BGY240S [NXP]
UHF amplifier module; UHF放大器器模块
| 型号： | BGY240S |
| 厂家： | 
NXP |
| 描述： | UHF amplifier module |
| 文件： | 总12页 (文件大小：85K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
BGY240S
UHF amplifier module
Product specification
1999 Aug 23
Supersedes data of 1998 Nov 05
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
FEATURES
PINNING - SOT388C
PIN
• 3.5 V nominal supply voltage
• 3 W output power
DESCRIPTION
1
RF input
• Easy output power control by DC voltage.
2
VC
3
4
VS
APPLICATIONS
RF output
ground
Flange
• Digital cellular radio systems with Time Division Multiple
Access (TDMA) operation (GSM systems) in the
890 to 915 MHz frequency range.
handbook, halfpage
DESCRIPTION
The BGY240S is a three-stage UHF amplifier module in a
SOT388C package. The module consists of three NPN
silicon planar transistor dies mounted together with
matching and bias circuit components on a metallized
ceramic substrate.
1
2
3
4
Top view
MBK197
Fig.1 Simplified outline.
QUICK REFERENCE DATA
RF performance at Tmb = 25 °C.
MODE OF
f
VS
VC
PL
Gp
η
ZS, ZL
OPERATION
(MHz)
(V)
(V)
(W)
(dB)
(%)
(Ω)
Pulsed; δ = 1 : 8
890 to 915
3.5
≤2.2
≥3
≥35
typ. 47
50
typ. 3.5
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS
VS DC supply voltage VC < 0.2 V; no RF
MIN.
MAX.
UNIT
−
7
V
VC ≥ 0.2 V
−
−
−
−
5
V
VC
DC control voltage
3
V
PD
input drive power
5
mW
W
°C
°C
PL
load power
3.8
+100
+100
Tstg
Tmb
storage temperature
operating mounting base temperature
−40
−30
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport
and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B.
1999 Aug 23
2
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
CHARACTERISTICS
ZS = ZL = 50 Ω; PD = 1 mW; VS = 3.5 V; VC ≤ 2.2 V; f = 890 to 915 MHz; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs unless
otherwise specified.
SYMBOL
IQ
PARAMETER
leakage current
CONDITIONS
MIN.
TYP.
MAX.
10
UNIT
µA
VC = 0.2 V
−
−
3
−
−
ICM
PL
peak control current
load power
adjust VC for PL = 2.5 W
VC = 2.2 V
3
mA
W
3.5
−
Gp
power gain
adjust VC for PL = 2.5 W
adjust VC for PL = 2.5 W
adjust VC for PL = 2.5 W
adjust VC for PL = 2.5 W
adjust VC for PL = 2.5 W
35
−
−
−
dB
%
η
efficiency
44
−
H2
second harmonic
third harmonic
input VSWR
stability
−
−
−35
−33
3 : 1
−60
dBc
dBc
H3
−
−
VSWRin
−
1.8 : 1
VS = 3 to 5 V; PD = −2 to +5 dBm;
VC = 0 to 2.2 V; PL ≤ 3 W;
−
−
dBc
VSWR ≤ 12 : 1 through all phases
isolation
VC = 0.2 V
−
−
−45
−82
−36
−80
dBm
dBm
Pn
noise power
PL = 2.5 W; bandwidth = 30 kHz;
10 MHz above transmission band
AM/PM conversion
AM/AM conversion
carrier rise time
carrier fall time
ruggedness
PD = −2 to +5 dBm;
PL = 6 to 34 dBm
−
−
−
−
−
3
deg/dB
%
PD with 3% AM; f = 100 kHz;
PL = 6 to 34 dBm
−
12
2
tr
tf
PL = 6 to 34 dBm; time to settle
within −0.5 dB of final PL
1.5
1.5
µs
PL = 6 to 34 dBm; time to settle
within −0.5 dB of final PL
2
µs
VS = 5 V; adjust VC for PL = 3 W;
VSWR ≤ 12 : 1 through all phases
no degradation
1999 Aug 23
3
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
MGM155
MGM156
4
6
handbook, halfpage
handbook, halfpage
880 MHz
P
L
880 MHz
P
L
(W)
(W)
3
915 MHz
915 MHz
4
2
1
0
2
0
2.5
0.5
1
1.5
2
2.5
(V)
3
3.5
4
4.5
(V)
V
V
C
S
ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
ZS = ZL = 50 Ω; VC = 2.2 V; PD = 1 mW;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
Fig.2 Load power as a function of control voltage;
typical values.
Fig.3 Load power as a function of supply voltage;
typical values.
MGM157
MGM158
5
50
handbook, halfpage
handbook, halfpage
P
η
L
(%)
(W)
4
40
915 MHz
30
3
2
880 MHz
20
1
0
10
0
880
890
900
910
920
0
1
2
3
4
(W)
P
L
f (MHz)
ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW; VC = 2.2 V;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
Fig.4 Efficiency as a function of load power;
typical values.
Fig.5 Load power as a function of frequency;
typical values.
