BZA856AVL,115 [NXP]
BZA800AVL series - Quadruple low capacitance ESD suppressor TSSOP 5-Pin;型号: | BZA856AVL,115 |
厂家: | NXP |
描述: | BZA800AVL series - Quadruple low capacitance ESD suppressor TSSOP 5-Pin 局域网 光电二极管 |
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DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
BZA800AVL series
Quadruple low capacitance ESD
suppressor
Product data sheet
2003 Oct 20
Supersedes data of 2003 Apr 01
NXP Semiconductors
Product data sheet
Quadruple low capacitance ESD
suppressor
BZA800AVL series
FEATURES
PINNING
PIN
• Low diode capacitance
DESCRIPTION
• Low leakage current
1
2
3
4
5
cathode 1
• SOT353 (SC-88A) surface mount package
• Common anode configuration.
common anode
cathode 2
cathode 3
APPLICATIONS
cathode 4
• Communication systems
• Computers and peripherals
• Audio and video equipment.
5
4
handbook, halfpage
DESCRIPTION
1
Monolithic transient voltage suppressor diode in a five lead
SOT353 (SC-88A) package for 4-bit wide ESD transient
suppression.
3
4
5
2
1
2
3
MARKING
MGT580
TYPE NUMBER
BZA856AVL
MARKING CODE
R3
R2
R1
Fig.1 Simplified outline (SOT353; SC-88A) and
symbol.
BZA862AVL
BZA868AVL
ORDERING INFORMATION
TYPE NUMBER
PACKAGE
NAME
DESCRIPTION
plastic surface mounted package; 5 leads
plastic surface mounted package; 5 leads
plastic surface mounted package; 5 leads
VERSION
BZA856AVL
BZA862AVL
BZA868AVL
−
−
−
SOT353
SOT353
SOT353
2003 Oct 20
2
NXP Semiconductors
Product data sheet
Quadruple low capacitance ESD
suppressor
BZA800AVL series
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
Per diode
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
IZ
working current
Tamb = 25 °C
−
−
−
−
−
note 1
200
3.5
mA
IF
continuous forward current
non-repetitive peak forward current
total power dissipation
Tamb = 25 °C
mA
A
IFSM
Ptot
PZSM
tp = 1 ms; square pulse
Tamb = 25 °C; note 2; see Fig.5
square pulse; tp = 1 ms
300
6
mW
W
non repetitive peak reverse power
dissipation
Tstg
Tj
storage temperature
junction temperature
electrostatic discharge
−65
+150
150
−
°C
°C
kV
kV
−
ESD
IEC 61000-4-2 (contact discharge) 15
HBM MIL-Std 883
10
−
Notes
1. DC working current limited by Ptot(max)
.
2. Device mounted on standard printed-circuit board.
ESD STANDARDS COMPLIANCE
STANDARD
IEC 61000-4-2, level 4 (ESD)
HBM MIL-Std 883, class 3
CONDITIONS
>15 kV (air); >8 kV (contact discharge)
>4 kV
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth j-a
thermal resistance from junction to
ambient
all diodes loaded
410
K/W
Rth j-s
thermal resistance from junction to
solder point; note 1
one diode loaded
all diodes loaded
200
185
K/W
K/W
Note
1. Solder point of common anode (pin 2).
2003 Oct 20
3
NXP Semiconductors
Product data sheet
Quadruple low capacitance ESD
suppressor
BZA800AVL series
ELECTRICAL CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
forward voltage
CONDITIONS
IF = 200 mA
MIN.
TYP.
MAX.
1.2
UNIT
VF
IR
−
−
V
reverse current
BZA856AVL
VR = 3 V
VR = 4 V
VR = 4.3 V
IZ = 1 mA
−
−
−
−
−
−
200
100
20
nA
nA
nA
BZA862AVL
BZA868AVL
VZ
rdif
SZ
Cd
working voltage
BZA856AVL
5.32
5.89
6.46
5.6
6.2
6.8
5.88
6.51
7.14
V
V
V
BZA862AVL
BZA868AVL
differential resistance
BZA856AVL
IZ = 1 mA
−
−
−
−
−
−
200
150
100
Ω
Ω
Ω
BZA862AVL
BZA868AVL
temperature coefficient
BZA856AVL
IZ = 1 mA
−
−
−
1.3
2.4
2.9
−
−
−
mV/K
mV/K
mV/K
BZA862AVL
BZA868AVL
diode capacitance
BZA856AVL
f = 1 MHz; VR = 0
f = 1 MHz; VR = 5 V
tp = 1 ms; Tamb = 25 °C
−
−
−
22
18
16
28
22
19
pF
pF
pF
BZA862AVL
BZA868AVL
diode capacitance
BZA856AVL
−
−
−
12
9
17
12
11
pF
pF
pF
BZA862AVL
BZA868AVL
8
IZSM
non-repetitive peak reverse current
BZA856AVL
−
−
−
−
−
−
0.90
0.85
0.80
A
A
A
BZA862AVL
BZA868AVL
2003 Oct 20
4
NXP Semiconductors
Product data sheet
Quadruple low capacitance ESD
suppressor
BZA800AVL series
MLD997
MLD999
2
10
10
handbook, halfpage
handbook, halfpage
I
P
ZSM
ZSM
(A)
(W)
BZA856AVL
BZA856AVL
BZA862AVL
1
10
BZA868AVL
BZA862AVL/BZA868AVL
−1
10
1
10
−2
−1
−2
−1
10
10
1
10
10
1
10
t
(ms)
t
(ms)
p
p
Fig.3 Maximum non-repetitive peak reverse
power dissipation as a function of pulse
duration (square pulse).
