BGY241 [NXP]
UHF amplifier module; UHF放大器器模块
| 型号： | BGY241 |
| 厂家： | 
NXP |
| 描述： | UHF amplifier module |
| 文件： | 总12页 (文件大小：93K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
andbook, halfpage
BGY241
UHF amplifier module
Product specification
1999 Sep 09
Supersedes data of 1999 May 01
Philips Semiconductors
Product specification
UHF amplifier module
BGY241
FEATURES
PINNING - SOT482C
PIN
• 3.5 V nominal supply voltage
• 35 dBm output power
DESCRIPTION
1
2
3
4
5
RF input
VC
• Easy output power control by DC voltage.
VS
APPLICATIONS
RF output
ground
• Digital cellular radio systems with Time Division Multiple
Access (TDMA) operation (GSM systems) in the
880 to 915 MHz frequency range.
handbook, halfpage
DESCRIPTION
5
The BGY241 is a three-stage UHF amplifier module in a
SOT482C leadless package with a plastic cover.
The module consists of one NPN silicon planar transistor
die and one bipolar monolithic integrated circuit mounted
together with matching and bias circuit components on a
metallized ceramic substrate.
4
3
2
1
Bottom view
MBK201
Fig.1 Simplified outline.
QUICK REFERENCE DATA
RF performance at Tmb = 25 °C.
MODE OF
f
VS
VC
PL
Gp
η
ZS; ZL
OPERATION
(MHz)
(V)
(V)
(dBm)
(dB)
(%)
(Ω)
Pulsed; δ = 1 : 8
880 to 915
3.5
≤2.2
35.2
≥35.2
typ. 43
50
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL PARAMETER CONDITIONS
VS DC supply voltage VC = 0; PD = 0 mW
MIN.
MAX.
UNIT
−
7
V
VC ≥ 0.2 V
−
5.5
2.7
10
V
VC
DC control voltage
−
V
PD
input drive power
−
dBm
dBm
°C
°C
PL
load power
−
36
Tstg
Tmb
storage temperature
operating mounting base temperature
−40
−30
+100
+100
CAUTION
This product is supplied in anti-static packing to prevent damage caused by electrostatic discharge during transport
and handling. For further information, refer to Philips specs.: SNW-EQ-608, SNW-FQ-302A and SNW-FQ-302B.
1999 Sep 09
2
Philips Semiconductors
Product specification
UHF amplifier module
BGY241
CHARACTERISTICS
ZS = ZL = 50 Ω; PD = 0 dBm; VS = 3.5 V; VC ≤ 2.2 V; f = 880 to 915 MHz; Tmb = 25 °C; δ = 1 : 8; tp = 575 µs;
unless otherwise specified.
SYMBOL
PARAMETER
leakage current
CONDITIONS
MIN.
TYP. MAX. UNIT
IQ
VC = 0.2 V; PD = 0 mW
VS = 7 V; VC = 0; PD = 0 mW
PL = 35.2 dBm
−
−
10
20
3
µA
−
6
mA
ICM
PL
peak control current
load power
−
−
mA
VC = 2.2 V
35.2
33.6
35.5
−
−
dBm
dBm
VS = 3 V; VC = 2.2 V;
−
Tmb = −20 to +85 °C
Gp
power gain
efficiency
PL = 35.2 dBm
PL = 34 dBm
−
35.2
42
−
dB
η
35
−
−
%
H2
second harmonic
third harmonic
input VSWR
stability
PL = 35.2 dBm
PL = 35.2 dBm
PL = 5 to 35 dBm
−50
−53
−
−38
−40
3 : 1
−60
dBc
dBc
H3
−
VSWRin
−
VS = 3 to 5 V; PD = −3 to +3 dBm;
VC = 0 to 2.2 V; PL ≤ 35.2 dBm;
VSWR ≤ 6 : 1 through all phases
−
−
dBc
isolation
VC = 0.5 V; PD = 3 dBm
−
−43
−
−37
−
dBm
MHz
dB/V
dBm
control bandwidth
control slope
noise power
