ACT108-600E [NXP]

AC Thyristor power switch; AC晶闸管电源开关
ACT108-600E
型号: ACT108-600E
厂家: NXP    NXP
描述:

AC Thyristor power switch
AC晶闸管电源开关

开关 电源开关
文件: 总12页 (文件大小:321K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ACT108-600E  
AC Thyristor power switch  
Rev. 02 — 21 October 2009  
Product data sheet  
1. Product profile  
1.1 General description  
AC Thyristor power switch in a SOT54 plastic package with self-protective capabilities  
against low and high energy transients  
1.2 Features and benefits  
„ Exclusive negative gate triggering  
„ Full cycle AC conduction  
„ Safe clamping of low energy  
over-voltage transients  
„ Self-protective turn-on during high  
„ Remote gate separates the gate driver  
energy voltage transients  
from the effects of the load current  
„ Very high noise immunity  
1.3 Applications  
„ Fan motor circuits  
„ Pump motor circuits  
„ Lower-power highly inductive, resistive  
and safety loads  
1.4 Quick reference data  
Table 1.  
Quick reference  
Symbol Parameter  
Conditions  
Min  
Typ  
Max Unit  
VDRM  
IGT  
repetitive peak  
off-state voltage  
-
-
600  
V
gate trigger current  
VD = 12 V; IT = 100 mA;  
LD+G-; Tj = 25 °C;  
see Figure 6  
1
-
10  
mA  
VD = 12 V; IT = 100 mA;  
LD- G-; Tj = 25 °C  
1
-
-
-
10  
0.8  
-
mA  
A
IT(RMS)  
dVD/dt  
RMS on-state  
current  
full sine wave; Tlead 71 °C;  
see Figure 1  
-
rate of rise of  
VDM = 402 V; Tj = 125 °C;  
gate open circuit;  
see Figure 10  
1000  
V/µs  
off-state voltage  
VCL  
VPP  
VT  
clamping voltage  
peak pulse voltage  
on-state voltage  
ICL = 100 mA; tp = 1 ms;  
Tj 125 °C; see Figure 13  
650  
-
-
-
-
V
Tj = 25 °C; non-repetitive,  
off-state; see Figure 4  
-
-
2
kV  
V
IT = 1.1 A; see Figure 9  
1.3  
ACT108-600E  
NXP Semiconductors  
AC Thyristor power switch  
2. Pinning information  
Table 2.  
Pinning information  
Pin  
1
Symbol Description  
Simplified outline  
Graphic symbol  
CM  
G
common  
gate  
LD  
2
3
LD  
load  
G
CM  
001aaj924  
3 2 1  
SOT54 (TO-92)  
3. Ordering information  
Table 3.  
Ordering information  
Type number  
Package  
Name  
Description  
plastic single-ended leaded (through hole) package; 3 leads  
Version  
ACT108-600E  
TO-92  
SOT54  
4. Limiting values  
Table 4.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
Parameter  
Conditions  
Min  
Max  
Unit  
VDRM  
repetitive peak off-state  
voltage  
-
600  
V
IT(RMS)  
ITSM  
RMS on-state current  
full sine wave; Tlead 71 °C; see Figure 1  
-
-
-
0.8  
8.8  
8
A
A
A
non-repetitive peak  
on-state current  
full sine wave; Tj(init) = 25 °C; tp = 16.7 ms  
full sine wave; Tj(init) = 25 °C; tp = 20 ms;  
see Figure 2 and 3  
I2t  
I2t for fusing  
tp = 10 ms; sine-wave pulse  
-
-
0.32  
100  
A2s  
dIT/dt  
rate of rise of on-state IT = 1 A; IG = 20 mA; dIG/dt = 0.2 A/µs  
current  
A/µs  
IGM  
peak gate current  
peak gate voltage  
average gate power  
storage temperature  
junction temperature  
peak pulse voltage  
t = 20 μs  
-
1
A
VGM  
PG(AV)  
Tstg  
Tj  
positive applied gate voltage  
over any 20 ms period  
-
15  
0.1  
150  
125  
2
V
-
W
°C  
°C  
kV  
-40  
-
-
VPP  
Tj = 25 °C; non-repetitive, off-state; see Figure 4  
ACT108-600E_2  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 02 — 21 October 2009  
2 of 12  
ACT108-600E  
NXP Semiconductors  
AC Thyristor power switch  
003aac803  
1.0  
P
(W)  
tot  
α = 180°  
α
0.8  
α
0.6  
0.4  
0.2  
0
0
0.1  
0.2  
0.3  
0.4  
0.5  
0.6  
0.7  
0.8  
I
(A)  
T(RMS)  
Fig 1. Total power dissipation as a function of RMS on-state current; maximum values  
003aac804  
10  
I
TSM  
(A)  
8
6
4
2
0
I
I
TSM  
T
t
1/f  
T
= 25 °C max  
j(init)  
2
3
1
10  
10  
10  
number of cycles  
Fig 2. Non-repetitive peak on-state current as a function of the number of sinusoidal current cycles; maximum  
values  
ACT108-600E_2  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 02 — 21 October 2009  
3 of 12  
ACT108-600E  
NXP Semiconductors  
AC Thyristor power switch  
003aac805  
103  
I
I
T
TSM  
t
ITSM  
(A)  
t
p
102  
T
j(init)  
= 25 °C max  
10  
1
105  
104  
103  
102  
tp (s)  
Fig 3. Non-repetitive peak on-state current as a function of pulse width; maximum values  
IEC 61000-4-5 Standards  
Surge Generator  
Open Circuit Voltage  
1.2 μs/50 μs waveform  
R
R
L
Gen  
5 μH  
2 Ω  
150 Ω  
R
G
DUT  
Load Model  
Surge pulse  
220 Ω  
003aad077  
Fig 4. Test circuit for inductive and resistive loads with conditions equivalent to IEC 61000-4-5  
ACT108-600E_2  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 02 — 21 October 2009  
4 of 12  
ACT108-600E  
NXP Semiconductors  
AC Thyristor power switch  
5. Thermal characteristics  
Table 5.  
