLECTOR-TO-EMITTER VOLTAGE (VOLTS)  
CE  
FIGURE 10, Capacitance vs Collector-To-Emitter Voltage  
FIGURE 11, Gate charge  
1000  
80  
VCE = 433V, VGE=15V, RG = 4.3  
TJ = 25°C or 125°C  
70  
60  
50  
40  
30  
20  
10  
0
T
T
d(off)  
r
100  
T
T
f
d(on)  
VCE = 433V, VGE=15V, RG = 4.3ꢁ  
TJ = 25°C  
TJ = 125°C  
10  
0
I
20  
40  
60  
80  
100  
0
20  
40  
60  
80  
100  
, COLLECTOR-TO-EMITTER CURRENT (A)  
I
, COLLECTOR-TO-EMITTER CURRENT (A)  
CE  
CE  
FIGURE 12, Turn-On Time vs Collector Current  
FIGURE 13, Turn-Off Time vs Collector Current  
4500  
4000  
3500  
3000  
2500  
2000  
1500  
1000  
500  
2500  
2000  
1500  
1000  
500  
VCE = 433V, VGE=15V, RG = 4.3ꢁ  
TJ = 25°C  
TJ = 125°C  
E
on2  
E
on2  
E
off  
VCE = 433V, VGE=15V, IC = 45A  
TJ = 125°C  
E
off  
0
0
0
20  
40  
60  
80  
100  
0
10  
20  
30  
40  
50  
R , GATE RESISTANCE (Ω)  
I
, COLLECTOR-TO-EMITTER CURRENT (A)  
G
CE  
FIGURE 15, Energy Loss vs Gate Resistance  
FIGURE 14, Energy Loss vs Collector Current  
2000  
1000  
100  
10  
1500  
1000  
500  
0
E
on2  
0.01ms  
0.1ms  
1ms  
E
1
off  
10ms  
VCE = 433V, VGE=15V, RG = 4.3ꢁ  
100ms  
IC = 45A  
0.1  
100  
, COLLECTOR-TO-EMITTER VOLTAGE  
CE  
1
10  
1000  
0
25  
50  
75  
100  
125  
T , JUNCTION TEMPERATURE (°C)  
V
J
FIGURE 16, Swiitching Energy vs Junction Temperature  
FIGURE 17, Minimum Switching Safe Operating Area  
APT45GR65B2DU30  
ULTRA SOFT RECOVERY ANTI-PARALLEL DIODE  
MAXIMUM RATINGS  
All Ratings: T = 25°C unless otherwise specied.  
C
Symbol Characteristic / Test Conditions  
APT45GR65B2DU30  
Unit  
IF(AV)  
IF(RMS)  
IFSM  
Maximum Average Forward Current (TC = 82°C, Duty Cycle = 0.5)  
30  
41  
RMS Forward Current (Square wave, 50% duty)  
Amps  
Non-Repetitive Forward Surge Current (TJ = 45°C, 8.3ms)  
210  
STATIC ELECTRICAL CHARACTERISTICS  
Symbol Characteristic / Test Conditions  
Min  
Typ  
3
Max  
Unit  
IF = 30A  
VF  
Forward Voltage  
IF = 60A  
3.9  
3.5  
Volts  
IF = 60A, TJ = 125°C  
DYNAMIC CHARACTERISTICS  
Symbol  
Parameter  
Test Conditions  
Min  
Typ  
Max  
Unit  
ns  
IF = 1.0A, dif/dt= -100 A/s, VR = 30V, Tj = 25°C  
Reverse Recovery Time  
Reverse Recovery Time  
Reverse Recovery Charge  
Maximum Reverse Recovery Current  
Reverse Recovery Energy  
Reverse Recovery  
28  
80  
trr  
trr  
ns  
IF = 30 Amps  
dif/dt= -200 A/s  
VR = 433 Volts  
Tj = 25°C  
110  
3
nC  
Qrr  
IRRM  
Err  
trr  
Amps  
μJ  
2
343  
965  