1.5
−
PL = −5 to +5 dBm
240
−76
−
Pn
PL = 5 to 35.2 dBm;
−
−75
bandwidth = 100 kHz;
20 MHz above transmitter band
AM/AM conversion
AM/PM conversion
TX/RX conversion
carrier rise time
carrier fall time
ruggedness
PD = 3% AM; f = 100 kHz;
PL = 5 to 35.2 dBm
−
−
−
−
−
12
−
14
2
%
PD = −0.5 to +0.5 dBm;
PL = 5 to 35.2 dBm
deg
dB
µs
PL = 35.2 dBm; f = 915 MHz;
PL (925 MHz)/PD (905 MHz)
25
1.5
1.5
30
2
tr
tf
PL = 6 to 34 dBm; time to settle within
−0.5 dB of final PL
PL = 6 to 34 dBm; time to settle within
−0.5 dB of final PL
2
µs
VS = 5 V; PL = 34.8 dBm;
VSWR ≤ 12 : 1 through all phases
no degradation
no degradation
VS = 4.5 V; VC = 2.3 V;
VSWR ≤ 5 : 1 through all phases
1999 Sep 09
3
Philips Semiconductors
Product specification
UHF amplifier module
BGY241
MGS649
MGS648
4
8
handbook, halfpage
handbook, halfpage
880 MHz
915 MHz
880 MHz
915 MHz
P
L
P
L
(W)
(W)
3
6
2
1
0
4
2
0
2
1
1.5
2
2.5
3
4
5
6
V
(V)
V
(V)
S
C
ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
ZS = ZL = 50 Ω; VC = 2.2 V; PD = 1 mW;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
Fig.2 Load power as a function of control voltage;
typical values.
Fig.3 Load power as a function of supply voltage;
typical values.
MGS650
MGS651
50
5
handbook, halfpage
handbook, halfpage
P
915 MHz
η
(%)
L
(W)
4
880 MHz
40
30
20
10
0
3
2
1
0
0
1
2
3
4
5
880
890
900
910
920
P
(W)
f (MHz)
L
ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW; VC = 2.2 V;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
Fig.4 Efficiency as a function of load power;
typical values.
Fig.5 Load power as a function of frequency;
typical values.
1999 Sep 09
4
Philips Semiconductors
Product specification
UHF amplifier module
BGY241
MGS652
MGS653
4
0
handbook, halfpage
handbook, halfpage
H , H
2
3
VSWR
in
(dBc)
−20
3
2
−40
−60
−80
H
H
3
880 MHz
2
915 MHz
1
0
1
2
3
4
880
890
900
910
920
P
(W)
f (MHz)
L
ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs
ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW; PL = 2.5 W;
Tmb = 25 °C; δ = 1 : 8; tp = 575 µs.
Fig.6 Input VSWR as a function of load power;
typical values.
Fig.7 Harmonics as a function of frequency;
typical values.
MGS654
MGS655
12
5
handbook, halfpage
handbook, halfpage
P
output
L
(W)
AM
(%)
880 MHz
10
8
4
(1)
(2)
915 MHz
3
(3)
(4)
6
2
4
1
0
2
0
0
20
40
60
80
T
100
(°C)
0
10
20
30
40
P
(dBm)
L
mb
ZS = ZL = 50 Ω; PD = 1 mW; VC = 2.2 V; δ = 1 : 8; tp = 575 µs.
(1) VS = 3.5 V; f = 880 MHz.
ZS = ZL = 50 Ω; VS = 3.5 V; PD = 1 mW; Tmb = 25 °C;
∆f = 100 kHz; input amplitude modulation = 3%;
δ = 1 : 8; tp = 575 µs.
(2) VS = 3.5 V; f = 915 MHz.
(3) VS = 3.1 V; f = 880 MHz.
(4) VS = 3.1 V; f = 915 MHz.
Fig.8 Load power as a function of mounting base
temperature; typical values.
Fig.9 Output amplitude modulation as a function
of load power; typical values.
