IP4284CZ10-TBR,115_技术文档

IP4284CZ10-TBR;

IP4284CZ10-TT

ESD protection for ultra high-speed interfaces

Rev. 3 — 19 May 2011

Product data sheet

1. Product profile

1.1 General description

The devices are designed to protect high-speed interfaces such as High-Definition

Multimedia Interface (HDMI), DisplayPort, SuperSpeed USB, external Serial Advanced

Technology Attachment (eSATA) and Low Voltage Differential Signaling (LVDS) interfaces

against ElectroStatic Discharge (ESD).

The devices include high-level ESD protection diodes for ultra high-speed signal lines and

are available in two package variants: XSON10 and TSSOP10.

All signal lines are protected by a special diode configuration offering ultra low line

capacitance of only 0.5 pF. These diodes provide protection to downstream components

from ESD voltages up to ±8 kV contact according to IEC 61000-4-2, level 4.

1.2 Features and benefits

Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen

and antimony (Dark Green compliant)

System ESD protection for USB 2.0 and USB SuperSpeed 3.0, HDMI 1.3 and

HDMI 1.4, DisplayPort, eSATA and LVDS

All signal lines with integrated rail-to-rail clamping diodes for downstream

ESD protection of ±8 kV according to IEC 61000-4-2, level 4

Matched 0.5 mm trace spacing

Signal lines with ≤ 0.05 pF matching capacitance between signal pairs

Line capacitance of only 0.5 pF for each channel

4-channel, XSON10 or TSSOP10 Pb-free package

Design-friendly ’pass-thru’ signal routing

1.3 Applications

The devices are designed for high-speed receiver and transmitter port protection:

TVs, monitors

DVD recorders and players

Notebooks, mother boards, graphic cards and ports

Set-top boxes and game consoles

IP4284CZ10-TBR/TT

NXP Semiconductors

ESD protection for ultra high-speed interfaces

2. Pinning information

Table 1.

Pinning

Symbol

Description

Simplified outline

Graphic symbol

IP4284CZ10-TBR (SOT1176-1)

1

2

3

4

5

6

7

8

9

10

CH1

CH2

GND

CH3

CH4

n.c.

channel 1 ESD protection

channel 2 ESD protection

ground

10

9

8

7

6

1

2

4

5

channel 3 ESD protection

channel 4 ESD protection

not connected

1

2

3

4

5

Transparent top view

XSON10

3, 8

018aaa001

n.c.

not connected

GND

n.c.

ground

not connected

n.c.

not connected

IP4284CZ10-TT (SOT552-1)

1

2

3

4

5

6

7

8

9

10

CH1

CH2

GND

CH3

CH4

n.c.

channel 1 ESD protection

channel 2 ESD protection

ground

1

2

4

5

10

6

channel 3 ESD protection

channel 4 ESD protection

not connected

3, 8

018aaa001

n.c.

not connected

GND

n.c.

ground

1

5

not connected

TSSOP10

n.c.

not connected

3. Ordering information

Table 2.

Ordering information

Type number

Package

Name

IP4284CZ10-TBR XSON10

Description

plastic extremely thin small outline package;

no leads; 10 terminals; body 1 × 2.5 × 0.5 mm

Version

SOT1176-1

IP4284CZ10-TT

TSSOP10 plastic thin shrink small outline package; 10 leads; SOT552-1

body width 3 mm

4. Marking

Table 3.

Marking codes

Type number

IP4284CZ10-TBR

IP4284CZ10-TT

Marking code

84

4284

IP4284CZ10-TBR_TT

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Product data sheet

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NXP Semiconductors

ESD protection for ultra high-speed interfaces

5. Limiting values

Table 4.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

V_I

Parameter

Conditions

Min

Max

Unit

input voltage

−0.5

+5.5

V

[1]

V_ESD

electrostatic discharge

voltage

IEC 61000-4-2, level 4

contact discharge

air discharge

-

±8

kV

°C

-

±15

+85

+125

T_amb

T_stg

ambient temperature

storage temperature

−40

−55

[1] All pins to ground.

6. Characteristics

Table 5.

Characteristics

T_amb= 25 °C unless otherwise specified.

