935284504118_技术文档

INTEGRATED CIRCUITS

DATA SHEET

TDA1565TH

High efficiency 2 × 40 W / 2 Ω

stereo car radio power amplifier

Product speciﬁcation

2004 Jan 27

Supersedes data of 2003 Aug 13

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

FEATURES

GENERAL DESCRIPTION

• Low dissipation due to switching from Single-Ended

(SE) to Bridge-Tied Load (BTL) mode

The TDA1565TH is a monolithic power amplifier in a

20-lead heatsink small outline plastic package. It contains

two identical 40 W amplifiers. Power dissipation is

minimized by switching from SE to BTL mode only when a

higher output voltage swing is needed. The device is

developed primarily for car radio applications.

• Differential inputs with high Common Mode Rejection

Ratio (CMRR)

• Mute, standby or operating mode selectable by pin

• Load dump protection circuit

• Short-circuit safe to ground; to supply voltage and

across load

• Loudspeaker protection circuit

• Thermal protection at high junction temperature

• Device switches to single-ended operation at high

junction temperature

• Clip detection at 2.5 % THD

• Diagnostic signal indicating clipping, short-circuit

protection and pre-warning of thermal protection.

QUICK REFERENCE DATA

SYMBOL

V_P

PARAMETER

supply voltage

CONDITIONS

DC-biased

MIN.

6.0

TYP. MAX. UNIT

14.4

−

18

30

45

8

V

non-operating

load dump

−

V

−

V

I_ORM

I_q(tot)

I_stb

repetitive peak output current

total quiescent current

standby current

−

A

R_L= ∞

−

95

1

150

50

150

−

mA

µA

kΩ

W

−

Z_i

differential input impedance

output power

90

25

37

−

120

31

40

60

26

80

65

−

P_o

R_L= 2 Ω; THD 0.5 %

R_L= 2 Ω; THD 10 %

R_L= 2 Ω; EIAJ

−

W

−

W

G_v

voltage gain

25

−

27

−

dB

mV

dB

CMRR

SVRR

∆V_O

α_cs

common mode rejection ratio

supply voltage ripple rejection

DC output offset voltage

channel separation

f = 1 kHz; R_s= 0 Ω

50

−

100

−

R_s= 0 Ω; P_o= 25 W

50

−

70

−

∆G_v

channel unbalance

1

ORDERING INFORMATION

TYPE

PACKAGE

NUMBER

NAME

DESCRIPTION

VERSION

TDA1565TH

HSOP20

plastic, heatsink small outline package; 20 leads; low stand-off

height

SOT418-3

2004 Jan 27

2

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

BLOCK DIAGRAM

V

P2

handbook, full pagewidth

P1

20

11

+

−

TDA1565TH

SLAVE

CONTROL

7

8

−

+

OUT2

channel 2

MUTE

−

+

13

14

−

+

I/V

−

IN2

V/I

+

−

+

IN2

V/I

60

kΩ

60

kΩ

V

P

16

V

ref

CSE

25 kΩ

19

−

+

CIN

60

kΩ

60

kΩ

+

−

V/I

18

17

−

+

IN1

+

−

+

−

V/I

3

4

IN1

−

+

OUT1

I/V

MUTE

channel 1

−

+

SLAVE

CONTROL

1

n.c.

9

10

12

CLIP DETECTION AND

THERMAL PROTECTION

PRE-WARNING

STANDBY

LOGIC

2

15

6

5

MHC600

MODE

DIAG

GND2

GND1

Fig.1 Block diagram.

3

2004 Jan 27

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

PINNING

SYMBOL

DESCRIPTION

not connected

n.c.

1

2

MODE

mute/standby/operating mode

selection

OUT1−

OUT1+

GND1

GND2

OUT2−

OUT2+

n.c.

3

4

inverting channel 1 output

non-inverting channel 1 output

ground 1

V

20

1

2

3

4

5

6

7

8

9

n.c.

P1

5

CIN 19

IN1− 18

IN1+ 17

CSE 16

DIAG 15

IN2+ 14

IN2− 13

n.c. 12

MODE

OUT1−

OUT1+

GND1

GND2

OUT2−

OUT2+

n.c.