Symbol  
Rth(j-lead)  
Thermal characteristics  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
thermal resistance from full cycle with heatsink compound;  
junction to lead see Figure 5  
-
-
60  
K/W  
Rth(j-a)  
thermal resistance from full cycle; printed-circuit board mounted;  
-
150  
-
K/W  
junction to ambient  
lead length 4 mm  
003aad294  
2
10  
Z
th(j-lead)  
(K/W)  
10  
1
P
1  
10  
t
t
p
2  
10  
5  
4  
3  
2  
10  
1  
10  
10  
10  
1
10  
10  
t
p
(s)  
Fig 5. Transient thermal impedance from junction to lead as a function of pulse width  
ACT108-600E_2  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 02 — 21 October 2009  
5 of 12  
ACT108-600E  
NXP Semiconductors  
AC Thyristor power switch  
6. Characteristics  
Table 6.  
Symbol  
IGT  
Characteristics  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
gate trigger current  
VD = 12 V; IT = 100 mA; LD+ G-;  
Tj = 25 °C; see Figure 6  
1
-
10  
mA  
VD = 12 V; IT = 100 mA; LD- G-; Tj = 25 °C  
1
-
-
-
10  
30  
mA  
mA  
IL  
latching current  
VD = 12 V; IG = 12 mA; Tj = 25 °C;  
see Figure 7  
IH  
holding current  
VD = 12 V; Tj = 25 °C; see Figure 8  
IT = 1.1 A; see Figure 9  
-
9
-
-
-
-
-
-
25  
1.3  
-
mA  
V
VT  
VGT  
on-state voltage  
gate trigger voltage  
-
VD = 600 V; IT = 100 mA; Tj 125 °C  
VD = 600 V; IT = 100 mA; Tj = 25 °C  
VD = 600 V; Tj 125 °C  
0.15  
V
-
1
V
ID  
off-state current  
-
0.2  
2
mA  
µA  
V/µs  
VD = 600 V; Tj 25 °C  
-
dVD/dt  
rate of rise of off-state VDM = 402 V; Tj = 125 °C; gate open  
1000  
-
voltage  
circuit; see Figure 10  
dIcom/dt  
rate of change of  
commutating current  
VD = 400 V; Tj = 125 °C; IT(RMS) = 1 A;  
dVcom/dt = 15 V/µs; gate open circuit;  
see Figure 11 and 12  
0.3  
-
-
-
-
A/ms  
V
VCL  
clamping voltage  
ICL = 100 mA; tp = 1 ms; Tj 125 °C;  
650  
see Figure 13  
003aac811  
003aac809  
3
3
I
L
I
GT  
(1)  
I
I
L(25°C)  
GT(25°C)  
2
2
(2)  
1
1
(2)  
(1)  
0
50  
0
50  
0
50  
100  
150  
50  
0
150  
100  
T (°C)  
T (°C)  
j
j
Fig 7. Normalized latching current as a function of  
junction temperature  
Fig 6. Normalized gate trigger current as a function of  
junction temperature  
ACT108-600E_2  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 02 — 21 October 2009  
6 of 12  
ACT108-600E  
NXP Semiconductors  
AC Thyristor power switch  
003aac810  
003aac812  
3
2.0  
IT  
(A)  
I
H
I
H(25°C)  
1.5  
2
1.0  
0.5  
0.0  
(1)  
(2)  
(3)  
1
0
50  
0.0  
0.5  
1.0  
1.5  
2.0  
0
50  
100  
150  
V
T (V)  
T (°C)  
j
Fig 8. Normalized holding current as a function of  
junction temperature  
Fig 9. On-state current as a function of on-state  
voltage  
003aac813  
003aac814  
12  
12  
A
B
A
B
10  
8
6
8
4
0
4
2
0
25  
50  
75  
100  
125  
25  
50  
75  
100  
125  
T (°C)  
j
T (°C)  
j
Fig 11. Normalized critical rate of rise of commutating  
current as a function of junction temperature  
Fig 10. Normalized rate of rise of off-state voltage as a  
function of junction temperature  
ACT108-600E_2  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 02 — 21 October 2009  
7 of 12  
ACT108-600E  
NXP Semiconductors  
AC Thyristor power switch  
003aac815  
003aac817  
1.2  
2.0  
A [B]  
V
CL  
A [spec]  
V
CL(25°C)  
1.5  
1.0  
0.5  
0.8  
0.4  
0
0
50  
1  
2
10  
1
10  
10  
0
50  
100  
150  
B (V/μs)  
T (°C)  
j
Fig 13. Normalized clamping voltage (upper limit) as a  
function of junction temperature; minimum  
values  
Fig 12. Normalized critical rate of change of  
commutating current as a function of critical  
rate of change of commutating voltage;  
minimum values  
ACT108-600E_2  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 02 — 21 October 2009  
8 of 12  
ACT108-600E  
NXP Semiconductors  
AC Thyristor power switch  
7. Package outline  
Plastic single-ended leaded (through hole) package; 3 leads  
SOT54  
c
E
d
A
L
b
1
2
e
1
e
D
3
b
1
L
1
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
(1)  
L
1
UNIT  
A
b
b
c
D
d
E
e
e
L
1
1
max.  