Symbol

Parameter

Conditions

Min Typ Max Unit

V_BRzd

Zener diode

I_test= 1 mA

6

-

9

V

breakdown voltage

I_LRzd

Zener diode reverse

leakage current

per TMDS channel;

V_I= 3.0 V

-

1

μA

V_F

forward voltage

-

0.7

0.5

-

V

[1]

C_ch(TMDS)

TMDS channel

capacitance

f = 1 MHz;

V_bias= 2.5 V

0.4

0.7

pF

ΔC_ch(TMDS)TMDS channel

capacitance difference

f = 1 MHz;

V_bias= 2.5 V

-

0.05

0.07

-

pF

[1][2]

[3]

C_ch(mutual)

mutual channel

capacitance

f = 1 MHz;

V_bias= 2.5 V

R_dyn

dynamic resistance

I = 1 A

positive transient

negative transient

-

1

8

-

Ω

V

[4]

V_{CL(ch)trt(pos)}positive transient channel V_ESD= 8 kV

clamping voltage

[1] This parameter is guaranteed by design.

[2] Between signal pin and pin n.c.

[3] According to IEC 61000-4-5 and IEC 61000-4-9.

[4] Human Body Model (HBM) according to JESD22-A-J114D.

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Product data sheet

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ESD protection for ultra high-speed interfaces

018aaa002

018aaa003

3

0

Sdd21;

Scc21

(dB)

Sdd21;

(1)

−3

−30

−60

−90

(2)

−9

−15

6

7

8

9

10

8

9

10

f (Hz)

(1) Sdd21

(2) Scc21

Sdd21

normalized to 100 Ω;

differential pairs CH1/CH2 versus CH3/CH4

normalized to 100 Ω;

differential pairs at CH1/CH2 or at CH3/CH4

Fig 1. Mixed-mode differential and common-mode

insertion loss; typical values

Fig 2. Mixed-mode differential NEXT crosstalk;

typical values

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Product data sheet

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NXP Semiconductors

ESD protection for ultra high-speed interfaces

018aaa004

018aaa005

5 Gbit/s; USB 3.0 CP0 pattern

Fig 3. Eye diagram using reference PCB

Fig 4. Typical eye diagram for IP4284CZ10

018aaa006

0.4

C

d

(pF)

0.2

(1)

(2)

0.0

−0.2

−0.4

−0.5

1.5

3.5

5.5

V

bias

(V)

(1) Pin 2

(2) Pin 1

Deviation from typical capacitance normalized at V_bias= 2.5 V

Fig 5. Line capacitance as a function of bias voltage; typical values

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Product data sheet

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ESD protection for ultra high-speed interfaces

018aaa008

018aaa007

8.5

3.5

V

(V)

CL

V

(V)

CL

3.0

8.0

2.5

2.0

1.5

7.5

7.0

0.5

1.0

1.5

2.0

2.5

0.5

1.0

1.5

2.0

2.5

I (A)

IEC 61000-4-5; t_p= 8/20 μs; positive pulse

IEC 61000-4-5; t_p= 8/20 μs; negative pulse

Fig 6. Dynamic resistance with positive clamping

Fig 7. Dynamic resistance with negative clamping

018aaa009

018aaa010

18

0

V

(V)

CL

V

(V)

CL

−4

12

−8

−12

−16

6

0

2

4

6

8

10

12

I (A)

14

−16

−12

−8

−4

0

I (A)

t_p= 100 ns; Transmission Line Pulse (TLP)

Fig 8. Dynamic resistance with positive clamping

Fig 9. Dynamic resistance with negative clamping

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Product data sheet

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ESD protection for ultra high-speed interfaces

7. Application information

The devices are designed to provide high-level ESD protection for high-speed serial

data buses such as HDMI, DisplayPort, eSATA and LVDS data lines.

When designing the Printed-Circuit Board (PCB), careful consideration should be given to

basic high-speed routing guidelines, impedance matching, and signal coupling.

Basic application diagrams for the ESD protection of an HDMI interface are shown in

Figure 10 and Figure 11.

IP4284CZ10-TBR

TMDS_D2+

TMDS_CH2+

5

TMDS_GND

TMDS_CH2–

4

TMDS_D2–

GND

8

3

2

1

TMDS_D1+

TMDS_CH1+

TMDS_CH1–

TMDS_GND

TMDS_D1–

IP4284CZ10-TBR

TMDS_D0+

TMDS_CH2+

TMDS_CH2–

GND

5

TMDS_GND

TMDS_D0–

4

3

8

TMDS_CLK+

TMDS_GND

HDMI

CONNECTOR

TMDS_CH1+

2

1

TMDS_CH1–

TMDS_CLK-

CEC

n.c.

