IP4350CX24_技术文档

IP4350CX24

9-channel SD memory card interface ESD protection ﬁlter to

IEC 61000-4-2 level 4

Rev. 01 — 5 February 2010

Product data sheet

1. Product proﬁle

1.1 General description

The IP4350CX24 is a diode array designed to provide protection to downstream

components against ElectroStatic Discharge (ESD) voltages as high as 15 kV.

The IP4350CX24 integrates 9 pairs of rail-to-rail diodes, 12 Zener diodes and 15 resistors

in a single wafer-level chip-scale package. It is fabricated using monolithic silicon

semiconductor technology and measures only 1.95 mm × 2.11 mm.

These features make the IP4350CX24 ideal for use in applications requiring a high degree

of miniaturization, such as mobile phone handsets, cordless telephones and personal

digital devices.

1.2 Features

I Pb-free, RoHS compliant and free of halogen and antimony (Dark Green compliant)

I All SD memory card channels with integrated ESD protection, EMI and RF ﬁlters

I ESD protection up to 15 kV on 9 channels at output terminals

I Integrated EMI and RF ﬁlters with pull-up resistors on 5 channels

I Integrated EMI and RF ﬁlters on 4 channels

I Additional SD card power supply protection

I Wafer level chip-scale package with 0.4 mm pitch

I Write protection, card detect biasing resistor integrated

I Supports electrical card detection

I Also available as IP4352CX24 with different ﬁlter behavior, same footprint

1.3 Applications

I SD memory card interfaces in cellular and PCS mobile handsets

I Cordless telephones

I Digital still and video cameras

I Media players

I Card readers

IP4350CX24

NXP Semiconductors

9-channel SD memory card interface ESD protection ﬁlter

2. Pinning information

2.1 Pinning

bump A1

index area

IP4350CX24

1

2

3

4

5

A

B

C

D

E

001aaj749

Transparent top view

Fig 1. Pin conﬁguration IP4350CX24

2.2 Pin description

Table 1.

Pin description

Symbol

DATA2

DATA3

GND_H

SDDATA2

SDDATA3

CD

A1

A2

A3

A4

A5

B1

B2

B4

B5

C1

C2

C3

C4

C5

D1

D2

D3

D4

D5

Type^[1]

I/O

S

Description

data 2 input or output

data 3 input or output

supply ground on host side

data 2 input or output on SD card side

data 3 input or output on SD card side

card detect output

I/O

O

CMD

I/O

I

command input or output on host side

card detect intput

SDCD

SDCMD

DAT3_PD

WP

I/O

I

command input or output on SD card side

data 3 pull-down

O

write protect

DAT3_PU

SDWP

VSD

I

data 3 pull-up

O

write protect on SD card side

memory card supply voltage

write protect and card detect

clock signal input or output

card supply ground

S

WP+CD

CLK

I/O

S

GND_C

SDWP+CD

SDCLK

I/O

write protect and card detect on SD card side

clock signal on SD card side

IP4350CX24_1

Product data sheet

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IP4350CX24

NXP Semiconductors

9-channel SD memory card interface ESD protection ﬁlter

Table 1.

Pin description …continued

Symbol

DATA1

E1

E2

E3

E4

E5

Type^[1]

Description

I/O

data 1 input or output

DATA0

I/O

data 0 input or output

GND_C

SDDATA1

SDDATA0

S

card supply ground

I/O

data 1 input or output on SD card side

data 0 input or output on SD card side

I/O

[1] I = input, O = output, I/O = input and output, S = power supply.

3. Ordering information

Table 2.

Ordering information

Type number

Package

Name

WLCSP24 wafer level chip-size package; 24 bumps; 1.95 × 2.11 × 0.61 mm

Description

Version

IP4350CX24

IP4350CX24/LF

4. Functional diagram

VSD

DAT3_PU

R11

R12 R13 R14 R15

R1

R2

R3

R4

R5

R6

R7

R8

R9

CLK

SDCLK

CMD

SDCMD

DATA0

DATA1

DATA2

DATA3

CD

SDDATA0

SDDATA1

SDDATA2

SDDATA3

SDCD

WP

SDWP

WP+CD

SDWP+CD

R21

DAT3_PD

GND_H

GND_C

001aaj750

Fig 2. Schematic diagram IP4350CX24

IP4350CX24_1

Product data sheet

Rev. 01 — 5 February 2010

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IP4350CX24

NXP Semiconductors

9-channel SD memory card interface ESD protection ﬁlter

5. Limiting values

Table 3.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

V_I

Parameter

Conditions

Min

Max

Unit

input voltage

−0.5

+5.0

V

V_ESD

electrostatic discharge voltage

IEC 61000-4-2, level 4; output pins A4,

A5, B4, B5, C4, C5, D4, D5, E4, E5

with pins A3, D3, E3 as ground

[1]

