APT54GA60B [MICROSEMI]

High Speed PT IGBT; 高速PT IGBT
APT54GA60B
型号: APT54GA60B
厂家: Microsemi    Microsemi
描述:

High Speed PT IGBT
高速PT IGBT

双极性晶体管
文件: 总6页 (文件大小:215K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
APT54GA60B  
APT54GA60S  
600V  
High Speed PT IGBT  
POWER MOS 8® is a high speed Punch-Through switch-mode IGBT. Low Eoff is achieved  
APT54GA60S  
through leading technology silicon design and lifetime control processes. A reduced Eoff  
-
D3PAK  
VCE(ON) tradeoff results in superior efciency compared to other IGBT technologies. Low  
gate charge and a greatly reduced ratio of Cres/Cies provide excellent noise immunity, short  
delay times and simple gate drive. The intrinsic chip gate resistance and capacitance of the  
poly-silicone gate structure help control di/dt during switching, resulting in low EMI, even  
when switching at high frequency.  
APT54GA60B  
Single die IGBT  
FEATURES  
TYPICAL APPLICATIONS  
• Fast switching with low EMI  
• Very Low Eoff for maximum efciency  
• Ultra low Cres for improved noise immunity  
• Low conduction loss  
• ZVS phase shifted and other full bridge  
• Half bridge  
• High power PFC boost  
• Welding  
• Low gate charge  
• UPS, solar, and other inverters  
• High frequency, high efciency industrial  
• Increased intrinsic gate resistance for low EMI  
• RoHS compliant  
Absolute Maximum Ratings  
Symbol Parameter  
Ratings  
Unit  
Collector Emitter Voltage  
600  
V
Vces  
IC1  
Continuous Collector Current @ TC = 25°C  
Continuous Collector Current @ TC = 100°C  
Pulsed Collector Current 1  
96  
54  
A
IC2  
ICM  
161  
VGE  
Gate-Emitter Voltage 2  
±30  
V
PD  
Total Power Dissipation @ TC = 25°C  
Switching Safe Operating Area @ TJ = 150°C  
Operating and Storage Junction Temperature Range  
416  
W
SSOA  
TJ, TSTG  
TL  
161A @ 600V  
-55 to 150  
°C  
Lead Temperature for Soldering: 0.063" from Case for 10 Seconds  
300  
Static Characteristics  
Symbol Parameter  
T = 25°C unless otherwise specied  
J
Test Conditions  
Min  
Typ  
Max  
Unit  
VBR(CES)  
Collector-Emitter Breakdown Voltage  
VGE = 0V, IC = 1.0mA  
600  
TJ = 25°C  
TJ = 125°C  
2.0  
1.9  
4.5  
2.5  
VGE = 15V,  
IC = 32A  
V
VCE(on)  
VGE(th)  
ICES  
Collector-Emitter On Voltage  
Gate Emitter Threshold Voltage  
Zero Gate Voltage Collector Current  
Gate-Emitter Leakage Current  
VGE =VCE , IC = 1mA  
3
6
TJ = 25°C  
250  
VCE = 600V,  
VGE = 0V  
μA  
TJ = 125°C  
2500  
±100  
IGES  
VGS = ±30V  
nA  
Thermal and Mechanical Characteristics  
Symbol Characteristic  
Min  
Typ  
-
Max  
.3  
Unit  
°C/W  
g
RθJC  
WT  
Junction to Case Thermal Resistance  
Package Weight  
-
-
5.9  
-
Torque  
Mounting Torque (TO-247 Package), 4-40 or M3 screw  
in·lbf  
10  
Microsemi Website - http://www.microsemi.com  
APT54GA60B_S  
Dynamic Characteristics  
T = 25°C unless otherwise specied  
J
Symbol  
Cies  
Parameter  
Test Conditions  
Capacitance  
Min  
Typ  
4130  
350  
45  
Max  
Unit  
Input Capacitance  
Coes  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
Gate-Emitter Charge  
VGE = 0V, VCE = 25V  
f = 1MHz  
pF  
Cres  
Qg3  
Gate Charge  
158  
26  
Qge  
VGE = 15V  
nC  
A
VCE= 300V  
Qgc  
Gate- Collector Charge  
52  
IC = 32A  
TJ = 150°C, RG = 4.7Ω4, VGE = 15V,  
L= 100uH, VCE = 600V  
Inductive Switching (25°C)  
VCC = 400V  
SSOA  
Switching Safe Operating Area  
161  
td(on)  
tr  
td(off)  
tf  
Turn-On Delay Time  
Current Rise Time  
17  
20  
ns  
μJ  
ns  
μJ  
Turn-Off Delay Time  
Current Fall Time  
112  
86  
VGE = 15V  
IC = 32A  
RG = 4.7Ω4  
Eon2  
Turn-On Switching Energy  
Turn-Off Switching Energy  
Turn-On Delay Time  
Current Rise Time  
