ISP1520BD-S_技术文档

ISP1520

Hi-Speed Universal Serial Bus hub controller

Rev. 02 — 04 May 2004

Product data

1. General description

The ISP1520 is a stand-alone Universal Serial Bus (USB) hub controller IC that

complies with Universal Serial Bus Speciﬁcation Rev. 2.0. It supports data transfer at

high-speed (480 Mbit/s), full-speed (12 Mbit/s) and low-speed (1.5 Mbit/s).

The upstream facing port can be connected to a Hi-Speed USB host or hub or to an

Original USB host or hub. If the upstream facing port is connected to a Hi-Speed USB

host or hub, then the ISP1520 will operate as a Hi-Speed USB hub. That is, it will

support high-speed, full-speed and low-speed devices connected to its downstream

facing ports. If the upstream facing port is connected to an Original USB host or hub,

then the ISP1520 will operate as an Original USB hub. That is, high-speed devices

that are connected to its downstream facing ports will operate in full-speed mode

instead.

The ISP1520 is a full hardware USB hub controller. All Original USB devices

connected to the downstream facing ports are handled using a single Transaction

Translator (TT), when operating in a cross-version environment. This allows the

whole 480 Mbit/s upstream bandwidth to be shared by all the Original USB devices

on its downstream facing ports.

The ISP1520 has four downstream facing ports. If not used, ports 3 and 4 can be

disabled. The vendor ID, product ID and string descriptors on the hub are supplied by

the internal ROM; they can also be supplied by an external I²C-bus™ EEPROM or a

microcontroller.

The ISP1520 IC is suitable for self-powered hub designs.

An analog overcurrent detection circuitry is built into the ISP1520, which can also

accept digital overcurrent signals from external circuits; for example, Micrel MOSFET

switch MIC2026. The circuitry can be conﬁgured to trip on a global or an individual

overcurrent condition.

Each port comes with two status indicator LEDs.

Target applications of the ISP1520 are monitor hubs, docking stations for notebooks,

internal USB hub for motherboards, hub for extending Intel^®Easy PCs, hub boxes,

and so on.

ISP1520

Hi-Speed USB hub controller

Philips Semiconductors

2. Features

■ Complies with:

◆ Universal Serial Bus Speciﬁcation Rev. 2.0

◆ Advanced Conﬁguration and Power Interface (ACPI™), OnNow™ and USB

power management requirements.

■ Supports data transfer at high-speed (480 Mbit/s), full-speed (12 Mbit/s) and

low-speed (1.5 Mbit/s)

■ Self-powered capability

■ USB suspend mode support

■ Conﬁgurable number of ports

■ Internal power-on reset and low voltage reset circuit

■ Port status indicators

■ Integrates high performance USB interface device with hub handler, Philips Serial

Interface Engine (SIE) and transceivers

■ Built-in overcurrent detection circuit

■ Individual or ganged power switching, individual or global overcurrent protection,

and non-removable port support by I/O pins conﬁguration

■ Simple I²C-bus (master/slave) interface to read device descriptor parameters,

language ID, manufacturer ID, product ID, serial number ID and string descriptors

from a dedicated external EEPROM, or to allow the microcontroller to set up hub

descriptors

■ Visual USB trafﬁc monitoring (GoodLink™) for the upstream facing port

■ Uses 12 MHz crystal oscillator with on-chip Phase-Locked Loop (PLL) for low

ElectroMagnetic Interference (EMI)

■ Full industrial operating temperature range from 0 °C to 70 °C

■ Available in LQFP64 package.

3. Applications

■ Monitor hubs

■ Docking stations for notebooks

■ Internal hub for USB motherboards

■ Hub for extending Easy PCs

■ Hub boxes.

9397 750 11689

Product data

Rev. 02 — 04 May 2004

2 of 51

ISP1520

Hi-Speed USB hub controller

Philips Semiconductors

4. Abbreviations

ACPI — Advanced Conﬁguration and Power Interface

EMI — ElectroMagnetic Interference

ESD — ElectroStatic Discharge

NAK — Not AcKnowledge

PID — Packet Identiﬁer

PLL — Phase-Locked Loop

SIE — Serial Interface Engine

TT — Transaction Translator

USB — Universal Serial Bus.

5. Ordering information

Table 1:

Ordering information

Type number Package

Name

Description

Version

ISP1520BD

LQFP64 plastic low proﬁle quad ﬂat package; 64 leads; body SOT314-2

10 × 10 × 1.4 mm

9397 750 11689

Product data

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ISP1520

Hi-Speed USB hub controller

Philips Semiconductors

7. Pinning information

7.1 Pinning

1

48

47

46

45

DP4

SUSPEND

2

GND

DM4

GND

DM0

3

4

DP0

RPU

V

CC2

5

44 DP3

GND

6

43

42

41

40

39

38

DM3

GND

RREF

7

TEST_HIGH

8

V

ISP1520BD

CC4

V

9

GND

CC1

10

11

V

GND

CC1

V

TEST_HIGH

CC4

TEST_HIGH 12

37 DP2

V

13

14

15

16

36

35

34

DM2

CC2

GND

DM1

DP1

GND

XTAL2

33 XTAL1

004aaa164

Fig 2. Pin conﬁguration.

7.2 Pin description

Table 2:

Pin description^[1]

Symbol^[2]

Type

Description

SUSPEND

1

O

suspend indicator output; HIGH indicates that the hub is in

the suspend mode

GND

DM0

DP0

RPU

2

3

4

5

-

ground supply

AI/O

AI

upstream facing port D− connection (analog)

upstream facing port D+ connection (analog)

pull-up resistor connection; connect this pin through a

resistor of 1.5 kΩ ± 5 % to 3.3 V

GND

6

-

ground supply

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ISP1520

Hi-Speed USB hub controller

Philips Semiconductors

Table 2:

Pin description^[1]…continued

Symbol^[2]

Type

Description

RREF

7

AI

reference resistor connection; connect this pin through a

resistor of 12 kΩ ± 1 % to an analog band gap ground

reference

TEST_HIGH

V_CC1

8

-

test pin; connect to 3.3 V

9

-

analog supply voltage 1 (3.3 V)

ground supply

GND

10

11

12

13

14

15

16

17

18

19

-

V_CC4

-

crystal and PLL supply voltage 4 (3.3 V)

test pin; connect to 3.3 V

TEST_HIGH

V_CC2

-

transceiver supply voltage 2 (3.3 V)

GND

-

ground supply

DM1

AI/O

-

downstream facing port 1 D− connection (analog)^[3]

downstream facing port 1 D+ connection (analog)^[3]

connect to GND

DP1

TEST_LOW

TEST_HIGH

OC1_N

-

connect to +5.0 V through a 10 kΩ resistor

AI/I

overcurrent sense input for downstream facing port 1

(analog/digital)