contact discharge

air discharge

−8

+8

kV

−15

+15

IEC 61000-4-2, level 1, all other pins

with A3, D3, E3 as ground

contact discharge

air discharge

−2

-

+2

kV

+2

kV

P_ch

channel power dissipation

total power dissipation

storage temperature

continuous power; T_amb= 70 °C

T_amb= 70 °C

25

mW

°C

P_tot

-

100

+150

260

+85

T_stg

−55

-

T_{reﬂow(peak)}

T_amb

peak reﬂow temperature

ambient temperature

10 s maximum

°C

−30

°C

[1] Device is qualiﬁed with 1000 pulses of ±15 kV contact discharges each, according to the IEC 61000-4-2 model and far exceeds the

speciﬁed level 4 (8 kV contact discharge).

6. Characteristics

Table 4.

Characteristics

T_amb= 25 °C unless otherwise speciﬁed.

Symbol

Parameter

Conditions

R1 to R9

R11 to R14

R15

Min

12

Typ

15

Max

18

Unit

Ω

R_s(ch)

channel series resistance

35

50

65

kΩ

3.29

329

4.7

47

6.11

611

R21

[1]

C_ch

channel capacitance

including diode capacitance;

V_I= 0 V; f = 1 MHz

each data channel from SD card

to I/O interface

-

8.8

-

pF

CLK channel

DAT3_PD

DAT3_PU

VSD

-

7.8

6

-

pF

V

-

5

-

37

-

V_BR

I_LR

breakdown voltage

I_I= 1 mA

V_I= 3 V

6

-

reverse leakage current

-

100

nA

[1] Guaranteed by design.

IP4350CX24_1

Product data sheet

Rev. 01 — 5 February 2010

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IP4350CX24

NXP Semiconductors

9-channel SD memory card interface ESD protection ﬁlter

7. Frequency response

Table 5.

Symbol

α_il

Frequency response

Parameter

Conditions

Min

Typ

Max

Unit

insertion loss

all channels; R_source= 50 Ω;

R_L= 50 Ω

f < 400 MHz

-

3

dB

400 MHz < f < 800 MHz

800 MHz < f < 2.5 GHz

2.5 GHz < f < 6.0 GHz

3

6

15

25

15

Table 6.

Symbol

Time domain response^[1]

Parameter

Conditions

Min

Typ

Max

Unit

high speed R_source= 50 Ω; t_r= t_f= 2 ns^[2]

t_r

t_f

rise time

load 20 pF || 100 kΩ

load 40 pF || 100 kΩ

load 20 pF || 100 kΩ

load 40 pF || 100 kΩ

-

2.3

3.4

2.4

3.5

-

ns

fall time

[1] All rise or fall times measured using source with 0 V to 3 V steps, 10 % to 90 %.

[2] Performed on all high speed lines (channels including R1 to R9, see Figure 2).

8. Application information

8.1 Insertion loss

The insertion loss measurement conﬁguration of a typical NetWork Analyzer (NWA)

system is shown in Figure 3. The insertion loss is measured with a test PCB utilizing laser

drilled micro-via holes that connect the PCB ground plane to the IP4350CX24 ground

pins.

DUT

IN

OUT

50 Ω

TEST BOARD

V

gen

001aai718

Fig 3. Frequency response set-up

The frequency response curves for all channels at frequencies up to 6 GHz are shown in

Figure 4 to Figure 7.

