933768910602 [NXP]
IC F/FAST SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDIP16, 0.300 INCH, PLASTIC, SOT-38-4, DIP-16, FF/Latch;型号: | 933768910602 |
厂家: | NXP |
描述: | IC F/FAST SERIES, POSITIVE EDGE TRIGGERED D FLIP-FLOP, TRUE OUTPUT, PDIP16, 0.300 INCH, PLASTIC, SOT-38-4, DIP-16, FF/Latch 光电二极管 输出元件 逻辑集成电路 触发器 |
文件: | 总10页 (文件大小:91K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
74F378
Hex D flip-flop with enable
Product specification
IC15 Data Handbook
1989 Oct 05
Philips
Semiconductors
Philips Semiconductors
Product specification
Hex D flip-flop with enable
74F378
FEATURES
• 6-bit high-speed parallel register
TYPICAL SUPPLY
CURRENT (TOTAL)
TYPE
TYPICAL f
max
74F378
100MHz
35mA
• Positive edge-triggered D-type inputs
• Fully buffered common Clock and Enable inputs
• Input clamp diodes limit high speed termination effects
• Fully TTL and CMOS compatible
ORDERING INFORMATION
COMMERCIAL
RANGE
= 5V ±10%,
DESCRIPTION
PKG DWG #
V
CC
T
amb
= 0°C to +70°C
DESCRIPTION
16–pin plastic DIP
16–pin plastic SO
N74F378N
SOT38-4
The 74F378 has six edge-triggered D-type flip-flops with individual
D inputs and Q outputs. The common buffered Clock (CP) input
loads all flip-flops simultaneously when the Enable (E) input is Low.
N74F378D
SOT109-1
The register is fully edge-triggered. The state of each D input, one
setup time before the Low-to-High clock transition is transformed to
the corresponding flop-flop’s Q output. The E input must be stable
one setup time prior to the Low-to-High clock transition for
predictable operation.
PIN CONFIGURATION
1
2
3
4
5
16
15
14
13
12
E
Q0
V
CC
Q5
D5
D4
Q4
D3
Q3
CP
D0
D1
Q1
6
7
8
11
10
9
D2
Q2
GND
SF00927
INPUT AND OUTPUT LOADING AND FAN OUT TABLE
PINS
DESCRIPTION
74F (U.L.)
HIGH/LOW
LOAD VALUE
HIGH/LOW
D0 – D5
CP
Data inputs
1.0/1.0
1.0/1.0
1.0/1.0
50/33
20µA/0.6mA
20µA/0.6mA
20µA/0.6mA
1.0mA/20mA
Clock pulse input (active rising edge)
Enable input (active low)
Data outputs
E
Q0 – Q5
NOTE:
One (1.0) FAST unit load is defined as: 20µA in the High state and 0.6mA in the Low state.
2
1989 Oct 05
853–0067 97804
Philips Semiconductors
Product specification
Hex D flip-flop with enable
74F378
LOGIC SYMBOL
IEC/IEEE SYMBOL
1
9
G1
1C2
3
4
6
11 13 14
3
4
6
2
5
D0 D1 D2 D3 D4 D5
Q0 Q1 Q2 Q3 Q4 Q5
2D
9
1
CP
E
7
11
13
14
10
12
15
2
5
7
10 12 15
V
= Pin 16
CC
GND = Pin 8
SF00916
SF00917
LOGIC DIAGRAM
D0
D1
D2
D3
11
D4
13
D5
14
3
4
6
1
E
D
Q
D
Q
D
Q
D
Q
D
Q
D
Q
CP
CP
CP
CP
CP
CP
9
CP
2
5
7
10
12
15
Q0
Q1
Q2
Q3
Q4
Q5
V
= Pin 16
CC
GND = Pin 8
SF00918
FUNCTION TABLE
INPUTS
OUTPUTS
Qn
OPERATING
MODE
E
l
CP
↑
Dn
h
l
H
L
Load “1”
Load “0”
l
↑
h
H
↑
X
X
X
no change Hold (do nothing)
no change
H = High-voltage level
h
=
High-voltage level one setup time
prior to the Low-to-High clock transition
Low-voltage level
Low-voltage level one setup time
prior to the Low-to-High clock transition
Don’t care
L
l
=
=
X
↑
=
=
Low-to-High clock transition
3
1989 Oct 05
Philips Semiconductors
Product specification
Hex D flip-flop with enable
74F378
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the
operating free-air temperature range.)
