PSMN102-200Y [NEXPERIA]

N-channel TrenchMOS SiliconMAX standard level FETProduction;
PSMN102-200Y
型号: PSMN102-200Y
厂家: Nexperia    Nexperia
描述:

N-channel TrenchMOS SiliconMAX standard level FETProduction

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PSMN102-200Y  
N-channel TrenchMOS SiliconMAX standard level FET  
Rev. 03 — 16 March 2011  
Product data sheet  
1. Product profile  
1.1 General description  
SiliconMAX standard level N-channel enhancement mode Field-Effect Transistor (FET) in  
a plastic package using TrenchMOS technology. This product is designed and qualified for  
use in computing, communications, consumer and industrial applications only.  
1.2 Features and benefits  
Higher operating power due to low  
Suitable for high frequency  
applications due to fast switching  
characteristics  
thermal resistance  
1.3 Applications  
Class D amplifier  
Motion control  
DC-to-DC converters  
Switched-mode power supplies  
1.4 Quick reference data  
Table 1.  
Symbol  
VDS  
Quick reference data  
Parameter  
Conditions  
Min Typ Max Unit  
drain-source  
voltage  
Tj 25 °C; Tj 150 °C  
-
-
-
-
-
-
200  
21.5  
113  
V
ID  
drain current  
Tmb = 25 °C; VGS = 10 V;  
see Figure 1; see Figure 3  
A
Ptot  
total power  
dissipation  
Tmb = 25 °C; see Figure 2  
W
Static characteristics  
RDSon drain-source  
VGS = 10 V; ID = 12 A;  
Tj = 25 °C; see Figure 9;  
see Figure 10  
-
-
86  
102 mΩ  
on-state  
resistance  
Dynamic characteristics  
QGD  
gate-drain charge VGS = 10 V; ID = 12 A;  
VDS = 100 V; see Figure 11;  
see Figure 12  
10.1  
-
nC  
PSMN102-200Y  
Nexperia  
N-channel TrenchMOS SiliconMAX standard level FET  
2. Pinning information  
Table 2.  
Pinning information  
Symbol Description  
Pin  
1
Simplified outline  
Graphic symbol  
S
S
S
G
D
source  
source  
source  
gate  
mb  
D
S
2
3
G
4
mbb076  
mb  
mounting base; connected to  
drain  
1
2 3 4  
SOT669 (LFPAK)  
3. Ordering information  
Table 3.  
Ordering information  
Type number  
Package  
Name  
Description  
Version  
PSMN102-200Y  
LFPAK  
plastic single-ended surface-mounted package (LFPAK); 4 leads SOT669  
4. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
VDS  
Parameter  
Conditions  
Min  
Max  
200  
200  
20  
Unit  
V
drain-source voltage  
drain-gate voltage  
gate-source voltage  
drain current  
Tj 25 °C; Tj 150 °C  
Tj 25 °C; Tj 150 °C; RGS = 20 kΩ  
-
VDGR  
VGS  
-
V
-20  
-
V
ID  
VGS = 10 V; Tmb = 25 °C; see Figure 1;  
see Figure 3  
21.5  
A
VGS = 10 V; Tmb = 100 °C; see Figure 1  
-
-
13.6  
65  
A
A
IDM  
peak drain current  
pulsed; tp 10 µs; Tmb = 25 °C;  
see Figure 3  
Ptot  
Tstg  
Tj  
total power dissipation  
storage temperature  
junction temperature  
Tmb = 25 °C; see Figure 2  
-
113  
150  
150  
W
-55  
-55  
°C  
°C  
Source-drain diode  
IS  
source current  
peak source current  
Tmb = 25 °C  
-
-
52  
A
A
ISM  
pulsed; tp 10 µs; Tmb = 25 °C  
208  
Avalanche ruggedness  
EDS(AL)S  
non-repetitive drain-source  
avalanche energy  
VGS = 10 V; Tj(init) = 25 °C; ID = 10.8 A;  
Vsup 200 V; unclamped; tp = 0.14 ms;  
RGS = 50 Ω  
-
202  
mJ  
PSMN102-200Y  
All information provided in this document is subject to legal disclaimers.  
