BGA2003T/R [NXP]
RF/Microwave Amplifier, 900 MHz - 1800 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER, PLASTIC, SOT-343R, 4 PIN;
| 型号： | BGA2003T/R |
| 厂家： | 
NXP |
| 描述： | RF/Microwave Amplifier, 900 MHz - 1800 MHz RF/MICROWAVE WIDE BAND LOW POWER AMPLIFIER, PLASTIC, SOT-343R, 4 PIN 放大器 射频 微波 功率放大器 |
| 文件： | 总13页 (文件大小：123K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
BGA2003
Silicon MMIC amplifier
Product specification
2010 Sep 13
Supersedes data of 1999 Jul 23
NXP Semiconductors
Product specification
Silicon MMIC amplifier
BGA2003
FEATURES
PINNING
• Low current
PIN
1
DESCRIPTION
• Very high power gain
GND
RF in
• Low noise figure
2
• Integrated temperature compensated biasing
• Control pin for adjustment bias current
• Supply and RF output pin combined.
3
CTRL (bias current control)
VS + RF out
4
APPLICATIONS
V +RFout
S
handbook, halfpage
CTRL
3
4
• RF front end
• Wideband applications, e.g. analog and digital cellular
telephones, cordless telephones (PHS, DECT, etc.)
BIAS
CIRCUIT
• Low noise amplifiers
2
1
RFin
GND
• Satellite television tuners (SATV)
• High frequency oscillators.
Top view
MAM427
Marking code: A3*
* = - : made in Hong Kong
* = p : made in Hong Kong
* = t : made in Malaysia
DESCRIPTION
Silicon MMIC amplifier consisting of an NPN double
polysilicon transistor with integrated biasing for low voltage
applications in a plastic, 4-pin SOT343R package.
Fig.1 Simplified outline (SOT343R) and symbol.
QUICK REFERENCE DATA
SYMBOL
VS
PARAMETER
DC supply voltage
DC supply current
CONDITIONS
RF input AC coupled
TYP.
MAX.
4.5
UNIT
−
V
IS
VVS-OUT = 2.5 V; ICTRL = 1 mA;
RF input AC coupled
11
−
−
−
mA
dB
dB
MSG
NF
maximum stable gain
noise figure
VVS-OUT = 2.5 V; f = 1800 MHz;
16
T
amb = 25 °C
VVS-OUT = 2.5 V; f = 1800 MHz; ΓS = Γopt
1.8
2010 Sep 13
2
NXP Semiconductors
Product specification
Silicon MMIC amplifier
BGA2003
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VS
VCTRL
IS
PARAMETER
supply voltage
CONDITIONS
RF input AC coupled
MIN.
MAX.
4.5
UNIT
−
−
−
V
V
voltage on control pin
supply current (DC)
2
forced by DC voltage on RF input
or ICTRL
30
mA
ICTRL
Ptot
Tstg
Tj
control current
−
−
3
mA
mW
°C
total power dissipation
storage temperature
operating junction temperature
Ts ≤ 100 °C
135
+150
150
−65
−
°C
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
VALUE
UNIT
Rth j-s
thermal resistance from junction to soldering point
350
K/W
CHARACTERISTICS
RF input AC coupled; Tj = 25 °C; unless otherwise specified.
SYMBOL
IS
PARAMETER
supply current
CONDITIONS
MIN.
TYP. MAX. UNIT
VVS-OUT = 2.5 V; ICTRL = 0.4 mA
VVS-OUT = 2.5 V; ICTRL = 1.0 mA
3
8
−
4.5
11
6
mA
mA
dB
15
−
MSG
maximum stable gain
insertion power gain
isolation
VVS-OUT = 2.5 V; IVS-OUT = 10 mA;
f = 900 MHz
24
V
VS-OUT = 2.5 V; IVS-OUT = 10 mA;
f = 1800 MHz
−
16
−
−
−
−
−
2
2
−
−
dB
2
VVS-OUT = 2.5 V; IVS-OUT = 10 mA;
f = 900 MHz
18
13
−
19
dB
|s21
s12
NF
|
V
VS-OUT = 2.5 V; IVS-OUT = 10 mA;
f = 1800 MHz
14
dB
VVS-OUT = 2.5 V; IVS-OUT = 0;
f = 900 MHz
26
dB
V
VS-OUT = 2.5 V; IVS-OUT = 0;
f = 1800 MHz
−
20
dB
noise figure
VVS-OUT = 2.5 V; IVS-OUT = 10 mA;
f = 900 MHz; ΓS = Γopt
−
1.8
1.8
−6.5
−4.8
dB
VVS-OUT = 2.5 V; IVS-OUT = 10 mA;
f = 1800 MHz; ΓS = Γopt
−
dB
IP3(in)
input intercept point; note 1
VVS-OUT = 2.3 V; IVS-OUT = 3.6 mA;
f = 900 MHz
−
dBm
dBm
VVS-OUT = 2.3 V; IVS-OUT = 3.5 mA;
