UPD16901 [NEC]
FLASH MEMORY VOLTAGE STEPUP DC/DC CONVERTER IC; FLASH内存电压STEPUP DC / DC转换器IC
| 型号： | UPD16901 |
| 厂家： | 
NEC |
| 描述： | FLASH MEMORY VOLTAGE STEPUP DC/DC CONVERTER IC |
| 文件： | 总12页 (文件大小：58K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DATA SHEET
MOS INTEGRATED CIRCUIT
µPD16901
FLASH MEMORY VOLTAGE STEPUP DC/DC CONVERTER IC
The µPD16901 is a DC/DC converter IC which produces a 12 V output from a 5 V input source. The integration
of a control circuit and power MOSFET in the output stage on a single-chip allows a power supply for flash memory
write and erasure to be configured with a reduced number of external components.
FEATURES
•
•
•
•
•
With an on-chip output stage power MOSFET, fewer external components are needed.
The ALLMOS structure achieves low power consumption.
Internally set output voltage eliminates the need for adjustment.
Output can be turned ON/OFF via an external signal.
A timer latch type overcurrent protection circuit on chip
ORDERING INFORMATION
Part Number
Package
14-pin plastic SOP (300 mil)
µPD16901GS
BLOCK DIAGRAM
ON/OFF
V
IN
CDLY
C1H
C1L
C2
Reference
voltage circuit
Startup
circuit
Timer latch short-circuit
protection circuit
Charge pump
circuit
V
SW
F/F
SW
β
Overcurrent
detection circuit
Oscillation
circuit
C.S.
FB
RT
GND
The information in this document is subject to change without notice.
Document No. S10643EJ2V0DS00 (2nd edition)
Date Published May 1997 N
Printed in Japan
1997
©
µPD16901
ABSOLUTE MAXIMUM RATINGS (TA = 25 ˚C unless specified otherwise)
Item
Supply voltage
Symbol
VIN
Condition
Rating
7.0
Unit
V
Output voltage
VSW
PT
20
V
Total power dissipation
Operating ambient temperature
Storage temperature range
Note
0.9
W
TA
–20 to 85
–55 to +150
˚C
˚C
Tstg
Note When 90 mm × 90 mm × 1.6 mm thick glass epoxy board is mounted
RECOMMENDED OPERATING RANGE
Item
Supply voltage
Symbol
VDD
MIN.
4.5
TYP.
5.0
MAX.
5.5
Unit
V
Charge pump capacitor
C1, C2
TA
0.033
0
0.1
0.47
70
µF
˚C
Operating ambient temperature
ELECTRICAL SPECIFICATIONS (TA = 25 ˚C, VIN = 5 V unless specified otherwise)
Item
(Oscillation block)
Oscillation frequency
On duty
Symbol
Condition
MIN.
153
TYP.
MAX.
181
Unit
fOSC
RT = 68 kΩ
167
67
kHz
%
DUTY
(Low voltage misoperation preventive circuit)
Operation start voltage
Operation stop voltage
Hysteresis width
VIN(start-up)
VIN(stop)
VHYS
3.3
2.7
0.3
3.7
3.2
0.5
4.3
3.8
0.7
V
V
V
(Overcurrent detection block)
Overcurrent detection voltage
(On/off control block)
VDET
270
VIN*0.7
–20
300
330
mV
ON/OFF pin input voltage
VIH
VIL
IIL
4.5 V ≤ VIN ≤ 5.5 V
4.5 V ≤ VIN ≤ 5.5 V
ON/OFF pin voltage = 0
V
V
VIN*0.3
–1
ON/OFF pin input current
(Charge pump circuit)
Output voltage
–5
µA
VCHG
4.5 V ≤ VIN ≤ 5.5 V
0 ˚C ≤ TA ≤ 70 ˚C
8.0
11
V
(Short-circuit protection circuit)
Timer latch pin output current
Timer latch detection voltage
(Output block)
ISCP
RT = 68 kΩ
2.0
3.3
1.0
4.5
µA
VDETT
0.85
1.15
V
Output stage on resistance
Output stage leakage current
RDS(ON)
IDSOFF
IPK = 0.5 A
VDS = 20 V
0.3
0.5
1.0
Ω
µA
2
µPD16901
PIN CONFIGURATION (Top View)
C
2
V
SW
NC
12
NC
11
NC
10
CS
9
FB
8
14
13
1
2
3
4
5
6
7
C1H
C1L
V
CC
ON/OFF
R
T
C
DLY
GND
CONTROL
3
µPD16901
PACKAGE DRAWINGS
14 PIN PLASTIC SOP (300 mil)
14
8
detail of lead end
1
7
A
H
I
J
L
B
N
C
M
M
D
NOTE
ITEM MILLIMETERS
INCHES
Each lead centerline is located within 0.12 mm (0.005 inch) of
its true position (T.P.) at maximum material condition.
