BAT74,215 [NXP]
BAT74 - Schottky barrier double diode SOT-143 4-Pin;
| 型号： | BAT74,215 |
| 厂家： | 
NXP |
| 描述： | BAT74 - Schottky barrier double diode SOT-143 4-Pin 光电二极管 |
| 文件： | 总10页 (文件大小：98K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
BAT74
Schottky barrier double diode
Rev. 03 — 19 April 2010
Product data sheet
1. Product profile
1.1 General description
Planar Schottky barrier double diode with an integrated guard ring for stress protection.
Two electrically isolated Schottky barrier diodes, encapsulated in a small SOT143B
Surface-Mounted Device (SMD) plastic package.
1.2 Features and benefits
Low forward voltage
Guard-ring protected
Small SMD plastic package
1.3 Applications
Ultra high-speed switching
Voltage clamping
Protection circuits
Blocking diodes
1.4 Quick reference data
Table 1.
Symbol
Per diode
IF
Quick reference data
Parameter
Conditions
Min
Typ
Max
Unit
forward current
reverse voltage
forward voltage
-
-
-
-
-
-
200
30
mA
V
VR
VF
IF = 100 mA
800
mV
2. Pinning information
Table 2.
Pinning
Pin
1
Description
Simplified outline
Graphic symbol
cathode (diode 1)
cathode (diode 2)
anode (diode 2)
anode (diode 1)
4
3
4
3
2
3
4
1
2
1
2
006aaa434
BAT74
NXP Semiconductors
Schottky barrier double diode
3. Ordering information
Table 3.
Ordering information
Type number Package
Name
Description
Version
BAT74
-
plastic surface-mounted package; 4 leads
SOT143B
4. Marking
Table 4.
Marking codes
Type number
Marking code[1]
BAT74
*L4
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Per diode
Conditions
Min
Max
Unit
VR
IF
reverse voltage
-
-
-
30
V
forward current
200
300
mA
mA
IFRM
repetitive peak forward
current
tp ≤ 1 s; δ ≤ 0.5
IFSM
non-repetitive peak forward tp < 10 ms
current
-
600
mA
Ptot
Tj
total power dissipation
junction temperature
ambient temperature
storage temperature
Tamb ≤ 25 °C
-
230
mW
°C
-
125
Tamb
Tstg
−65
−65
+125
+150
°C
°C
Double diode operation
VR
reverse voltage
-
-
-
-
30
V
[1]
[2]
60
V
IF
forward current
110
200
mA
mA
IFRM
repetitive peak forward
current
tp ≤ 1 s; δ ≤ 0.5
[1] Series connection.
[2] If both diodes are in forward operation at the same moment, total device current is max. 110 mA. If one
diode is in reverse operation and the other is in forward operation at the same moment, total device current
is max. 200 mA.
BAT74_3
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 — 19 April 2010
2 of 10
BAT74
NXP Semiconductors
Schottky barrier double diode
6. Thermal characteristics
Table 6.
Symbol
Rth(j-a)
Thermal characteristics
Parameter
Conditions
Min
Typ
Max Unit
[1]
thermal resistance from
junction to ambient
in free air
-
-
500
K/W
[1] Refer to SOT143B standard mounting conditions.
7. Characteristics
Table 7.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter
Per diode
Conditions
Min
Typ
Max
Unit
VF
forward voltage
IF = 0.1 mA
IF = 1 mA
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
240
320
400
500
800
2
mV
mV
mV
mV
mV
μA
[1]
IF = 10 mA
IF = 30 mA
IF = 100 mA
VR = 25 V
[2]
[3]
IR
reverse current
Cd
trr
diode capacitance VR = 1 V; f = 1 MHz
10
pF
reverse recovery
time
5
ns
[1] Temperature coefficient of forward voltage −0.6 %/K.
[2] Pulse test: tp = 300 μs; δ = 0.02.
[3] When switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA.