PSW1_N

20

I/O

output — power switch control output (open-drain) with an

internal pull-up resistor for downstream facing port 1

input — function of the pin when used as an input is given in

Table 5

GND

21

22

23

24

-

ground supply

GND

ground supply

V_CC3

digital supply voltage 3 (3.3 V)

V_REF(5V0)

reference voltage (5 V ± 5 %); used to power internal pull-up

resistors of PSWn_N pins and also for the analog

overcurrent detection

OC4_N

25

26

AI/I

I/O

overcurrent sense input for downstream facing port 4

(analog/digital)

PSW4_N

output — power switch control output (open-drain) with an

internal pull-up resistor for downstream facing port 4

input — function of the pin when used as an input is given in

Table 5

OC3_N

27

28

AI/I

I/O

overcurrent sense input for downstream facing port 3

(analog/digital)

PSW3_N

output — power switch control output (open-drain) with an

internal pull-up resistor for downstream facing port 3

input — function of the pin when used as an input is given in

Table 5

OC2_N

29

30

AI/I

I/O

overcurrent sense input for downstream facing port 2

(analog/digital)

PSW2_N

output — power switch control output (open-drain) with an

internal pull-up resistor for downstream facing port 2

input — function of the pin when used as an input is given in

Table 5

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ISP1520

Hi-Speed USB hub controller

Philips Semiconductors

Table 2:

Pin description^[1]…continued

Symbol^[2]

Type

Description

RESET_N

31

I

asynchronous reset input; when reset is active, the internal

switch to the 1.5 kΩ external resistor is opened, and all pins

DPn and DMn are three-state; it is recommended that you

connect to V_BUSthrough an RC circuit; refer to the

schematics in the ISP1520 Hub Demo Board User’s Guide

ADOC

32

I

analog or digital overcurrent detect selection input; a LOW

selects the digital mode and a HIGH (3.3 V) selects the

analog mode

XTAL1

XTAL2

GND

33

34

35

36

37

38

39

40

41

42

43

44

45

46

47

48

49

I

crystal oscillator input (12 MHz)

O

crystal oscillator output (12 MHz)

-

ground supply

DM2

AI/O

downstream facing port 2 D− connection (analog)^[3]

downstream facing port 2 D+ connection (analog)^[3]

test pin; connect to 3.3 V

DP2

AI/O

TEST_HIGH

V_CC1

-

analog supply voltage 1 (3.3 V)

GND

-

ground supply

V_CC4

-

crystal and PLL supply voltage 4 (3.3 V)

GND

-

ground supply

DM3

AI/O

downstream facing port 3 D− connection (analog)^[4]

downstream facing port 3 D+ connection (analog)^[4]

transceiver supply voltage 2 (3.3 V)

ground supply

downstream facing port 4 D− connection (analog)^[4]

downstream facing port 4 D+ connection (analog)^[4]

DP3

AI/O

V_CC2

-

GND

-

DM4

AI/O

I

DP4

NOOC

no overcurrent protection selection input; connect this pin to

HIGH (3.3 V) to select no overcurrent protection; if no

overcurrent is selected, all OCn_N pins must be connected

to V_REF(5V0)

GRN4_N

AMB4_N

GRN3_N

AMB3_N

50

51

52

53

I/O

output — green LED port indicator (open-drain) for

downstream facing port 4

input — function of the pin when used as an input is given in

Table 9

output — amber LED port indicator (open-drain) for

downstream facing port 4

input — function of the pin when used as an input is given in

Table 8

output — green LED port indicator (open-drain) for

downstream facing port 3

input — function of the pin when used as an input is given in

Table 9

output — amber LED port indicator (open-drain) for

downstream facing port 3

input — function of the pin when used as an input is given in

Table 8

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ISP1520

Hi-Speed USB hub controller

Philips Semiconductors

Table 2:

Pin description^[1]…continued

Symbol^[2]

Type

Description

GRN2_N

54

I/O

output — green LED port indicator (open-drain) for

downstream facing port 2

input — function of the pin when used as an input is given in

Table 9

AMB2_N

55

56

I/O

output — amber LED port indicator (open-drain) for

downstream facing port 2

input — function of the pin when used as an input is given in

Table 8

V_REF(5V0)

-

reference voltage (5 V ± 5 %); used to power internal pull-up

resistors of PSWn_N pins and also for the analog

overcurrent detection

V_CC3

57

58

59

60

-

digital supply voltage 3 (3.3 V)

ground supply

GND

-

GND

-

ground supply

GRN1_N

I/O

output — green LED port indicator (open-drain) for

downstream facing port 1

input — function of the pin when used as an input is given in

Table 9

AMB1_N

61

62

I/O

O

output — amber LED port indicator (open-drain) for

downstream facing port 1

input — function of the pin when used as an input is given in

Table 8

HUBGL_N

hub GoodLink LED indicator output; the LED is off until the

hub is conﬁgured; a transaction between the host and the

hub will blink the LED off for 100 ms; this LED is off in the

suspend mode (open-drain)

SCL

SDA

63

64

I/O

I²C-bus clock (open-drain); see Table 11

I²C-bus data (open-drain); see Table 11

[1] The maximum current the ISP1520 can sink on a pin is 8 mA.

[2] Symbol names ending with underscore N (for example, NAME_N) represent active LOW signals.

[3] Downstream ports 1 and 2 cannot be disabled.

[4] To disable a downstream port n, connect both pins DPn and DMn to V_CC(3.3 V); unused ports must

be disabled in reverse order starting from port 4.

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ISP1520

Hi-Speed USB hub controller

Philips Semiconductors

8. Functional description

8.1 Analog transceivers

The integrated transceivers directly interface to USB lines. They can transmit and

receive serial data at high-speed (480 Mbit/s), full-speed (12 Mbit/s) and low-speed

(1.5 Mbit/s).

8.2 Hub controller core

The main components of the hub core are:

• Philips Serial Interface Engine (SIE)

• Routing logic

• Transaction Translator (TT)

• Mini-host controller

• Hub repeater

• Hub controller

• Port controller

• Bit clock recovery.

8.2.1 Philips serial interface engine

The Philips SIE implements the full USB protocol layer. It is completely hardwired for

speed and needs no ﬁrmware intervention. The functions of this block include:

synchronization, pattern recognition, parallel or serial conversion, bit (de-)stufﬁng,

CRC checking and generation, Packet IDentiﬁer veriﬁcation and generation, address

recognition, and handshake evaluation and generation.

8.2.2 Routing logic

The routing logic directs signaling to the appropriate modules (mini-host controller,

Original USB repeater and Hi-Speed USB repeater) according to the topology in

which the hub is placed.

