IP4284CZ10-TB,115 [NXP]
DIODE TRANSIENT SUPPRESSOR DIODE ARRAY,UNIDIRECTIONAL,LLCC, Transient Suppressor;
| 型号： | IP4284CZ10-TB,115 |
| 厂家： | 
NXP |
| 描述： | DIODE TRANSIENT SUPPRESSOR DIODE ARRAY,UNIDIRECTIONAL,LLCC, Transient Suppressor 二极管 |
| 文件： | 总15页 (文件大小：152K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
IP4284CZ10-TB; IP4284CZ10-TT
ESD protection for ultra high-speed interfaces
Rev. 02 — 1 April 2010
Product data sheet
1. Product profile
1.1 General description
The devices are designed to protect high-speed interfaces such as High-Definition
Multimedia Interface (HDMI), DisplayPort, SuperSpeed USB, external Serial Advanced
Technology Attachment (eSATA) and Low Voltage Differential Signaling (LVDS) interfaces
against ElectroStatic Discharge (ESD).
The devices include high-level ESD protection diodes for ultra high-speed signal lines and
are available in two package variants: XSON10U and TSSOP10.
All signal lines are protected by a special diode configuration offering ultra low line
capacitance of only 0.5 pF. These diodes provide protection to downstream components
from ESD voltages up to ±8 kV contact according to IEC 61000-4-2, level 4.
1.2 Features and benefits
Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen
and antimony (Dark Green compliant)
System ESD protection for USB 2.0 and USB SuperSpeed 3.0, HDMI 1.3 and
HDMI 1.4, DisplayPort, eSATA and LVDS
All signal lines with integrated rail-to-rail clamping diodes for downstream
ESD protection of ±8 kV according to IEC 61000-4-2, level 4
Matched 0.5 mm trace spacing
Signal lines with ≤ 0.05 pF matching capacitance between signal pairs
Line capacitance of only 0.5 pF for each channel
4-channel, XSON10U or TSSOP10 Pb-free package
Design-friendly ’pass-thru’ signal routing
1.3 Applications
The devices are designed for high-speed receiver and transmitter port protection:
TVs, monitors
DVD recorders and players
Notebooks, mother boards, graphic cards and ports
Set-top boxes and game consoles
IP4284CZ10-TB/TT
NXP Semiconductors
ESD protection for ultra high-speed interfaces
2. Pinning information
Table 1.
Pinning
Symbol
Pin
Description
Simplified outline
Graphic symbol
IP4284CZ10-TB (SOT1059-1)
1
2
3
4
5
6
7
8
9
10
CH1
CH2
GND
CH3
CH4
n.c.
channel 1 ESD protection
channel 2 ESD protection
ground
1
2
4
5
1
2
3
4
5
10
9
channel 3 ESD protection
channel 4 ESD protection
not connected
8
3, 8
018aaa001
n.c.
not connected
7
GND
n.c.
ground
not connected
6
n.c.
not connected
Transparent top view
XSON10U
IP4284CZ10-TT (SOT552-1)
1
2
3
4
5
6
7
8
9
10
CH1
CH2
GND
CH3
CH4
n.c.
channel 1 ESD protection
channel 2 ESD protection
ground
1
2
4
5
10
6
channel 3 ESD protection
channel 4 ESD protection
not connected
3, 8
018aaa001
n.c.
not connected
GND
n.c.
ground
1
5
not connected
TSSOP10
n.c.
not connected
3. Ordering information
Table 2.
Ordering information
Type number
Package
Name
Description
Version
IP4284CZ10-TB
IP4284CZ10-TT
XSON10U
plastic extremely thin small outline package; no leads; 10 terminals; SOT1059-1
UTLP based; body 1 × 2.5 × 0.5 mm
TSSOP10
plastic thin shrink small outline package; 10 leads; body width 3 mm SOT552-1
IP4284CZ10-TB_TT_2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 1 April 2010
2 of 15
IP4284CZ10-TB/TT
NXP Semiconductors
ESD protection for ultra high-speed interfaces
4. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VI
Parameter
Conditions
Min
−0.5
-
Max
+5.5
±8
Unit
V
input voltage
[1]
VESD
electrostatic discharge
voltage
IEC 61000-4-2, level 4;
contact discharge
kV
Tamb
Tstg
ambient temperature
storage temperature
−40
−55
+85
°C
°C
+125
[1] All pins to ground.