534  
466  
16  
6
Eoff  
TJ = +25°C  
td(on  
tr  
td(off)  
tf  
Inductive Switching (125°C)  
21  
VCC = 400V  
Turn-Off Delay Time  
Current Fall Time  
146  
145  
891  
838  
VGE = 15V  
IC = 32A  
RG = 4.7Ω4  
Eon2  
Turn-On Switching Energy  
Turn-Off Switching Energy  
6
Eoff  
TJ = +125°C  
1
2
3
4
5
Repetitive Rating: Pulse width and case temperature limited by maximum junction temperature.  
Pulse test: Pulse Width < 380μs, duty cycle < 2%.  
See Mil-Std-750 Method 3471  
RG is external gate resistance, not including internal gate resistance or gate driver impedance. (MIC4452)  
Eon2 is the clamped inductive turn on energy that includes a commutating diode reverse recovery current in the IGBT turn on energy loss. A combi device is used for the  
clamping diode.  
Eoff is the clamped inductive turn-off energy measured in accordance with JEDEC standard JESD24-1.  
Microsemi reserves the right to change, without notice, the specications and information contained herein.  
6
Typical Performance Curves  
APT54GA60B_S  
100  
350  
300  
250  
200  
150  
100  
50  
V
= 15V  
GE  
15V  
13V  
TJ= 25°C  
TJ= 55°C  
10V  
75  
50  
25  
TJ= 125°C  
TJ= 150°C  
9V  
8V  
7V  
6V  
5V  
28 32  
0
0
0
2
4
6
8
0
4
8
12  
16 20 24  
V
, COLLECTOR-TO-EMITTER VOLTAGE (V)  
V
, COLLECTOR-TO-EMITTER VOLTAGE (V)  
CE  
CE  
FIGURE 1, Output Characteristics (T = 25°C)  
FIGURE 2, Output Characteristics (T = 25°C)  
J
J
200  
150  
100  
50  
16  
14  
12  
10  
250μs PULSE  
TEST<0.5 % DUTY  
CYCLE  
I
= 32A  
C
T
= 25°C  
J
V
= 120V  
CE  
V
= 300V  
CE  
8
V
= 480V  
CE  
6
4
2
0
TJ= 25°C  
TJ= -55°C  
TJ= 125°C  
0
0
2
4
6
8
10  
12  
14  
0
20 40 60 80 100 120 140 160  
GATE CHARGE (nC)  
V
, GATE-TO-EMITTER VOLTAGE (V)  
GE  
FIGURE 4, Gate charge  
FIGURE 3, Transfer Characteristics  
4
3
2
1
0
4
3
2
1
0
TJ = 25°C.  
250μs PULSE TEST  
<0.5 % DUTY CYCLE  
I
= 64A  
I
= 64A  
= 32A  
C
C
I
I
= 32A  
C
C
I
= 16A  
C
I
= 16A  
C
VGE = 15V.  
250μs PULSE TEST  
<0.5 % DUTY CYCLE  
6
8
10  
12  
14  
16  
0
25  
50  
75  
100  
125  
150  
V
, GATE-TO-EMITTER VOLTAGE (V)  
T , Junction Temperature (°C)  
GE  
J
FIGURE 5, On State Voltage vs Gate-to-Emitter Voltage  
FIGURE 6, On State Voltage vs Junction Temperature  
1.15  
160  
140  
120  
100  
80  
1.10  
1.05  
1.00  
0.95  
0.90  
0.85  
0.80  
0.75  
0.70  
60  
40  
20  
0
-50 -25  
0
25 50 75 100 125 150  
25  
50  
75  
100  
125  
150  
T , JUNCTION TEMPERATURE  
T , Case Temperature (°C)  
J
C
FIGURE 7, Threshold Voltage vs Junction Temperature  
FIGURE 8, DC Collector Current vs Case Temperature  
Typical Performance Curves  
APT54GA60B_S  
200  
160  
120  
80  
21  
VCE = 400V  
TJ = 25°C, or 125°C  
20  
19  
18  
17  
16  
15  
14  
R
G = 4.7  
L = 100μH  
VGE =15V,TJ=125°C  
VGE =15V,TJ=25°C  
V
= 15V  
GE  
40  
VCE = 400V  
RG = 4.7ꢀ  
L = 100μH  
0
0
10  
20  
30  
40  
50  
60  
70  
0
I
10  
20  
30  
40  
50  
60  
70  
, COLLECTOR-TO-EMITTER CURRENT (A)  
I
, COLLECTOR-TO-EMITTER CURRENT (A)  
CE  
CE  
FIGURE 9, Turn-On Delay Time vs Collector Current  
FIGURE 10, Turn-Off Delay Time vs Collector Current  
70  
60  
50  
40  
30  
20  
10  
0
200  
R
G = 4.7, L = 100μH, VCE = 400V  
160  
T
J = 125°C, VGE = 15V  
120  
80  
40  
0
T
J = 25°C, VGE = 15V  
TJ = 25 or 125°C,VGE = 15V  
R
G = 4.7, L = 100μH, VCE = 400V  
0
I
10  
20  
30  
40  
50  
60 70  
0
10  
20  
30  
40  
50  
60  
70  
I
, COLLECTOR-TO-EMITTER CURRENT (A)  
, COLLECTOR-TO-EMITTER CURRENT (A)  
CE  
CE  
FIGURE 12, Current Fall Time vs Collector Current  
FIGURE 11, Current Rise Time vs Collector Current  
2400  
2000  
1600  
1200  
800  
2400  
2000  
1600  
1200  
