LMX2604 [NSC]

Triple-band VCO for GSM900/DCS1800/PCS1900; 三频VCO用于GSM900 / DCS1800 / PCS1900
LMX2604
型号: LMX2604
厂家: National Semiconductor    National Semiconductor
描述:

Triple-band VCO for GSM900/DCS1800/PCS1900
三频VCO用于GSM900 / DCS1800 / PCS1900

过程控制系统 分布式控制系统 PCS GSM DCS
文件: 总14页 (文件大小:268K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
January 2004  
LMX2604  
Triple-band VCO for GSM900/DCS1800/PCS1900  
General Description  
Features  
n On-chip Triple-band RF VCOs  
GSM: 880 MHz to 915 MHz  
DCS: 1710 MHz to 1785 MHz  
PCS: 1850 MHz to 1910 MHz  
n On-chip tank circuit  
The LMX2604 is a fully integrated VCO (Voltage-Controlled  
Oscillator) IC designed for GSM900/DCS1800/PCS1900  
triple-band application. The IC is ideal for use in the trans-  
mitter modulation loop by providing extremely small form  
factor and low phase noise. The IC has two VCOs, one for  
GSM and a second for DCS/PCS. The IC has two separate  
buffer amplifiers to drive an external high power amplifier,  
one for GSM900 band and the other one for DCS1800/  
PCS1900 bands. The IC also has a differential buffer ampli-  
fier to drive a mixer for the offset PLL.  
n Low phase noise  
— -167 dBc/Hz 20 MHz offset in GSM band  
— -163 dBc/Hz 20 MHz offset in DCS band  
— -162 dBc/Hz 20 MHz offset in PCS band  
@
@
@
n High output power  
The resonant circuits of the VCOs are fully integrated in the  
chip to ease the application of the IC. The high quality factor  
of the embedded tank circuit achieves very low phase noise  
characteristics at the VCO output. The only required external  
components are a couple of supply bypass capacitors and  
matching components.  
— +6 dBm in GSM mode  
— +6 dBm in DCS and PCS mode  
n Low current consumption  
— 18 mA in GSM mode  
— 15 mA in DCS and PCS mode  
n +2.6 V to +3.0 V supply voltage  
n 0.25 µm RF CMOS process  
n Small 20-pin 4x4 LLP package  
A control pin for controlling the oscillation frequency is  
shared by the two VCOs.  
The LMX2604 IC is provided in a 20-pin 4x4 LLP (Leadless  
Leadframe package).  
Applications  
n Transmit VCO for GSM, DCS, and PCS  
n Closed loop modulation systems  
Functional Block Diagram  
20066101  
FastLock is a trademark of National Semiconductor Corporation.  
TRI-STATE® is a registered trademark of National Semiconductor Corporation.  
© 2004 National Semiconductor Corporation  
DS200661  
www.national.com  
Connection Diagram  
20-Pin 4x4 LLP (TM) Package  
20066102  
Pin Descriptions  
Pin Number  
Name  
CE  
I/O  
I
Description  
1
Chip enable input pin. High=enable, Low=disable  
Ground pins  
2,4,15  
GND (Note 1)  
MIXout  
BSW  
O
I
3
Mixer output pin (RF output)  
5
Band switch input pin. High=DCS/PCS, Low=GSM  
Supply voltage pins  
11,19  
VDD  
O
O
I
12  
GSMout  
DCSPCSout  
CPin  
RF output pin for VCO in GSM band  
RF output pin for VCO in DCS and PCS band  
Charge pump input pin  
13  
16  
6,7,8,9,10,14,17,18,20  
NC  
No Connection, These pins must be left open  
Note 1: The exposed die attach pad is grounded.  
Ordering Information  
Package  
20-Pin LLP  
20-Pin LLP  
Part Number  
LMX2604LQ  
LMX2604LQX  
Package Marking  
LMX2604LQ  
Media Transport  
NSC Drawing  
LQA20A  
1000 Unit Tape and Reel  
4500 Unit Tape and Reel  
LMX2604LQ  
LQA20A  
www.national.com  
2
Absolute Maximum Ratings (Notes 3, 4, 5)  
Parameter  
Supply Voltage  
Symbol  
VDD  
Ratings  
-0.3 to 3.6  
-0.3 to VDD+0.3  
10  
Unit  
V
Input Voltage  
VIN  
V
Input Current (Note 2)  
Storage Temperature Range  
IIN  
mA  
˚C  
TSTG  
-65 to 150  
Note 2: Maximum input current is for a logic pin, not the power pins.  
Recommended Operating Conditions  
Parameter  
Symbol  
TA  
Condition  
Min  
-30  
2.6  
Typical  
25  
Max  
85  
Unit  
˚C  
Ambient Temperature  
Supply Voltage (to GND)  
VDD=3V  
VDD  
2.8  
3.0  
V
Note 3: “Absolute Maximum Ratings” indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is  
intended to be functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The  
guaranteed specifications apply only for the test conditions listed.  