5. Characteristics
Table 4.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol
Parameter
Conditions
Min Typ Max Unit
VBRzd
Zener diode
Itest = 1 mA
6
-
9
V
breakdown voltage
ILRzd
Zener diode reverse
leakage current
per TMDS channel;
VI = 3.0 V
-
-
1
μA
VF
forward voltage
-
0.7
0.5
-
V
[1]
[1]
Cch(TMDS)
TMDS channel
capacitance
f = 1 MHz;
Vbias = 2.5 V
0.4
0.7
pF
ΔCch(TMDS) TMDS channel
capacitance difference
f = 1 MHz;
Vbias = 2.5 V
-
-
0.05
0.07
-
-
pF
pF
[1][2]
[4]
Cch(mutual)
mutual channel
capacitance
f = 1 MHz;
Vbias = 2.5 V
Rdyn
dynamic resistance
I = 1 A
positive transient
negative transient
-
-
-
1
1
8
-
-
-
Ω
Ω
V
[3]
VCL(ch)trt(pos) positive transient channel VESD = 8 kV
clamping voltage
[1] This parameter is guaranteed by design.
[2] Between signal pin and pin n.c.
[3] Human Body Model (HBM) according to JESD22-A-J114D.
[4] According to IEC 61000-4-5 and IEC 61000-4-9.
IP4284CZ10-TB_TT_2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 1 April 2010
3 of 15
IP4284CZ10-TB/TT
NXP Semiconductors
ESD protection for ultra high-speed interfaces
018aaa002
018aaa003
3
0
Sdd21;
Scc21
(dB)
Sdd21;
NEXT
(dB)
(1)
−3
−30
−60
−90
(2)
−9
−15
6
7
8
9
10
8
9
10
10
10
10
10
10
10
10
10
f (Hz)
f (Hz)
(1) Sdd21
(2) Scc21
Sdd21
normalized to 100 Ω;
differential pairs CH1/CH2 versus CH3/CH4
normalized to 100 Ω;
differential pairs at CH1/CH2 or at CH3/CH4
Fig 1. Mixed-mode differential and common-mode
insertion loss; typical values
Fig 2. Mixed-mode differential NEXT crosstalk;
typical values
IP4284CZ10-TB_TT_2
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 1 April 2010
4 of 15
IP4284CZ10-TB/TT
NXP Semiconductors
ESD protection for ultra high-speed interfaces
018aaa004
018aaa005
5 Gbit/s; USB 3.0 CP0 pattern
5 Gbit/s; USB 3.0 CP0 pattern
Fig 3. Eye diagram using reference PCB
Fig 4. Eye diagram using IP4284CZ10-TB
018aaa006
0.4
C
d
(pF)
0.2
(1)
(2)
0.0
−0.2
−0.4
−0.5
1.5
3.5
5.5
V
bias
(V)
(1) Pin 2
(2) Pin 1
Deviation from typical capacitance normalized at Vbias = 2.5 V
Fig 5. Line capacitance as a function of bias voltage; typical values
IP4284CZ10-TB_TT_2
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 1 April 2010
5 of 15
IP4284CZ10-TB/TT
NXP Semiconductors
ESD protection for ultra high-speed interfaces
018aaa008
018aaa007
8.5
3.5
V
(V)
CL
V
(V)
CL
3.0
8.0
2.5
2.0
1.5
7.5
7.0
0.5
1.0
1.5
2.0
2.5
0.5
1.0
1.5
2.0
2.5
I (A)
I (A)
IEC 61000-4-5; tp = 8/20 μs; positive pulse
IEC 61000-4-5; tp = 8/20 μs; negative pulse
Fig 6. Dynamic resistance with positive clamping
Fig 7. Dynamic resistance with negative clamping
018aaa009
018aaa010
18
0
V
(V)
CL
V
(V)
CL
−4
12
−8
−12
−16
6
0
0
2
4
6
8
10
12
I (A)
14
−16
−12
−8
−4
0
I (A)
tp = 100 ns; Transmission Line Pulse (TLP)
tp = 100 ns; Transmission Line Pulse (TLP)
Fig 8. Dynamic resistance with positive clamping
Fig 9. Dynamic resistance with negative clamping
IP4284CZ10-TB_TT_2
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 1 April 2010
6 of 15
IP4284CZ10-TB/TT
NXP Semiconductors
ESD protection for ultra high-speed interfaces
6. Application information
The devices are designed to provide high-level ESD protection for high-speed serial
data buses such as HDMI, DisplayPort, eSATA and LVDS data lines.