f = 1800 MHz
−
Note
1. See application note RNR-T45-99-B-0514.
2010 Sep 13
3
NXP Semiconductors
Product specification
Silicon MMIC amplifier
BGA2003
MGS537
200
handbook, halfpage
P
tot
(mW)
100 pF
handbook, halfpage
R1
C
V
S
150
L1
4
RF out
R
CTRL
100
50
V
3
CTRL
BGA2003
2
1
C
0
0
50
100
150
200
RF in
T
(°C)
MGS536
s
Fig.2 Typical application circuit.
Fig.3 Power derating.
MGS538
MGS539
2.5
30
handbook, halfpage
handbook, halfpage
I
CTRL
(mA)
I
VS-OUT
(mA)
2
20
1.5
1
10
0.5
0
0
0
0
0.5
1
1.5
2
0.5
1
1.5
2
2.5
I
(mA)
V
(V)
CTRL
CTRL
ICTRL = (VCTRL − 0.83)/296.
VS-OUT = 2.5 V.
Fig.4 Control current as a function of the control
voltage on pin 3; typical values.
Fig.5 Bias current as a function of the control
current; typical values.
2010 Sep 13
4
NXP Semiconductors
Product specification
Silicon MMIC amplifier
BGA2003
MGS540
MGS541
30
20
handbook, halfpage
handbook, halfpage
(6)
I
VS-OUT
(mA)
25
I
VS-OUT
(mA)
(5)
(4)
(3)
15
20
15
10
5
10
5
(2)
(1)
0
0
0
−40
0
40
80
120
(°C)
1
2
3
4
5
T
V
(V)
amb
VS-OUT
VS-OUT = 2.5 V.
(1) ICTRL = 0.2 mA.
(2) ICTRL = 0.4 mA.
(3) ICTRL = 1.0 mA.
(4) ICTRL = 1.5 mA.
(5) ICTRL = 2.0 mA.
(6) ICTRL = 2.5 mA.
ICTRL = 1 mA.
Fig.6 Bias current (IVS-OUT) as a function of the
ambient temperature with ICTRL as
parameter; typical values.
Fig.7 Bias current (IVS-OUT) as a function of the
voltage at the output pin (VVS-OUT); typical
values.
MGS543
MGS542
30
handbook, halfpage
gain
25
handbook, halfpage
f
T
(dB)
(GHz)
25
20
15
10
5
MSG
G
max
20
G
UM
15
10
5
0
0
0
5
10
15
20
25
0
10
20
I
30
(mA)
I
(mA)
VS-OUT
VS-OUT
VVS-OUT = 2.5 V; f = 1000 MHz.
VVS-OUT = 2.5 V; f = 900 MHz.
Fig.8 Transition frequency as a function of the
bias current (IVS-OUT); typical values.
Fig.9 Gain as a function of the bias current
(IVS-OUT); typical values.
2010 Sep 13
5
NXP Semiconductors
Product specification
Silicon MMIC amplifier
BGA2003
MGS545
MGS544
40
25
handbook, halfpage
handbook, halfpage
gain
(dB)
gain
(dB)
MSG
20
30
20
10
0
G
max
15
G
UM
G
UM
G
max
10
5
0
2
3
4
10
10
10
0
5
10
15
20
25
f (MHz)
I
(mA)
VS-OUT
VVS-OUT = 2.5 V; f = 1800 MHz.
VVS-OUT = 2.5 V; IVS-OUT = 10 mA.
Fig.10 Gain as a function of the bias current
(IVS-OUT); typical values.
Fig.11 Gain as a function of frequency; typical
values.