8.2.3 Transaction translator

The TT acts as a go-between mechanism that links devices operating in the Original

USB mode and the Hi-Speed USB upstream mode. For the ‘IN’ direction, data is

concatenated in TT buffers till the proper length is reached, before the host takes the

transaction. In the reverse direction (OUT), the mini-host dispenses the data

contained in TT buffers over a period that ﬁts into the Original USB bandwidth. This

continues until all outgoing data is emptied. TT buffers are used only on split

transactions.

8.2.4 Mini-host controller

The internal mini-host generates all the Original USB IN, OUT or SETUP tokens for

the downstream facing ports, while the upstream facing port is in the high-speed

mode. The responses from the Original USB devices are collected in TT buffers, until

the end of the complete split transaction clears the TT buffers.

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ISP1520

Hi-Speed USB hub controller

Philips Semiconductors

8.2.5 Hub repeater

A hub repeater is responsible for managing connectivity on a per packet basis. It

implements packet signaling connectivity and resume connectivity. There are two

repeaters in the ISP1520: a Hi-Speed USB repeater and an Original USB repeater.

The only major difference between these two repeaters is the speed at which they

operate. When the hub is connected to an Original USB system, it automatically

switches itself to function as a pure Original USB hub.

8.2.6 Hub and port controllers

The hub controller provides status report. The port controller provides control for

individual downstream facing port; it controls the port routing module. Any port status

change will be reported to the host via the hub status change (interrupt) endpoint.

8.2.7 Bit clock recovery

The bit clock recovery circuit extracts the clock from the incoming USB data stream.

8.3 Phase-locked loop clock multiplier

A 12 MHz to 480 MHz clock multiplier PLL is integrated on-chip. This allows the use

of low-cost 12 MHz crystals. The low crystal frequency also minimizes

ElectroMagnetic Interference (EMI). No external components are required for the

operation of the PLL.

8.4 I²C-bus controller

A simple serial I²C-bus interface is provided to transfer vendor ID, product ID and

string descriptor from an external I²C-bus EEPROM (for example, Philips PCF8582 or

equivalent) or microcontroller. A master/slave I²C-bus protocol is implemented

according to the timing requirements as mentioned in the I²C-bus standard

speciﬁcations. The maximum data count during I²C-bus transfers for the ISP1520 is

256 bytes.

8.5 Overcurrent detection circuit

An overcurrent detection circuit is integrated on-chip. The main features of this circuit

are: self reporting, automatic resetting, low-trip time and low cost. This circuit offers

an easy solution at no extra hardware cost on the board.

8.6 GoodLink

Indication of a good USB connection is provided through GoodLink technology. An

LED can be directly connected to pin HUBGL_N via an external 330 Ω resistor.

During enumeration, the LED blinks on momentarily. After successful conﬁguration,

the LED blinks off for 100 ms upon each transaction.

This feature provides a user-friendly indication of the status of the hub, the connected

downstream devices and the USB trafﬁc. It is a useful diagnostics tool to isolate faulty

USB equipment and helps to reduce ﬁeld support and hotline costs.

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ISP1520

Hi-Speed USB hub controller

Philips Semiconductors

8.7 Power-on reset

The ISP1520 has an internal Power-On Reset (POR) circuit.

The triggering voltage of the POR circuit is 2.03 V nominal. A POR is automatically

generated when V_CCgoes below the trigger voltage for a duration longer than 1 µs.

POR

V

CC

≤ 683 µs

2.03 V

0 V

t

1

004aaa388

At t₁: clock is running and available.

Fig 3. Power-on reset timing.

POR

EXTERNAL CLOCK

004aaa365

A

Stable external clock is to be available at A.

Fig 4. External clock with respect to power-on reset.

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ISP1520

Hi-Speed USB hub controller

Philips Semiconductors

9. Conﬁguration selections

The ISP1520 is conﬁgured through I/O pins and, optionally, through an external

I²C-bus, in which case the hub can update its conﬁguration descriptors as a master or

as a slave.

Table 3 shows the conﬁguration parameters.

Table 3:

Conﬁguration parameters

Mode and selection

Option

Conﬁguration method

Pin control

Software control

Affected ﬁeld

Control pin

Reference

Number of downstream 2 ports

DM1/DP1 to

DM4/DP4

see Section 9.1.1 bNbrPorts0

see Table 22

facing ports

3 ports

4 ports

Power switching mode ganged

PSW1_N to

see Section 9.1.2 wHubCharacteristics:

bits D1 and D0

see Table 22

multiple ganged^[1]PSW4_N

individual

bPwrOn2PwrGood:

time interval

Overcurrent protection none

mode

NOOC and

OC1_N to

OC4_N

see Section 9.1.3 wHubCharacteristics:

bits D4 and D3

see Table 22

global^[2]

multiple ganged

individual

Non-removable ports

any port can be

non-removable

AMBn_N

see Section 9.1.4 wHubCharacteristics:

bit D2 (compound hub)

DeviceRemovable:

bit map

Port indicator support

no

yes

all GRNn_N

see Section 9.1.5 wHubCharacteristics:

bit D7

see Table 22

[1] Multiple ganged power mode is reported as individual power mode; refer to the USB 2.0 speciﬁcation.

[2] When the hub uses the global overcurrent protection mode, the overcurrent indication is through the wHubStatus ﬁeld bit 1 (overcurrent)

and the corresponding change bit (overcurrent change).

9.1 Conﬁguration through I/O pins

9.1.1 Number of downstream facing ports

To discount a physical downstream facing port, connect pins DP and DM of that

downstream facing port to V_CC(3.3 V) starting from the highest port number (4).

The sum of physical ports conﬁgured is reﬂected in the bNbrPorts ﬁeld.

Table 4:

Downstream facing port number pin conﬁguration

Number of physical

DM1/DP1

DM2/DP2

DM3/DP3

DM4/DP4

downstream facing port

4

3

2

15 kΩ

pull-down

15 kΩ

pull-down

15 kΩ

pull-down

15 kΩ

pull-down

15 kΩ

pull-down

15 kΩ

pull-down

15 kΩ

pull-down

V_CC

15 kΩ

V_CC

pull-down

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ISP1520

Hi-Speed USB hub controller

Philips Semiconductors

9.1.2 Power switching

Power switching of downstream ports can be done individually or ganged, where all

ports are simultaneously switched with one power switch. The ISP1520 supports both

modes, which can be selected using input PSWn_N; see Table 5.

Voltage drop requirements: Self-powered hubs are required to provide a minimum

of 4.75 V to its output port connectors at all legal load conditions. To comply with

Underwriters Laboratory Inc. (UL) safety requirements, the power from any port must

be limited to 25 W (5 A at 5 V). Overcurrent protection may be implemented on a

global or individual basis.