5.2  
5.0  
0.48  
0.40  
0.66  
0.55  
0.45  
0.38  
4.8  
4.4  
1.7  
1.4  
4.2  
3.6  
14.5  
12.7  
mm  
2.54  
1.27  
2.5  
Note  
1. Terminal dimensions within this zone are uncontrolled to allow for flow of plastic and terminal irregularities.  
REFERENCES  
OUTLINE  
EUROPEAN  
ISSUE DATE  
PROJECTION  
VERSION  
IEC  
JEDEC  
JEITA  
04-06-28  
04-11-16  
SOT54  
TO-92  
SC-43A  
Fig 14. Package outline SOT54 (TO-92)  
ACT108-600E_2  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 02 — 21 October 2009  
9 of 12  
ACT108-600E  
NXP Semiconductors  
AC Thyristor power switch  
8. Revision history  
Table 7.  
Revision history  
Document ID  
Release date  
Data sheet status  
Change notice  
Supersedes  
ACT108-600E_2  
Modifications:  
20091021  
Product data sheet  
-
ACT108-600E_1  
Various changes to content.  
20090901 Product data sheet  
ACT108-600E_1  
-
-
ACT108-600E_2  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 02 — 21 October 2009  
10 of 12  
ACT108-600E  
NXP Semiconductors  
AC Thyristor power switch  
9. Legal information  
9.1 Data sheet status  
Document status [1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term 'short data sheet' is explained in section "Definitions".  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product  
status information is available on the Internet at URL http://www.nxp.com.  
Applications — Applications that are described herein for any of these  
9.2 Definitions  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) may cause permanent  
damage to the device. Limiting values are stress ratings only and operation of  
the device at these or any other conditions above those given in the  
Characteristics sections of this document is not implied. Exposure to limiting  
values for extended periods may affect device reliability.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Terms and conditions of sale — NXP Semiconductors products are sold  
subject to the general terms and conditions of commercial sale, as published  
at http://www.nxp.com/profile/terms, including those pertaining to warranty,  
intellectual property rights infringement and limitation of liability, unless  
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of  
any inconsistency or conflict between information in this document and such  
terms and conditions, the latter will prevail.  
9.3 Disclaimers  
General — Information in this document is believed to be accurate and  
reliable. However, NXP Semiconductors does not give any representations or  
warranties, expressed or implied, as to the accuracy or completeness of such  
information and shall have no liability for the consequences of use of such  
information.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
Export control — This document as well as the item(s) described herein may  
be subject to export control regulations. Export might require a prior  
authorization from national authorities.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in medical, military, aircraft,  
space or life support equipment, nor in applications where failure or  
malfunction of an NXP Semiconductors product can reasonably be expected  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
9.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
10. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
ACT108-600E_2  
© NXP B.V. 2009. All rights reserved.  
Product data sheet  
Rev. 02 — 21 October 2009  
11 of 12  
ACT108-600E  
NXP Semiconductors  
AC Thyristor power switch  
11. Contents  
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . .1  
1.1  
1.2  
1.3  
1.4  
General description . . . . . . . . . . . . . . . . . . . . . .1  
Features and benefits. . . . . . . . . . . . . . . . . . . . .1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . .1  
Quick reference data . . . . . . . . . . . . . . . . . . . . .1  
2
3
4
5
6
7
8
Pinning information. . . . . . . . . . . . . . . . . . . . . . .2  
Ordering information. . . . . . . . . . . . . . . . . . . . . .2  
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . .2  
Thermal characteristics . . . . . . . . . . . . . . . . . . .5  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . .6  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . .9  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . .10  
9
Legal information. . . . . . . . . . . . . . . . . . . . . . . .11  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . .11  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . .11  
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . .11  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . .11  
9.1  
9.2  
9.3  
9.4  
10  
Contact information. . . . . . . . . . . . . . . . . . . . . .11  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2009.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 21 October 2009  
Document identifier: ACT108-600E_2  

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