BZA868AL [NXP]
Quadruple ESD transient voltage suppressor; 四ESD瞬态电压抑制器
| 型号： | BZA868AL |
| 厂家： | 
NXP |
| 描述： | Quadruple ESD transient voltage suppressor |
| 文件： | 总9页 (文件大小：145K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DISCRETE SEMICONDUCTORS
DATA SHEET
book, halfpage
BZA800AL series
Quadruple ESD transient voltage
suppressor
Product data sheet
2002 Jan 11
NXP Semiconductors
Product data sheet
Quadruple ESD transient voltage
suppressor
BZA800AL series
FEATURES
PINNING
PIN
• ESD rating >8 kV contact discharge, according to
IEC1000-4-2
DESCRIPTION
1
2
3
4
5
cathode 1
• SOT353 (SC-88A) surface mount package
• Common anode configuration.
common anode
cathode 2
cathode 3
APPLICATIONS
cathode 4
• Computers and peripherals
• Audio and video equipment
• Communication systems.
5
4
DESCRIPTION
handbook, halfpage
1
Monolithic transient voltage suppressor diode in a five lead
SOT353 (SC-88A) package for 4-bit wide ESD transient
suppression.
3
4
5
2
MARKING
1
2
3
MGT580
TYPE NUMBER
BZA856AL
MARKING CODE
M1
M2
M3
BZA862AL
BZA868AL
Fig.1 Simplified outline (SOT353) and symbol.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
Per diode
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
IZ
working current
continuous forward current
non-repetitive peak forward current tp = 1 ms; square pulse
Tamb = 25 °C
−
−
−
−
note 1
200
4
mA
IF
Tamb = 25 °C
mA
A
IFSM
Ptot
PZSM
total power dissipation
Tamb = 25 °C; note 2; see Fig.5
300
mW
non repetitive peak reverse power square pulse; tp = 1 ms; see Fig.3
dissipation:
BZA856AL
−
−
−
16
W
W
W
°C
°C
BZA862AL
15
BZA868AL
14
Tstg
Tj
storage temperature
junction temperature
−65
+150
150
−
Notes
1. DC working current limited by Ptot(max)
.
2. Device mounted on standard printed-circuit board.
2002 Jan 11
2
NXP Semiconductors
Product data sheet
Quadruple ESD transient voltage
suppressor
BZA800AL series
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
CONDITIONS
all diodes loaded
VALUE
410
UNIT
K/W
K/W
K/W
thermal resistance from junction to ambient
Rth j-s
thermal resistance from junction to solder point; one diode loaded
200
note 1
all diodes loaded
185
Note
1. Solder point of common anode (pin 2).
ELECTRICAL CHARACTERISTICS
Tj = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
forward voltage
CONDITIONS
IF = 200 mA
MIN.
TYP.
MAX.
UNIT
VF
IR
−
−
1.3
V
reverse current
BZA856AL
VR = 3 V
VR = 4 V
VR = 4.3 V
IZ = 1 mA
−
−
−
−
−
−
1000
500
nA
nA
nA
BZA862AL
BZA868AL
100
VZ
working voltage
BZA856AL
5.32
5.89
6.46
5.6
6.2
6.8
5.88
6.51
7.14
V
V
V
BZA862AL
BZA868AL
rdif
differential resistance
BZA856AL
IZ = 1 mA
−
−
−
−
−
−
400
300
200
Ω
Ω
Ω
BZA862AL
BZA868AL
SZ
temperature coefficient
BZA856AL
IZ = 1 mA
−
−
−
0.3
1.6
2.2
−
−
−
mV/K
mV/K
mV/K
BZA862AL
BZA868AL
Cd
diode capacitance
BZA856AL
f = 1 MHz; VR = 0
−
−
−
−
−
−
125
105
90
pF
pF
pF
BZA862AL
BZA868AL
IZSM
non-repetitive peak reverse current
BZA856AL
tp = 1 ms; Tamb = 25 °C
−
−
−
−
−
−
2.2
2.1
2
A
A
A
BZA862AL
BZA868AL
2002 Jan 11
3
NXP Semiconductors
Product data sheet
Quadruple ESD transient voltage
suppressor
BZA800AL series
MLD790
MLD791
2
10
10
handbook, halfpage
handbook, halfpage
P
I
ZSM
ZSM
(A)
(W)
BZA856AL
BZA856AL
BZA862AL
1
10
BZA862AL
BZA868AL
BZA868AL
−1
10
1
10
−2
−1
−2
−1
10
10
10
1
10
1
10
t
(ms)
t (ms)
p
p
PZSM = VZSM × IZSM
.