Assuming a 5 V ± 3 % power supply, the worst-case supply voltage is 4.85 V. This

only allows a voltage drop of 100 mV across the hub Printed-Circuit Board (PCB) to

each downstream connector. This includes a voltage drop across the:

• Power supply connector

• Hub PCB (power and ground traces, ferrite beads)

• Power switch (FET on-resistance)

• Overcurrent sense device.

The PCB resistance and power supply connector resistance may cause a drop of

25 mV, leaving only 75 mV as the voltage drop allowed across the power switch and

overcurrent sense device. The individual voltage drop components are shown in

Figure 5.

For global overcurrent detection, an increased voltage drop is needed for the

overcurrent sense device (in this case, a low-ohmic resistor). This can be realized by

using a special power supply of 5.1 V ± 3 %, as shown in Figure 6.

voltage drop

75 mV

voltage drop

25 mV

4.85 V (min)

4.75 V (min)

V

5 V

+

−

BUS

POWER SUPPLY

± 3 % regulated

hub board

resistance

D+

(1)

downstream

port

low-ohmic

PMOS switch

D−

connector

ISP1520

power switch

GND

SHIELD

(PSWn_N)

004aaa261

(1) Includes PCB traces, ferrite beads, and so on.

Fig 5. Typical voltage drop components in the self-powered mode using individual overcurrent detection.

voltage drop

100 mV

voltage drop

75 mV

voltage drop

25 mV

4.95 V (min)

4.75 V (min)

V

5.1 V KICK-UP

POWER SUPPLY

± 3 % regulated

+

−

BUS

low-ohmic

sense resistor

for overcurrent

detection

hub board

resistance

D+

(1)

downstream

port

connector

low-ohmic

PMOS switch

D−

ISP1520

power switch

GND

SHIELD

(PSWn_N)

004aaa262

(1) Includes PCB traces, ferrite beads, and so on.

Fig 6. Typical voltage drop components in the self-powered mode using global overcurrent detection.

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ISP1520

Hi-Speed USB hub controller

Philips Semiconductors

PSWn_N pins have integrated weak pull-up resistors inside the chip.

Table 5:

Power switching mode: pin conﬁguration

Power switching mode

PSW1_N

PSW2_N

PSW3_N

PSW4_N

Ganged

internal

pull-up

ground

Individual

internal

pull-up

internal

pull-up

internal

pull-up

internal

pull-up

9.1.3 Overcurrent protection mode

The ISP1520 supports all overcurrent protection modes: none, global and individual.

No overcurrent protection mode reporting is selected when pin NOOC = HIGH.

Global and individual overcurrent protection modes are selected using pins PSWn_N,

following the power switching modes selection scheme; see Table 6.

For the global overcurrent protection mode, only PSW1_N and OC1_N are active;

that is, in this mode, the remaining overcurrent indicator pins are disabled. To inhibit

the analog overcurrent detection, the OC_N pins must be connected to V_REF(5V0)

.

Table 6:

Overcurrent protection mode pin conﬁguration

Power switching mode

NOOC

HIGH

LOW

PSW1_N PSW2_N PSW3_N PSW4_N

None

ground

Global

internal

pull-up

Individual

LOW

internal

pull-up

internal

pull-up

internal

pull-up

internal

pull-up

Both analog and digital overcurrent modes are supported; see Table 7.

For digital overcurrent detection, the normal digital TTL level is accepted on the

overcurrent input pins. For analog overcurrent detection, the threshold is given in the

DC characteristics. In this mode, to ﬁlter out false overcurrent conditions because of

in rush and spikes, a dead time of 15 ms is built into the IC, that is, overcurrent must

persist for 15 ms before it is reported to the host.

Table 7:

Pin ADOC

3.3 V

Overcurrent detection mode selection pin conﬁguration

Mode selection

analog

Description

threshold ∆V_trip

Ground

digital

normal digital TTL level

9.1.4 Non-removable port

A non-removable port, by deﬁnition, is a port that is embedded inside the hub

application box and is not externally accessible. The LED port indicators

(pins AMBn_N) of such a port are not used. Therefore, the corresponding amber LED

port indicators are disabled to signify that the port is non-removable; see Table 8.

More than one non-removable port can be speciﬁed by appropriately connecting the

corresponding amber LED indicators. At least one port should, however, be left as a

removable port.

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ISP1520

Hi-Speed USB hub controller

Philips Semiconductors

The detection of any non-removable port sets the hub descriptor into a compound

hub.

Table 8:

Non-removable port pin conﬁguration

AMBn_N (n = 1 to 4)

Ground

Non-removable port

non-removable

removable

Pull-up with amber LED

9.1.5 Port indicator support

The port indicator support can be disabled by grounding all green port indicators (all

pins GRNn_N); see Table 9. This is a global feature. It is not possible to disable port

indicators for only one port.

Table 9:

Port indicator support: pin conﬁguration

GRN1_N to GRN4_N

Port indicator support

not supported

Ground

LED pull-up green LED for at least one port

supported

9.2 Device descriptors and string descriptors settings using I²C-bus

9.2.1 Background information on I²C-bus

The I²C-bus is suitable for bi-directional communication between ICs or modules. It

consists of two bi-directional lines: SDA for data signals and SCL for clock signals.

Both these lines must be connected to a positive supply voltage through a pull-up

resistor.

The basic I²C-bus protocol is deﬁned as:

• Data transfer is initiated only when the bus is not busy.

• Changes in the data line occur when the clock is LOW and must be stable when

the clock is HIGH. Any changes in data lines when the clock is HIGH will be

interpreted as control signals.

Different conditions on I²C-bus: The I²C-bus protocol deﬁnes the following

conditions:

Not busy — both SDA and SCL remain HIGH

START — a HIGH-to-LOW transition on SDA, while SCL is HIGH

STOP — a LOW-to-HIGH transition on SDA, while SCL is HIGH

Data valid — after a START condition, data on SDA must be stable for the duration of

the HIGH period of SCL.

Data transfer: The master initiates each data transfer using a START condition and

terminates it by generating a STOP condition. To facilitate the next byte transfer, each

byte of data must be acknowledged by the receiver. The acknowledgement is done by

pulling the SDA line LOW on the ninth bit of the data. An extra clock pulse needs to

be generated by the master to accommodate this bit.

For more detailed information on the operation of the bus, refer to The I²C-bus

speciﬁcation.

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I²C-bus address: The address of the ISP1520 is given in Table 10.

Table 10: I²C-bus slave address

MSB

Slave address

LSB

A1

0

Bit

A7

A6

A5

A4

A3

A2

R/W

Value

0

1

0

1

0/1

9.2.2 Architecture of conﬁgurable hub descriptors

MICROCONTROLLER

SERIAL EEPROM

2

I C-bus

signature

match

MASTER/SLAVE

I C-BUS INTERFACE

2

RAM

(256 bytes)

DESCRIPTOR

GENERATOR

INTERFACE

HUB CORE

MUX

ROM

(256 bytes)

MLD711

The I²C-bus cannot be shared between the EEPROM and the external microcontroller.

