IP4286CZ6_技术文档

IP4286CZ6

Integrated 4-channel ESD protection

Rev. 01 — 20 April 2009

Objective data sheet

1. Product proﬁle

1.1 General description

The IP4286CZ6 is designed to protect the capacitive loads of Input/Output (I/O) ports

(such as USB 2.0, Ethernet, DVI etc.) from being damaged by ElectroStatic Discharge

(ESD).

To provide ESD protection to downstream signal and supply components, the IP4286CZ6

incorporates four pairs of ultra-low capacitance rail-to-rail diodes plus two Zener diodes.

This provides protection against contact discharge voltages as high as ±8 kV in

accordance with IEC 61000-4-2, level 4.

The ESD protection is independent of the supply voltage due to the rail-to-rail diodes

being connected to a Zener diode.

The IP4286CZ6 is fabricated using monolithic silicon technology and integrates 4 ultra-low

capacitance rail-to-rail ESD protection diodes plus two Zener diodes.

1.2 Features

I Pb-free and RoHS compliant

I ESD IEC 61000-4-2 level 4, ±8 kV contact discharge compliant protection

I Four input ESD rail-to-rail protection diodes with ultra-low input capacitance of 0.6 pF

maximum

I Low-voltage clamping due to integrated Zener diodes

1.3 Applications

General-purpose downstream ESD protection high frequency analog signals and

high-speed serial data transmission for ports inside:

I PC/Notebook USB 2.0/IEEE 1394 ports

I Cellular and PCS mobile handsets

I DVI interfaces

I HDMI interfaces

I Cordless telephones

I Wireless data (WAN/LAN) systems

I PDAs

IP4286CZ6

NXP Semiconductors

Integrated 4-channel ESD protection

2. Pinning information

Table 1.

Pinning

1

Description

Simpliﬁed outline

Graphic symbol

ESD protection for I/O signals

ground

6

1

5

2

4

3

6

5

4

1

2

3

2

3

ESD protection for I/O signals

ground

4

5

TSOP6/SC-88

6

5

4

6

ESD protection for I/O signals

bottom view

1

2

3

XSON6

001aaj836

3. Ordering information

Table 2.

Ordering information

Type number

Package

Name

Description

Version

IP4286CZ6-TTD

IP4286CZ6-TBF

TSOP6

XSON6

plastic surface-mounted package (TSOP6); 6 leads

SOT457

plastic extremely thin small outline package; no leads; SOT886

6 terminals; body 1 × 1.45 × 0.5 mm

IP4286CZ6-TTY

SC-88

plastic surface-mounted package; 6 leads

SOT363

4. Limiting values

Table 3.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

Parameter

Conditions

Min

Max

Unit

V_ESD

electrostatic discharge

voltage

IEC 61000-4-2, level 4,

contact discharge

−8

+8

kV

T_stg

V_I

storage temperature

input voltage

−55

+125

+5.5

°C

−0.5

V

IP4286CZ6_1

Objective data sheet

Rev. 01 — 20 April 2009

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IP4286CZ6

NXP Semiconductors

Integrated 4-channel ESD protection

5. Characteristics

Table 4.

Characteristics

T_amb= 25 °C unless otherwise speciﬁed.

Symbol Parameter

Conditions

Min Typ Max Unit

[1]

C_(I/O-GND)input/output to ground

capacitance

pins 1, 3, 4 and 6 to ground;

V_I= 3.3 V; f = 1 MHz

-

0.6

-

pF

I_LR

reverse leakage current

pins 1, 3, 4 and 6 to ground;

V_I= 3.0 V

-

100 nA

[1]

C_(zd-GND)Zener diode to ground

capacitance

pin 5 and pin 2

-

20

-

pF

V

V_BRzd

Zener diode breakdown

voltage

pin 5 and pin 2; I = 1 mA

6

-

9

-

V_F

forward voltage

0.7

V

[1] Guaranteed by design.

6. Application information

6.1 Typical application

The IP4286CZ6 is capable of protecting both USB data lines of a USB 2.0 port from

Electrostatic Discharge and is optimized to protect two USB 2.0 ports simultaneously. A

typical application is shown in Figure 1.