6

ground 2

7

inverting channel 2 output

non-inverting channel 2 output

not connected

8

TDA1565TH

9

n.c.

10

11

12

13

14

15

16

17

18

19

20

not connected

V_P2

supply voltage 2

V

P2

11

10 n.c.

n.c.

not connected

IN2−

IN2+

DIAG

CSE

inverting channel 2 input

non-inverting channel 2 input

diagnostic output

001aaa306

electrolytic capacitor for SE mode

non-inverting channel 1 input

inverting channel 1 input

common input

IN1+

IN1−

CIN

Fig.2 Pin configuration.

V_P1

supply voltage 1

2004 Jan 27

4

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

FUNCTIONAL DESCRIPTION

The TDA1565TH contains two identical amplifiers with

differential inputs. At low output power (output amplitudes

of up to 3 V (RMS) at V_P= 14.4 V), the device operates as

a normal SE amplifier. When a larger output voltage swing

is required, the circuit automatically switches internally to

BTL operation.

V

18

MODE

(V)

handbook, halfpage

Operating

With a sine wave input signal, the power dissipation of a

conventional BTL amplifier with an output power of up to

3 W is more than twice the power dissipation of the

TDA1565TH (see Fig.10).

4

During normal use, when the amplifier is driven by typical

variable signals such as music, the high (BTL) output

power is only needed for a small percentage of time.

Assuming that a music signal has a normal (Gaussian)

amplitude distribution, the power dissipation of a

conventional BTL amplifier with the same output power is

approximately 70 % higher (see Fig.11).

3

2

1

0

Mute

Standby

MGR176

The heatsink must be designed for music signal operation.

When such a heatsink is used, the IC’s thermal protection

will disable the BTL mode when the junction temperature

exceeds 150 °C. In this case the output power is limited to

10 W per amplifier. The gain of each amplifier is internally

fixed at 26 dB.

Fig.3 Switching levels of the mode select pin

(pin MODE).

The device can be switched to any of the following modes

by applying the appropriate voltage to the MODE pin (see

Fig.3):

• Standby with low standby current (less than 50 µA)

• Mute condition; DC adjusted

• On, operation.

The diagnostic output indicates the following conditions:

• Clip detection at 2.5 % THD (see Fig.4)

• Short-circuit protection (see Fig.5):

The device is fully protected against a short-circuit of the

output pins to ground or to the supply voltage. It is also

protected against a loudspeaker short-circuit and against

high junction temperatures. In the event of a permanent

short-circuit condition, the output stage is repeatedly

switched on and off with a low duty-cycle resulting in low

power dissipation.

– When an output short-circuit occurs (for at least

10 µs); the output stages are switched off for approx.

500 ms, after which time the outputs are checked to

see if a short-circuit condition still exists. During any

short-circuit condition, the power dissipation is very

low. During a short-circuit condition pin DIAG is at

logic LOW.

• Start-up/shutdown; when the product is internally muted

• Thermal protection pre-warning:

When the supply voltage drops below 6 V (e.g. vehicle

engine start), the circuit is immediately muted to prevent

audible ‘clicks’ that may be produced in the electronic

circuitry preceding the power amplifier.

– If the junction temperature rises above 145 °C but is

below the thermal protection temperature of 150 °C,

the diagnostic output indicates that the thermal

protection condition is about to become active. This

pre-warning can be used by another device to reduce

the amplitude of the input signal which would reduce

the power dissipation. The thermal protection

The voltage across the SE electrolytic capacitor

connected to pin 16 is kept at 0.5 V_Pby a voltage buffer

(see Fig.1). The capacitor value has an important

influence on the output power in SE mode, especially at

low frequency signals; a high value is recommended to

minimize power dissipation at low frequencies.

pre-warning is indicated by a logic LOW at pin DIAG.

2004 Jan 27

5

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

Heatsink design

There are two parameters that determine the size of the

heatsink. The first is the rating of the virtual junction

temperature and the second is the ambient temperature at

which the amplifier must still deliver its full power in the

BTL mode.