DDC_CLK

DDC_DAT

GND

+5 V

HOT PLUG DETECTION

6

5

4

100 nF

IP4221CZ6

1

2

3

018aaa115

Fig 10. Application diagram of HDMI ESD protection using IP4284CZ10-TBR

IP4284CZ10-TBR_TT

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Product data sheet

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ESD protection for ultra high-speed interfaces

IP4284CZ10-TT

TMDS_D2+

TMDS_GND

TMDS_D2+

TMDS_D2–

TMDS_D1+

TMDS_D1–

TMDS_GND

TMDS_D1–

IP4284CZ10-TT

TMDS_D0+

TMDS_GND

TMDS_D0–

TMDS_D0+

TMDS_D0–

TMDS_CLK+

TMDS_GND

HDMI

CONNECTOR

TMDS_CLK+

TMDS_CLK1–

TMDS_CLK–

CEC

n.c.

DDC_CLK

DDC_DAT

GND

+5 V

HOT PLUG DETECTION

100 nF

IP4220CZ6

018aaa012

Fig 11. Application diagram of HDMI ESD protection using IP4284CZ10-TT

IP4284CZ10-TBR_TT

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Product data sheet

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ESD protection for ultra high-speed interfaces

8. Package outline

XSON10: plastic extremely thin small outline package; no leads;

10 terminals; body 1 x 2.5 x 0.5 mm

SOT1176-1

X

D

B

A

E

A

1

A

3

terminal 1

index area

detail X

e

1

C

v

w

C A

B

C

terminal 1

index area

e

b

y

C

1

y

1

5

L

1

k

L

10

6

0

1

2 mm

scale

Dimensions

(1)

Unit

A

1

A

3

b

D

E

e

1

k

L

1

v

w

y

1

max 0.5 0.05

mm nom

min

0.25 2.6 1.1

0.127 0.20 2.5 1.0 0.5

0.15 2.4 0.9

0.40 0.45

0.35 0.40 0.1 0.05 0.05 0.05

0.2 0.30 0.35

2

0.00

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

sot1176-1_po

References

Outline

version

European

projection

Issue date

IEC

- - -

JEDEC

- - -

JEITA

- - -

10-06-21

10-06-22

SOT1176-1

Fig 12. Package outline SOT1176-1 (XSON10)

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Product data sheet

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NXP Semiconductors

ESD protection for ultra high-speed interfaces

TSSOP10: plastic thin shrink small outline package; 10 leads; body width 3 mm

SOT552-1

D

E

A

X

c

y

H

v

M

A

E

Z

6

10

A

(A )

2

A

3

A

1

pin 1 index

θ

L

p

L

1

5

detail X

e

w M

b

p

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

A

(1)

(2)

(1)

A

b

c

D

E

e

H

L

UNIT

v

w

y

Z

θ

1

2

3

p

E

p

max.

0.15

0.05

0.95

0.80

0.30

0.15

0.23

0.15

3.1

2.9

3.1

2.9

5.0

4.8

0.7

0.4

0.67

0.34

6°

0°

mm

1.1

0.5

0.25

0.95

0.1

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-07-29

03-02-18

SOT552-1

Fig 13. Package outline SOT552-1 (TSSOP10)

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ESD protection for ultra high-speed interfaces

9. Soldering

Footprint information for reflow soldering of XSON10 package

SOT1176-1

Hx

C

Hy Ay By

0.05

D

P

0.05

Generic footprint pattern

Refer to the package outline drawing for actual layout

solder land

solder paste deposit

solder land plus solder paste

occupied area

solder resist

Dimensions in mm

Remark:

P

Ay

By

C

D

Hx

2.45

Hy

Stencil of 75 μm is recommended.

A stencil of 75 μm gives an aspect ratio of 0.77

With a stencil of 100 μm one will obtain an aspect ratio of 0.58

0.5

1.25

0.3

0.475

0.2

1.5

sot1176-1_fr

Reflow soldering is the only recommended soldering method.