VZSM is the non-repetitive peak reverse voltage at IZSM
.
Fig.3 Maximum non-repetitive peak reverse
power dissipation as a function of pulse
duration (square pulse).
Fig.2 Maximum non-repetitive peak reverse
current as a function of pulse time.
MLD792
MLD793
120
400
handbook, halfpage
handbook, halfpage
P
tot
C
d
(pF)
(mW)
300
80
200
100
0
BZA856AL
BZA862AL
BZA868AL
40
0
0
2
4
6
8
0
50
100
150
T
(°C)
V
(V)
amb
R
Tj = 25 °C; f = 1 MHz.
Fig.4 Diode capacitance as a function of reverse
voltage; typical values.
Fig.5 Power derating curve.
2002 Jan 11
4
NXP Semiconductors
Product data sheet
Quadruple ESD transient voltage
suppressor
BZA800AL series
ESD TESTER
RG 223/U
DIGITIZING
50 Ω coax
OSCILLOSCOPE
R
450 Ω
Z
10×
ATTENUATOR
50 Ω
C
Z
note 1
1/4 BZA800AL
IEC 61000-4-2 network
= 150 pF; R = 330 Ω
Note 1: attenuator is only used for open
socket high voltage measurements
C
Z
Z
vertical scale = 100 V/div
horizontal scale = 50 ns/div
vertical scale = 5 V/div
horizontal scale = 50 ns/div
BZA868AL
BZA862AL
BZA856AL
GND
GND
unclamped +1 kV ESD voltage waveform
(IEC 61000-4-2 network)
clamped +1 kV ESD voltage waveform
(IEC 61000-4-2 network)
GND
vertical scale = 100 V/div
horizontal scale = 50 ns/div
vertical scale = 5 V/div
horizontal scale = 50 ns/div
unclamped −1 kV ESD voltage waveform
(IEC 61000-4-2 network)
clamped −1 kV ESD voltage waveform
(IEC 61000-4-2 network)
MLD794
Fig.6 ESD clamping test set-up and waveforms.
5
2002 Jan 11
NXP Semiconductors
Product data sheet
Quadruple ESD transient voltage
suppressor
BZA800AL series
APPLICATION INFORMATION
Typical common anode application
A quadruple transient suppressor in a SOT353 (SC88A) package makes it possible to protect four separate lines using
only one package. A simplified example is shown in Fig 7.
A
B
C
D
keyboard,
terminal,
printer,
etc.
I/O
FUNCTIONAL
DECODER
BZA800AL
GND
MLD795
Fig.7 Computer interface protection.
Device placement and printed-circuit board layout
Circuit board layout is of extreme importance in the suppression of transients. The clamping voltage of the BZA800AL is
determined by the peak transient current and the rate of rise of that current (di/dt). Since parasitic inductances can further
add to the clamping voltage (V = L di/dt) the series conductor lengths on the printed-circuit board should be kept to a
minimum. This includes the lead length of the suppression element.
In addition to minimizing conductor length the following printed-circuit board layout guidelines are recommended:
1. Place the suppression element close to the input terminals or connectors
2. Keep parallel signal paths to a minimum
3. Avoid running protection conductors in parallel with unprotected conductors
4. Minimize all printed-circuit board loop areas including power and ground loops
5. Minimize the length of the transient return path to ground
6. Avoid using shared transient return paths to a common ground point.
2002 Jan 11
6
NXP Semiconductors
Product data sheet
Quadruple ESD transient voltage
suppressor
BZA800AL series
PACKAGE OUTLINE
Plastic surface mounted package; 5 leads
SOT353
D
B
E
A
X
y
H
v
M
A
E
5
4
Q
A
A
1
1
2
3
c
e
b
L
p
w
M B
1
p
e
detail X
0
1
2 mm
scale
DIMENSIONS (mm are the original dimensions)
A
1
(2)
UNIT
A
b
c
D
E
e
e
H
L
Q
v
w
y
p
p
1
E
max
0.30
0.20
1.1
0.8
0.25
0.10
2.2
1.8
1.35
1.15
2.2
2.0
0.45
0.15
0.25
0.15
mm
0.1
1.3
0.65
0.2
0.2
0.1
REFERENCES
JEDEC
EUROPEAN
PROJECTION
OUTLINE
VERSION
ISSUE DATE
IEC
EIAJ
SC-88A
97-02-28
SOT353
2002 Jan 11
7
NXP Semiconductors
Product data sheet
Quadruple ESD transient voltage
suppressor
BZA800AL series
DATA SHEET STATUS
DOCUMENT
STATUS(1)
PRODUCT
STATUS(2)
DEFINITION
Objective data sheet
Development
This document contains data from the objective specification for product
development.
Preliminary data sheet
Product data sheet
Qualification
Production
This document contains data from the preliminary specification.
This document contains the product specification.
Notes
1. Please consult the most recently issued document before initiating or completing a design.
2. The product status of device(s) described in this document may have changed since this document was published
and may differ in case of multiple devices. The latest product status information is available on the Internet at
URL http://www.nxp.com.
DISCLAIMERS
above those given in the Characteristics sections of this
document is not implied. Exposure to limiting values for
extended periods may affect device reliability.
General ⎯ Information in this document is believed to be
accurate and reliable. However, NXP Semiconductors
does not give any representations or warranties,
expressed or implied, as to the accuracy or completeness
of such information and shall have no liability for the
consequences of use of such information.
Terms and conditions of sale ⎯ NXP Semiconductors
products are sold subject to the general terms and
conditions of commercial sale, as published at
http://www.nxp.com/profile/terms, including those
pertaining to warranty, intellectual property rights
infringement and limitation of liability, unless explicitly
otherwise agreed to in writing by NXP Semiconductors. In
case of any inconsistency or conflict between information
in this document and such terms and conditions, the latter
will prevail.
Right to make changes ⎯ NXP Semiconductors
reserves the right to make changes to information
published in this document, including without limitation
specifications and product descriptions, at any time and
without notice. This document supersedes and replaces all
information supplied prior to the publication hereof.
No offer to sell or license ⎯ Nothing in this document
may be interpreted or construed as an offer to sell products
that is open for acceptance or the grant, conveyance or
implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use ⎯ NXP Semiconductors products are
not designed, authorized or warranted to be suitable for
use in medical, military, aircraft, space or life support
equipment, nor in applications where failure or malfunction
of an NXP Semiconductors product can reasonably be
expected to result in personal injury, death or severe
property or environmental damage. NXP Semiconductors
accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at
the customer’s own risk.
Export control ⎯ This document as well as the item(s)
described herein may be subject to export control
regulations. Export might require a prior authorization from
national authorities.
Quick reference data ⎯ The Quick reference data is an
extract of the product data given in the Limiting values and
Characteristics sections of this document, and as such is
not complete, exhaustive or legally binding.
Applications ⎯ Applications that are described herein for
any of these products are for illustrative purposes only.
NXP Semiconductors makes no representation or
warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values ⎯ Stress above one or more limiting
values (as defined in the Absolute Maximum Ratings
System of IEC 60134) may cause permanent damage to
the device. Limiting values are stress ratings only and
operation of the device at these or any other conditions
2002 Jan 11
8
NXP Semiconductors
Customer notification
This data sheet was changed to reflect the new company name NXP Semiconductors. No changes were
made to the content, except for the legal definitions and disclaimers.
Contact information
For additional information please visit: http://www.nxp.com
For sales offices addresses send e-mail to: salesaddresses@nxp.com
© NXP B.V. 2009
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613514/01/pp9
Date of release: 2002 Jan 11
Document order number: 9397 750 09173
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