MHC601

handbook, halfpage

V

OUT1;

V

OUT2

Example:

With a conventional BTL amplifier, the maximum power

dissipation for a typical signal, such as music (at each

amplifier) will be approximately two times 15 W. At a virtual

junction temperature of 150 °C and a maximum ambient

temperature of 65 °C, R_th(vj-c)= 1.8 K/W and

0

V

DIAG

R_th(c-h)= 0.2 K/W. For a conventional BTL amplifier the

thermal resistance of the heatsink should be:

150 – 65

2 × 15

– 1.8 – 0.2 = 0.83 K/W

----------------------

0

t

Compared to a conventional BTL amplifier, the

TDA1565TH has a higher efficiency. The thermal

resistance of the heatsink should be:

150 – 65

2 × 10

– 1.8 – 0.2 = 2.25 K/W (see Fig.6).

----------------------

Fig.4 Clip detection waveforms.

short-circuit

removed

output pins

handbook, halfpage

short-circuit

(to ground)

loudspeaker

short-circuit

I

OUT1;

I

OUT2

Imax

virtual junction

channel 1 channel 2

handbook, halfpage

t

3.0 K/W

Imax

0.3 K/W

V

DIAG

case

MHC586

0

t

500

ms

500

ms

500

ms

500

ms

500

ms

10 µs 10 µs 10 µs

10 µs 10 µs

MHC595

Fig.5 Short-circuit protection waveforms.

Fig.6 Equivalent thermal resistance network.

2004 Jan 27

6

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 60134).

SYMBOL

V_P

PARAMETER

CONDITIONS

operating

MIN.

MAX.

18

UNIT

supply voltage

−

V

non operating

30

V

load dump; t_r> 2.5 ms

45

V

V_P(sc)

V_rp

short-circuit safe voltage

reverse polarity voltage

repetitive peak output current

total power dissipation

16

V

6

V

I_ORM

P_tot

8

A

60

W

°C

T_stg

T_vj

storage temperature

−55

−

+150

150

+85

virtual junction temperature

operating ambient temperature

T_amb

−40

THERMAL CHARACTERISTICS

SYMBOL

PARAMETER

CONDITIONS

VALUE

UNIT

R_th(j-c)

R_th(j-a)

thermal resistance from junction to case

thermal resistance from junction to ambient

see Fig.6

in free air

1.8

40

K/W

2004 Jan 27

7

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

DC CHARACTERISTICS

V_P= 14.4 V; T_amb= 25 °C; measured in Fig.7; unless otherwise speciﬁed.

SYMBOL

Supplies

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

V_P

supply voltage

note 1

6.0

14.4

18.0

V

I_q(tot)

I_stb

quiescent current

standby current

R_L= ∞

−

95

1

150

50

−

mA

µA

V

V_CSE

average voltage of SE

7.1

electrolytic capacitor at pin 16

∆V_O

DC output offset voltage

on state

−

100

mV

mute state

Mode select switch (see Fig.3)

V_MODE

voltage at mode select pin

standby condition

mute condition

on condition

0

2

4

−

1

V

−

3

V

5

V_P

40

V

I_MODE

mode select input current

V_MODE= 5 V

25

µA

Diagnostic

V_DIAG

voltage at diagnostic output pin protection/temp

pre-warning/clip detection

V_DIAG< 0.5 V

−

0.5

V

I_DIAG

diagnostic sink current

2

−

mA

Protection

T_pre

pre-warning temperature

BTL disable temperature

−

145

150

−

°C

T_dis(BTL)

note 2

Notes

1. The circuit is DC-biased at V_P= 6 to 18 V and AC-operating at V_P= 8 to 18 V.

2. If the junction temperature exceeds 150 °C, the output power is limited to 10 W per channel.

2004 Jan 27

8

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

AC CHARACTERISTICS

V_P= 14.4 V; R_L= 2 Ω; f = 1 kHz; T_amb= 25 °C; measured in Fig.7; unless otherwise speciﬁed.

SYMBOL

PARAMETER

output power

CONDITIONS

MIN.

25

TYP.