V

BUS

D

GND

IP4286CZ6

V

BUS

D

GND

001aaj837

Fig 1. Application diagram for protecting two USB ports

IP4286CZ6_1

Objective data sheet

Rev. 01 — 20 April 2009

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IP4286CZ6

NXP Semiconductors

Integrated 4-channel ESD protection

7. Package outline

Plastic surface-mounted package (TSOP6); 6 leads

SOT457

D

B

E

A

X

y

H

v

M

A

E

6

5

4

Q

pin 1

index

A

1

c

1

2

3

L

p

e

b

p

w

M B

detail X

0

1

2 mm

scale

DIMENSIONS (mm are the original dimensions)

UNIT

A

b

c

D

E

e

H

L

Q

v

w

y

p

1

p

E

0.1

0.013

0.40

0.25

1.1

0.9

0.26

0.10

3.1

2.7

1.7

1.3

3.0

2.5

0.6

0.2

0.33

0.23

mm

0.95

0.2

0.1

REFERENCES

JEDEC JEITA

EUROPEAN

PROJECTION

OUTLINE

VERSION

ISSUE DATE

IEC

05-11-07

06-03-16

SOT457

SC-74

Fig 2. Package outline SOT457 (TSOP6)

IP4286CZ6_1

Objective data sheet

Rev. 01 — 20 April 2009

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IP4286CZ6

NXP Semiconductors

Integrated 4-channel ESD protection

XSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 1 x 1.45 x 0.5 mm

SOT886

b

1

2

3

4×

(2)

L

1

e

6

5

4

e

1

e

1

6×

(2)

A

1

D

E

terminal 1

index area

0

1

2 mm

scale

DIMENSIONS (mm are the original dimensions)

(1)

A

1

UNIT

b

D

E

e

L

1

max max

0.25

0.17

1.5

1.4

1.05

0.95

0.35 0.40

0.27 0.32

mm

0.5 0.04

0.6

0.5

Notes

1. Including plating thickness.

2. Can be visible in some manufacturing processes.

REFERENCES

JEDEC JEITA

OUTLINE

VERSION

EUROPEAN

PROJECTION

ISSUE DATE

IEC

04-07-15

04-07-22

SOT886

MO-252

Fig 3. Package outline SOT886 (XSON6)

IP4286CZ6_1

Objective data sheet

Rev. 01 — 20 April 2009

5 of 12

IP4286CZ6

NXP Semiconductors

Integrated 4-channel ESD protection

Plastic surface-mounted package; 6 leads

SOT363

D

B

E

A

X

y

H

v

M

A

E

6

5

4

Q

pin 1

index

A

1

2

3

c

e

1

b

p

L

p

w

M B

e

detail X

0

1

2 mm

scale

DIMENSIONS (mm are the original dimensions)

A

1

UNIT

A

b

c

D

E

e

H

L

Q

v

w

y

p

1

E

max

0.30

0.20

1.1

0.8

0.25

0.10

2.2

1.8

1.35

1.15

2.2

2.0

0.45

0.15

0.25

0.15

mm

0.1

1.3

0.65

0.2

0.1

REFERENCES

JEDEC JEITA

EUROPEAN

PROJECTION

OUTLINE

VERSION

ISSUE DATE

IEC

04-11-08

06-03-16

SOT363

SC-88

Fig 4. Package outline SOT363 (SC-88)

IP4286CZ6_1

Objective data sheet

Rev. 01 — 20 April 2009

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IP4286CZ6

NXP Semiconductors

Integrated 4-channel ESD protection

8. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reﬂow

soldering description”.

8.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for ﬁne pitch SMDs. Reﬂow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

8.2 Wave and reﬂow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reﬂow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature proﬁle. Leaded packages,

packages with solder balls, and leadless packages are all reﬂow solderable.