©
Nexperia B.V. 2017. All rights reserved  
Product data sheet  
Rev. 03 — 16 March 2011  
2 of 13  
PSMN102-200Y  
Nexperia  
N-channel TrenchMOS SiliconMAX standard level FET  
003aac023  
003aab937  
120  
120  
I
P
der  
der  
(%)  
(%)  
80  
80  
40  
40  
0
0
0
50  
100  
150  
200  
0
50  
100  
150  
200  
T
(°C)  
T
(°C)  
mb  
mb  
Fig 1. Normalized continuous drain current as a  
function of mounting base temperature  
Fig 2. Normalized total power dissipation as a  
function of solder point temperature  
003aab740  
3
10  
I
D
(A)  
2
10  
Limit R  
= V / I  
DS D  
DSon  
t
= 10 μs  
p
10  
100 μs  
1 ms  
DC  
1
10 ms  
100 ms  
1  
10  
2
3
1
10  
10  
10  
V
(V)  
DS  
Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage  
PSMN102-200Y  
All information provided in this document is subject to legal disclaimers.  
©
Nexperia B.V. 2017. All rights reserved  
Product data sheet  
Rev. 03 — 16 March 2011  
3 of 13  
PSMN102-200Y  
Nexperia  
N-channel TrenchMOS SiliconMAX standard level FET  
5. Thermal characteristics  
Table 5.  
Symbol  
Rth(j-mb)  
Thermal characteristics  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
thermal resistance from  
junction to mounting base  
Mounted on a printed-circuit board;  
vertical in still air; see Figure 4  
-
-
1.1  
K/W  
003aac268  
10  
Z
th(j-mb)  
(K/W)  
1
d = 0.5  
0.2  
1 0.1  
10  
10  
10  
0.05  
t
p
0.02  
P
δ =  
T
2  
single shot  
t
t
p
T
3  
10  
6  
5  
4  
3  
2  
1  
10  
10  
10  
10  
10  
1
t
(s)  
p
Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration  
PSMN102-200Y  
All information provided in this document is subject to legal disclaimers.  
©
Nexperia B.V. 2017. All rights reserved  
Product data sheet  
Rev. 03 — 16 March 2011  
4 of 13  
PSMN102-200Y  
Nexperia  
N-channel TrenchMOS SiliconMAX standard level FET  
6. Characteristics  
Table 6.  
Symbol  
Characteristics  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Static characteristics  
V(BR)DSS drain-source  
breakdown voltage  
ID = 250 µA; VGS = 0 V; Tj = 25 °C  
ID = 250 µA; VGS = 0 V; Tj = -55 °C  
200  
178  
2
-
-
V
V
V
-
-
VGS(th)  
gate-source threshold ID = 1 mA; VDS = VGS; Tj = 25 °C;  
3
4
voltage  
see Figure 7; see Figure 8  
ID = 1 mA; VDS = VGS; Tj = 150 °C;  
see Figure 7; see Figure 8  
1
-
-
-
-
V
V
ID = 1 mA; VDS = VGS; Tj = -55 °C;  
see Figure 7; see Figure 8  
4.4  
IDSS  
drain leakage current  
gate leakage current  
VDS = 160 V; VGS = 0 V; Tj = 25 °C  
VDS = 160 V; VGS = 0 V; Tj = 150 °C  
VGS = 20 V; VDS = 0 V; Tj = 20 °C  
VGS = -20 V; VDS = 0 V; Tj = 20 °C  
-
-
-
-