MAX. UNIT

P_o

R_L= 2 Ω; THD = 0.5 %

R_L= 2 Ω; THD = 10 %

R_L= 2 Ω; EIAJ

31

40

60

26

34

0.1

−

W

%

W

Hz

37

−

V_P= 13.2 V; THD = 0.5 %

V_P= 13.2 V; THD = 10 %

P_o= 1 W; note 1

−

THD

P

total harmonic distortion

power dissipation

−

see Figs 10 and 11

B_p

power bandwidth

THD = 0.5 %; P_o= −1 dB

−

20 to

−

with respect to 25 W

15000

f_ro(l)

low frequency roll-off

−1 dB; note 2

−1 dB

−

25

−

Hz

f_ro(h)

G_v

high frequency roll-off

130

25

−

kHz

dB

closed-loop voltage gain

supply voltage ripple rejection

P_o= 1 W; (see Fig.16)

26

27

SVRR

R_s= 0 Ω; V_ripple= 2 V_(p-p);

(see Fig.17)

on/mute

50

65

90

80

120

1

−

dB

kΩ

%

standby

−

CMRR

Z_i

common mode rejection ratio

differential input impedance

mismatch in input impedance

SE to BTL switch voltage level

f = 1 kHz; R_s= 0 Ω

−

90

−

150

−

∆Z_i

V_SE-BTL

V_out

note 3

−

3

−

V

output voltage mute (RMS value) V_i= 1 V (RMS)

−

95

100

90

70

−

150

−

µV

dB

V_n(o)

noise output voltage

on; R_s= 0 Ω; note 4

on; R_s= 10 kΩ; note 4

mute; note 5

−

150

−

α_cs

channel separation

channel unbalance

R_s= 0 Ω; P_o= 25 W

50

−

∆G_v

1

Notes

1. The distortion is measured with a bandwidth of 10 Hz to 30 kHz (see Figures 20 and 21).

2. Frequency response externally fixed (input capacitors determine the low frequency roll-off).

3. The SE to BTL switch voltage level depends on the value of V_P.

4. Noise output voltage measured with a bandwidth of 20 Hz to 20 kHz.

5. Noise output voltage is independent of the source resistance (R_s).

2004 Jan 27

9

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

TEST AND APPLICATION INFORMATION

handbook, full pagewidth

V

220 nF

2200 µF

P

V

P1

P2

11

20

TDA1565TH

−

100 nF

3.9 Ω

OUT2−

7

8

0.5R

s

IN2− 13

+

100 nF

220 nF

2 Ω

3.9 Ω

−

+

OUT2+

0.5R

s

IN2+ 14

220 nF

60

kΩ

V

ref

25 kΩ

16

CIN 19

CSE

2200 µF

10 µF

60

kΩ

60

kΩ

0.5R

s

IN1− 18

+

−

3

4

OUT1−

220 nF

3.9 Ω

2 Ω

OUT1+

s

IN1+ 17

100 nF

3.9 Ω

+

−

220 nF

CLIP AND

DIAGNOSTIC

STANDBY

LOGIC

signal ground

power ground

2

15

6

5

MODE

DIAG

GND2 GND1

V

MODE

R

pu

V

logic

10 kΩ

MHC603

Connect Boucherot (IEC-60268) filter to pin 4 and pin 7 using the shortest possible connection.

R_s= Source resistance.

Fig.7 Application diagram.

2004 Jan 27

10

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

handbook, full pagewidth

DIAG

IN2

AGND

220 nF

1000 µF

IN1

22 µF

10 µF

22 µF

on

2200 µF

TDA1564TH/65TH

off

V

GND

Out1

Out2

P

MHC587

a. Top silk screen (top view).

b. Top copper track (top view).

Fig.8 PCB layout (component side) for the application shown in Fig.7.

11

2004 Jan 27

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

handbook, full pagewidth

2.7

kΩ

220 nF

51 kΩ

3E9

220 nF

100 nF

150 kΩ

100 nF 3E9

3E9 100 nF

MHC588

a. Bottom silk screen (top view; legend reversed).

b. Bottom copper track (top view).

Fig.9 PCB layout (soldering side) for the application shown in Fig.7.

2004 Jan 27

12

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

MHC589

MHC590

50

40

handbook, halfpage

P

(W)

P

(W)

(1)

40

30

20

10

(1)

(2)

30

20

10

0

10

20

30

2

4

6

8

10

P

(W)

o

P

(W)

o

Input signal 1 kHz, sinusoidal; V_P= 14.4 V; R_L= 2 Ω.

