APTM120SK68T1G [MICROSEMI]

Buck chopper MOSFET Power Module; 降压斩波器的MOSFET功率模块
APTM120SK68T1G
型号: APTM120SK68T1G
厂家: Microsemi    Microsemi
描述:

Buck chopper MOSFET Power Module
降压斩波器的MOSFET功率模块

晶体 晶体管 功率场效应晶体管 开关 脉冲 斩波器 局域网
文件: 总5页 (文件大小:147K)
中文:  中文翻译
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APTM120SK68T1G  
VDSS = 1200V  
Buck chopper  
MOSFET Power Module  
R
DSon = 680mΩ typ @ Tj = 25°C  
ID = 15A @ Tc = 25°C  
11  
5
6
Application  
AC and DC motor control  
Switched Mode Power Supplies  
Q1  
7
8
Features  
NTC  
3
4
Power MOS 8™ MOSFETs  
-
-
-
-
-
Low RDSon  
Low input and Miller capacitance  
Low gate charge  
Avalanche energy rated  
Very rugged  
CR2  
1
Very low stray inductance  
Internal thermistor for temperature monitoring  
High level of integration  
12  
2
Benefits  
Outstanding performance at high frequency operation  
Direct mounting to heatsink (isolated package)  
Low junction to case thermal resistance  
Solderable terminals both for power and signal for  
easy PCB mounting  
Low profile  
RoHS Compliant  
Pins 1/2 ; 3/4 ; 5/6 must be shorted together  
Absolute maximum ratings  
Symbol  
Parameter  
Max ratings  
Unit  
VDSS  
Drain - Source Breakdown Voltage  
1200  
15  
11  
V
Tc = 25°C  
Tc = 80°C  
ID  
Continuous Drain Current  
A
IDM  
VGS  
RDSon  
Pulsed Drain current  
Gate - Source Voltage  
Drain - Source ON Resistance  
90  
±30  
816  
357  
V
mΩ  
W
PD  
Maximum Power Dissipation  
Tc = 25°C  
IAR  
Avalanche current (repetitive and non repetitive)  
12  
A
These Devices are sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed. See application note  
APT0502 on www.microsemi.com  
1 – 5  
www.microsemi.com  
APTM120SK68T1G  
All ratings @ Tj = 25°C unless otherwise specified  
Electrical Characteristics  
Symbol Characteristic  
Test Conditions  
DS =1200V  
VGS = 0V  
Min Typ Max Unit  
Tj = 25°C  
100  
V
IDSS  
Zero Gate Voltage Drain Current  
µA  
Tj = 125°C  
500  
RDS(on) Drain – Source on Resistance  
VGS(th) Gate Threshold Voltage  
VGS = 10V, ID = 12A  
VGS = VDS, ID = 2.5mA  
VGS = ±30 V  
680  
4
816  
5
±100 nA  
mΩ  
V
3
IGSS  
Gate – Source Leakage Current  
Dynamic Characteristics  
Symbol Characteristic  
Test Conditions  
Min  
Typ  
6696  
615  
80  
Max Unit  
Ciss  
Coss  
Crss  
Input Capacitance  
Output Capacitance  
Reverse Transfer Capacitance  
V
GS = 0V  
VDS = 25V  
f = 1MHz  
pF  
Qg  
Qgs  
Qgd  
Td(on)  
Tr  
Total gate Charge  
Gate – Source Charge  
Gate – Drain Charge  
Turn-on Delay Time  
Rise Time  
260  
42  
VGS = 10V  
V
Bus = 600V  
nC  
ns  
ID = 12A  
120  
45  
Resistive switching @ 25°C  
V
V
GS = 15V  
Bus = 800V  
27  
Td(off) Turn-off Delay Time  
Tf Fall Time  
145  
42  
ID = 12A  
RG = 2.2Ω  
Chopper diode ratings and characteristics  
Symbol Characteristic  
Test Conditions  
Min Typ Max Unit  
Maximum Peak Repetitive Reverse Voltage  
Maximum Reverse Leakage Current  
DC Forward Current  
VRRM  
IRM  
IF  
1200  
V
µA  
A
Tj = 25°C  
Tj = 125°C  
Tc = 80°C  
100  
500  
VR=1200V  
30  
2.6  
3.2  
1.8  
IF = 30A  
IF = 60A  
IF = 30A  
3.1  
VF  
Diode Forward Voltage  
V
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
Tj = 25°C  
Tj = 125°C  
300  
380  
trr  
Reverse Recovery Time  
Reverse Recovery Charge  
ns  
IF = 30A  
VR = 800V  
di/dt =200A/µs  
360  
Qrr  
nC  
1700  
Thermal and package characteristics  
Symbol Characteristic  
Min Typ Max Unit  
Transistor  
Diode  
0.35  
°C/W  
1.2  
RthJC  
Junction to Case Thermal Resistance  
RMS Isolation Voltage, any terminal to case t =1 min, I isol<1mA, 50/60Hz  
Operating junction temperature range  