-
-
1
µA  
µA  
nA  
nA  
mΩ  
-
100  
100  
100  
102  
IGSS  
-
-
RDSon  
drain-source on-state  
resistance  
VGS = 10 V; ID = 12 A; Tj = 25 °C;  
see Figure 9; see Figure 10  
86  
VGS = 10 V; ID = 12 A; Tj = 150 °C;  
see Figure 9; see Figure 10  
-
-
206  
1.1  
245  
-
mΩ  
RG  
gate resistance  
f = 1 MHz  
Dynamic characteristics  
QG(tot)  
QGS  
total gate charge  
ID = 12 A; VDS = 100 V; VGS = 10 V;  
see Figure 11; see Figure 12  
-
-
-
-
30.7  
6.3  
-
-
-
-
nC  
nC  
nC  
V
gate-source charge  
gate-drain charge  
QGD  
10.1  
4.6  
VGS(pl)  
gate-source plateau  
voltage  
ID = 12 A; VDS = 100 V; see Figure 11;  
see Figure 12  
Ciss  
Coss  
Crss  
input capacitance  
output capacitance  
VDS = 30 V; VGS = 0 V; f = 1 MHz;  
Tj = 25 °C; see Figure 13  
-
-
-
1568  
170  
55  
-
-
-
pF  
pF  
pF  
reverse transfer  
capacitance  
td(on)  
tr  
td(off)  
tf  
turn-on delay time  
rise time  
VDS = 100 V; RL = 5.8 ; VGS = 10 V;  
RG(ext) = 5.6 Ω  
-
-
-
-
14.2  
29.5  
33  
-
-
-
-
ns  
ns  
ns  
ns  
turn-off delay time  
fall time  
28  
Source-drain diode  
VSD source-drain voltage  
IS = 12 A; VGS = 0 V; Tj = 25 °C;  
see Figure 14  
-
-
-
0.9  
1.2  
V
trr  
reverse recovery time IS = 20 A; dIS/dt = -100 A/µs; VGS = 0 V;  
VDS = 30 V  
143  
268  
-
-
ns  
nC  
Qr  
recovered charge  
IS = 20 A; dIS/dt = -100 A/µs; VGS = 0 V  
PSMN102-200Y  
All information provided in this document is subject to legal disclaimers.  
©
Nexperia B.V. 2017. All rights reserved  
Product data sheet  
Rev. 03 — 16 March 2011  
5 of 13  
PSMN102-200Y  
Nexperia  
N-channel TrenchMOS SiliconMAX standard level FET  
003aab742  
003aab744  
40  
50  
V
DS  
> I × R  
D
DSon  
I
V
(V) = 10  
6
D
GS  
I
D
(A)  
(A)  
40  
30  
30  
20  
10  
0
20  
10  
0
T = 150 °C  
25 °C  
j
5
4.8  
4.6  
4.4  
4.2  
0
1.25  
2.5  
3.75  
5
0
2
4
6
8
V
(V)  
V
(V)  
GS  
DS  
Tj = 25 °C  
Tj = 25 °C and 150 °C; VDS > ID x RDSon  
Fig 5. Output characteristics: drain current as a  
function of drain-source voltage; typical values  
Fig 6. Transfer characteristics: drain current as a  
function of gate-source voltage; typical values  
003aac062  
003aab852  
1  
10  
5
I
V
D
GS(th)  
(V)  
(A)  
2  
10  
4
max  
min  
typ  
max  
3  
4  
5  
6  
10  
10  
10  
10  
3
typ  
2
min  
1
0
0
2
4
6
60  
0
60  
120  
160  
V
(V)  
T (°C)  
j
GS  
Fig 7. Sub-threshold drain current as a function of  
gate-source voltage  
Fig 8. Gate-source threshold voltage as a function of  
junction temperature  
PSMN102-200Y  
All information provided in this document is subject to legal disclaimers.  