Fig 7. Conﬁgurable hub descriptors.

The conﬁgurable hub descriptors can be masked in the internal ROM memory; see

Figure 7. These descriptors can also be supplied from an external EEPROM or a

microcontroller. The ISP1520 implements both the master and slave I²C-bus

controllers. The information from the external EEPROM or the microcontroller is

transferred into the internal RAM during the power-on reset. A signature word is used

to identify correct descriptors. If the signature matches, the content of the RAM is

chosen instead of the ROM.

When the external microcontroller mode is selected and while the external

microcontroller is writing to the internal RAM, any request to conﬁgurable descriptors

will be responded to with a Not AcKnowledge (NAK). There is no speciﬁed time-out

period for the NAK signal. This data is then passed to the host during the

enumeration process.

The three conﬁguration methods are selected by connecting pins SCL and SDA in the

manner given in Table 11.

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Table 11: Conﬁguration method

Conﬁguration method

SCL

SDA

Internal ROM

ground

External EEPROM

External microcontroller

2.2 to 4.7 kΩ pull-up

driven LOW by the

microcontroller during reset

9.2.3 ROM or EEPROM map

00H

02H

Signature

Device Descriptor

0AH

10H

Language ID

String Descriptor

(first Language ID):

iManufacturer string

iProduct string

iSerial Number string

7FH

80H

String Descriptor

(second Language ID):

iManufacturer string

iProduct string

iSerial Number string

FFH

MLD714

Fig 8. ROM or EEPROM map.

Remark: A 128-byte EEPROM supports one language ID only, and a 256-byte

EEPROM supports two language IDs.

9.2.4 ROM or EEPROM detailed map

Table 12: ROM or EEPROM detailed map

Address Content

(Hex)

Default Example Comment

(Hex)

Signature descriptor

00

01

signature (low

55

-

signature to signify valid data comment

signature (high)

AA

Device descriptor

02

03

04

05

06

07

08

idVendor (low)

CC

04

20

15

00

-

Philips Semiconductors vendor ID

ISP1520 product ID

idVendor (high)

idProduct (low)

idProduct (high)

bcdDevice (low)

-

device release; silicon revision

increments this value

bcdDevice (high) 02

-

RSV, iSN, iP, iM

-

00

if all the three strings are supported, the

value of this byte is 39H

09

reserved

-

FF

-

String descriptor Index 0 (language ID)

0A 06

bLength^[1]

-

two language ID support

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Table 12: ROM or EEPROM detailed map…continued

Address Content Default Example Comment

(Hex)

03^[2]

09

0B

bDescriptorType

wLANGID[0]

-

STRING

0C

LANGID code zero (ﬁrst language ID)

(English—USA in this example)

0D

04

0E

wLANGID[1]

09

LANGID code one (second language ID)

(English—UK in this example)

0F

08

String descriptor Index 1 (iManufacturer)^[3]

10

bLength

-

2E

03^[2]

string descriptor length (manufacturer ID)

11

bDescriptorType

bString

STRING

12 13

14 15

16 17

18 19

1A 1B

1C 1D

1E 1F

20 21

22 23

24 25

26 27

28 29

2A 2B

2C 2D

2E 2F

30 31

32 33

34 35

36 37

38 39

3A 3B

3C 3D

50 00

68 00

69 00

6C 00

69 00

70 00

73 00

20 00

53 00

65 00

6D 00

69 00

63 00

6F 00

6E 00

64 00

75 00

63 00

74 00

6F 00

72 00

73 00

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String descriptor Index 2 (iProduct)

3E

bLength

-

10

03^[2]

string descriptor length (product ID)

3F

bDescriptorType

bString

STRING

40 41

42 43

44 45

46 47

48 49

4A 4B

4C 4D

49 00

53 00

50 00

31 00

35 00

32 00

30 00

I of ISP1520

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P

1

5

2

0

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Table 12: ROM or EEPROM detailed map…continued

Address Content Default Example Comment

(Hex) (Hex) (Hex)

String descriptor Index 3 (iSerialNumber)

Remark: If supported, this string must be unique.

4E

bLength

-

3A

03^[2]

string descriptor length (serial number)

4F

bDescriptorType

bString

STRING

50 51

52 53

54 55

56 57

58 59

5A 5B

5C 5D

5E 5F

60 61

62 63

64 65

66 67

68 69

6A 6B

6C 6D

6E 6F

70 71

72 73

74 75

76 77

78 79

7A 7B

7C 7D

7E 7F

80 81

82 83

84 85

86 87

39 00

34 00

37 00

33 00

37 00

38 00

37 00

36 00

37 00

38 00

20 00

3D 00

20 00

77 00

69 00

72 00

65 00

64 00

20 00

73 00

75 00

70 00

6F 00

72 00

74 00

9 of 947337877678 = wired support

4

7

3

7

8

7

6

7

8

=

w

i

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p

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Table 12: ROM or EEPROM detailed map…continued

Address Content Default Example Comment

(Hex) (Hex) (Hex)

String descriptor Index 1 (iManufacturer) second language

88

bLength

-

2E

03^[2]

string descriptor length (manufacturer ID)

89

bDescriptorType

bString

STRING

8A 8B

8C 8D

8E 8F

90 91

92 93

94 95

96 97

98 99

9A 9B

9C 9D

9E 9F

A0 A1

A2 A3

A4 A5

A6 A7

A8 A9

AA AB

AC AD

AE AF

B0 B1

B2 B3

B4 B5

50 00

68 00

69 00

6C 00

69 00

70 00

73 00

20 00

53 00

65 00

6D 00

69 00

63 00

6F 00

6E 00

64 00

75 00

63 00

74 00

6F 00

72 00

73 00

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String descriptor Index 2 (iProduct)

B6

bLength

-

10^[1]

03^[2]

string descriptors (product ID)

B7

bDescriptorType

bString

STRING

B8 B9

BA BB

BC BD

BE BF

C0 C1

C2 C3

C4 C5

49 00

53 00

50 00

31 00

35 00

32 00

30 00

I of ISP1520

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1

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2

0

String descriptor Index 3 (iSerialNumber)

C6

bLength

-

16^[1]

03^[2]

string descriptors (serial number)

C7

bDescriptorType

bString

STRING

C8 C9

CA CB

36 00

35 00

6 of 6568824022

5

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Table 12: ROM or EEPROM detailed map…continued

Address Content Default Example Comment

(Hex)

CC CD

CE CF

D0 D1

D2 D3

D4 D5

D6 D7

D8 D9

DA DB

DC DD

DE DF

E0 E1

E2 E3

E4 E5

E6 E7

E8 E9

EA EB

EC ED

EE EF

F0 F1

F2 F3

F4 F5

F6 F7

F8 F9

FA FB

FC FD

FE

(Hex)

36 00

38 00

32 00

34 00

30 00

32 00

FF FF

FF

-

6

8

2

4

0

2

FF

upper boundary of all string descriptors

[1] If this string descriptor is not supported, this bLength ﬁeld must be programmed with the value 02H.

