935324035128 [NXP]
Peizoresistive Sensor;
| 型号： | 935324035128 |
| 厂家： | 
NXP |
| 描述： | Peizoresistive Sensor 传感器 换能器 |
| 文件： | 总14页 (文件大小：370K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Pressure
MP3V5004G
Rev 2, 06/2010
Freescale Semiconductor
Integrated Silicon Pressure Sensor,
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
MP3V5004G
Series
0 to 3.92 kPa (0 to 400 mm H2O)
0.6 to 3.0 V Output
The MP3V5004G series piezoresistive transducer is a state-of-the-art
monolithic silicon pressure sensor designed for a wide range of
applications, but particularly those employing a microcontroller or
microprocessor with A/D inputs. This sensor combines a highly sensitive
implanted strain gauge with advanced micromachining techniques, thin-film
metallization, and bipolar processing to provide an accurate, high level
analog output signal that is proportional to the applied pressure.
Typical Applications
• Washing Machine Water Level
• Ideally Suited for Microprocessor or
Microcontroller-Based Systems
Features
• Temperature Compensated from 10°C to 60°C
• Available in Gauge Surface Mount (SMT) Configuration
• Durable Thermoplastic (PPS) Package
ORDERING INFORMATION
# of Ports
None Single
Pressure Type
Device Marking
Package
Options
Case
No.
Device Name
Dual
Gauge Differential Absolute
Small Outline Package (MP3V5004 Series)
MP3V5004GC6U
MP3V5004GC6T1
MP3V5004DP
Rail
Tape & Reel
Trays
482A
482A
1351
1368
1369
MP3V5004G
MP3V5004G
MP3V5004DP
MP3V5004GV
MP3V5004GP
•
•
•
•
•
•
MP3V5004GVP
MP3V5004GP
Trays
•
•
•
•
Trays
SMALL OUTLINE PACKAGES
MP3V5004GC6U/6T1
CASE 482A
MP3V5004DP
CASE 1351
MP3V5004GVP
CASE 1368
MP3V5004GP
CASE 1369
© Freescale Semiconductor, Inc., 2008, 2010. All rights reserved.
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2.
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range
POP
0
—
3.92
400
kPa
mm H2O
Supply Voltage(1)
Supply Current
VS
IS
2.7
—
3.0
—
3.3
10
VDC
mAdc
V
Span at 306 mm H2O (3 kPa)(2)
Offset(3) (4)
VFSS
VOFF
V/P
—
1.8
0.6
—
0.45
—
0.75
—
V
Sensitivity
0.6
5.9
V/kPa
mV/mm H2O
Accuracy(4) (5)
0 to 100 mm H2O (10 to 60°C)
100 to 400 mm H2O (10 to 60°C)
—
—
—
—
—
—
±1.5
±2.5
%VFSS
%VFSS
1. Device is ratiometric within this specified excitation range.
2. Span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the minimum rated
pressure.
3. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
4. Accuracy (error budget) consists of the following:
Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum
or maximum rated pressure, at 25°C.
Offset Stability:
Output deviation, after 1000 temperature cycles, -30° to 100°C, and 1.5 million pressure cycles, with minimum
rated pressure applied.
TcSpan:
TcOffset:
Output deviation over the temperature range of 10° to 60°C, relative to 25°C.
Output deviation with minimum rated pressure applied, over the temperature range of 10° to 60°C, relative to 25°C.
Variation from Nominal: The variation from nominal values, for Offset or Full Scale Span, as a percent of VFSS, at 25°C.
5. Auto-Zero at Factory Installation: Due to the sensitivity of the MP3V5004G, external mechanical stresses and mounting position can affect
the zero pressure output reading. Auto-zeroing is defined as storing the zero pressure output reading and subtracting this from the device's
output during normal operations. Reference AN1636 for specific information. The specified accuracy assumes a maximum temperature
change of ±5°C between auto-zero and measurement.
MP3V5004G
Sensors
2
Freescale Semiconductor
Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Symbol
PMAX
TSTG
TA
Value
16
Units
kPa
°C
Maximum Pressure (P1 > P2)
Storage Temperature
–30 to +100
0 to +85
Operating Temperature
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
2
Gain Stage #2
and Ground
Reference
Shift
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
VOUT
4
Circuitry
3
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
GND
Figure 1. Fully Integrated Pressure Sensor Schematic
MP3V5004G
Sensors
Freescale Semiconductor
3
Pressure
On-chip Temperature Compensation and Calibration
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 2 illustrates the gauge configuration in the basic
chip carrier (Case 482A). A fluorosilicone gel isolates the die
surface and wire bonds from the environment, while allowing
the pressure signal to be transmitted to the silicon diaphragm.