(1) For a conventional BTL amplifier.

(2) For TDA1565TH.

Input signal IEC 268 filtered pink noise; V_P= 14.4 V; R_L= 2 Ω.

(1) For a conventional BTL amplifier.

(2) For TDA1565TH.

Fig.10 Power dissipation as a function of output

power; sine wave driven.

Fig.11 Power dissipation as a function of output

power; pink noise through IEC-60268 filter.

2.2 µF

470 nF

430 Ω

330 Ω

91

nF

68

nF

3.3

kΩ

3.3

kΩ

10

kΩ

input

output

MGC428

Fig.12 IEC-60268 filter.

2004 Jan 27

13

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

handbook, full pagewidth

V

220 nF

2200 µF

P

V

P2

P1

20

11

TDA1565TH

−

100 nF

3.9 Ω

OUT2−

7

8

IN2− 13

220 nF

+

100 nF

2 Ω

3.9 Ω

−

+

OUT2+

IN2+ 14

220 nF

60

kΩ

V

ref

25 kΩ

16

CIN 19

CSE

2200 µF

10 µF

IEC-60268

FILTER

60

kΩ

60

kΩ

IN1− 18

220 nF

+

−

3

4

OUT1−

pink

noise

3.9 Ω

2 Ω

IN1+ 17

220 nF

100 nF

3.9 Ω

+

−

OUT1+

INTERFACE

signal ground

power ground

MODE

2

DIAG

15

6

5

MODE

DIAG GND2 GND1

R

V

pu

MODE

V

logic

MHC604

Fig.13 Test and application diagram for dissipation measurements with a simulated music signal (pink noise).

2004 Jan 27

14

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

MHC599

(3)

MHC598

200

150

handbook, halfpage

I

P

(mA)

I

P

(mA)

150

100

50

(2)

50

(1)

0

1

2

3

4

5

0

8

16

24

V

(V)

V

(V)

P

MODE

V_IN= 5 mV; V_P= 14.4 V.

(1) Standby.

(2) Mute.

V_MODE= 5 V; R_L= ∞.

(3) Operating.

Fig.14 Quiescent current as a function of V_P.

Fig.15 I_Pas a function of V_MODE.

MHC597

MHC591

28

0

handbook, halfpage

G

v

SVRR

(dB)

26

−20

−40

−60

24

22

20

−80

2

3

4

5

6

2

3

4

5

10

f (Hz)

V_IN= 100 mV.

(V_ripple= 2 V (p-p).

Fig.16 Gain as a function of frequency.

Fig.17 SVRR as a function of frequency.

2004 Jan 27

15

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

MHC592

MHC596

−10

0.8

handbook, halfpage

α

P

cs

o

(W)

0.6

(dB)

−30

(1)

−50

0.4

0.2

(2)

(1)

(2)

−70

−90

0

2

3

4

5

10

8

16

24

V

(V)

P

f (Hz)

(1) P_o= 1 W.

(2) P_o= 10 W.

V_IN= 50 mV.

(1) Low supply mute.

(2) Load dump.

Fig.18 Channel separation as a function of

frequency.

Fig.19 AC operation as a function of V_P.

2004 Jan 27

16

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

MHC594

2

10

handbook, full pagewidth

THD

+

noise

(%)

10

1

(1)

(2)

(3)

−1

10

−2

10

0.1

0.2

0.5

1

2

5

10

20

50

P

(W)

o

R_L= 2 Ω.

(1) 10 kHz.

(2) 1 kHz.

(3) 100 Hz.

Fig.20 THD + noise as a function of P_o.

2004 Jan 27

17

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

MHC593

10

handbook, full pagewidth

THD

+

noise

(%)

(1)

1

(2)

−1

10

−2

10

2

3

4

5

10

f (Hz)

R_L= 2 Ω.

(1) P_o= 10 W.

(2) P_o= 1 W.

Fig.21 THD + noise as a function of frequency.

2004 Jan 27

18

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

handbook, full pagewidth

MBH691

V

P

V

load

0

−V

P

V

P

V

master

1/2 V

P

0

V

P

V

slave

1/2 V

P

0

1

2

t (ms)

3

Also see Fig.7.