<
Note 4: This Device is a high performance RF integrated circuit with an ESD rating 2 kV and is ESD sensitive. Handling and assembly of this device should only  
be done at ESD-free workstations.  
Note 5: Stresses in excess of the absolute maximum ratings can cause permanent or latent damage to the device. These are absolute stress ratings only.  
Functional operation of the device is only implied at these or any other conditions in excess of those given in the operation sections of the data sheet. Exposure to  
absolute maximum ratings for extended periods can adversely affect device reliability  
Electrical Characteristics  
AC Characteristics (VDD=2.8V, TA=25˚C; unless otherwise noted)  
Symbol  
Parameter  
Remarks  
Min  
880  
1710  
1850  
10  
Typ  
Max  
915  
1785  
1910  
20  
Units  
GSM Band  
MHz  
f
Frequency Range  
DCS Band  
MHz  
PCS Band  
GSM Band  
15  
20  
Tuning Sensitivity  
(Note 6)  
KVCO  
DCS Band  
15  
25  
MHz/V  
PCS Band  
20  
25  
30  
GSM Band  
4
6
8
Pout  
Output Power  
dBm  
dBm  
DCS & PCS Band  
GSM Band  
4
6
8
-5.5  
-4.5  
-3.5  
-2.5  
-120  
-136  
-152  
-167  
-112  
-130  
-146  
-163  
-110  
-129  
-145  
-162  
-1.5  
-0.5  
Output power of  
MIXout pin  
PMIXout  
DCS & PCS Band  
at 100 kHz offset  
at 400 kHz offset  
at 3 MHz offset (Note 7)  
at 20 MHz offset (Note 7)  
at 100 kHz offset  
at 400 kHz offset  
at 3 MHz offset (Note 7)  
at 20 MHz offset (Note 7)  
at 100 kHz offset  
at 400 kHz offset  
at 3 MHz offset (Note 7)  
at 20 MHz offset (Note 7)  
-128  
-124  
Phase Noise  
(GSM Band)  
L(f)  
L(f)  
L(f)  
dBc/Hz  
dBc/Hz  
Phase Noise  
(DCS Band)  
-124  
-15  
Phase Noise  
(PCS Band)  
dBc/Hz  
dBc  
Second Harmonic  
Suppression  
All Bands at RF output port.  
-20  
Note 6: Tuning Sensitivty is measured after coarse lock. Minimum and maximum limits are supported by characterization.  
Note 7: Supported by characterization  
3
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Electrical Characteristics (Continued)  
DC Characteristics (VDD=2.8V, TA=25˚C; unless otherwise noted)  
Symbol  
Parameter  
Logical Input High  
Voltage  
Condition  
Min  
Typ  
Max  
Units  
VIH  
0.8VDD  
VDD+0.3  
V
Logical Input Low  
Voltage  
VIL  
IIH  
IIL  
-0.3  
-2.5  
-2.5  
0.2VDD  
2.5  
V
Logical Input High  
Current  
µA  
Logical Input Low  
Current  
2.5  
µA  
pF  
Input Capacitance  
Supply Current  
(Note 8)  
5
IDD,GSM  
18  
21  
mA  
Supply Current  
(Note 8)  
IDD,DCS/PCS  
Istd  
15  
18  
mA  
µA  
Standby Current  
2.5  
Note 8: The current consumption in VCO and driver amplifier is all included  
Note 9: For CE, BSW, and CPin pins  
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4
Typical Performance Characteristics : Phase Noise  
Typical phase noise characteristics in GSM band  
20066161  
Typical phase noise characteristics in DCS band  
20066162  
5
www.national.com  
Typical Performance Characteristics : Phase Noise (Continued)  
Typical phase noise characteristics in PCS band  
20066163  
www.national.com  
6
Typical Performance Characteristic : GSMout Impedance  
GSMout  
20066130  
GSMout  
Frequency (MHz)  
Real (Ohms)  
Imaginary (Ohms)  
Absolute (Ohms)  
800  
850  
900  
950  
1000  
126  
126  
126  
126  
125  
-72  
-74  
-75  
-77  
-80  
146  
146  
146  
147  
149  
7
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Typical Performance Characteristic : MIXout Impedance, GSM  
MIXout, GSM  
20066131  
MIXout, GSM  
Frequency (MHz)  
Real (Ohms)  
Imaginary (Ohms)  
Absolute (Ohms)  
800  
850  
900  
950  
1000  
141  
133  
126  
120  
115  
-256  
-249  
-243  
-237  
-232  
292  
282  
274  
266  
259  
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8
Typical Performance Characteristic : DCSPCSout Impedance  
DCSPCSout  
20066132  
DCSPCSout  
Frequency (MHz)  
1600  
Real (Ohms)  
Imaginary (Ohms)  
Absolute (Ohms)  
80  
78  
77  
76  
73  
71  
68  
64  
57  
-54  
-53  
-51  
-50  
-49  
-48  
-48  
-48  
-51  
96  
94  
93  
91  
88  
85  
83  
80  
77  
1650  
1700  
1750  
1800  
1850  
1900  
1950  
2000  
9
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Typical Performance Characteristic : MIXout Impedance, DCS/PCS  
MIXout, DCS/PCS  
20066133  
MIXout, DCSPCS  
Frequency (MHz)  
1600  
Real (Ohms)  
Imaginary (Ohms)  
Absolute (Ohms)  
66  
65  
64  
66  
64  
63  
62  
61  
59  
-164  
-162  
-160  
-157  
-157  
-153  
-150  
-146  
-143  
177  
175  
172  
171  
169  
166  
162  
159  
155  
1650  
1700  
1750  
1800  
1850  
1900  
1950  
2000  
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10  
FREQUENCY SELECTION AND POWER DOWN  
CONTROL  
Functional Description  
The BSW pin selects the operating frequency band. The  
table below shows the appropriate settings with the CE pin.  