Key characteristics in both wave and reﬂow soldering are:

• Board speciﬁcations, including the board ﬁnish, solder masks and vias

• Package footprints, including solder thieves and orientation

• The moisture sensitivity level of the packages

• Package placement

• Inspection and repair

• Lead-free soldering versus SnPb soldering

8.3 Wave soldering

Key characteristics in wave soldering are:

• Process issues, such as application of adhesive and ﬂux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

• Solder bath speciﬁcations, including temperature and impurities

IP4286CZ6_1

Objective data sheet

Rev. 01 — 20 April 2009

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IP4286CZ6

NXP Semiconductors

Integrated 4-channel ESD protection

8.4 Reﬂow soldering

Key characteristics in reﬂow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reﬂow process usually leads to

higher minimum peak temperatures (see Figure 5) than a SnPb process, thus

reducing the process window

• Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reﬂow temperature proﬁle; this proﬁle includes preheat, reﬂow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classiﬁed in accordance with

Table 5 and 6

Table 5.

SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm³)

< 350

≥ 350

220

< 2.5

235

220

≥ 2.5

220

Table 6.

Lead-free process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm³)

< 350

260

350 to 2000

> 2000

260

< 1.6

260

250

245

1.6 to 2.5

> 2.5

260

245

250

245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reﬂow

soldering, see Figure 5.

IP4286CZ6_1

Objective data sheet

Rev. 01 — 20 April 2009

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IP4286CZ6

NXP Semiconductors

Integrated 4-channel ESD protection

maximum peak temperature

= MSL limit, damage level

temperature

minimum peak temperature

= minimum soldering temperature

peak

temperature

time

001aac844

MSL: Moisture Sensitivity Level

Fig 5. Temperature proﬁles for large and small components

For further information on temperature proﬁles, refer to Application Note AN10365

“Surface mount reﬂow soldering description”.

9. Abbreviations

Table 7.

Abbreviations

Description

Acronym

DVI

Digital Visual Interface

ESD

ElectroStatic Discharge

HDMI

LAN

High-Deﬁnition Multimedia Interface

Local Area Network

PCS

Personal Communications Services

Personal Digital Assistant

Restriction of Hazardous Substances

Universal Serial Bus

PDA

RoHS

USB

WAN

Wide Area Network

IP4286CZ6_1

Objective data sheet

Rev. 01 — 20 April 2009

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IP4286CZ6

NXP Semiconductors

Integrated 4-channel ESD protection

10. Revision history

Table 8.

Revision history

Document ID

Release date

Data sheet status

Change notice

Supersedes

IP4286CZ6_1

20090420

Objective data sheet

-

IP4286CZ6_1

Objective data sheet

Rev. 01 — 20 April 2009

10 of 12

IP4286CZ6

NXP Semiconductors

Integrated 4-channel ESD protection

11. Legal information

11.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Deﬁnition

Objective [short] data sheet

This document contains data from the objective speciﬁcation for product development.

This document contains data from the preliminary speciﬁcation.

This document contains the product speciﬁcation.

Preliminary [short] data sheet Qualiﬁcation

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Deﬁnitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

11.2 Deﬁnitions

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

11.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

11.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

12. Contact information

For more information, please visit: http://www.nxp.com

For sales ofﬁce addresses, please send an email to: salesaddresses@nxp.com

IP4286CZ6_1

Objective data sheet

Rev. 01 — 20 April 2009

11 of 12

IP4286CZ6

NXP Semiconductors

Integrated 4-channel ESD protection

13. Contents

1

Product proﬁle . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1

1.2

1.3

General description. . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

Application information. . . . . . . . . . . . . . . . . . . 3

Typical application. . . . . . . . . . . . . . . . . . . . . . . 3

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 4

3

4

5

6

6.1

7

8

Soldering of SMD packages . . . . . . . . . . . . . . . 7

Introduction to soldering . . . . . . . . . . . . . . . . . . 7

Wave and reﬂow soldering . . . . . . . . . . . . . . . . 7

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . . 7

Reﬂow soldering . . . . . . . . . . . . . . . . . . . . . . . . 8

8.1

8.2

8.3

8.4

9

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 10

10

11

Legal information. . . . . . . . . . . . . . . . . . . . . . . 11

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 11

Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11

11.1

11.2

11.3

11.4

12

13

Contact information. . . . . . . . . . . . . . . . . . . . . 11

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 20 April 2009

Document identifier: IP4286CZ6_1


型号：	IP4286CZ6
厂家：	NXP
描述：	Integrated 4-channel ESD protection 集成4通道ESD保护
文件：	总12页 (文件大小：72K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

IP4286CZ6 [NXP]

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