7
ns  
IF = 30 Amps  
dif/dt= -200 A/s  
VR = 433 Volts  
Tj = 125°C  
Reverse Recovery Charge  
Maximum Reverse Recovery Current  
Reverse Recovery Energy  
Reverse Recovery  
nC  
Qrr  
IRRM  
Err  
trr  
Amps  
μJ  
88  
124  
1355  
24  
ns  
IF = 30 Amps  
dif/dt= -1000 A/s  
VR= 433 Volts  
Tj = 125°C  
Reverse Recovery Charge  
Maximum Reverse Recovery Current  
Reverse Recovery Energy  
Softness Factor (tb/ta)  
nC  
Qrr  
IRRM  
Err  
S
Amps  
μJ  
211  
2
IF = 15A, dif/dt= -1000 A/s, VR= 800V, Tj = 125°C  
TYPICAL PERFORMANCE CURVES  
0.9  
0.8  
D = 0.9  
0.7  
0.7  
0.6  
0.5  
0.5  
0.4  
Note:  
t
1
0.3  
0.3  
0.2  
0.1  
t
2
t
1
t
0.1  
Duty Factor D =  
/
2
Peak T = P  
x Z  
+ T  
C
J
DM  
θJC  
0.05  
SINGLE PULSE  
0
10-5  
10-4  
10-2  
RECTANGULAR PULSE DURATION (seconds)  
10-3  
0.1  
1
FIGURE 18, MAXIMUM EFFECTIVE TRANSIENT THERMAL IMPEDANCE, JUNCTION-TO-CASE vs. PULSE DURATION  
TYPICAL PERFORMANCE CURVES  
APT45GR65B2DU30  
60  
450  
400  
350  
300  
250  
200  
150  
100  
50  
T
= 125°C  
= 433V  
J
T
= 150°C  
V
J
60A  
R
50  
40  
30  
20  
10  
T
= 125°C  
J
30A  
15A  
T
= 25°C  
J
T
= -55°C  
J
0
0
0
200  
400  
600 800 1000 1200  
0
2
4
6
V , ANODE-TO-CATHODE VOLTAGE (V)  
- di /dt, CURRENT RATE OF CHANGE(A/s)  
F
F
FIGURE 19, F Forward Current vs. Forward Voltage  
FIGURE 20, Reverse Recovery Time vs. Current Rate of Change  
2000  
1800  
1600  
1400  
1200  
1000  
800  
35  
T
= 125°C  
= 433V  
T
= 125°C  
= 433V  
J
J
V
V
R
R
30  
25  
20  
15  
10  
5
60A  
60A  
30A  
30A  
15A  
15A  
600  
400  
200  
0
0
0
200  
400  
600  
800 1000 1200  
0
200  
400  
600  
800 1000 1200  
-di /dt, CURRENT RATE OF CHANGE (A/s)  
-di /dt, CURRENT RATE OF CHANGE (A/s)  
F
F
FIGURE 21, Reverse Recovery Charge vs. Current Rate of Change  
FIGURE 22, Reverse Recovery Current vs. Current Rate of Change  
50  
1.4  
Duty cycle = 0.5  
45  
1.2  
40  
35  
30  
25  
20  
15  
10  
5
1.0  
0.7  
t
rr  
I
RRM  
0.6  
0.4  
0.2  
Q
rr  
0
0
25  
50  
CASE TEMPERATURE (°C)  
FIGURE 24, Max Average Forward Current vs. Case Temperature  
75  
100  
125  
150  
0
25  
50  
75  
100  
125  
150  
TJ, JUNCTION TEMPERATURE (°C)  
FIGURE 23, Dynamic Parameters vs. Junction Temperature  
140  
120  
100  
80  
60  
40  
20  
0
0
10  
200 300 400  
500 600 700  
V , REVERSE VOLTAGE (V)  
R
FIGURE 25, Junction Capacitance vs. Reverse Voltage  
APT45GR65B2DU30  
V
r
diF /dt Adjus t  
+18V  
0V  
D.U.T.  
