BGY205 [NXP]

UHF amplifier module; UHF放大器器模块
BGY205
型号: BGY205
厂家: NXP    NXP
描述:

UHF amplifier module
UHF放大器器模块

放大器
文件: 总11页 (文件大小:66K)
中文:  中文翻译
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DISCRETE SEMICONDUCTORS  
DATA SHEET  
BGY205  
UHF amplifier module  
1996 May 21  
Product specification  
Supersedes data of May 1994  
Philips Semiconductors  
Product specification  
UHF amplifier module  
BGY205  
FEATURES  
PINNING - SOT321B  
PIN  
6 V nominal supply voltage  
DESCRIPTION  
3.5 W pulsed output power  
1
RF input  
Easy control of output power by DC voltage.  
2
VC  
3
4
VS  
APPLICATIONS  
RF output  
ground  
Flange  
Digital cellular radio systems with Time Division Multiple  
Access (TDMA) operation (GSM systems) in the  
880 to 915 MHz frequency range.  
DESCRIPTION  
The BGY205 is a four-stage UHF amplifier module in a  
SOT321B package. The module consists of four NPN  
silicon planar transistor dies mounted together with  
matching and bias circuit components on a metallized  
ceramic substrate.  
1
2
3
4
Top view  
MSA489  
Fig.1 Simplified outline.  
QUICK REFERENCE DATA  
RF performance at Tmb = 25 °C.  
MODE OF  
f
VS  
VC  
PL  
Gp  
η
ZS; ZL  
OPERATION  
(MHz)  
(V)  
(V)  
(W)  
(dB)  
(%)  
()  
Pulsed; δ = 1 : 8  
880 to 915  
6
4  
3.5  
32.5  
40  
50  
1996 May 21  
2
Philips Semiconductors  
Product specification  
UHF amplifier module  
BGY205  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
VS  
PARAMETER  
MIN.  
MAX.  
8.5  
UNIT  
DC supply voltage  
DC control voltage  
input drive power  
load power  
V
V
VC  
4.5  
7
PD  
mW  
W
PL  
4
Tstg  
Tmb  
storage temperature  
40  
30  
+100  
+100  
°C  
operating mounting base temperature  
°C  
CHARACTERISTICS  
ZS = ZL = 50 ; PD = 3 dBm; VS = 6 V; VC 4 V; f = 880 to 915 MHz; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs; unless  
otherwise specified.  
SYMBOL  
PARAMETER  
leakage current  
CONDITIONS  
MIN.  
TYP.  
MAX.  
100  
UNIT  
µA  
IQ  
IC  
VC = 0.5 V  
control current  
load power  
adjust VC for PL = 3.5 W  
VC = 4 V  
500  
µA  
W
PL  
3.5  
32.5  
40  
Gp  
power gain  
adjust VC for PL = 3.5 W  
adjust VC for PL = 3.5 W  
adjust VC for PL = 3.5 W  
adjust VC for PL = 3.5 W  
adjust VC for PL = 3.5 W  
dB  
%
η
efficiency  
45  
H2  
second harmonic  
third harmonic  
input VSWR  
stability  
40  
40  
2 : 1  
60  
dBc  
dBc  
H3  
VSWRin  
PD = 0 to 6 dBm; VS = 5 to 8.5 V;  
VC = 0 to 4 V; PL 3.5 W;  
dBc  
VSWR 6 : 1 through all phases  
isolation  
VC = 0.5 V  
1
36  
dBm  
MHz  
%
control bandwidth  
AM-AM conversion  
R1 = 0; C1 = 0; see Fig.16  
PD with 3% AM; f = 100 kHz;  
PL = 3.5 mW to 3.5 W  
12  
Pn  
noise power  
ruggedness  
PL = 3.5 W; bandwidth = 30 kHz;  
20 MHz above transmitter band  
85  
dBm  
VS = 8.5 V; adjust VC for PL = 3.5 W;  
no degradation  
VSWR 10 : 1 through all phases  
1996 May 21  
3
Philips Semiconductors  
Product specification  
UHF amplifier module  
BGY205  
MBG742  
MBG741  
40  
40  
handbook, halfpage  
P
L
P
L
(dBm)  
(dBm)  
30  
30  
915 MHz  
880 MHz  
20  
880 MHz  
915 MHz  
10  
0
20  
10  
0
10  
20  
20  
15  
10  
5  
0
5
2.5  
2.7  
2.9  
3.1  
3.3  
3.5  
(V)  
V
P
(dBm)  
C
D
ZS = ZL = 50 ; PD = 3 dBm; VS = 6 V;  
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.  