Storage Temperature Range  
VISOL  
TJ  
TSTG  
TC  
2500  
-40  
-40  
-40  
2.5  
V
150  
125  
100  
4.7  
80  
°C  
Operating Case Temperature  
Torque Mounting torque  
Wt Package Weight  
To heatsink  
M4  
N.m  
g
2 – 5  
www.microsemi.com  
APTM120SK68T1G  
Temperature sensor NTC (see application note APT0406 on www.microsemi.com for more information).  
Symbol Characteristic  
R25 Resistance @ 25°C  
B 25/85 T25 = 298.15 K  
Min Typ Max Unit  
50  
kΩ  
K
3952  
R25  
T: Thermistor temperature  
RT: Thermistor value at T  
RT  
=
1
1
exp B  
25/ 85  
T25  
T
SP1 Package outline (dimensions in mm)  
See application note 1904 - Mounting Instructions for SP1 Power Modules on www.microsemi.com  
Typical Mosfet Performance Curve  
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
0.4  
0.35  
0.3  
0.9  
0.7  
0.5  
0.3  
0.25  
0.2  
0.15  
0.1  
0.1  
0.05  
Single Pulse  
0.01  
0.05  
0
0.00001  
0.0001  
0.001  
0.1  
1
10  
rectangular Pulse Duration (Seconds)  
3 – 5  
www.microsemi.com  
APTM120SK68T1G  
Low Voltage Output Characteristics  
Low Voltage Output Characteristics  
20  
35  
30  
25  
20  
15  
10  
5
VGS=10V  
TJ=125°C  
TJ=25°C  
15  
VGS=6, 7,8 & 9V  
5V  
10  
TJ=125°C  
5
0
4.5V  
0
0
5
10  
15  
20  
25  
30  
0
5
10  
15  
20  
V
DS, Drain to Source Voltage (V)  
VDS, Drain to Source Voltage (V)  
Normalized RDS(on) vs. Temperature  
Transfert Characteristics  
20  
15  
10  
5
3
2.5  
2
VDS > ID(on)xRDS(on)MAX  
250µs pulse test @ < 0.5  
duty cycle  
VGS=10V  
ID=12A  
TJ=125°C  
TJ=25°C  
1.5  
1
0.5  
0
0
25  
50  
75  
100  
125  
150  
0
1
2
3
4
5
6
TJ, Junction Temperature (°C)  
VGS, Gate to Source Voltage (V)  
Capacitance vs Drain to Source Voltage  
10000  
Gate Charge vs Gate to Source  
12  
10  
8
Ciss  
ID=12A  
VDS=240V  
TJ=25°C  
VDS=600V  
1000  
100  
10  
Coss  
Crss  
6
VDS=960V  
4
2
0
0
50  
100  
150  
200  
0
40  
80 120 160 200 240 280  
VDS, Drain to Source Voltage (V)  
Gate Charge (nC)  
4 – 5  
www.microsemi.com  
APTM120SK68T1G  
Typical Diode Performance Curve  
Maximum Effective Transient Thermal Impedance, Junction to Case vs Pulse Duration  
1.4  
1.2  
1
0.9  
0.7  
0.5  
0.3  
0.8  
0.6  
0.4  
0.2  
0
0.1  
0.05  
Single Pulse  
0.01  
0.00001  
0.0001  
0.001  
0.1  
1
10  
Rectangular Pulse Duration (Seconds)  
Forward Current vs Forward Voltage  
Trr vs. Current Rate of Charge  
80  
60  
40  
20  
0
500  
400  
300  
200  
100  
0
TJ=125°C  
VR=800V  
TJ=125°C  
45 A  
30 A  
15 A  
TJ=25°C  
0.0  
1.0  
2.0  
3.0  
4.0  
0
200 400 600 800 1000 1200  
VF, Anode to Cathode Voltage (V)  
-diF/dt (A/µs)  
IRRM vs. Current Rate of Charge  
QRR vs. Current Rate Charge  
4
3
2
1
0
30  
25  
20  
15  
10  
5
TJ=125°C  
VR=800V  
30 A  
15 A  
TJ=125°C  
VR=800V  
45 A  
30 A  
15 A  
45 A  
0
0
200 400 600 800 1000 1200  
0
200 400 600 800 1000 1200  
-diF/dt (A/µs)  
-diF/dt (A/µs)  
Capacitance vs. Reverse Voltage  
Max. Average Forward Current vs. Case Temp.  
200  
160  
120  
80  
50  
Duty Cycle = 0.5  
TJ=175°C  
40  
30  
20  
10  
0
40  
0
25  
50  
75  
100  
125  
150  
175  
1
10  
100  
1000  
VR, Reverse Voltage (V)  
Case Temperature (ºC)  
Microsemi reserves the right to change, without notice, the specifications and information contained herein  
Microsemi's products are covered by one or more of U.S patents 4,895,810 5,045,903 5,089,434 5,182,234 5,019,522  
5,262,336 6,503,786 5,256,583 4,748,103 5,283,202 5,231,474 5,434,095 5,528,058 and foreign patents. U.S and Foreign patents pending. All Rights Reserved.  
5 – 5  
www.microsemi.com  

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