V_load= (V_OUT2+)−(V_OUT2−) or (V_OUT1+)−(V_OUT1−).

V_master= V_OUT2+or V_OUT1−

V_slave= V_OUT2−or V_OUT1+

.

Fig.22 Output waveforms.

2004 Jan 27

19

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

Application notes

ADVANTAGES OF HIGH EFFICIENCY

1. Power conversion improvement (power supply): The

fact that the reduction of power dissipation is directly

related to a reduction of supply current is often

V

= 14.4 V

handbook, halfpage

P

Power

dissipation

reduction of 40%

Supply

current

at P = 3.2 W

o

neglected. One advantage is voltage is dropped over

the whole supply chain. Another advantage is reduced

stress for the coil in the supply line. Even the adapter

or supply circuit is cooler due to the reduced

reduction of

32%

dissipation of heat in the whole chain because more

supply current will be converted into output power.

Same junction

temperature

Same heatsink

size

choice

2. Power dissipation reduction: This is the best known

advantage of high efficiency amplifiers.

3. Heatsink size reduction. The size of heatsink for a

conventional amplifier can be reduced by

Heatsink

size

reduction of

50%

Heatsink

temperature

reduction of

40%

approximately 50 % at V_P= 14.4 V when the

TDA1565TH is used. In this case, the maximum

heatsink temperature remains the same.

MHC610

4. Heatsink temperature reduction: The power

dissipation and the thermal resistance of the heatsink

determine the rise in heatsink temperature.

Fig.23 Heatsink design.

If the same sized heatsink of a conventional amplifier is

used, the maximum heatsink temperature and the

maximum junction temperature both decrease, which

extends the life of the semiconductor device; the maximum

power dissipation for music, or similar input signals

decreases by 40 %.

ADVANTAGE OF THE CONCEPT USED BY TDA1565TH

Because the TDA1565TH uses a single-ended capacitor

to create a non-dissipating half supply voltage, it is highly

efficient under all conditions. Other design concepts rely

on the fact that both input signals have the same amplitude

and phase. Using a SE capacitor prevents any adverse

affects on efficiency that could result from any form of

processing that may have been applied to the input

signals, such as amplitude difference, phase shift or

delays between both input signals, or other DSP

processing.

It is clear that the use of the TDA1565TH saves a

significant amount of energy. The maximum supply current

decreases by approximately 32 %, which reduces the

power dissipation in the amplifier as well as in the whole

supply chain. The TDA1565TH allows the size of the

heatsink to be reduced by approximately 50 %, or the

temperature of the heatsink to be reduced by 40 % if the

size of the heatsink is unchanged.

2004 Jan 27

20

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

INTERNAL PIN CONFIGURATIONS

NAME

MODE

EQUIVALENT CIRCUIT

2

MHC607

3, 8

OUT1+, OUT2−

V

P1, P2

3, 8

16

MHC608

4, 7

OUT1+, OUT2−

V

P1, P2

4, 7

16

MHC609

15

DIAG

V

P2

15

MGW264

2004 Jan 27

21

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

16

NAME

EQUIVALENT CIRCUIT

CSE

V

P2

16

MHC606

17, 18, IN1+, IN1−

13, 14, IN2+, IN2−

V

P1, P2

19

CIN

V

P1, P2

13, 14, 17, 18

19

MHC605

2004 Jan 27

22

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

PACKAGE OUTLINE

HSOP20: plastic, heatsink small outline package; 20 leads; low stand-off height

SOT418-3

E

A

D

x

X

c

y

E

H

2

v

M

A

E

D

1

D

2

10

1

pin 1 index

Q

A

2

(A )

3

E

1

A

4

θ

L

p

detail X

20

11

w

M

Z

b

p

e

0

5

10 mm

scale

DIMENSIONS (mm are the original dimensions)

A

max.