SYMBOL
PARAMETER
RATING
–0.5 to +7.0
–0.5 to +7.0
–30 to +5
UNIT
V
V
CC
V
IN
Supply voltage
Input voltage
Input current
V
I
IN
mA
V
I
Voltage applied to output in High output state
Current applied to output in Low output state
–0.5 to V
V
OUT
CC
40
mA
°C
°C
OUT
T
amb
Operating free-air temperature range
Storage temperature range
0 to +70
T
stg
–65 to +150
RECOMMENDED OPERATING CONDITIONS
LIMITS
SYMBOL
PARMETER
SYMBOL
UNIT
MIN
4.5
NOM
MAX
V
Supply voltage
5.0
5.5
V
V
CC
IH
IL
V
V
High-level input voltage
Low-level input voltage
Input clamp current
2.0
0.8
–18
–1
V
I
I
I
mA
mA
mA
IK
High-level output current
Low-level output current
OH
OL
20
T
amb
Operating free-air temperature range
0
70
°C
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
TEST
LIMITS
UNIT
SYMBOL
PARAMETER
1
2
CONDITIONS
MIN TYP
MAX
±10%V
±5%V
V
V
= MIN, V = MAX,
2.5
V
V
CC
CC
IL
V
OH
High-level output voltage
= MIN, I = MAX
2.7
3.4
CC
IH
OH
V
V
V
V
V
V
= MIN, V = MAX,
±10%V
0.30
0.30
0.50
0.50
V
V
CC
IL
CC
V
V
Low-level output voltage
OL
= MIN, I = MAX
±5%V
IH
OL
CC
Input clamp voltage
= MIN, I = I
IK
–0.73 –1.2
V
IK
CC
CC
CC
CC
I
I
I
I
Input current at maximum input voltage
High-level input current
= MAX, V = 7.0V
100
20
µA
µA
mA
I
I
= MAX, V = 2.7V
IH
IL
I
Low-level input current
= MAX, V = 0.5V
–0.6
I
3
Short-circuit output current
I
V
= MAX
= MAX
–60
–150
mA
OS
CC
CC
CC
I
32
35
45
45
mA
mA
CCH
I
Supply current (total)
V
I
CCL
Notes:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V = 5V, T
= 25°C.
amb
CC
3. Not more than one output should be shorted at a time. For testing I , the use of high-speed test apparatus and/or sample-and-hold
OS
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I tests should be performed last.
OS
4
1989 Oct 05
Philips Semiconductors
Product specification
Hex D flip-flop with enable
74F378
AC ELECTRICAL CHARACTERISTICS
LIMITS
T
T
amb
= +25°C
= 0°C to +70°C
amb
SYMBOL
PARAMETER
TEST
V
CC
= +5.0V
V
CC
= +5.0V ± 10%
UNIT
CONDITION
C = 50pF, R = 500Ω
C = 50pF, R = 500Ω
L L
L
L
MIN
TYP
MAX
MIN
MAX
f
Maximum clock frequency
Waveform 1
Waveform 1
80
100
80
MHz
ns
MAX
t
t
Propagation delay
CP to Qn
3.0
3.5
5.5
6.0
7.5
8.5
3.0
3.5
8.5
9.5
PLH
PHL
AC SETUP REQUIREMENTS
LIMITS
T
T
V
= +25°C
= +5.0V
= 0°C to +70°C
= +5.0V ± 10%
CC
amb
amb
SYMBOL
PARAMETER
TEST
V
UNIT
CC
CONDITION
C = 50pF, R = 500Ω
C = 50pF, R = 500Ω
L L
L
L
MIN
TYP
MAX
MIN
MAX
t (H)
t (L)
s
Setup time, High or Low
Dn to CP
4.0
4.0
4.0
4.0
s
Waveform 2
Waveform 2
Waveform 2
Waveform 2
Waveform 1
ns
ns
ns
ns
ns
t (H)
Hold time, High or Low
Dn to CP
0
0
0
0
h
t (L)
h
t (H)
Setup time, High or Low
E to CP
4.0
10.0
4.0
10.0
s
t (L)
s
t (H)
Hold time, High or Low
E to CP
0
0
0
0
h
t (L)
h
t
w
t
w
(H)
(L)
CP Pulse width,
High or Low
4.0
6.0
4.0
6.0
AC WAVEFORMS
For all waveforms, V = 1.5V.