A
B
C
10.46 MAX.
1.42 MAX.
1.27 (T.P.)
0.412 MAX.
0.056 MAX.
0.050 (T.P.)
+0.10
0.40
+0.004
0.016
D
–0.05
–0.003
E
F
G
H
I
0.1±0.1
1.8 MAX.
1.55
0.004±0.004
0.071 MAX.
0.061
7.7±0.3
5.6
0.303±0.012
0.220
J
1.1
0.043
+0.004
0.008
+0.10
0.20
K
L
–0.002
–0.05
+0.008
0.024
0.6±0.2
–0.009
M
N
0.12
0.10
0.005
0.004
+7°
3°
+7°
3°
P
–3°
–3°
P14GM-50-300B-4
4
µPD16901
STANDARD CHARACTERISTIC CURVES
PT
- TA
characteristic
fOSC -VIN characteristic
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
180
175
When mounted on
T = 25 ˚C
A
90 mm × 90 mm × 1.6 mm
glass epoxy board
0.9 W
170
165
160
139 ˚C/W
85 ˚C
80 100
155
–20
0
20
40
60
3.5
4.0
4.5
5.0
5.5
6.0
6.5
Ambient temperature T
A
(˚C)
Input voltage VIN (V)
I
CC (ON) - VIN characteristic
f
OSC - T
A
characteristic
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
180
175
170
165
160
155
150
145
V
IN = 5 V
T
A
= 85 ˚C
= 0 ˚C
T
A
= 25 ˚C
TA
3.5
4.0
4.5
5.0
5.5
6.0
6.5
–20
0
20
40
60
80 100
(˚C)
Input voltage VIN (V)
Ambient temperature T
A
V
DET - T
A
characteristic
V
DETT - T
A
characteristic
340
330
320
310
300
290
280
270
1.12
V
IN = 5 V
VIN = 5 V
1.1
1.08
1.06
1.04
1.02
1.0
0.98
–20
0
20
40
60
80 100
(˚C)
–20
0
20
40
60
80 100
(˚C)
Ambient temperature T
A
Ambient temperature T
A
5
µPD16901
ISCP - T
A
characteristic
I
CC (OFF) - T characteristic
A
5
4
140
120
100
80
VIN = 5 V
VIN = 5 V
µ
µ
3
2
1
60
40
20
0
–20
0
–20
0
20
40
60
80 100
(˚C)
0
20
40
60
80 100
(˚C)
Ambient temperature T
A
Ambient temperature T
A
6
µPD16901
STANDARD CONNECTION DIAGRAM
+
4.5 V to 5.5 V
ON/OFF
33µF
CIN
C2
CT
C1
0.1
µ
F
0.1µF
0.1µF
L
V
IN
CDLY
C1H
C1L
C2
33 µH
Reference
voltage circuit
Startup
circuit
Timer latch short-circuit
protection circuit
Charge pump
circuit
D
V
SW
F/F
SW
+
15 µF
COUT
β
C.S.
Overcurrent
detection circuit
Oscillation
circuit
R
CS
0.3 Ω
FB
RT
GND
68 kΩ
Remark The circuit constants and circuit configuration in this connection diagram are shown for illustrative
purposes and not intended for volume production design.
ELECTRICAL SPECIFICATIONS
(as per standard connection diagram. TA = 25 ˚C, VIN = 5 V, IOUT = 140 mA unless specified otherwise)
Item
Symbol
Condition
4.5 V ≤ VIN ≤ 5.5 V
MIN.
TYP.
MAX.
12.48
Unit
V
Output voltage
VOUT
11.52
12.00
0 mA ≤ IO ≤ 140 mA
0 ˚C ≤TA ≤ 60 ˚C
Input stability
Load stability
REGIN
REGL
η
4.5 V ≤ VIN < 5.5 V
0 mA ≤ IO < 140 mA
0.5
0.004
83
%/V
%/mA
%
Conversion efficiency
Operating circuit current
Standby circuit current
Startup voltage
ICC
IO = 0
3.0
100
4.3
mA
µA
ICC(OFF)
VIN(start-up)
ON/OFF pin voltage = 0
3.7
V
Remark These specifications are reference values confirmed with the standard connection diagram (without
taking account of variations) and are not intended to guarantee the characteristics of the product as a
DC/DC converter.