[2] If this string descriptor is not supported, this bDescriptorType ﬁeld must be used (programmed with

any value, for example, 03H).

[3] String descriptor index (iManufacturer) starts from the address 0EH for one language ID support and

10H for two languages ID support.

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10. Hub controller description

Each USB device is composed of several independent logic endpoints. An endpoint

acts as a terminus of communication ﬂow between the host and the device. At design

time, each endpoint is assigned a unique number (endpoint identiﬁer; see Table 13).

The combination of the device address (given by the host during enumeration), the

endpoint number and the transfer direction allows each endpoint to be uniquely

referenced.

The ISP1520 has two endpoints: endpoint 0 (control) and endpoint 1 (interrupt).

Table 13: Hub endpoints

Function

Endpoint

identiﬁer

Transfer type

Direction ^[1]

Maximum packet

size (bytes)

Hub ports 0 to 4

0

control

OUT

IN

64

1

interrupt

IN

[1] IN: input for the USB host; OUT: output from the USB host.

10.1 Endpoint 0

According to the USB speciﬁcation, all devices must implement a default control

endpoint. This endpoint is used by the host to conﬁgure the USB device. It provides

access to the device conﬁguration and allows generic USB status and control access.

The ISP1520 supports the following descriptor information through its control

endpoint 0:

• Device descriptor

• Device_qualiﬁer descriptor

• Conﬁguration descriptor

• Interface descriptor

• Endpoint descriptor

• Hub descriptor

• Other_speed_conﬁguration descriptor.

The maximum packet size of this endpoint is 64 bytes.

10.2 Endpoint 1

Endpoint 1 can be accessed only after the hub has been conﬁgured by the host (by

sending the Set Conﬁguration command). It is used by the ISP1520 to send the

status change information to the host.

Endpoint 1 is an interrupt endpoint. The host polls this endpoint once every 255 ms.

After the hub is conﬁgured, an IN token is sent by the host to request the port change

status. If the hub detects no change in the port status, it returns a NAK to this

request, otherwise the Status Change byte is sent. Table 14 shows the content of the

change byte.

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Table 14: Status Change byte: bit allocation

Bit

Name

Value Description

0

Hub Status Change

0

1

0

1

-

no change in the hub status

change in the hub status detected

1 to 4 Port n Status Change

no change in the status of port n (n = 1 to 4)

change in the status of port n (n = 1 to 4)

not used

5 to 7

-

11. Descriptors

The ISP1520 hub controller supports the following standard USB descriptors:

• Device

• Device_qualiﬁer

• Other_speed_conﬁguration

• Conﬁguration

• Interface

• Endpoint

• Hub.

The hub returns different descriptors based on the mode of operation: full-speed or

high-speed.

Table 15: Device descriptor

Offset

Field name

Value (Hex)

Comments

(bytes)

Full-speed

High-speed

0

bLength

12

01

00

02

09

00

40

CC

04

20

15

00

02

01

02

03

12

01

00

02

09

00

01

40

CC

04

20

15

00

02

01

02

03

01

descriptor length = 18 bytes

type = DEVICE

1

bDescriptorType

bcdUSB

2

see USB speciﬁcation Rev. 2.0

3

4

bDeviceClass

bDeviceSubClass

bDeviceProtocol

bMaxPacketSize0

idVendor

HUB_CLASSCODE

5

HubSubClassCode

6

HubProtocolHSpeedOneTT

packet size = 64 bytes

7

8

Philips Semiconductors vendor ID (04CC); can be

customized

9

10

11

12

13

14

15

16

17

idProduct

bcdDevice

the ISP1520 product ID; can be customized

device ID; can be customized

iManufacturer

iProduct

can be customized

iSerialNumber

can be customized; this value must be unique

one conﬁguration

bNumConﬁgurations 01

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Table 16: Device_qualiﬁer descriptor

Offset

Field name

Value (Hex)

Comments

(bytes)

Full-speed

High-speed

0

1

2

3

4

5

6

7

8

bLength

0A

06

00

02

09

00

40

0A

06

00

02

09

00

01

40

01

descriptor length = 10 bytes

type = DeviceQualiﬁerType

see USB speciﬁcation Rev. 2.0

bDescriptorType

bcdUSB

bDeviceClass

HUB_CLASSCODE

bDeviceSubClass

bDeviceProtocol

bMaxPacketSize0

HubSubClassCode

HubProtocolHSpeedOneTT

packet size = 64 bytes

number of conﬁgurations

bNumConﬁgurations 01

Table 17: Other_speed_conﬁguration descriptor

Offset

Field name

Value (Hex)

Comments

(bytes)

Full-speed

High-speed

0

1

2

3

4

5

6

7

bLength

09

07

19

00

01

09

07

19

00

01

00

E0

A0

00

descriptor length = 9 bytes

type = OtherSpeedConﬁgurationType

TotalConfByte

bDescriptorType

wTotalLength

bNumInterfaces

-

bConﬁgurationValue 01

-

iConﬁguration

bmAttributes

00

E0

A0

00

no string supported

self-powered

others

8

bMaxPower

self-powered

Table 18: Conﬁguration descriptor

Offset

Field name

Value (Hex)

Comments

(bytes)

Full-speed

High-speed

0

1

2

3

4

5

6

7

8

bLength

09

02

19

00

01

09

02

19

00

01

00

E0

00

descriptor length = 9 bytes

type = CONFIGURATION

bDescriptorType

wTotalLength

total length of conﬁguration, interface and endpoint

descriptors = 25 bytes

bNumInterfaces

one interface

bConﬁgurationValue 01

conﬁguration value = 1

no conﬁguration string descriptor

self-powered

iConﬁguration

bmAttributes

bMaxPower^[1]

00

E0

00

self-powered

[1] Value in units of 2 mA.