800  
V
V
=
=
400V  
+15V  
V
V
=
=
400V  
+15V  
CE  
GE  
CE  
GE  
R
= 4.7ꢀ  
R
=4.7ꢀ  
G
G
TJ = 125°C  
TJ = 125°C  
TJ = 25°C  
TJ = 25°C  
400  
400  
0
0
0
10  
20  
30  
40  
50  
60  
70  
0
10  
20  
30  
40  
50  
60 70  
I
, COLLECTOR-TO-EMITTER CURRENT (A)  
I
, COLLECTOR-TO-EMITTER CURRENT (A)  
CE  
CE  
FIGURE 13, Turn-On Energy Loss vs Collector Current  
FIGURE 14, Turn-Off Energy Loss vs Collector Current  
6000  
5000  
4000  
3000  
2000  
1000  
2400  
V
V
T
=
=
400V  
+15V  
V
V
=
=
400V  
+15V  
Eon2,64A  
CE  
GE  
CE  
GE  
Eon2,64A  
= 125°C  
R
= 10ꢀ  
J
G
2000  
1600  
1200  
800  
Eoff,64A  
Eoff,64A  
Eon2,32A  
Eoff,32A  
Eon2,32A  
Eon2,16A  
Eoff,16A  
Eoff,32A  
Eon2,16A  
Eoff,16A  
400  
0
0
0
25  
50  
75  
100  
125  
0
10  
20  
30  
40  
50  
T , JUNCTION TEMPERATURE (°C)  
R , GATE RESISTANCE (OHMS)  
J
G
FIGURE 16, Switching Energy Losses vs Junction Temperature  
FIGURE 15, Switching Energy Losses vs Gate Resistance  
Typical Performance Curves  
APT54GA60B_S  
10000  
500  
100  
Cies  
1000  
10  
1
Coes  
100  
10  
Cres  
0.1  
1
10  
100  
1000  
0
100  
200  
300  
400  
500  
V
, COLLECTOR-TO-EMITTER VOLTAGE  
V
, COLLECTOR-TO-EMITTER VOLTAGE (VOLTS)  
CE  
CE  
FIGURE 18, Minimum Switching Safe Operating Area  
FIGURE 17, Capacitance vs Collector-To-Emitter Voltage  
0.35  
0.30  
D = 0.9  
0.25  
0.7  
0.20  
0.5  
Note:  
0.15  
t
1
0.3  
0.10  
t
2
t
0.1  
0.05  
0
1
t
/
2
Duty Factor D =  
Peak T = P x Z  
+ T  
C
J
DM  
θJC  
SINGLE PULSE  
10-3  
0.05  
-4  
10-5  
10  
10 -2  
10-1  
1.0  
RECTANGULAR PULSE DURATION (SECONDS)  
Figure 19a, Maximum Effective Transient Thermal Impedance, Junction-To-Case vs Pulse Duration  
APT54GA60B_S  
10%  
Gate Voltage  
td(on)  
T
= 125°C  
J
90%  
APT30DQ60  
tr  
Collector Current  
Collector Voltage  
VCE  
VCC  
IC  
10%  
5%  
5%  
Switching Energy  
A
D.U.T.  
Figure 12, Inductive Switching Test Circuit  
Figure 13, Turn-on Switching Waveforms and Denitions  
T
= 125°C  
90%  
td(off)  
J
Gate Voltage  
Collector Voltage  
tf  
10%  
0
Collector Current  
Switching Energy  
Figure 14, Turn-off Switching Waveforms and Denitions  
D3PAK Package Outline  
TO-247 (B) Package Outline  
e3 100% Sn Plated  
4.98 (.196)  
5.08 (.200)  
1.47 (.058)  
1.57 (.062)  
4.69 (.185)  
5.31 (.209)  
15.95 (.628)  
16.05(.632)  
13.41 (.528)  
13.51(.532)  
15.49 (.610)  
16.26 (.640)  
1.04 (.041)  
1.15(.045)  
1.49 (.059)  
2.49 (.098)  
5.38 (.212)  
6.20 (.244)  
6.15 (.242) BSC  
Revised  
8/29/97  
11.51 (.453)  
11.61 (.457)  
13.79 (.543)  
13.99(.551)  
20.80 (.819)  
21.46 (.845)  
3.50 (.138)  
3.81 (.150)  
0.46 (.018)  
0.56 (.022)  
{3 Plcs}  
1.27 (.050)  
1.40 (.055)  
0.020 (.001)  
0.178 (.007)  
2.87 (.113)  
3.12 (.123)  
3.81 (.150)  
4.50 (.177) Max.  
1.98 (.078)  
2.08 (.082)  
4.06 (.160)  
2.67 (.105)  
2.84 (.112)  
(Base of Lead)  
1.65 (.065)  
2.13 (.084)  
1.22 (.048)  
1.32 (.052)  
0.40 (.016)  
0.79 (.031)  
19.81 (.780)  
20.32 (.800)  
Collector  
and Leads  
are Plated  
5.45 (.215) BSC  
{2 Plcs.}  
1.01 (.040)  
1.40 (.055)  
Gate  
Collector  
Emitter  
Emitter  
Collector  
Gate  
2.21 (.087)  
2.59 (.102)  
5.45 (.215) BSC  
2-Plcs.  
Dimensions in Millimeters (Inches)  
Dimensions in Millimeters and (Inches)  
Microsemi’s products are covered by one or more of U.S. patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522 5,262,336 6,503,786 5,256,583  
4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 6,939,743, 7,352,045 5,283,201 5,801,417 5,648,283 7,196,634 6,664,594 7,157,886 6,939,743 7,342,262  
and foreign patents. US and Foreign patents pending. All Rights Reserved.  