IP4350CX24_1

Product data sheet

Rev. 01 — 5 February 2010

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IP4350CX24

NXP Semiconductors

9-channel SD memory card interface ESD protection ﬁlter

001aaj751

0

s

21

(dB)

−10

−20

−30

−40

(2)

(1)

−1

2

3

4

10

1

10

f (MHz)

(1) pin A1 to pin A4

(2) pin A2 to pin A5

Fig 4. Measured insertion loss magnitudes

001aaj752

0

s

21

(dB)

(1)

−10

(2)

−20

−30

−40

(3)

−1

2

3

4

10

1

10

f (MHz)

(1) pin B1 to pin B4

(2) pin B2 to pin B5

(3) pin C2 to pin C5

Fig 5. Measured insertion loss magnitudes

IP4350CX24_1

Product data sheet

Rev. 01 — 5 February 2010

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IP4350CX24

NXP Semiconductors

9-channel SD memory card interface ESD protection ﬁlter

001aak050

0

s

(dB)

21

(2)

−10

−20

−30

−40

(1)

−1

2

3

4

10

1

10

f (MHz)

(1) pin D1 to pin D4

(2) pin D2 to pin D5

Fig 6. Measured insertion loss magnitudes

001aak051

0

s

21

(dB)

−10

(2)

−20

−30

−40

(1)

−1

2

3

4

10

1

10

f (MHz)

(1) pin E1 to pin E4

(2) pin E2 to pin E5

Fig 7. Measured insertion loss magnitudes

8.2 Crosstalk

The set-up for crosstalk measurements in a 50 Ω NWA system from one channel to

another is shown in Figure 8. Typical examples of crosstalk measurement results are

depicted in Figure 9, Figure 10 and Figure 11. Unused channels are terminated with 50 Ω

to ground.

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Product data sheet

Rev. 01 — 5 February 2010

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IP4350CX24

NXP Semiconductors

9-channel SD memory card interface ESD protection ﬁlter

IN_1

IN_2

OUT_2

OUT_1

DUT

50 Ω

TEST BOARD

50 Ω

V

gen

001aag220

Fig 8. Crosstalk measurement conﬁguration

001aaj797

−20

α

(1)

ct

(dB)

−40

(2)

−60

−80

−100

−1

2

3

4

10

1

10

f (MHz)

(1) pin A1 to pin B4

(2) pin A1 to pin E4

Fig 9. Crosstalk behavior between adjacent channels

IP4350CX24_1

Product data sheet

Rev. 01 — 5 February 2010

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IP4350CX24

NXP Semiconductors

9-channel SD memory card interface ESD protection ﬁlter

001aaj795

−20

α

ct

(2)

(dB)

−40

(1)

−60

−80

−100

−1

2

3

4

10

1

10

f (MHz)

(1) pin A2 to pin E5

(2) pin A2 to pin B5

Fig 10. Crosstalk behavior between adjacent channels

001aaj796

−20

α

ct

(dB)

−40

(2)

(1)

−60

−80

−100

−1

2

3

4

10

1

10

f (MHz)

(1) pin C2 to pin E5

(2) pin C2 to pin D5

Fig 11. Crosstalk behavior between adjacent channels

IP4350CX24_1

Product data sheet

Rev. 01 — 5 February 2010

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IP4350CX24

NXP Semiconductors

9-channel SD memory card interface ESD protection ﬁlter

9. Package outline

WLCSP24: wafer level chip-size package; 24 bumps; 1.95 x 2.11 x 0.61 mm

IP4350CX24

D

B

A

bump A1

index area

A

2

E

A

1

detail X

e

1

e

b

E

e

D

C

B

A

e

2

X

1

2

3

4

5

0

e

1

2 mm

scale

Dimensions

Unit

A

b

D

E

e

2

1

2

1

max 0.66 0.22

0.31 2.00 2.16

mm nom 0.61 0.20 0.41 0.26 1.95 2.11 0.4 1.6 1.6

min 0.56 0.18

0.21 1.90 2.06

ip4350cx24_lf_po

Issue date

References

Outline

version

European

projection

IEC

JEDEC

JEITA

09-04-06

09-07-15

IP4350CX24

Fig 12. Package outline IP4350CX24/LF (WLCSP24)

IP4350CX24_1

Product data sheet

Rev. 01 — 5 February 2010

10 of 16

IP4350CX24

NXP Semiconductors

9-channel SD memory card interface ESD protection ﬁlter

10. Soldering of WLCSP packages

10.1 Introduction to soldering WLCSP packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering WLCSP (Wafer Level Chip-Size Packages) can be found in application note

AN10439 “Wafer Level Chip Scale Package” and in application note AN10365 “Surface

mount reﬂow soldering description”.

Wave soldering is not suitable for this package.

All NXP WLCSP packages are lead-free.