ZS = ZL = 50 ; VS = 6 V; PL = 3.5 mW;  
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.  
Fig.2 Load power as a function of control voltage;  
typical values.  
Fig.3 Load power as a function of drive power;  
typical values.  
MBG740  
MBG739  
12  
50  
handbook, halfpage  
handbook, halfpage  
915 MHz  
η
(%)  
10  
8
40  
890 MHz  
6
30  
20  
10  
880 MHz  
4
915 MHz  
2
0
0
10  
20  
30  
40  
0
1
2
3
4
P
(dBm)  
P
(W)  
L
L
ZS = ZL = 50 ; PD = 3 dBm; VS = 6 V;  
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.  
ZS = ZL = 50 ; PD = 3 dBm; VS = 6 V; Tmb = 25 °C;  
δ = 1 : 8; tp = 575 µs; input amplitude modulation = 3%.  
Fig.4 Output amplitude modulation as a  
Fig.5 Efficiency as a function of load power;  
typical values.  
function of load power; typical values.  
1996 May 21  
4
Philips Semiconductors  
Product specification  
UHF amplifier module  
BGY205  
MBG735  
MBG736  
5
5
handbook, halfpage  
handbook, halfpage  
V
P
C
L
(V)  
4
(W)  
4
3
2
3
2
1
1
0
0
880  
890  
900  
910  
920  
880  
890  
900  
910  
920  
f (MHz)  
f (MHz)  
ZS = ZL = 50 ; PD = 3 dBm; VS = 6 V;  
ZS = ZL = 50 ; PD = 3 dBm; VS = 6 V;  
PL = 3.5 W; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.  
VC = 4 V; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.  
Fig.6 Load power as a function of frequency;  
typical values.  
Fig.7 Control voltage as a function of  
frequency; typical values.  
MBG738  
MBG734  
30  
10  
handbook, halfpage  
H
, H  
2
3
phase  
(deg)  
(dBc)  
40  
10  
30  
50  
70  
H
H
2
3
50  
60  
70  
80  
880  
890  
900  
910  
920  
0
1
2
3
f (MHz)  
f (MHz)  
ZS = ZL = 50 ; PD = 3 dBm; VS = 6 V;  
ZS = ZL= 50 ; PD = 3 dBm; VS = 6 V; PL = 15 to 35.4 dBm;  
PL = 3.5 W; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.  
f = 880 to 915 MHz; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs; R1 = 0; C1 = 0.  
Fig.8 Harmonics as a function of  
frequency; typical values.  
Fig.9 Control loop phase as a function of  
frequency on the control pin; typical values.  
1996 May 21  
5
Philips Semiconductors  
Product specification  
UHF amplifier module  
BGY205  
MBG730  
MBG731  
25  
25  
handbook, halfpage  
handbook, halfpage  
G
v
G
v
20  
20  
915 MHz  
915 MHz  
15  
10  
15  
10  
880 MHz  
880 MHz  
5
0
5
0
0
0
1
2
3
4
1
2
3
4
f (MHz)  
f (MHz)  
PL = 25 dBm.  
PL = 30 dBm.  
ZS = ZL = 50 ; PD = 3 dBm; VS = 6 V;  
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs; R1 = 0; C1 = 0.  
ZS = ZL = 50 ; PD = 3 dBm; VS = 6 V;  
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs; R1 = 0; C1 = 0.  
Fig.10 Control loop voltage gain as a function of  
frequency on the control pin; typical values.  
Fig.11 Control loop voltage gain as a function of  
frequency on the control pin; typical values.  
MBG729  
MBG728  
25  
25  
handbook, halfpage  
handbook, halfpage  
G
v
G
v
20  
20  
915 MHz  
15  
15  
915 MHz  
880 MHz  
10  
10  
880 MHz  
5
0
5
0
0
1
2
3
4
0
1
2
3
4
f (MHz)  
f (MHz)  
PL = 20 dBm.  
PL = 15 dBm.  
ZS = ZL = 50 ; PD = 3 dBm; VS = 6 V;  
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs; R1 = 0; C1 = 0.  
ZS = ZL = 50 ; PD = 3 dBm; VS = 6 V;  
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs; R1 = 0; C1 = 0.  
Fig.12 Control loop voltage gain as a function of  
frequency on the control pin; typical values.  
Fig.13 Control loop voltage gain as a function of  
frequency on the control pin; typical values.  