M
The shaded areas indicate when the input is permitted to change for predictable output performance.
1/f
MAX
Dn
En
CP
V
V
M
M
CP
V
V
M
V
M
M
t
t
(H)
w
t
s
t
h
t
t (L)
w
PHL
PLH
V
V
V
V
M
M
M
M
V
V
M
Qn
M
t =0
h
t =0
h
t (L)
t (H)
s
s
SF00919
V
V
M
M
Waveform 1. Propagation Delay, Clock Input to Output,
Clock Pulse Width, and Maximum Clock Frequency
SF00920
Waveform 2. Data and Enable Setup Time and Hold Times
5
1989 Oct 05
Philips Semiconductors
Product specification
Hex D flip-flop with enable
74F378
TEST CIRCUIT AND WAVEFORM
t
w
AMP (V)
90%
V
CC
90%
NEGATIVE
PULSE
V
V
M
M
10%
10%
V
V
OUT
IN
0V
PULSE
GENERATOR
D.U.T.
t
t )
t
t )
THL ( f
TLH ( r
R
C
R
L
t
t )
T
L
t
t )
TLH ( r
THL ( f
AMP (V)
90%
M
90%
POSITIVE
PULSE
V
V
M
10%
10%
0V
Test Circuit for Totem-Pole Outputs
DEFINITIONS:
t
w
Input Pulse Definition
INPUT PULSE REQUIREMENTS
R
L
C
L
R
T
=
=
=
Load resistor;
see AC ELECTRICAL CHARACTERISTICS for value.
Load capacitance includes jig and probe capacitance;
see AC ELECTRICAL CHARACTERISTICS for value.
Termination resistance should be equal to Z
pulse generators.
family
74F
V
rep. rate
t
t
t
amplitude
M
w
TLH
THL
of
OUT
2.5ns 2.5ns
3.0V
1.5V
1MHz
500ns
SF00006
6
1989 Oct 05
Philips Semiconductors
Product specification
Hex D flip-flop with enable
74F378
DIP16: plastic dual in-line package; 16 leads (300 mil)
SOT38-4
7
1989 Oct 05
Philips Semiconductors
Product specification
Hex D flip-flop with enable
74F378
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
8
1989 Oct 05
Philips Semiconductors
Product specification
Hex D flip-flop with enable
74F378
NOTES
9
1989 Oct 05
Philips Semiconductors
Product specification
Hex D flip-flop with enable
74F378
Data sheet status
[1]
Data sheet
status
Product
status
Definition
Objective
specification
Development
This data sheet contains the design target or goal specifications for product development.
Specification may change in any manner without notice.
Preliminary
specification
Qualification
This data sheet contains preliminary data, and supplementary data will be published at a later date.
Philips Semiconductors reserves the right to make chages at any time without notice in order to
improve design and supply the best possible product.
Product
specification
Production
This data sheet contains final specifications. Philips Semiconductors reserves the right to make
changes at any time without notice in order to improve design and supply the best possible product.
[1] Please consult the most recently issued datasheet before initiating or completing a design.
Definitions
Short-form specification — The data in a short-form specification is extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Limiting values definition — Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one
or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or
at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended
periods may affect device reliability.
Application information — Applications that are described herein for any of these products are for illustrative purposes only. Philips
Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or
modification.
Disclaimers
Life support — These products are not designed for use in life support appliances, devices or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications
do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application.
Righttomakechanges—PhilipsSemiconductorsreservestherighttomakechanges, withoutnotice, intheproducts, includingcircuits,standard
cells, and/or software, described or contained herein in order to improve design and/or performance. Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless
otherwise specified.
Philips Semiconductors
811 East Arques Avenue
P.O. Box 3409
Copyright Philips Electronics North America Corporation 1998
All rights reserved. Printed in U.S.A.
Sunnyvale, California 94088–3409
Telephone 800-234-7381
print code
Date of release: 10-98
9397-750-05122
Document order number:
Philips
Semiconductors
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