10.2 Board mounting

Board mounting of a WLCSP requires several steps:

1. Solder paste printing on the PCB

2. Component placement with a pick and place machine

3. The reﬂow soldering itself

10.3 Reﬂow soldering

Key characteristics in reﬂow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reﬂow process usually leads to

higher minimum peak temperatures (see Figure 13) than a PbSn process, thus

reducing the process window

• Solder paste printing issues, such as smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reﬂow temperature proﬁle; this proﬁle includes preheat, reﬂow (in which the board is

heated to the peak temperature), and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic) while being low enough that the packages and/or boards are not

damaged. The peak temperature of the package depends on package thickness and

volume and is classiﬁed in accordance with Table 7.

Table 7.

Lead-free process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm³)

< 350

260

350 to 2000

260

> 2000

260

< 1.6

1.6 to 2.5

> 2.5

260

250

245

250

245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reﬂow

soldering, see Figure 13.

IP4350CX24_1

Product data sheet

Rev. 01 — 5 February 2010

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IP4350CX24

NXP Semiconductors

9-channel SD memory card interface ESD protection ﬁlter

maximum peak temperature

= MSL limit, damage level

temperature

minimum peak temperature

= minimum soldering temperature

peak

temperature

time

001aac844

MSL: Moisture Sensitivity Level

Fig 13. Temperature proﬁles for large and small components

For further information on temperature proﬁles, refer to application note AN10365

“Surface mount reﬂow soldering description”.

10.3.1 Stand off

The stand off between the substrate and the chip is determined by:

• The amount of printed solder on the substrate

• The size of the solder land on the substrate

• The bump height on the chip

The higher the stand off, the better the stresses are released due to TEC (Thermal

Expansion Coefﬁcient) differences between substrate and chip.

10.3.2 Quality of solder joint

A ﬂip-chip joint is considered to be a good joint when the entire solder land has been

wetted by the solder from the bump. The surface of the joint should be smooth and the

shape symmetrical. The soldered joints on a chip should be uniform. Voids in the bumps

after reﬂow can occur during the reﬂow process in bumps with high ratio of bump diameter

to bump height, i.e. low bumps with large diameter. No failures have been found to be

related to these voids. Solder joint inspection after reﬂow can be done with X-ray to

monitor defects such as bridging, open circuits and voids.

10.3.3 Rework

In general, rework is not recommended. By rework we mean the process of removing the

chip from the substrate and replacing it with a new chip. If a chip is removed from the

substrate, most solder balls of the chip will be damaged. In that case it is recommended

not to re-use the chip again.

IP4350CX24_1

Product data sheet

Rev. 01 — 5 February 2010

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IP4350CX24

NXP Semiconductors

9-channel SD memory card interface ESD protection ﬁlter

Device removal can be done when the substrate is heated until it is certain that all solder

joints are molten. The chip can then be carefully removed from the substrate without

damaging the tracks and solder lands on the substrate. Removing the device must be

done using plastic tweezers, because metal tweezers can damage the silicon. The

surface of the substrate should be carefully cleaned and all solder and ﬂux residues

and/or underﬁll removed. When a new chip is placed on the substrate, use the ﬂux

process instead of solder on the solder lands. Apply ﬂux on the bumps at the chip side as

well as on the solder pads on the substrate. Place and align the new chip while viewing

with a microscope. To reﬂow the solder, use the solder proﬁle shown in application note

AN10365 “Surface mount reﬂow soldering description”.

10.3.4 Cleaning

Cleaning can be done after reﬂow soldering.

11. Abbreviations

Table 8.

Abbreviations

Description

Acronym

DUT

EMI

Device Under Test

ElectroMagnetic Interference

ElectroStatic Discharge

NetWork Analyzer

ESD

NWA

PCB

PCS

RFI

Printed-Circuit Board

Personal Communication System

Radio Frequency Interference

Restriction of Hazardous Substances

Secure Digital

RoHS

SD

12. Revision history

Table 9.

Revision history

Document ID

Release date

20100205

Data sheet status

Change notice

Supersedes

IP4350CX24_1

Product data sheet

-

IP4350CX24_1

Product data sheet

Rev. 01 — 5 February 2010

13 of 16

IP4350CX24

NXP Semiconductors

9-channel SD memory card interface ESD protection ﬁlter

13. Legal information

13.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Deﬁnition

Objective [short] data sheet

This document contains data from the objective speciﬁcation for product development.