When designing the Printed-Circuit Board (PCB), careful consideration should be given to
basic high-speed routing guidelines, impedance matching, and signal coupling.
Basic application diagrams for the ESD protection of an HDMI interface are shown in
Figure 10 and Figure 11.
IP4284CZ10-TB
TMDS_D2+
TMDS_GND
TMDS_CH2+
TMDS_CH2−
GND
5
4
3
TMDS_D2−
8
TMDS_D1+
TMDS_CH1+
2
1
TMDS_GND
TMDS_CH1−
TMDS_D1−
IP4284CZ10-TB
TMDS_D0+
TMDS_CH2+
TMDS_CH2−
GND
5
TMDS_GND
4
3
TMDS_D0−
8
TMDS_CLK+
TMDS_GND
HDMI
CONNECTOR
TMDS_CH1+
2
1
TMDS_CH1−
TMDS_CLK−
CEC
n.c.
DDC_CLK
DDC_DAT
GND
+5 V
HOT PLUG DETECTION
6
5
4
100 nF
IP4221CZ6
1
2
3
018aaa011
Fig 10. Application diagram of HDMI ESD protection using IP4284CZ10-TB
IP4284CZ10-TB_TT_2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 1 April 2010
7 of 15
IP4284CZ10-TB/TT
NXP Semiconductors
ESD protection for ultra high-speed interfaces
IP4284CZ10-TT
TMDS_D2+
TMDS_GND
TMDS_D2+
TMDS_D2−
TMDS_D2−
TMDS_D1+
TMDS_D1+
TMDS_GND
TMDS_D1−
TMDS_D1−
IP4284CZ10-TT
TMDS_D0+
TMDS_GND
TMDS_D0−
TMDS_D0+
TMDS_D0−
TMDS_CLK+
TMDS_GND
HDMI
CONNECTOR
TMDS_CLK+
TMDS_CLK1−
TMDS_CLK−
CEC
n.c.
DDC_CLK
DDC_DAT
GND
+5 V
HOT PLUG DETECTION
100 nF
IP4220CZ6
018aaa012
Fig 11. Application diagram of HDMI ESD protection using IP4284CZ10-TT
IP4284CZ10-TB_TT_2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 1 April 2010
8 of 15
IP4284CZ10-TB/TT
NXP Semiconductors
ESD protection for ultra high-speed interfaces
7. Package outline
XSON10U: plastic extremely thin small outline package; no leads;
10 terminals; UTLP based; body 1 x 2.5 x 0.5 mm
SOT1059-1
D
B
A
E
A
A
1
terminal 1
index area
detail X
e
1
C
M
v
w
C A
C
B
e
b
L
1
y
1
y
M
C
1
5
L
2
e
2
L
10
6
X
0
0.5
1 mm
scale
DIMENSIONS (mm are the original dimensions)
A
UNIT
A
1
b
D
E
e
e
1
e
2
L
L
L
v
w
y
y
1
1
2
max
0.05 0.25
0.00 0.15
2.6
2.4
1.1
0.9
0.4
0.2
0.15 0.45
0.00 0.25
mm
0.5
0.5
2
0.6
0.1
0.05 0.05
0.1
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC
- - -
JEDEC
JEITA
07-12-20
08-01-18
SOT1059-1
- - -
Fig 12. Package outline SOT1059-1 (XSON10U)
IP4284CZ10-TB_TT_2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 1 April 2010
9 of 15
IP4284CZ10-TB/TT
NXP Semiconductors
ESD protection for ultra high-speed interfaces
TSSOP10: plastic thin shrink small outline package; 10 leads; body width 3 mm
SOT552-1
D
E
A
X
c
y
H
v
M
A
E
Z
6
10
A
(A )
2
A
3
A
1
pin 1 index
θ
L
p
L
1
5
detail X
e
w M
b
p
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(2)
(1)
A
A
A
b
c
D
E
e
H
L
L
UNIT
v
w
y
Z
θ
1
2
3
p
E
p
max.