MGS546
3
min
handbook, halfpage
NF
(dB)
2.5
2
(1)
(3)
(2)
1.5
(4)
1
0.5
0
2
1
10
10
I
(mA)
VS-OUT
(1) f = 2400 MHz.
(2) f = 1800 MHz.
(3) f = 1000 MHz.
(4) f = 900 MHz.
Fig.12 Minimum noise figure as a function of the
bias current (IVS-OUT); typical values.
2010 Sep 13
6
NXP Semiconductors
Product specification
Silicon MMIC amplifier
BGA2003
90°
unstable region
1.0
0.8
0.6
0.4
0.2
0
source
+1
135°
45°
+2
unstable
region load
+0.5
(1)
(2)
+0.2
+5
(3)
Γopt
0.2
0.5
1
2
5
180°
0°
0
(4)
−5
−0.2
(5)
(6)
f = 900 MHz; VVS-OUT = 2.5 V;
VS-OUT = 10 mA; Zo = 50 Ω.
I
(1) G = 23 dB.
(2) G = 22 dB.
(3) G =21 dB.
(4) NF = 1.8 dB.
(5) NF = 2 dB.
(6) NF = 2.2 dB.
−0.5
−2
−45°
−135°
−1
1.0
−90°
MGS547
Fig.13 Noise, stability and gain circles; typical values.
90°
unstable region
source
1.0
unstable
region load
+1
0.8
0.6
0.4
0.2
0
135°
45°
+2
+0.5
(4)
(3)
(2)
(1)
+0.2
+5
0.2
0.5
1
2
5
180°
0°
0
Γopt
f = 1800 MHz; VVS-OUT = 2.5 V;
(5)
I
VS-OUT = 10 mA; Zo = 50 Ω.
−5
−0.2
(6)
(7)
(1) Gmax = 16.1 dB.
(2) G = 16 dB.
(3) G = 15 dB.
(4) G = 14 dB.
(5) NF = 1.9 dB.
(6) NF = 2.1 dB.
(7) NF = 2.3 dB.
−0.5
−2
−45°
−135°
−1
1.0
−90°
MGS548
Fig.14 Noise, stability and gain circles; typical values.
2010 Sep 13
7
NXP Semiconductors
Product specification
Silicon MMIC amplifier
BGA2003
90°
1.0
0.8
0.6
0.4
0.2
0
+1
135
°
45
°
+2
+0.5
+0.2
+5
0.2
0.5
1
2
5
180°
0°
0
1 GHz
100 MHz
2 GHz
3 GHz
200 MHz
500 MHz
−5
−0.2
−135
−0.5
−2
−45°
°
−1
1.0
−90°
MGS549
VVS-OUT = 2.5 V; IVS-OUT = 10 mA; Zo = 50 Ω.
Fig.15 Common emitter input reflection coefficient (s11); typical values.
90°
135°
45°
500 MHz
900 MHz
1 GHz
200 MHz
1.8 GHz
3 GHz
100 MHz
20
16
12
8
4
180°
0°
−135°
−45°
MGS550
−90°
VVS-OUT = 2.5 V; IVS-OUT = 10 mA; Zo = 50 Ω.
Fig.16 Common emitter forward transmission coefficient (s21); typical values.
8
2010 Sep 13
NXP Semiconductors
Product specification
Silicon MMIC amplifier
BGA2003
90°
135°
45°
3 GHz
0.5
0.4
0.3
0.2
0.1
180°
0°
100 MHz
−135°
−45°
MGS551
−90°
VVS-OUT = 2.5 V; IVS-OUT = 10 mA; Zo = 50 Ω.
Fig.17 Common emitter reverse transmission coefficient (s12); typical values.
90°
1.0
0.8
0.6
0.4
0.2
0
+1
135
°
45
°
+2
+0.5
+0.2
+5
0.2
0.5
1
2
5
180°
0°
0
100 MHz
900 MHz
200 MHz
1 GHz
−5
−0.2
−135
500 MHz
3 GHz
1.8 GHz
−0.5
−2
−45°
°
−1
1.0
−90°
MGS552
VVS-OUT = 2.5 V; IVS-OUT = 10 mA; Zo = 50 Ω.
Fig.18 Common emitter output reflection coefficient (s22); typical values.