(1)

(2)

A

b

c

D

E

1

E

e

H

E

L

p

Q

v

w

x

y

Z

θ

UNIT

2

3

4

p

1

2

8°

0°

+0.08 0.53 0.32

−0.04 0.40 0.23

16.0 13.0 1.1 11.1 6.2

15.8 12.6 0.9 10.9 5.8

2.9

2.5

14.5 1.1

13.9 0.8

1.7

1.5

2.5

2.0

3.5

3.2

mm

1.27

3.5

0.35

0.25 0.25 0.03 0.07

Notes

1. Limits per individual lead.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

02-02-12

03-07-23

SOT418-3

2004 Jan 27

23

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

SOLDERING

If wave soldering is used the following conditions must be

observed for optimal results:

Introduction to soldering surface mount packages

• Use a double-wave soldering method comprising a

turbulent wave with high upward pressure followed by a

smooth laminar wave.

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our “Data Handbook IC26; Integrated Circuit Packages”

(document order number 9398 652 90011).

• For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint

longitudinal axis is preferred to be parallel to the

transport direction of the printed-circuit board;

There is no soldering method that is ideal for all surface

mount IC packages. Wave soldering can still be used for

certain surface mount ICs, but it is not suitable for fine pitch

SMDs. In these situations reflow soldering is

recommended.

– smaller than 1.27 mm, the footprint longitudinal axis

must be parallel to the transport direction of the

printed-circuit board.

Reﬂow soldering

The footprint must incorporate solder thieves at the

downstream end.

Reflow soldering requires solder paste (a suspension of

fine solder particles, flux and binding agent) to be applied

to the printed-circuit board by screen printing, stencilling or

pressure-syringe dispensing before package placement.

Driven by legislation and environmental forces the

• For packages with leads on four sides, the footprint must

be placed at a 45° angle to the transport direction of the

printed-circuit board. The footprint must incorporate

solder thieves downstream and at the side corners.

worldwide use of lead-free solder pastes is increasing.

During placement and before soldering, the package must

be fixed with a droplet of adhesive. The adhesive can be

applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the

adhesive is cured.

Several methods exist for reflowing; for example,

convection or convection/infrared heating in a conveyor

type oven. Throughput times (preheating, soldering and

cooling) vary between 100 and 200 seconds depending

on heating method.

Typical dwell time of the leads in the wave ranges from

3 to 4 seconds at 250 °C or 265 °C, depending on solder

material applied, SnPb or Pb-free respectively.

Typical reflow peak temperatures range from

215 to 270 °C depending on solder paste material. The

top-surface temperature of the packages should

preferably be kept:

A mildly-activated flux will eliminate the need for removal

of corrosive residues in most applications.

• below 225 °C (SnPb process) or below 245 °C (Pb-free

process)

Manual soldering

– for all BGA, HTSSON-T and SSOP-T packages

Fix the component by first soldering two

diagonally-opposite end leads. Use a low voltage (24 V or

less) soldering iron applied to the flat part of the lead.

Contact time must be limited to 10 seconds at up to

300 °C.

– for packages with a thickness ≥ 2.5 mm

– for packages with a thickness < 2.5 mm and a

volume ≥ 350 mm³so called thick/large packages.

• below 240 °C (SnPb process) or below 260 °C (Pb-free

process) for packages with a thickness < 2.5 mm and a

volume < 350 mm³so called small/thin packages.

When using a dedicated tool, all other leads can be

soldered in one operation within 2 to 5 seconds between

270 and 320 °C.

Moisture sensitivity precautions, as indicated on packing,

must be respected at all times.

Wave soldering

Conventional single wave soldering is not recommended

for surface mount devices (SMDs) or printed-circuit boards

with a high component density, as solder bridging and

non-wetting can present major problems.

To overcome these problems the double-wave soldering

method was specifically developed.

2004 Jan 27

24

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

Suitability of surface mount IC packages for wave and reﬂow soldering methods

SOLDERING METHOD

PACKAGE⁽¹⁾

WAVE

not suitable

REFLOW⁽²⁾

BGA, HTSSON..T⁽³⁾, LBGA, LFBGA, SQFP, SSOP..T⁽³⁾, TFBGA,

USON, VFBGA

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON,

HTQFP, HTSSOP, HVQFN, HVSON, SMS

PLCC⁽⁵⁾, SO, SOJ

not suitable⁽⁴⁾

suitable

LQFP, QFP, TQFP

not recommended⁽⁵⁾⁽⁶⁾suitable

SSOP, TSSOP, VSO, VSSOP

CWQCCN..L⁽⁸⁾, PMFP⁽⁹⁾, WQCCN..L⁽⁸⁾

not recommended⁽⁷⁾

suitable

not suitable

Notes

1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy

from your Philips Semiconductors sales office.