1999 Aug 23
4
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
MGM151
MGM152
4
−20
handbook, halfpage
handbook, halfpage
H , H
2
3
(dBc)
VSWR
in
−30
3
H
3
−40
−50
−60
H
2
880 MHz
2
1
915 MHz
0
1
2
3
4
(W)
880
890
900
910
920
P
L
f (MHz)
ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW; PL = 2.5 W;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
Fig.6 Input VSWR as a function of load power;
typical values.
Fig.7 Harmonics as a function of frequency;
typical values.
MGM153
MGM154
5
10
handbook, halfpage
P
output
AM
(%)
L
(W)
4
8
915 MHz
(1)
(2)
880 MHz
3
6
4
(3)
(4)
2
1
0
2
0
0
20
40
60
80
T
100
(°C)
0
10
20
30
40
P
(dBm)
L
mb
ZS = ZL = 50 Ω; PD = 1 mW; VC = 2.2 V; δ = 1 : 8; tp = 575 µs.
(1) VS = 3.5 V; f = 880 MHz.
(2) VS = 3.5 V; f = 915 MHz.
ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW; Tmb = 25 °C;
(3) VS = 3.1 V; f = 880 MHz.
∆f = 100 kHz; input amplitude modulation = 3%; δ = 1 : 8; tp = 575 µs.
(4) VS = 3.1 V; f = 915 MHz.
Fig.8 Load power as a function of mounting base
temperature; typical values.
Fig.9 Output amplitude modulation as a function
of load power; typical values.
1999 Aug 23
5
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
90
1
2
3 4
50 Ω
input
50 Ω
output
47
MBH435
V
V
S
C
Dimensions in mm.
Fig.10 Printed-circuit board test fixture.
C2
L1
C3
C1
Z
Z
2
1
R1
C4
typ.
1.35A
MGD432
RF output
RF input
V
V
S
C
Fig.11 Test circuit.
6
1999 Aug 23
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
List of components (see Fig.11)
COMPONENT
DESCRIPTION
VALUE
680 pF
DIMENSIONS
CATALOGUE NO.
C1, C2
C3
multilayer ceramic chip capacitor
tantalum capacitor
2222 851 11681
2.2 µF; 35 V
47 µF; 40 V
C4
electrolytic capacitor
Grade 4S2 Ferroxcube bead
stripline; note 1
2222 030 37479
4330 030 36300
L1
Z1, Z2
R1
50 Ω
width 2.33 mm
metal film resistor
100 Ω; 0.6 W
2322 156 11001
Note
1. The striplines are on a double copper-clad printed-circuit board with PTFE fibreglass dielectric (εr = 2.2);
thickness 1⁄32 inch.
1999 Aug 23
7
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
SOLDERING
The indicated temperatures are those at the solder
interfaces.
MGM159
300
handbook, halfpage
Advised solder types are types with a liquidus less than or
equal to 210 °C.
T
(°C)
Solder dots or solder prints must be large enough to wet
the contact areas.
200
100
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these ovens.
A double reflow process is permitted.
Hand soldering must be avoided because the soldering
iron tip can exceed the maximum permitted temperature of
250 °C and damage the module.
The maximum allowed temperature is 250 °C for a
maximum of 5 seconds.
0
0
1
2
3
4
5
t (min)
The maximum ramp-up is 10 °C per second.
The maximum cool-down is 5 °C per second.
Fig.12 Recommended reflow temperature profile.
Cleaning
The following fluids may be used for cleaning:
• Alcohol
• Bio-Act (Terpene Hydrocarbon)
• Acetone.
Ultrasonic cleaning should not be used since this can
cause serious damage to the product.
1999 Aug 23
8
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
17.7
12.5
12
6
4
8.75
6.75
0.57
12.5
footprint metallization
1
solder area
1.8
2.9
occupied area
0.7
1.37
5.08
1.7
2.54
5.08
17.9
17.1
12.4
12.1
6.4
solder area
7.55
1.67
5.55
2.45
2.7
1.1
0.5
1.37
5.08
1.5
2.54
5.08
MGM150
Dimensions in mm.
Fig.13 Footprint SOT388C.
9
1999 Aug 23
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
PACKAGE OUTLINE
Rectangular single-ended surface-mount package; metal cap; 4 in-line leads
SOT388C
U
A
y
D
U
1
E
L
1
1
2
3
4
L
c
b
w
M
e
1
Z
e
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
b
c
D
e
e
E
L
L
U
U
1
w
y
Z
1
1
0.30
0.20
2.7
2.3
0.56
0.46
17.1
16.7
12.2
11.8
0.7
0.3
3.4
3.0
17.3
16.9
6.0
5.6
2.3
1.9
mm
5.08
2.54
0.25
0.15
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
99-02-06
SOT388C
1999 Aug 23
10
Philips Semiconductors
Product specification
UHF amplifier module
BGY240S
DEFINITIONS
Data Sheet Status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Aug 23
11
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67
SCA
© Philips Electronics N.V. 1999
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under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
125002/07/pp12
Date of release: 1999 Aug 23
Document order number: 9397 750 06262
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