1996 May 21  
6
Philips Semiconductors  
Product specification  
UHF amplifier module  
BGY205  
MBG732  
MBG733  
4
4
handbook, halfpage  
handbook, halfpage  
V
C
(V)  
V
C
(V)  
3.5  
3.5  
P
= 35.4 dBm  
L
P
= 35.4 dBm  
L
3
2.5  
2
3
30 dBm  
20 dBm  
10 dBm  
30 dBm  
20 dBm  
10 dBm  
2.5  
2
40  
o
o
40  
0
40  
80  
0
40  
80  
T
( C)  
T
( C)  
mb  
mb  
f = 880 MHz.  
f = 915 MHz.  
ZS = ZL = 50 ; PD = 3 dBm; VS = 6 V; δ = 1 : 8; tp = 575 µs.  
ZS = ZL = 50 ; PD = 3 dBm; VS = 6 V; δ = 1 : 8; tp = 575 µs.  
Fig.14 Control voltage as a function of mounting  
base temperature; typical values.  
Fig.15 Control voltage as a function of mounting  
base temperature; typical values.  
C2  
C1  
R1  
L1  
Z
Z
2
1
C3  
C4  
typ.  
1.35 A  
RF  
input  
V
V
RF  
output  
C
S
MBG743  
Fig.16 Test circuit.  
7
1996 May 21  
Philips Semiconductors  
Product specification  
UHF amplifier module  
BGY205  
90  
1
2
3
4
50 Ω  
input  
50 Ω  
output  
60  
MSA915  
V
V
S
C
Dimensions in mm.  
Fig.17 Printed-circuit board layout.  
List of components (see Fig.16)  
COMPONENT  
DESCRIPTION  
multilayer ceramic chip capacitor  
VALUE  
DIMENSIONS  
CATALOGUE NO.  
C1, C2  
C3  
680 pF  
2222 851 11681  
tantalum capacitor  
electrolytic capacitor  
Grade 4S2 Ferroxcube bead  
stripline; note 1  
2.2 µF; 35 V  
47 µF; 40 V  
C4  
2222 030 37479  
4330 030 36300  
width = 2.33 mm −  
L1  
Z1, Z2  
R1  
50 Ω  
metal film resistor  
100 ; 0.6 W  
2322 156 11001  
Note  
1. The striplines are on a double copper-clad printed-circuit board with PTFE fibreglass dielectric (εr = 2.2); thickness  
1
32 inch.  
1996 May 21  
8
Philips Semiconductors  
Product specification  
UHF amplifier module  
BGY205  
SOLDERING  
The indicated temperatures are those at the solder  
interfaces.  
MLB740  
300  
handbook, halfpage  
Advised solder types are types with a liquidus less than or  
equal to 210 °C.  
T
mb  
o
( C)  
Solder dots or solder prints must be large enough to wet  
the contact areas.  
200  
100  
Footprints for soldering should cover the module contact  
area +0.1 mm on all sides.  
Soldering can be carried out using a conveyor oven, a hot  
air oven, an infrared oven or a combination of these ovens.  
Hand soldering must be avoided because the soldering  
iron tip can exceed the maximum permitted temperature of  
250 °C and damage the module.  
0
0
100  
200  
300  
400  
t (s)  
The maximum temperature profile and soldering time is  
indicated as follows (see Fig.18):  
t = 350 s at 100 °C  
Fig.18 Maximum allowable temperature profile.  
t = 300 s at 125 °C  
t = 200 s at 150 °C  
t = 100 s at 175 °C  
t = 50 s at 200 °C  
t = 5 s at 250 °C (maximum temperature).  
Cleaning  
The following fluids may be used for cleaning:  
Alcohol  
Bio-Act (Terpene Hydrocarbon)  
Triclean B/S  
Acetone.  
Ultrasonic cleaning should not be used since this can  
cause serious damage to the product.  
1996 May 21  
9
Philips Semiconductors  
Product specification  
UHF amplifier module  
BGY205  
PACKAGE OUTLINE  
25.0  
24.6  
1.65  
1.25  
22.1  
21.7  
3.0  
2.6  
4.3  
3.9  
3.1  
2.9  
(4×)  
5.1  
4.9  
13.4  
13.0  
2.4  
2.2  
MSA397  
1.2  
min  
1
2
3
4
0.55  
0.45  
(4×)  
0.30  
0.20  
0.25  
M
0.1  
3.7  
3.3  
(4×)  
5.08  
7.62  
5.08  
Dimensions in mm.  
Fig.19 SOT321B.  
1996 May 21  
10  
Philips Semiconductors  
Product specification  
UHF amplifier module  
BGY205  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1996 May 21  
11  

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