BAT74_3
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 — 19 April 2010
3 of 10
BAT74
NXP Semiconductors
Schottky barrier double diode
msa893
msa892
3
3
10
10
I
(1)
I
R
F
(1) (2) (3)
(μA)
(mA)
2
2
10
10
(2)
10
10
(1)
(2) (3)
1
1
(3)
−1
−1
0
10
10
10
20
30
0
0.4
0.8
1.2
V
R
(V)
V
F
(V)
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
(1) Tamb = 125 °C
(2) Tamb = 85 °C
(3) Tamb = 25 °C
Fig 1. Forward current as a function of forward
voltage; typical values
Fig 2. Reverse current as a function of reverse
voltage; typical values
msa891
msa894
15
300
C
(pF)
P
tot
(mW)
d
10
200
5
0
100
0
0
10
20
30
0
75
150
V
(V)
T
amb
(°C)
R
f = 1 MHz; Tamb = 25 °C
Standard footprint
Fig 3. Diode capacitance as a function of reverse
voltage; typical values
Fig 4. Power derating curve
BAT74_3
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 — 19 April 2010
4 of 10
BAT74
NXP Semiconductors
Schottky barrier double diode
8. Test information
t
r
t
p
t
D.U.T.
10 %
I
F
+ I
F
t
rr
R
S
= 50 Ω
SAMPLING
OSCILLOSCOPE
t
R
= 50 Ω
V = V + I × R
S
i
R
F
(1)
90 %
V
R
mga881
input signal
output signal
(1)
IR = 1 mA
Fig 5. Reverse recovery time test circuit and waveforms
9. Package outline
3.0
2.8
1.1
0.9
1.9
4
3
0.45
0.15
2.5 1.4
2.1 1.2
1
2
0.88
0.78
0.48
0.38
0.15
0.09
1.7
Dimensions in mm
04-11-16
Fig 6. Package outline BAT74 (SOT143B)
10. Packing information
Table 8.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
3000
10000
BAT74
SOT143B
4 mm pitch, 8 mm tape and reel
-215
-235
[1] For further information and the availability of packing methods, see Section 14.
BAT74_3
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 — 19 April 2010
5 of 10
BAT74
NXP Semiconductors
Schottky barrier double diode
11. Soldering
3.25
1.9
0.6
(3×)
0.5
(3×)
solder lands
solder resist
0.7 0.6
(3×) (3×)
2
solder paste
occupied area
3
0.7 0.6
Dimensions in mm
0.75
0.95
0.9
1
sot143b_fr
Fig 7. Reflow soldering footprint BAT74 (SOT143B)
4.45
2.2
1.2
(3×)
1.425
(3×)
solder lands
solder resist
2.575
4.6
occupied area
Dimensions in mm
1.425
preferred transport direction during soldering
1
1.2
sot143b_fw
Fig 8. Wave soldering footprint BAT74 (SOT143B)
BAT74_3
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 — 19 April 2010
6 of 10
BAT74
NXP Semiconductors
Schottky barrier double diode
12. Revision history
Table 9.
Revision history
Document ID
BAT74_3
Release date
Data sheet status
Change notice
Supersedes
20100419
Product data sheet
-
BAT74_2
Modifications:
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Section 1.1 “General description”: amended
• Table 1 “Quick reference data”: added
• Section 4 “Marking”: updated
• Section 8 “Test information”: added
• Figure 5: enhanced
• Figure 6: superseded by minimized package outline drawing
• Section 10 “Packing information”: added
• Section 11 “Soldering”: added
• Section 13 “Legal information”: updated
BAT74_2
BAT74_1
20010905
Product specification
-
-
BAT74_1
-
19960319
Product specification
BAT74_3
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 — 19 April 2010
7 of 10
BAT74
NXP Semiconductors
Schottky barrier double diode
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
13.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
13.3 Disclaimers
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
BAT74_3
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 — 19 April 2010
8 of 10
BAT74
NXP Semiconductors
Schottky barrier double diode
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
BAT74_3
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 03 — 19 April 2010
9 of 10
BAT74
NXP Semiconductors
Schottky barrier double diode
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
Packing information . . . . . . . . . . . . . . . . . . . . . 5
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
3
4
5
6
7
8
9
10
11
12
13
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 8
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 8
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
13.1
13.2
13.3
13.4
14
15
Contact information. . . . . . . . . . . . . . . . . . . . . . 9
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 19 April 2010
Document identifier: BAT74_3
相关型号：
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