1999 Sep 09
5
Philips Semiconductors
Product specification
UHF amplifier module
BGY241
C2
C1
Z
Z
2
1
C3
C4
R1
RF output
RF input
V
V
S
C
MGS656
Fig.10 Test circuit.
List of components (see Fig.10)
COMPONENT
DESCRIPTION
VALUE
DIMENSIONS
CATALOGUE NO.
C1,C2
C3
multilayer ceramic chip capacitor
tantalum capacitor
680 pF
2222 851 11681
2.2 µF; 35 V
47 µF; 40 V
50 Ω
−
C4
electrolytic capacitor
stripline; note 1
2222 030 37479
−
Z1,Z2
R1
width 2.33 mm
metal film resistor
100 Ω; 0.6 W
2322 156 11001
Note
1. The striplines are on a double copper-clad printed-circuit board with PTFE fibreglass dielectric (εr = 2.2);
thickness 1⁄32 inch.
1999 Sep 09
6
Philips Semiconductors
Product specification
UHF amplifier module
BGY241
SOLDERING
The indicated temperatures are those at the solder
interfaces.
MGM159
300
handbook, halfpage
Advised solder types are types with a liquidus less than or
T
(°C)
equal to 210 °C.
Solder dots or solder prints must be large enough to wet
the contact areas.
200
100
Soldering can be carried out using a conveyor oven, a hot
air oven, an infrared oven or a combination of these
ovens. A double reflow process is permitted.
Hand soldering is not recommended because the
soldering iron tip can exceed the maximum permitted
temperature of 250 °C and damage the module.
In case hand soldering is needed, recommendations can
be found in RNR-45-98-A-0485.
0
0
1
2
3
4
5
t (min)
The maximum allowed temperature is 250 °C for a
maximum of 5 seconds.
Fig.11 Recommended reflow temperature profile.
The maximum ramp-up is 10 °C per second.
The maximum cool-down is 5 °C per second.
Cleaning
The following fluids may be used for cleaning:
• Alcohol
• Bio-Act (Terpene Hydrocarbon)
• Acetone.
Ultrasonic cleaning should not be used since this can
cause serious damage to the product.
1999 Sep 09
7
Philips Semiconductors
Product specification
UHF amplifier module
BGY241
4.400
4.000
3.200
4.000
2.800
1.800
0
2.5 mm
scale
0.500
0.600
1.000
1.400
1.300
1.900
0.450
1.000
MGS345
0.050
0.900
0.900
1.200
1.000
0.600
2.300
3.700
1.300
Solder land
3.150
3.900
Solder paste
Green tape area,
max. height 0.03 mm
Dimensions in mm.
Fig.12 Footprint SOT482C.
8
1999 Sep 09
Philips Semiconductors
Product specification
UHF amplifier module
BGY241
PACKAGE OUTLINE
Leadless surface mounted package; plastic cap; 4 terminations
SOT482C
e
e
e
d
b
1
b
b
b
2
b
(4×)
1
2
3
b
3
L
1
2
3
4
L
1
2
L
D
D
1
A
c
5
E
E
1
pin 1 index
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
b
b
b
b
c
D
D
E
E
1
e
e
L
L
L
2
d
1
2
3
1
1
1
1.90
1.59
1.9
1.7
1.4
1.2
0.8
0.6
0.6
0.4
0.70
0.57
13.7 13.35
13.3 13.05
8.2
7.8
7.85
7.55
2.6
2.4
4.6
4.4
1.15
0.85
2.65
2.35
3.85
3.55
mm
2.0
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
99-05-18
99-08-16
SOT482C
1999 Sep 09
9
Philips Semiconductors
Product specification
UHF amplifier module
BGY241
DEFINITIONS
Data Sheet Status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1999 Sep 09
10
Philips Semiconductors
Product specification
UHF amplifier module
BGY241
NOTES
1999 Sep 09
11
Philips Semiconductors – a worldwide company
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For all other countries apply to: Philips Semiconductors,
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5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
68
SCA
© Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
125002/06/pp12
Date of release: 1999 Sep 09
Document order number: 9397 750 06002
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