©
Nexperia B.V. 2017. All rights reserved  
Product data sheet  
Rev. 03 — 16 March 2011  
6 of 13  
PSMN102-200Y  
Nexperia  
N-channel TrenchMOS SiliconMAX standard level FET  
03al52  
003aab743  
3
200  
4.5  
5
a
R
DSon  
(mΩ)  
2
1
160  
V
(V) = 6  
10  
GS  
120  
80  
0
60  
0
60  
120  
180  
0
10  
20  
30  
40  
T (°C)  
j
I (A)  
D
Fig 9. Normalized drain-source on-state resistance  
factor as a function of junction temperature  
Fig 10. Drain-source on-state resistance as a function  
of drain current; typical values  
003aab746  
10  
I
= 12 A  
D
V
DS  
V
(V)  
GS  
T = 25 °C  
j
I
D
8
6
4
2
0
40  
100  
V
GS(pl)  
V
GS(th)  
GS  
V
= 160 V  
DS  
V
Q
Q
GS1  
GS2  
Q
Q
GD  
GS  
Q
G(tot)  
003aaa508  
0
10  
20  
30  
40  
Q
(nC)  
G
Fig 11. Gate charge waveform definitions  
Fig 12. Gate-source voltage as a function of gate  
charge; typical values  
PSMN102-200Y  
All information provided in this document is subject to legal disclaimers.  
©
Nexperia B.V. 2017. All rights reserved  
Product data sheet  
Rev. 03 — 16 March 2011  
7 of 13  
PSMN102-200Y  
Nexperia  
N-channel TrenchMOS SiliconMAX standard level FET  
003aab747  
003aab745  
4
10  
50  
I
S
(A)  
C
(pF)  
40  
C
iss  
3
10  
30  
20  
10  
0
T = 150 °C  
25 °C  
j
C
C
oss  
2
10  
rss  
10  
10  
1  
2
1
10  
10  
0
0.3  
0.6  
0.9  
1.2  
V
(V)  
V
(V)  
SD  
DS  
Fig 13. Input, output and reverse transfer capacitances  
as a function of drain-source voltage; typical  
values  
Fig 14. Source current as a function of source-drain  
voltage; typical values  
PSMN102-200Y  
All information provided in this document is subject to legal disclaimers.  
©
Nexperia B.V. 2017. All rights reserved  
Product data sheet  
Rev. 03 — 16 March 2011  
8 of 13  
PSMN102-200Y  
Nexperia  
N-channel TrenchMOS SiliconMAX standard level FET  
7. Package outline  
Plastic single-ended surface-mounted package (LFPAK); 4 leads  
SOT669  
A
2
E
A
C
c
E
b
b
2
1
2
L
3
1
mounting  
base  
b
4
D
1
D
H
L
2
1
2
3
4
X
e
w
M
c
A
b
1/2 e  
A
(A )  
3
C
A
1
θ
L
detail X  
y
C
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
D
(1)  
D
(1)  
(1)  
1
A
A
A
H
L
L
L
2
w
y
θ
UNIT  
A
b
b
b
b
c
c
E
E
1
e
1
2
3
1
2
3
4
2
max  
1.20 0.15 1.10  
1.01 0.00 0.95  
0.50 4.41 2.2 0.9 0.25 0.30 4.10  
0.35 3.62 2.0 0.7 0.19 0.24 3.80  
5.0 3.3  
4.8 3.1  
6.2 0.85 1.3 1.3  
5.8 0.40 0.8 0.8  
8°  
0°  
mm  
0.25  
4.20  
1.27  
0.25 0.1  
Note  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
04-10-13  
06-03-16  
SOT669  
MO-235  
Fig 15. Package outline SOT669 (LFPAK)  
PSMN102-200Y  
All information provided in this document is subject to legal disclaimers.  
©
Nexperia B.V. 2017. All rights reserved  
Product data sheet  
Rev. 03 — 16 March 2011  
9 of 13  
PSMN102-200Y  
Nexperia  
N-channel TrenchMOS SiliconMAX standard level FET  
8. Revision history  
Table 7.  
Revision history  
Document ID  
Release date  
Data sheet status  
Change notice  
Supersedes  
PSMN102-200Y v.3  
Modifications:  
20110316  
Product data sheet  
-
PSMN102-200Y v.2  
Various changes to content.  