Fig.2 Maximum non-repetitive peak reverse
current as a function of pulse time.
MLD998
MLD793
26
400
handbook, halfpage
handbook, halfpage
C
d
P
tot
(pF)
22
(mW)
300
18
200
100
0
BZA856AVL
14
BZA862AVL
10
BZA868AVL
6
0
1
2
3
4
5
0
50
100
150
T
(°C)
V
(V)
amb
R
Tj = 25 °C; f = 1 MHz.
Fig.4 Diode capacitance as a function of reverse
voltage; typical values.
Fig.5 Power derating curve.
2003 Oct 20
5
NXP Semiconductors
Product data sheet
Quadruple low capacitance ESD
suppressor
BZA800AVL series
ESD TESTER
RG 223/U
DIGITIZING
50 Ω coax
OSCILLOSCOPE
R
450 Ω
Z
10×
ATTENUATOR
50 Ω
C
Z
note 1
1/4 BZA800AVL
IEC 1000-4-2 network
= 150 pF; R = 330 Ω
Note 1: attenuator is only used for open
socket high voltage measurements
C
Z
Z
vertical scale = 200 V/div
horizontal scale = 50 ns/div
vertical scale = 5 V/div
horizontal scale = 50 ns/div
BZA868AVL
GND3
BZA862AVL
BZA856AVL
GND2
GND1
GND
unclamped +1 kV ESD voltage waveform
(IEC 1000-4-2 network)
clamped +1 kV ESD voltage waveform
(IEC 1000-4-2 network)
GND
GND
vertical scale = 200 V/div
horizontal scale = 50 ns/div
vertical scale = 5 V/div
horizontal scale = 50 ns/div
unclamped −1 kV ESD voltage waveform
(IEC 1000-4-2 network)
clamped −1 kV ESD voltage waveform
(IEC 1000-4-2 network)
MLE004
Fig.6 ESD clamping test set-up and waveforms.
6
2003 Oct 20
NXP Semiconductors
Product data sheet
Quadruple low capacitance ESD
suppressor
BZA800AVL series
APPLICATION INFORMATION
Typical common anode application
A quadruple transient suppressor in a SOT353 package makes it possible to protect four separate lines using only one
package. Two simplified examples are shown in Figs.7 and 8.
A
B
C
D
keyboard,
terminal,
printer,
etc.
I/O
FUNCTIONAL
DECODER
BZA800AVL
GND
MLE006
Fig.7 Computer interface protection.
V
V
DD
GG
address bus
RAM
ROM
data bus
I/O
CPU
CLOCK
control bus
BZA800AVL
GND
MLE007
Fig.8 Microprocessor protection.
7
2003 Oct 20
NXP Semiconductors
Product data sheet
Quadruple low capacitance ESD
suppressor
BZA800AVL series
Device placement and printed-circuit board layout
Circuit board layout is of extreme importance in the
suppression of transients. The clamping voltage of the
BZA800AVL is determined by the peak transient current
and the rate of rise of that current (di/dt). Since parasitic
inductances can further add to the clamping voltage
(V = L di/dt) the series conductor lengths on the
printed-circuit board should be kept to a minimum. This
includes the lead length of the suppression element.
In addition to minimizing conductor length the following
printed-circuit board layout guidelines are recommended:
1. Place the suppression element close to the input
terminals or connectors
2. Keep parallel signal paths to a minimum
3. Avoid running protection conductors in parallel with
unprotected conductors
4. Minimize all printed-circuit board loop areas including
power and ground loops
5. Minimize the length of the transient return path to
ground
6. Avoid using shared transient return paths to a common
ground point.
2003 Oct 20
8
NXP Semiconductors
Product data sheet
Quadruple low capacitance ESD
suppressor
BZA800AVL series
PACKAGE OUTLINE
Plastic surface mounted package; 5 leads
SOT353
D
B
E
A
X
y
H
v
M
A
E
5
4
Q
A
A
1
1
2
3
c
e
b
L
p
w
M B
1
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
(2)
UNIT
A
b
c
D
E
e
e
H
L
Q
v
w
y
p
p
1
E
max
0.30
0.20
1.1
0.8
0.25
0.10
2.2
1.8
1.35
1.15
2.2
2.0
0.45
0.15
0.25
0.15
mm
0.1
1.3
0.65
0.2
0.2
0.1
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
SC-88A
97-02-28
SOT353
2003 Oct 20
9
NXP Semiconductors
Product data sheet
Quadruple low capacitance ESD
suppressor
BZA800AVL series
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Product data sheet
Qualification
Production
This document contains data from the preliminary specification.
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage to
the device. Limiting values are stress ratings only and
operation of the device at these or any other conditions
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
General ⎯ Information in this document is believed to be
accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completeness
of such information and shall have no liability for the
consequences of use of such information.
Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
Terms and conditions of sale ⎯ NXP Semiconductors
products are sold subject to the general terms and
conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, including those
pertaining to warranty, intellectual property rights
infringement and limitation of liability, unless explicitly
otherwise agreed to in writing by NXP Semiconductors. In
case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter
will prevail.
Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in medical, military, aircraft, space or life support
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
2003 Oct 20
10
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were
made to the content, except for the legal definitions and disclaimers.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
© NXP B.V. 2009
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R76/02/pp11
Date of release: 2003 Oct 20
Document order number: 9397 750 11934
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