t
Q
/
30μH  
rr rr  
Waveform  
PEARSON 2878  
CURRENT  
TRANSFORMER  
FIGURE 26, Diode Test Circuit  
1
2
3
4
IF - Forward Conduction Current  
6
diF/dt - Rate of Diode Current Change Through Zero Crossing  
RRM - Maximum Reverse Recovery Current  
ta - Time to reach Maximum Reverse Recovery Current (IRRM  
1
4
5
Zero  
I
7
)
0.25 I  
RRM  
3
tb - Time from Maximum Reverse Recovery Current (IRRM) to projected  
zero crossing based on a straight line from IRRM through 25% IRRM.  
trr - Reverse Recovery Time measured from zero crossing where  
diode current goes from positive to negative, to the point at  
which the straight line through IRRM and 0.25, IRRM passes through zero  
Qrr - Area Under the Curve Dened by IRRM and trr  
5
2
6
7
FIGURE 27, Diode Reverse Recovery Waveform Denition  
®
T-MAX (B2) Package Outline  
4.69 (.185)  
5.31 (.209)  
15.49 (.610)  
16.26 (.640)  
1.49 (.059)  
2.49 (.098)  
5.38 (.212)  
6.20 (.244)  
20.80 (.819)  
21.46 (.845)  
2.87 (.113)  
3.12 (.123)  
4.50 (.177) Max.  
1.65 (.065)  
2.13 (.084)  
Gate  
0.40 (.016)  
1.016(.040)  
19.81 (.780)  
20.32 (.800)  
1.01 (.040)  
1.40 (.055)  
Collector (Cathode)  
Emitter (Anode)  
2.21 (.087)  
2.59 (.102)  
5.45 (.215) BSC  
2-Plcs.  
These dimensions are equal to the TO-247 without the mounting hole.  
Dimensions in Millimeters and (Inches)  
APT45GR65B2DU30  
Disclaimer:  
The information contained in the document (unless it is publicly available on the Web without access restrictions) is PROPRIETARY AND  
CONFIDENTIAL information of Microsemi and cannot be copied, published, uploaded, posted, transmitted, distributed or disclosed or used  
without the express duly signed written consent of Microsemi. If the recipient of this document has entered into a disclosure agreement with  
Microsemi, then the terms of such Agreement will also apply. This document and the information contained herein may not be modied, by  
any person other than authorized personnel of Microsemi. No license under any patent, copyright, trade secret or other intellectual property  
right is granted to or conferred upon you by disclosure or delivery of the information, either expressly, by implication, inducement, estoppels or  
otherwise. Any license under such intellectual property rights must be approved by Microsemi in writing signed by an ofcer of Microsemi.  
Microsemi reserves the right to change the conguration, functionality and performance of its products at anytime without any notice. This  
product has been subject to limited testing and should not be used in conjunction with life-support or other mission-critical equipment or  
applications. Microsemi assumes no liability whatsoever, and Microsemi disclaims any express or implied warranty, relating to sale and/or  
use of Microsemi products including liability or warranties relating to tness for a particular purpose, merchantability, or infringement of any  
patent, copyright or other intellectual property right. Any performance specications believed to be reliable but are not veried and customer or  
user must conduct and complete all performance and other testing of this product as well as any user or customer's nal application. User or  
customer shall not rely on any data and performance specications or parameters provided by Microsemi. It is the customer’s and user’s re-  
sponsibility to independently determine suitability of any Microsemi product and to test and verify the same. The information contained herein  
is provided “AS IS, WHERE IS” and with all faults, and the entire risk associated with such information is entirely with the User. Microsemi  
specically disclaims any liability of any kind including for consequential, incidental and punitive damages as well as lost prot. The product is  
subject to other terms and conditions which can be located on the web at http://www.microsemi.com/terms-a-conditions.  

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