This document contains data from the preliminary speciﬁcation.

This document contains the product speciﬁcation.

Preliminary [short] data sheet Qualiﬁcation

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Deﬁnitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

malfunction of an NXP Semiconductors product can reasonably be expected

13.2 Deﬁnitions

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on a weakness or default in the

customer application/use or the application/use of customer’s third party

customer(s) (hereinafter both referred to as “Application”). It is customer’s

sole responsibility to check whether the NXP Semiconductors product is

suitable and ﬁt for the Application planned. Customer has to do all necessary

testing for the Application in order to avoid a default of the Application and the

product. NXP Semiconductors does not accept any liability in this respect.

Product speciﬁcation — The information and data provided in a Product

data sheet shall deﬁne the speciﬁcation of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product is

deemed to offer functions and qualities beyond those described in the

Product data sheet.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those given in

the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

13.3 Disclaimers

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/proﬁle/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

Limited warranty and liability — Information in this document is believed to

be accurate and reliable. However, NXP Semiconductors does not give any

representations or warranties, expressed or implied, as to the accuracy or

completeness of such information and shall have no liability for the

consequences of use of such information.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation -

lost proﬁts, lost savings, business interruption, costs related to the removal or

replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from national authorities.

Non-automotive qualiﬁed products — Unless the data sheet of an NXP

Semiconductors product expressly states that the product is automotive

qualiﬁed, the product is not suitable for automotive use. It is neither qualiﬁed

nor tested in accordance with automotive testing or application requirements.

NXP Semiconductors accepts no liability for inclusion and/or use of

non-automotive qualiﬁed products in automotive equipment or applications.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

In the event that customer uses the product for design-in and use in

automotive applications to automotive speciﬁcations and standards, customer

(a) shall use the product without NXP Semiconductors’ warranty of the

IP4350CX24_1

Product data sheet

Rev. 01 — 5 February 2010

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IP4350CX24

NXP Semiconductors

9-channel SD memory card interface ESD protection ﬁlter

product for such automotive applications, use and speciﬁcations, and (b)

13.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

whenever customer uses the product for automotive applications beyond NXP

Semiconductors’ speciﬁcations such use shall be solely at customer’s own

risk, and (c) customer fully indemniﬁes NXP Semiconductors for any liability,

damages or failed product claims resulting from customer design and use of

the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product speciﬁcations.

14. Contact information

For more information, please visit: http://www.nxp.com

For sales ofﬁce addresses, please send an email to: salesaddresses@nxp.com

IP4350CX24_1

Product data sheet

Rev. 01 — 5 February 2010

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9-channel SD memory card interface ESD protection ﬁlter

15. Contents

1

Product proﬁle . . . . . . . . . . . . . . . . . . . . . . . . . . 1

General description. . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

1.1

1.2

1.3

2

2.1

2.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 2

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 2

3

4

5

6

7

Ordering information. . . . . . . . . . . . . . . . . . . . . 3

Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4

Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4

Frequency response . . . . . . . . . . . . . . . . . . . . . 5

8

8.1

8.2

Application information. . . . . . . . . . . . . . . . . . . 5

Insertion loss . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Crosstalk. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7

9

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10

10

10.1

10.2

10.3

10.3.1

10.3.2

10.3.3

10.3.4

Soldering of WLCSP packages. . . . . . . . . . . . 11

Introduction to soldering WLCSP packages . . 11

Board mounting . . . . . . . . . . . . . . . . . . . . . . . 11

Reﬂow soldering . . . . . . . . . . . . . . . . . . . . . . . 11

Stand off . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Quality of solder joint . . . . . . . . . . . . . . . . . . . 12

Rework . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12

Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13

11

12

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 13

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13

13

Legal information. . . . . . . . . . . . . . . . . . . . . . . 14

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14

Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 14

Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15

13.1

13.2

13.3

13.4

14

15

Contact information. . . . . . . . . . . . . . . . . . . . . 15

Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 5 February 2010

Document identifier: IP4350CX24_1


型号：	IP4350CX24
厂家：	NXP
描述：	9-channel SD memory card interface ESD protection filter to IEC 61000-4-2 level 4 9通道SD存储卡接口的ESD保护滤波器符合IEC 61000-4-2 4级存储
文件：	总16页 (文件大小：110K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

IP4350CX24 [NXP]

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