PRODUCT DESCRIPTION  
The LMX2604 IC has two VCOs, which are configured as an  
LC resonant oscillator. The active components and tank  
elements are all integrated on the IC. The oscillator core and  
the tank circuit are designed to be immune to external noise  
such as supply and load variation. The IC is easy-to-use and  
occupies extremely small area in the board.  
CE  
BSW  
Low  
High  
Low  
High  
Output  
Low  
Low  
High  
High  
X
X
Low Band (GSM)  
High Band (DCS/PCS)  
Two output amplifiers are also integrated to deliver high  
output power of +6 dBm in GSM/DCS/PCS applications. The  
amplifiers isolate the oscillator cores from the external load,  
and drive the external 50 ohm load. The output driver is  
designed to have low noise floor and to reduce pulling by  
load variation. An additional amplifier to drive the mixer in the  
transmit PLL is also provided. Only an attenuator composed  
of a few passive elements is necessary to meet the power  
level of the mixer input of the transmit PLL.  
In real implementation, the component values of the tank  
circuit vary from the nominal value. The IC has built-in circuit  
to track the variation and compensate that kind of the varia-  
tion during normal operation. This self-correction algorithm  
does not require any external control signal and elements.  
The figure below shows an application circuit of the  
LMX2604. The LMX2604 is developed for the use in a GSM  
handset as part of the transmitter PLL. To complete the  
offset PLL in the transmit path, several passive elements for  
the external loop filter should be also provided. The charge  
pump output port of the external transceiver IC is fed to the  
CPin pin.  
The frequency of the oscillator is controlled by the CPin pin,  
which is internally connected to the varactor. This control pin  
is connected to the loop filter of the modulation loop in the  
transmit path. Any additional noise on this tuning input is  
directly translated into FM noise, which can degrade the  
phase noise characteristics of the oscillator. Typically, the  
loop filter of the PLL provides an appropriately low imped-  
ance source at its output and thus proper additional filtering  
stage is often required to reduce the high frequency noise  
and spurious signals.  
The locking process of the LMX2604 is composed of two  
stages. First, the internal control circuitry of the LMX2604  
controls the fast frequency acquisition behavior of the  
LMX2604. After the frequency acquisition, the whole loop  
enters in its normal operating mode.  
Application Circuit of LMX2604  
20066172  
11  
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frequency such that the final tuning voltage on the CPin line  
of the VCO is approximately Vdd/2. Benefits of this system is  
the maximum required charge pump voltage is reduced as  
large frequency ranges may be tuned with a small tuning  
voltage. This makes the digitally tuned VCO different from  
conventional analog VCOs.  
Functional Description (Continued)  
FREQUENCY ACQUISITION  
On the rising edge of CE the VCO goes through a frequency  
acquisition mode which coarse locks the PLL to the approxi-  
mate final frequency. This portion of the lock digitally sets the  
Frequency Acquisition Timing Diagram  
20066122  
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12  
Physical Dimensions inches (millimeters) unless otherwise noted  
20066107  
20-Pin LLP (Leadless Leadframe package) Package  
Order Number LMX2604LQX for 4500 Unit Reel  
Order Number LMX2604LQ for 1000 Unit Reel  
NS Package Number LQA20  
13  
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Notes  
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DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL  
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1. Life support devices or systems are devices or  
systems which, (a) are intended for surgical implant  
into the body, or (b) support or sustain life, and  
whose failure to perform when properly used in  
accordance with instructions for use provided in the  
labeling, can be reasonably expected to result in a  
significant injury to the user.  
2. A critical component is any component of a life  
support device or system whose failure to perform  
can be reasonably expected to cause the failure of  
the life support device or system, or to affect its  
safety or effectiveness.  
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