9
2010 Sep 13
NXP Semiconductors
Product specification
Silicon MMIC amplifier
BGA2003
PACKAGE OUTLINE
Plastic surface-mounted package; reverse pinning; 4 leads
SOT343R
D
B
E
A
X
H
v
M
A
y
E
e
3
4
Q
A
A
1
c
2
1
L
w
M
B
b
b
1
p
p
e
1
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
max
A
UNIT
b
b
c
D
E
e
e
H
E
L
Q
v
w
y
p
p
1
1
0.4
0.3
1.1
0.8
0.7
0.5
0.25
0.10
2.2
1.8
1.35
1.15
2.2
2.0
0.45
0.15
0.23
0.13
mm
0.1
1.15
0.2
0.2
0.1
1.3
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
97-05-21
06-03-16
SOT343R
2010 Sep 13
10
NXP Semiconductors
Product specification
Silicon MMIC amplifier
BGA2003
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Product data sheet
Qualification
Production
This document contains data from the preliminary specification.
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Limited warranty and liability ⎯ Information in this
document is believed to be accurate and reliable.
However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to
the accuracy or completeness of such information and
shall have no liability for the consequences of use of such
information.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
In no event shall NXP Semiconductors be liable for any
indirect, incidental, punitive, special or consequential
damages (including - without limitation - lost profits, lost
savings, business interruption, costs related to the
removal or replacement of any products or rework
charges) whether or not such damages are based on tort
(including negligence), warranty, breach of contract or any
other legal theory.
Customers are responsible for the design and operation of
their applications and products using NXP
Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or
customer product design. It is customer’s sole
responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the
customer’s applications and products planned, as well as
for the planned application and use of customer’s third
party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks
associated with their applications and products.
Notwithstanding any damages that customer might incur
for any reason whatsoever, NXP Semiconductors’
aggregate and cumulative liability towards customer for
the products described herein shall be limited in
accordance with the Terms and conditions of commercial
sale of NXP Semiconductors.
NXP Semiconductors does not accept any liability related
to any default, damage, costs or problem which is based
on any weakness or default in the customer’s applications
or products, or the application or use by customer’s third
party customer(s). Customer is responsible for doing all
necessary testing for the customer’s applications and
products using NXP Semiconductors products in order to
avoid a default of the applications and the products or of
the application or use by customer’s third party
customer(s). NXP does not accept any liability in this
respect.
Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in life support, life-critical or safety-critical systems or
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
2010 Sep 13
11
NXP Semiconductors
Product specification
Silicon MMIC amplifier
BGA2003
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) will cause permanent damage to
the device. Limiting values are stress ratings only and
(proper) operation of the device at these or any other
conditions above those given in the Recommended
operating conditions section (if present) or the
Characteristics sections of this document is not warranted.
Constant or repeated exposure to limiting values will
permanently and irreversibly affect the quality and
reliability of the device.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Non-automotive qualified products ⎯ Unless this data
sheet expressly states that this specific NXP
Semiconductors product is automotive qualified, the
product is not suitable for automotive use. It is neither
qualified nor tested in accordance with automotive testing
or application requirements. NXP Semiconductors accepts
no liability for inclusion and/or use of non-automotive
qualified products in automotive equipment or
applications.
Terms and conditions of commercial sale ⎯ NXP
Semiconductors products are sold subject to the general
terms and conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an
individual agreement is concluded only the terms and
conditions of the respective agreement shall apply. NXP
Semiconductors hereby expressly objects to applying the
customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
In the event that customer uses the product for design-in
and use in automotive applications to automotive
specifications and standards, customer (a) shall use the
product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and
specifications, and (b) whenever customer uses the
product for automotive applications beyond NXP
Semiconductors’ specifications such use shall be solely at
customer’s own risk, and (c) customer fully indemnifies
NXP Semiconductors for any liability, damages or failed
product claims resulting from customer design and use of
the product for automotive applications beyond NXP
Semiconductors’ standard warranty and NXP
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may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Semiconductors’ product specifications.
Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
2010 Sep 13
12
NXP Semiconductors
provides High Performance Mixed Signal and Standard Product
solutions that leverage its leading RF, Analog, Power Management,
Interface, Security and Digital Processing expertise
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal
definitions and disclaimers. No changes were made to the technical content, except for the marking codes
and the package outline drawings which were updated to the latest version.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
© NXP B.V. 2010
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R77/05/pp13
Date of release: 2010 Sep 13
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