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Hi-Speed USB hub controller

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Table 19: Interface descriptor

Offset

Field name

Value (Hex)

Comments

(bytes)

Full-speed

High-speed

0

1

2

3

4

5

6

7

8

bLength

09

04

00

01

09

04

00

01

09

00

descriptor length = 9 bytes

type = INTERFACE

-

bDescriptorType

bInterfaceNumber

bAlternateSetting

bNumEndpoints

bInterfaceClass

no alternate setting

status change (interrupt) endpoint

HUB_CLASSCODE

HubSubClassCode

-

bInterfaceSubClass 00

bInterfaceProtocol

bInterface

00

no interface string descriptor

Table 20: Endpoint descriptor

Offset

Field name

Value (Hex)

Comments

(bytes)

Full-speed

High-speed

0

1

2

3

4

5

6

bLength

07

05

81

03

01

00

FF

07

05

81

03

01

00

0C

descriptor length = 7 bytes

type = ENDPOINT

bDescriptorType

bEndpointAddress

bmAttributes

endpoint 1 at the address number 1

interrupt endpoint

wMaxPacketSize

packet size = 1 byte

bInterval

polling interval

Table 21: Hub descriptor

Offset

Field name

Value (Hex)

Comments

(bytes)

Full-speed

High-speed

0

1

2

bDescLength

bDescriptorType

bNbrPorts

09

29

04

03

02

09

29

04

03

02

A9

00

32

64

00

FF

descriptor length = 9 bytes

type = HUB

number of enabled downstream facing ports; selectable by

DP/DM strapping

3

4

5

6

7

8

wHubCharacteristics A9

see Table 22

00

bPwrOn2PwrGood^[1]32

ganged or individual mode = 100 ms

bHubContrCurrent

DeviceRemovable

PortPwrCtrlMask

64

00

FF

-

four downstream facing ports, no embedded port

-

[1] Value in units of 2 ms.

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Table 22: wHubCharacteristics bit description

Bit

Function

Value Description

D0, D1

logical power switching mode 00

ganged

01

11

individual and multiple ganged

-

D2

compound hub selection

0

1

non-compound

compound

D3, D4

overcurrent protection mode 00

global

01

10

11

individual and multiple ganged

none

-

D5

D6

D7

-

port indicator

0

1

global feature

-

12. Hub requests

The hub must react to a variety of requests initiated by the host. Some requests are

standard and are implemented by any USB device whereas others are hub-class

speciﬁc requests.

12.1 Standard USB requests

Table 23 shows the supported standard USB requests.

Table 23: Standard USB requests

bmRequestType bRequest wValue

wIndex

bytes 2, 3 bytes 4, 5

wLength

bytes 6, 7 Data response

(hex)

Request

byte 0

(bits 7 to 0)

byte 1

(hex)

Address

Set Address

0000 0000

05

device

address^[1]

00, 00

none

Conﬁguration

Get Conﬁguration

Set Conﬁguration (0)

Set Conﬁguration (1)

Descriptors

1000 0000

0000 0000

08

09

00, 00

01, 00

00, 00

01, 00

00, 00

conﬁguration value

none

Get Conﬁguration

Descriptor

1000 0000

06

00, 02

00, 00

length^[2]

conﬁguration interface

and endpoint descriptors

Get Device Descriptor

06

00, 01

03, 00

03, 01

03, 02

03, 03

00, 00

length^[2]

device descriptor

language ID descriptor

manufacturer string

product string

Get String Descriptor (0) 1000 0000

Get String Descriptor (1) 1000 0000

Get String Descriptor (2) 1000 0000

Get String Descriptor (3) 1000 0000

serial number string

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Table 23: Standard USB requests…continued

bmRequestType bRequest wValue

wIndex

wLength

Request

Feature

byte 0

(bits 7 to 0)

byte 1

(hex)

bytes 2, 3 bytes 4, 5

bytes 6, 7 Data response

(hex)

Clear Device Feature

(Remote_ Wakeup)

0000 0000

0000 0010

0000 0000

0000 0010

01

03

01, 00

00, 00

01, 00

00, 00

81, 00

00, 00

81, 00

00, 00

none

Clear Endpoint (1)

Feature (Halt/Stall)

Set Device Feature

(Remote_ Wakeup)

Set Endpoint (1)

Feature (Halt/Stall)

Status

Get Device Status

Get Interface Status

1000 0000

1000 0001

00

00, 00

00/80, 00^[3]02, 00

02, 00

device status

zero

Get Endpoint (0) Status 1000 0010

Get Endpoint (1) Status 1000 0010

endpoint 0 status

endpoint 1 status

81, 00 02, 00

[1] Device address: 0 to 127.

[2] Returned value in bytes.

[3] MSB speciﬁes endpoint direction: 0 = OUT, 1 = IN. The ISP1520 accepts either value.

12.2 Hub class requests

Table 24 shows the hub class requests.

Table 24: Hub class requests

bmRequestType bRequest

wValue

bytes 2, 3

(hex)

wIndex

bytes 4, 5

(hex)

wLength

bytes 6, 7

(hex)

Request

byte 0

byte 1

(hex)

Data

(bits 7 to 0)

Descriptor

Get Hub Descriptor

1010 0000

0010 0000

06

01

descriptortype 00, 00

and index

length^[2]

00, 00

descriptor

none

Feature

Clear Hub Feature

00, 00

(C_LOCAL_POWER)

Clear Port Feature

Set Port Feature

Status

0010 0011

01

03

feature^[3], 00

port^[4], 00

00, 00

none

Get Hub Status

1010 0000

1010 0011

00

00, 00

04, 00

hub status and

change status

Get Port Status

port^[4], 00

port status and

change status

TT

ClearTTBuffer

0010 0011

0010 0000

08

09

Dev_Addr,

EP_nr

01, 00

00, 00

none

ResetTT

00, 00

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Hi-Speed USB hub controller

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Table 24: Hub class requests…continued

bmRequestType bRequest

wValue

bytes 2, 3

(hex)

wIndex

bytes 4, 5

(hex)

wLength

bytes 6, 7

(hex)

Request

byte 0

byte 1

(hex)

Data

(bits 7 to 0)

[1]

GetTTState

StopTT

1010 0011

0010 0011

10

11

TT-ﬂags

00, 00

01, 00

-

TT state

none

00, 00

Test modes

Test_J

0010 0011

03

15, 00

port^[4], 01

port^[4], 02

port^[4], 03

port^[4], 04

port^[4], 05

00, 00

none

Test_K

Test_SE0_NAK

Test_Packet

Test_Force_Enable

[1] Returns vendor-speciﬁc data.

[2] Returned value in bytes.

[3] Feature selector value; see Table 25.

[4] Downstream port identiﬁer: 1 to N with N is number of enabled ports (2 to 4).

Table 25: Hub class feature selector

Feature selector name

C_HUB_LOCAL_POWER

C_HUB_OVER_CURRENT

PORT_CONNECTION

PORT_ENABLE

Recipient

hub

Value

00

01

00

01

02

03

04

08

09

16

17

18

19

20

21

22

hub

port

PORT_SUSPEND

PORT_OVER_CURRENT

PORT_RESET

PORT_POWER

PORT_LOW_SPEED

C_PORT_CONNECTION

C_PORT_ENABLE

C_PORT_SUSPEND

C_PORT_OVER_CURRENT

C_PORT_RESET

PORT_TEST

PORT_INDICATOR

12.3 Detailed responses to hub requests

12.3.1 Get conﬁguration

This request returns the conﬁguration value of the device. This request returns one

byte of data; see Table 26.