Fig 14. Reflow soldering footprint SOT1176-1 (XSON10)

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ESD protection for ultra high-speed interfaces

Footprint information for reflow soldering of TSSOP10 package

SOT552-1

Hx

Gx

P2

(0.125)

Hy Gy

By Ay

C

D2 (4x)

P1

D1

Generic footprint pattern

Refer to the package outline drawing for actual layout

solder land

occupied area

DIMENSIONS in mm

P1 P2 Ay

By

C

D1

D2

Gx

Gy

Hx

Hy

0.500 0.550 5.400 3.200 1.100 0.300 0.400 2.750 3.900 3.700 5.650

sot552-1_fr

Reflow soldering is the only recommended soldering method.

Fig 15. Reflow soldering footprint SOT552-1 (TSSOP10)

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ESD protection for ultra high-speed interfaces

10. Abbreviations

Table 6.

Abbreviations

Description

Digital Versatile Disc

Acronym

DVD

eSATA

ESD

external Serial Advanced Technology Attachment

ElectroStatic Discharge

HBM

Human Body Model

HDMI

LVDS

TLP

High-Definition Multimedia Interface

Low Voltage Differential Signaling

Near End Crosstalk

Restriction of Hazardous Substances

Transmission Line Pulse

TMDS

UTLP

Transition Minimized Differential Signaling

Ultra Thin Leadless Package

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ESD protection for ultra high-speed interfaces

11. Revision history

Table 7.

Document ID

IP4284CZ10-TBR_TT v.3 20110519

Revision history

Release date

Data sheet status

Change notice

Supersedes

Product data sheet

-

IP4284CZ10-TB_TT v.2

Modifications:

• Deleted type number IP4284CZ10-TB.

• Added type number IP4284CZ10-TBR.

• Section 4 “Marking”: added.

• Table 4 “Limiting values”: updated V_ESDvalues.

• Section 9 “Soldering”: added.

• Section 12 “Legal information”: updated.

IP4284CZ10-TB_TT v.2

IP4284CZ10-TB_TT v.1

20100401

Product data sheet

-

IP4284CZ10-TB_TT v.1

-

20100304

Preliminary data sheet

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ESD protection for ultra high-speed interfaces

12. Legal information

12.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Definition

Objective [short] data sheet

This document contains data from the objective specification for product development.

This document contains data from the preliminary specification.

This document contains the product specification.

Preliminary [short] data sheet Qualification

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Definitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

malfunction of an NXP Semiconductors product can reasonably be expected

12.2 Definitions

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

office. In case of any inconsistency or conflict with the short data sheet, the

full data sheet shall prevail.

Customers are responsible for the design and operation of their applications

and products using NXP Semiconductors products, and NXP Semiconductors

accepts no liability for any assistance with applications or customer product

design. It is customer’s sole responsibility to determine whether the NXP

Semiconductors product is suitable and fit for the customer’s applications and

products planned, as well as for the planned application and use of

customer’s third party customer(s). Customers should provide appropriate

design and operating safeguards to minimize the risks associated with their

applications and products.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default in the

customer’s applications or products, or the application or use by customer’s

third party customer(s). Customer is responsible for doing all necessary

testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications and

the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

12.3 Disclaimers

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation - lost

profits, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

No offer to sell or license — Nothing in this document may be interpreted or

construed as an offer to sell products that is open for acceptance or the grant,

conveyance or implication of any license under any copyrights, patents or

other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

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ESD protection for ultra high-speed interfaces

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

product for such automotive applications, use and specifications, and (b)

whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor tested

in accordance with automotive testing or application requirements. NXP

Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualified products in automotive equipment or applications.

12.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

13. Contact information

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

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Rev. 3 — 19 May 2011

16 of 17

IP4284CZ10-TBR/TT

NXP Semiconductors

ESD protection for ultra high-speed interfaces

14. Contents

1

Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1

1.2

1.3

General description . . . . . . . . . . . . . . . . . . . . . 1

Features and benefits. . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3

Application information. . . . . . . . . . . . . . . . . . . 7

Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 13

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 14

3

4

5

6

7

8

9

10

11

12

Legal information. . . . . . . . . . . . . . . . . . . . . . . 15

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15

Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 15

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16

12.1

12.2

12.3

12.4

13

14

Contact information. . . . . . . . . . . . . . . . . . . . . 16

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 19 May 2011

Document identifier: IP4284CZ10-TBR_TT


型号：	IP4284CZ10-TBR,115
厂家：	NXP
描述：	IP4284CZ10-TBR; IP4284CZ10-TT - ESD protection for ultra high-speed interfaces DFN 10-Pin 光电二极管
文件：	总17页 (文件大小：641K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

IP4284CZ10-TBR,115 [NXP]

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