0.15
0.05
0.95
0.80
0.30
0.15
0.23
0.15
3.1
2.9
3.1
2.9
5.0
4.8
0.7
0.4
0.67
0.34
6°
0°
mm
1.1
0.5
0.25
0.95
0.1
0.1
0.1
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-07-29
03-02-18
SOT552-1
Fig 13. Package outline SOT552-1 (TSSOP10)
IP4284CZ10-TB_TT_2
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 1 April 2010
10 of 15
IP4284CZ10-TB/TT
NXP Semiconductors
ESD protection for ultra high-speed interfaces
8. Abbreviations
Table 5.
Abbreviations
Description
Digital Versatile Disc
Acronym
DVD
eSATA
ESD
external Serial Advanced Technology Attachment
ElectroStatic Discharge
HBM
Human Body Model
HDMI
LVDS
NEXT
RoHS
TLP
High-Definition Multimedia Interface
Low Voltage Differential Signaling
Near End Crosstalk
Restriction of Hazardous Substances
Transmission Line Pulse
TMDS
UTLP
Transition Minimized Differential Signaling
Ultra Thin Leadless Package
IP4284CZ10-TB_TT_2
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 1 April 2010
11 of 15
IP4284CZ10-TB/TT
NXP Semiconductors
ESD protection for ultra high-speed interfaces
9. Revision history
Table 6.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
IP4284CZ10-TB_TT_2
Modifications:
20100401
Product data sheet
-
IP4284CZ10-TB_TT_1
• Data sheet status changed to ’Product data sheet’
20100304 Preliminary data sheet
IP4284CZ10-TB_TT_1
-
-
IP4284CZ10-TB_TT_2
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 1 April 2010
12 of 15
IP4284CZ10-TB/TT
NXP Semiconductors
ESD protection for ultra high-speed interfaces
10. Legal information
10.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of an NXP Semiconductors product can reasonably be expected
10.2 Definitions
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on a weakness or default in the
customer application/use or the application/use of customer’s third party
customer(s) (hereinafter both referred to as “Application”). It is customer’s
sole responsibility to check whether the NXP Semiconductors product is
suitable and fit for the Application planned. Customer has to do all necessary
testing for the Application in order to avoid a default of the Application and the
product. NXP Semiconductors does not accept any liability in this respect.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
10.3 Disclaimers
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from national authorities.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
non-automotive qualified products in automotive equipment or applications.
IP4284CZ10-TB_TT_2
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 1 April 2010
13 of 15
IP4284CZ10-TB/TT
NXP Semiconductors
ESD protection for ultra high-speed interfaces
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
10.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
11. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
IP4284CZ10-TB_TT_2
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© NXP B.V. 2010. All rights reserved.
Product data sheet
Rev. 02 — 1 April 2010
14 of 15
IP4284CZ10-TB/TT
NXP Semiconductors
ESD protection for ultra high-speed interfaces
12. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2
3
4
5
6
7
8
9
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 7
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 11
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 12
10
Legal information. . . . . . . . . . . . . . . . . . . . . . . 13
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
10.1
10.2
10.3
10.4
11
12
Contact information. . . . . . . . . . . . . . . . . . . . . 14
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 1 April 2010
Document identifier: IP4284CZ10-TB_TT_2
相关型号：
IP4284CZ10-TBR,115
IP4284CZ10-TBR; IP4284CZ10-TT - ESD protection for ultra high-speed interfaces DFN 10-Pin
NXP
IP4284CZ10-TBR/S50
IP4284CZ10-TBR; IP4284CZ10-TT - ESD protection for ultra high-speed interfaces DFN 10-Pin
NXP
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