相关型号:

APT54GA60BD30

High Speed PT IGBT
MICROSEMI

APT54GA60S

High Speed PT IGBT
MICROSEMI

APT54GA60SD30

High Speed PT IGBT
MICROSEMI

APT55-101DN

TRANSISTOR | MOSFET | N-CHANNEL | 550V V(BR)DSS | 17.5A I(D) | CHIP
ETC

APT5510B2FLL

POWER MOS 7 FREDFET
ADPOW

APT5510B2FLLG

Power Field-Effect Transistor, 49A I(D), 550V, 0.1ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TMAX-3
MICROSEMI

APT5510JFLL

POWER MOS 7 FREDFET
ADPOW

APT5510LFLL

POWER MOS 7 FREDFET
ADPOW

APT5510LFLL

Power Field-Effect Transistor, 49A I(D), 550V, 0.1ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-264AA, TO-264, 3 PIN
MICROSEMI

APT5510LFLLG

Power Field-Effect Transistor, 49A I(D), 550V, 0.1ohm, 1-Element, N-Channel, Silicon, Metal-oxide Semiconductor FET, TO-264AA, TO-264, 3 PIN
MICROSEMI

APT5511EN

Transistor
ADPOW

APT5513B2FLL

POWER MOS 7 FREDFET
ADPOW