20101220 Product data sheet  
PSMN102-200Y v.2  
-
PSMN102-200Y v.1  
PSMN102-200Y  
All information provided in this document is subject to legal disclaimers.  
©
Nexperia B.V. 2017. All rights reserved  
Product data sheet  
Rev. 03 — 16 March 2011  
10 of 13  
PSMN102-200Y  
Nexperia  
N-channel TrenchMOS SiliconMAX standard level FET  
9. Legal information  
9.1 Data sheet status  
Document status [1] [2]  
Product status [3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term 'short data sheet' is explained in section "Definitions".  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product  
status information is available on the Internet at URL http://www.nexperia.com.  
Suitability for use — Nexperia products are not designed,  
9.2 Definitions  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. Nexperia does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
malfunction of a Nexperia product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. Nexperia accepts no liability for inclusion and/or use of  
Nexperia products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local Nexperia sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. Nexperia makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
Nexperia and its customer, unless Nexperia and  
Customers are responsible for the design and operation of their applications  
and products using Nexperia products, and Nexperia  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the Nexperia  
product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the Nexperia product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
9.3 Disclaimers  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, Nexperia does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information.  
Nexperia does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using Nexperia  
products in order to avoid a default of the applications and  
In no event shall Nexperia be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
the products or of the application or use by customer’s third party  
customer(s). Nexperia does not accept any liability in this respect.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, Nexperia’s aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of Nexperia.  
Right to make changes — Nexperia reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
Terms and conditions of commercial sale — Nexperia  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nexperia.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
PSMN102-200Y  
All information provided in this document is subject to legal disclaimers.  
©
Nexperia B.V. 2017. All rights reserved  
Product data sheet  
Rev. 03 — 16 March 2011  
11 of 13  
PSMN102-200Y  
Nexperia  
N-channel TrenchMOS SiliconMAX standard level FET  
agreement shall apply. Nexperia hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of Nexperia products by customer.  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
Nexperia’s specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies Nexperia for any  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond Nexperia’s  
standard warranty and Nexperia’s product specifications.  
Export control — This document as well as the item(s) described herein may  
be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
9.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific Nexperia product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. Nexperia  
accepts no liability for inclusion and/or use of  
non-automotive qualified products in automotive equipment or applications.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without Nexperia’s warranty of the  
10. Contact information  
For more information, please visit: http://www.nexperia.com  
For sales office addresses, please send an email to: salesaddresses@nexperia.com  
PSMN102-200Y  
All information provided in this document is subject to legal disclaimers.  
©
Nexperia B.V. 2017. All rights reserved  
Product data sheet  
Rev. 03 — 16 March 2011  
12 of 13  
PSMN102-200Y  
Nexperia  
N-channel TrenchMOS SiliconMAX standard level FET  
11. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1  
1.1  
1.2  
1.3  
1.4  
General description . . . . . . . . . . . . . . . . . . . . . .1  
Features and benefits. . . . . . . . . . . . . . . . . . . . .1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1  
Quick reference data . . . . . . . . . . . . . . . . . . . . .1  
2
3
4
5
6
7
8
Pinning information. . . . . . . . . . . . . . . . . . . . . . .2  
Ordering information. . . . . . . . . . . . . . . . . . . . . .2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2  
Thermal characteristics . . . . . . . . . . . . . . . . . . .4  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .5  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . .10  
9
Legal information. . . . . . . . . . . . . . . . . . . . . . . .11  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .11  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .11  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . .11  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .12  
9.1  
9.2  
9.3  
9.4  
10  
Contact information. . . . . . . . . . . . . . . . . . . . . .12  
© Nexperia B.V. 2017. All rights reserved  
For more information, please visit: http://www.nexperia.com  
For sales office addresses, please send an email to: salesaddresses@nexperia.com  
Date of release: 16 March 2011  

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