MSN0880K-TO220 [MORESEMI]

75V(D-S) N-Channel Enhancement Mode Power MOS FET;
MSN0880K-TO220
型号: MSN0880K-TO220
厂家: MORE Semiconductor    MORE Semiconductor
描述:

75V(D-S) N-Channel Enhancement Mode Power MOS FET

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中文:  中文翻译
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MSN0880K  
75V(D-S) N-Channel  
Enhancement Mode Power MOS FET  
Features  
VDS=75VID=80A@ VGS=10V;  
RDS(ON)<8m@ VGS=10V  
Special process technology for high ESD capability  
Special designed for convertors and power controls  
High density cell design for ultra low Rdson  
Fully characterized avalanche voltage and current  
Good stability and uniformity with high EAS  
Lead Free  
Excellent package for good heat dissipation  
Application  
Power switching application  
Hard switched and high frequency circuits  
Uninterruptible power supply  
Marking and pin assignment  
PIN Configuration  
Schematic diagram  
TO-220-3L top view  
Package Marking and Ordering Information  
Device Marking  
Device  
Device Package  
Reel Size  
Tape width  
Quantity  
MSN0880K  
TO-220-3L  
-
-
-
MSN0880K  
Table 1. Absolute Maximum Ratings (TC=25)  
Parameter  
Symbol  
Value  
75  
Unit  
Drain-Source Voltage (VGS=0V)  
VDS  
VGS  
V
V
Gate-Source Voltage (VDS=0V)  
±25  
80  
Drain Current (DC) at Tc=25  
ID (DC)  
ID (DC)  
IDM (pluse)  
dv/dt  
PD  
A
Drain Current (DC) at Tc=100℃  
Drain Current-Continuous@ Current-Pulsed (Note 1)  
60  
A
320  
30  
A
Peak diode recovery voltage  
V/ns  
W
Maximum Power Dissipation(Tc=25)  
Derating factor  
Single pulse avalanche energy (Note 2)  
Operating Junction and Storage Temperature Range  
Notes 1.Repetitive Rating: Pulse width limited by maximum junction temperature  
2.EAS condition : Tj=25,VDD=50V,VG=10V,L=0.3mH ,ID=62A;  
170  
1.13  
580  
W/℃  
mJ  
EAS  
TJ,TSTG  
-55 To 175  
MORE Semiconductor Company Limited  
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MSN0880K  
Table 2. Thermal Characteristic  
Parameter  
Symbol  
RthJC  
Value  
0.88  
63  
Unit  
/W  
/W  
Thermal ResistanceJunction-to-CaseMaximum)  
Thermal ResistanceJunction-to-Ambient Maximum)  
RthJA  
Table 3. Electrical Characteristics (TC=25unless otherwise noted)  
Parameter  
Symbol  
Condition  
Min Typ Max  
Unit  
On/off states  
Drain-Source Breakdown Voltage  
Zero Gate Voltage Drain Current(Tc=25)  
Zero Gate Voltage Drain Current(Tc=125)  
Gate-Body Leakage Current  
Gate Threshold Voltage  
BVDSS  
IDSS  
VGS=0V ID=250μA  
VDS=75V,VGS=0V  
VDS=75V,VGS=0V  
VGS=±20V,VDS=0V  
VDS=VGS,ID=250μA  
VGS=10V, ID=40A  
75  
84  
V
μA  
μA  
nA  
V
1
10  
±100  
4
IDSS  
IGSS  
VGS(th)  
RDS(ON)  
2
2.85  
6.5  
Drain-Source On-State Resistance  
Dynamic Characteristics  
Forward Transconductance  
Input Capacitance  
8
mΩ  
gFS  
Clss  
Coss  
Crss  
Qg  
VDS=10V,ID=40A  
20  
-
-
S
4400  
340  
260  
100  
20  
PF  
PF  
PF  
nC  
nC  
nC  
V
DS=25V,VGS=0V,  
F=1.0MHz  
Output Capacitance  
Reverse Transfer Capacitance  
Total Gate Charge  
VDS=30V,ID=30A,  
Gate-Source Charge  
Qgs  
Qgd  
VGS=10V  
Gate-Drain Charge  
30  
Switching times  
Turn-on Delay Time  
td(on)  
tr  
td(off)  
tf  
17.8  
11.8  
56  
nS  
nS  
nS  
nS  
Turn-on Rise Time  
V
DD=30V,ID=2A,RL=15Ω  
GS=10V,RG=2.5Ω  
V
Turn-Off Delay Time  
Turn-Off Fall Time  
14.6  
Source- Drain Diode Characteristics  
Source-drain current(Body Diode)  
Pulsed Source-drain current(Body Diode)  
Forward on voltage(Note 1)  
Reverse Recovery Time(Note 1)  
Reverse Recovery Charge(Note 1)  
Forward Turn-on Time  
ISD  
ISDM  
VSD  
trr  
80  
320  
1.2  
36  
A
A
Tj=25,ISD=40A,VGS=0V  
V
nS  
nC  
Tj=25,IF=75A,di/dt=100A/μs  
Qrr  
ton  
56  
Intrinsic turn-on time is negligible(turn-on is dominated by LS+LD)  
Notes 1.Pulse Test: Pulse Width 300μs, Duty Cycle 1.5%, RG=25, Starting Tj=25  
MORE Semiconductor Company Limited  
http://www.moresemi.com  
2/6  
MSN0880K  
Test Circuit  
1) EAS Test Circuit  
2) Gate Charge Test Circuit  
3) Switch Time Test Circuit  
MORE Semiconductor Company Limited  
http://www.moresemi.com  
3/6  
MSN0880K  
Typical Electrical and Thermal Characteristics (curves)  
Figure1. Safe operating area  
Figure2. Source-Drain Diode Forward Voltage  
Figure3. Output characteristics  
Figure4. Transfer characteristics  
Figure5. Static drain-source on resistance  
Figure6. RDS(ON) vs Junction Temperature  
MORE Semiconductor Company Limited  
http://www.moresemi.com  
4/6  
MSN0880K  
Figure7. BVDSS vs Junction Temperature  
Figure8. VGS(th) vs Junction Temperature  
Figure9. Gate charge waveforms  
Figure10. Capacitance  
MORE Semiconductor Company Limited  
http://www.moresemi.com  
5/6  
MSN0880K  
TO-220-3L Package Information  
Symbol  
Dimensions In Millimeters  
Dimensions In Inches  
Min.  
4.400  
2.250  
0.710  
1.170  
0.330  
1.200  
9.910  
8.9500  
12.650  
Max.  
4.600  
2.550  
0.910  
1.370  
0.650  
1.400  
10.250  
9.750  
12.950  
Min.  
0.173  
0.089  
0.028  
0.046  
0.013  
0.047  
0.390  
0.352  
0.498  
Max.  
0.181  
0.100  
0.036  
0.054  
0.026  
0.055  
0.404  
0.384  
0.510  
A
A1  
b
b1  
c
c1  
D
E
E1  
e
2.540 TYP.  
0.100 TYP.  
e1  
F
4.980  
2.650  
7.900  
0.000  
12.900  
2.850  
5.180  
2.950  
8.100  
0.300  
13.400  
3.250  
0.196  
0.104  
0.311  
0.000  
0.508  
0.112  
0.204  
0.116  
0.319  
0.012  
0.528  
0.128  
H
h
L
L1  
V
7.500 REF.  
0.295 REF.  
Φ
3.400  
3.800  
0.134  
0.150  
MORE Semiconductor Company Limited  
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