2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum

temperature (with respect to time) and body size of the package, there is a risk that internal or external package

cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the

Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.

3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account

be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature

exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature

must be kept as low as possible.

4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder

cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,

the solder might be deposited on the heatsink surface.

5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.

The package footprint must incorporate solder thieves downstream and at the side corners.

6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not

suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than

0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.

8. Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered pre-mounted

on flex foil. However, the image sensor package can be mounted by the client on a flex foil by using a hot bar

soldering process. The appropriate soldering profile can be provided on request.

9. Hot bar or manual soldering is suitable for PMFP packages.

2004 Jan 27

25

Philips Semiconductors

Product speciﬁcation

High efﬁciency 2 × 40 W / 2 Ω

stereo car radio power ampliﬁer

TDA1565TH

DATA SHEET STATUS

DATA SHEET

STATUS⁽¹⁾

PRODUCT

STATUS⁽²⁾⁽³⁾

LEVEL

DEFINITION

I

Objective data

Development This data sheet contains data from the objective speciﬁcation for product

development. Philips Semiconductors reserves the right to change the

speciﬁcation in any manner without notice.

II

Preliminary data Qualiﬁcation

This data sheet contains data from the preliminary speciﬁcation.

Supplementary data will be published at a later date. Philips

Semiconductors reserves the right to change the speciﬁcation without

notice, in order to improve the design and supply the best possible

product.

III

Product data

Production

This data sheet contains data from the product speciﬁcation. Philips

Semiconductors reserves the right to make changes at any time in order

to improve the design, manufacturing and supply. Relevant changes will

be communicated via a Customer Product/Process Change Notiﬁcation

(CPCN).

Notes

1. Please consult the most recently issued data sheet before initiating or completing a design.

2. The product status of the device(s) described in this data sheet may have changed since this data sheet was

published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.

3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

DEFINITIONS

DISCLAIMERS

Short-form specification

The data in a short-form

Life support applications

These products are not

specification is extracted from a full data sheet with the

same type number and title. For detailed information see

the relevant data sheet or data handbook.

designed for use in life support appliances, devices, or

systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips

Semiconductors customers using or selling these products

for use in such applications do so at their own risk and

agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

Limiting values definition Limiting values given are in

accordance with the Absolute Maximum Rating System

(IEC 60134). Stress above one or more of the limiting

values may cause permanent damage to the device.

These are stress ratings only and operation of the device

at these or at any other conditions above those given in the

Characteristics sections of the specification is not implied.

Exposure to limiting values for extended periods may

affect device reliability.

Right to make changes

Philips Semiconductors

reserves the right to make changes in the products -

including circuits, standard cells, and/or software -

described or contained herein in order to improve design

and/or performance. When the product is in full production

(status ‘Production’), relevant changes will be

Application information

Applications that are

communicated via a Customer Product/Process Change

Notification (CPCN). Philips Semiconductors assumes no

responsibility or liability for the use of any of these

products, conveys no licence or title under any patent,

copyright, or mask work right to these products, and

makes no representations or warranties that these

products are free from patent, copyright, or mask work

right infringement, unless otherwise specified.

described herein for any of these products are for

illustrative purposes only. Philips Semiconductors make

no representation or warranty that such applications will be

suitable for the specified use without further testing or

modification.

2004 Jan 27

26

Philips Semiconductors – a worldwide company

Contact information

For additional information please visit http://www.semiconductors.philips.com.

Fax: +31 40 27 24825

For sales ofﬁces addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.

SCA76

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

R32/02/pp27

Date of release: 2004 Jan 27

Document order number: 9397 750 12581


型号：	935284504118
厂家：	NXP
描述：	40W, 2 CHANNEL, AUDIO AMPLIFIER, PDSO20, PLASTIC, SOT-418-3, HSOP-20 放大器光电二极管商用集成电路
文件：	总27页 (文件大小：236K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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