The MP3V5004G series sensor operating characteristics
are based on the use of dry air as pressure media. Media,
other than dry air, may have adverse effects on sensor
performance and long-term reliability. Internal reliability and
qualification test for dry air, and other media, are available
from the factory. Contact the factory for information regarding
media tolerance in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the MP3V5004G to the A/D input of
the microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 4 shows the sensor output signal relative to
pressure input. Typical, minimum and maximum output
curves are shown for operation over a temperature range of
10°C to 60°C using the decoupling circuit shown in Figure 3
The output will saturate outside of the specified pressure
range.
Fluorosilicone
Die
+3 V
Stainless
Steel Cap
Gel Die Coat
P1
OUTPUT
Vout
Thermoplas-
tic
Wire
Bond
Vs
IPS
Lead
Frame
1.0 μF
GND
470 pF
0.01 μF
P2
Differential Sensing
Element
Die Bond
Figure 2. Cross Sectional Diagram SSOP (not to scale)
Figure 3. Recommended Power Supply Decoupling and
Output Filtering.
(For additional output filtering, please refer to Application
Note AN1646.)
3.0
TRANSFER FUNCTION:
V
out = VS*[(0.2*P) + 0.2] ± 2.5% VFSS
VS = 3.0 V ± 0.30 Vdc
TEMP = 10 to 60°C
2.0
1.0
0.6
Typical
Max
Min
2 kPa
200 mm H2O
4 kPa
400 mm H2O
Figure 4. Output vs. Pressure Differential at ±2.5% VFSS
(See Note 5 in Operating Characteristics table)
MP3V5004G
Sensors
4
Freescale Semiconductor
Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Freescale Semiconductor designates the two sides of the
pressure sensor as the Pressure (P1) side and the Vacuum
(P2) side. The Pressure (P1) side is the side containing
silicone gel which isolates the die from the environment. The
Freescale Semiconductor pressure sensor is designed to
operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
table below.
Part Number
MP3V5004GC6U/T1
MP3V5004GP
Case Type
Pressure (P1) Side Identifier
Side with Port Attached
Side with Port Attached
Side with Part Marking
Stainless Steel Cap
482A
1369
1351
1368
MP3V5004DP
MP3V5004GVP
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGES
Surface mount board layout is a critical portion of the total
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
0.100 TYP 8X
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
inch
0.100 TYP 8X
2.54
mm SCALE 2:1
Figure 5. SOP Footprint
MP3V5004G
Sensors
Freescale Semiconductor
5
Pressure
PACKAGE DIMENSIONS
–A–
D 8 PL
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4
M
S
S
0.25 (0.010)
T
B
A
5
N
–B–
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.
G
INCHES
MILLIMETERS
8
1
DIM
A
B
C
D
MIN
MAX
0.425
0.425
0.520
0.042
MIN
10.54
10.54
12.70
0.96
MAX
10.79
10.79
13.21
1.07
0.415
0.415
0.500
0.038
S
W
G
H
J
K
M
N
S
V
W
0.100 BSC
2.54 BSC
0.002
0.009
0.061
0
0.010
0.011
0.071
7
0.448
0.725
0.255
0.125
0.05
0.23
1.55
0
0.25
0.28
1.80
7
11.38
18.41
6.48
3.17
V
0.444
0.709
0.245
0.115
11.28
18.01
6.22
2.92
C
H
J
–T–
SEATING
PLANE
PIN 1 IDENTIFIER
M
K
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
MP3V5004G
Sensors
Freescale Semiconductor
6
Pressure
PACKAGE DIMENSIONS
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MP3V5004G
Sensors
Freescale Semiconductor
7
Pressure
PACKAGE DIMENSIONS
CASE 1351-01
ISSUE A
SMALL OUTLINE PACKAGE
MP3V5004G
Sensors
8
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1368-01
ISSUE C
SMALL OUTLINE PACKAGE
MP3V5004G
Sensors
Freescale Semiconductor
9
Pressure
PACKAGE DIMENSIONS
CASE 1368-01
ISSUE C
SMALL OUTLINE PACKAGE
MP3V5004G
10
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1368-01
ISSUE C
SMALL OUTLINE PACKAGE
MP3V5004G
Sensors
Freescale Semiconductor
11
Pressure
PACKAGE DIMENSIONS
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MP3V5004G
12
Sensors
Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
CASE 1369-01
ISSUE B
SMALL OUTLINE PACKAGE
MP3V5004G
Sensors
Freescale Semiconductor
13
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MP3V5004G
Rev. 2
06/2010
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