7
µPD16901
STANDARD CHARACTERISTIC CURVES (as per standard connection diagram)
η
- I
O
characteristic
IO (MAX) - VIN characteristic
100
80
350
300
250
200
150
100
50
V
V
IN = 5.5 V
IN = 4.5 V
T = 85 °C
A
TA = 25 °C
η
VIN = 5 V
TA = 0 °C
60
40
20
0
0
0
25
50
75
100
(mA)
125
150
3.5
4.0
4.5
5.0
5.5
6.0
6.5
Output current I
O
Input voltage VIN (V)
V
O
- I
O
characteristic
V
O
-TA characteristic
13
12.5
12
V
IN = 5V
I = 140 mA
O
12.5
12
V
IN = 5.5 V
VIN = 5 V
VIN = 4.5 V
11.5
11.5
11
11
–20
0
25
50
75
100
(mA)
125
150
0
20
40
60
80 100
°C
Output current I
O
Ambient temperature T
A
(
)
8
µPD16901
RECOMMENDED SOLDERING CONDITIONS
This product should be soldered and mounted under the conditions recommended below.
Forsolderingmethodsandconditionsotherthanthoserecommended,pleasecontactyourNECsalesrepresentative.
For details of recommended soldering conditions, refer to the information document "Semiconductor Device
Mounting Technology Manual."
Recommended
Soldering Method
Infrared reflow
Soldering Conditions
Condition Symbol
Package peak temperature: 235 ˚C; Duration: 30 sec. max. (210 ˚C or above):
IR35-00-3
Note
Number of times: Max. 3; Time limit: None
Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less)
is recommended.
VPS
Package peak temperature: 215 ˚C; Duration: 40 sec. max. (200 ˚C or above):
VP15-00-1
WS60-00-1
Note
Number of times: 1; Time limit: None
Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less)
is recommended.
Wave soldering
Package peak temperature: 260 ˚C or less, Duration: 10 sec. max.,
Preparatory heating temperature: 120 ˚C or less; Number of times: 1
Flux: Rosin type flux with reduced chlorine content (chlorine 0.2 Wt% or less)
is recommended.
Note For the storage period after unpacking from the dry-pack, storage conditions are max. 25 ˚C, 65% RH.
Caution Use of more than one soldering method should be avoided.
REFERENCE DOCUMENTS
NEC Semiconductor Device Reliability/Quality Control System
Semiconductor Device Quality Guarantee Guide
10983E
MEI-1202
C10535E
Semiconductor Device Mounting Technology Manual
9
µPD16901
[MEMO]
10
µPD16901
[MEMO]
11
µPD16901
No part of this document may be copied or reproduced in any form or by any means without the prior written
consent of NEC Corporation. NEC Corporation assumes no responsibility for any errors which may appear in
this document.
NEC Corporation does not assume any liability for infringement of patents, copyrights or other intellectual property
rights of third parties by or arising from use of a device described herein or any other liability arising from use
of such device. No license, either express, implied or otherwise, is granted under any patents, copyrights or other
intellectual property rights of NEC Corporation or others.
While NEC Corporation has been making continuous effort to enhance the reliability of its semiconductor devices,
the possibility of defects cannot be eliminated entirely. To minimize risks of damage or injury to persons or
property arising from a defect in an NEC semiconductor device, customers must incorporate sufficient safety
measures in its design, such as redundancy, fire-containment, and anti-failure features.
NEC devices are classified into the following three quality grades:
"Standard", "Special", and "Specific". The Specific quality grade applies only to devices developed based on a
customer designated "quality assurance program" for a specific application. The recommended applications of
a device depend on its quality grade, as indicated below. Customers must check the quality grade of each device
before using it in a particular application.
Standard: Computers, office equipment, communications equipment, test and measurement equipment,
audio and visual equipment, home electronic appliances, machine tools, personal electronic
equipment and industrial robots
Special: Transportation equipment (automobiles, trains, ships, etc.), traffic control systems, anti-disaster
systems, anti-crime systems, safety equipment and medical equipment (not specifically designed
for life support)
Specific: Aircrafts, aerospace equipment, submersible repeaters, nuclear reactor control systems, life
support systems or medical equipment for life support, etc.
The quality grade of NEC devices is "Standard" unless otherwise specified in NEC's Data Sheets or Data Books.
If customers intend to use NEC devices for applications other than those specified for Standard quality grade,
they should contact an NEC sales representative in advance.
Anti-radioactive design is not implemented in this product.
M4 96.5
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