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Table 26: Get hub conﬁguration response

Bit

Function

Value Description

0

conﬁguration value

0

1

0

device is not conﬁgured

device is conﬁgured

-

1 to 7

reserved

12.3.2 Get device status

This request returns two bytes of data; see Table 27.

Table 27: Get device status response

Bit

0

Function

Value Description

self-powered

remote wake-up

1

0

1

0

self-powered

disabled

enabled

-

1

2 to 15

reserved

12.3.3 Get interface status

The request returns two bytes of data; see Table 28.

Table 28: Get interface status response

Bit

Function

Value Description

0 to 15

reserved

0

-

12.3.4 Get endpoint status

The request returns two bytes of data; see Table 29.

Table 29: Get endpoint status response

Bit

Function

Value Description

0

halt

0

1

0

endpoint is not halted

endpoint is halted

-

1 to 15

reserved

12.3.5 Get hub status

The request returns four bytes of data; see Table 30.

Table 30: Get hub status response

Bit

Function

Value Description

0

local power source

0

1

0

1

0

local power supply good

local power supply lost (inactive)

no overcurrent condition currently exists

a hub overcurrent condition exists

-

1

overcurrent indicator

reserved

2 to 15

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Table 30: Get hub status response…continued

Bit

Function

Value Description

16

local power status change

0

1

0

1

0

no change in the local power status

local power status has changed

no change in overcurrent

overcurrent status has changed

-

17

overcurrent indicator change

18 to 31 reserved

12.3.6 Get port status

This request returns four bytes of data. The ﬁrst word contains the port status bits

(wPortStatus), and the next word contains the port status change bits

(wPortChange). The contents of wPortStatus is given in Table 31, and the contents of

wPortChange is given in Table 32.

Table 31: Get port status response (wPortStatus)

Bit

Function

Value

Description

0

current connect status

0

1

0

1

0

1

0

1

0

1

0

1

0

no device is present

a device is present on this port

port is disabled

1

2

3

4

port enabled or disabled

suspend

port is enabled

port is not suspended

port is suspended

overcurrent indicator

reset

no overcurrent condition exists

an overcurrent condition exists

reset signaling is not asserted

reset signaling is asserted

-

5 to 7

8

reserved

port power

port is in the powered-off state

port is not in the powered-off state

9

low-speed device attached

full-speed or high-speed device is

attached

1

0

1

0

1

0

1

0

low-speed device is attached

full-speed device is attached

high-speed device is attached

not in the port test mode

in the port test mode

10

11

12

high-speed device attached

port test mode

port indicator control

displays default colors

displays software controlled color

-

13 to 15 reserved

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Table 32: Get port status change response (wPortChange)

Bit

Function

Value

Description

0

connect status change

0

1

0

1

0

1

0

1

0

1

0

no change in the current connect status

change in the current connect status

port is enabled

1

2

3

4

port enable or disable change

suspend change

port is disabled

no change

resume complete

overcurrent indicator change

reset change

no change in the overcurrent indicator

change in the overcurrent indicator

no change

reset complete

5 to 15 reserved

-

12.4 Various get descriptors

bmRequestType — 10000000B

bmRequest — GET_DESCRIPTOR = 6

Table 33: Get descriptor request

Request name

wValue

wIndex

Data

Descriptor index

Descriptor type

Zero/Language ID

Get device

descriptor

00

01

0

device descriptor

Get conﬁguration

descriptor

00

01

02

03

0

n

conﬁguration interface and

endpoint descriptors

Get language ID

string descriptor

language ID support string

Get manufacturer

string descriptor

manufacturer string in LANGID n

product string in LANGID n

Get product string 02

descriptor

Get serial number 03

string descriptor

serial number string in LANGID n

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13. Limiting values

Table 34: Absolute maximum ratings

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

V_CC

Parameter

Conditions

Min

−0.5

-

Max

+4.6

+5.25

+6.0

+4.6

100

Unit

V

supply voltage 3.3 V

V_REF(5V0)

V_I(5V0)

V_I(3V3)

V_O(3V3)

I_lu

input reference voltage 5.0 V

input voltage on 5 V buffers

input voltage on 3.3 V buffers

output voltage on 3.3 V buffers

latch-up current

V

[1]

3.0 V < V_CC< 3.6 V

V

V_I< 0 or V_I> V_CC

mA

V

[2][3]

V_esd

electrostatic discharge voltage

on pins DM1 to DM4, DP1 to DP4,

OC1_N to OC4_N, and all

V_REF(5V0)and GND pins; I_LI< 1 µA

−4000

+4000

on all other pins; I_LI< 1 µA

−2000

−40

+2000

V

T_stg

storage temperature

+125

°C

[1] Valid only when supply voltage is present.

[2] Test method available on request.

[3] Equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor (Human Body Model).

14. Recommended operating conditions

Table 35: Recommended operating ranges

Symbol

V_CC

Parameter

Min

3.0

4.5

0

Typ

3.3

5.0

-

Max

3.6

Unit

V

supply voltage 3.3 V

[1]

V_REF(5V0)

V_I(3V3)

V_I(5V0)

T_amb

input reference voltage 5 V

input voltage on 3.3 V pins

input voltage on 5 V tolerant pins

operating temperature

5.25

V_CC

V

0

-

V_REF(5V0)

70

V

0

-

°C

[1] All internal pull-up resistors are connected to this voltage.

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15. Static characteristics

Table 36: Static characteristics: supply pins

V_CC= 3.0 V to 3.6 V; T_amb= 0 °C to 70 °C; unless otherwise speciﬁed.

Symbol Parameter

Full-speed

Conditions

Min

Typ

Max

Unit

I_REF(5V0)supply current 5 V

-

0.5

91

-

mA

[1]

[2]

I_CC(tot)

total supply current 3.3 V

I_CC(tot)= I_CC1+ I_CC2+ I_CC3+ I_CC4

High-speed

I_CC(tot)

total supply current 3.3 V

suspend mode; internal clock stopped

no device connected

-

0.5

-

mA

136.3

180

221

256

288

1 active device connected

2 active devices connected

3 active devices connected

4 active devices connected

[1] Irrespective of the number of devices connected, the value of I_CCis always 91 mA in full-speed.

[2] Including R_pudrop current.

Table 37: Static characteristics: digital input and outputs^[1]

V_CC= 3.0 V to 3.6 V; T_amb= 0 °C to 70 °C; unless otherwise speciﬁed.

Symbol Parameter

Digital input pins

Conditions

Min

Typ

Max

Unit

V_IL

V_IH

I_LI

LOW-level input voltage

-

0.8

-

V

HIGH-level input voltage

input leakage current

2.0

−1

V

+1

µA

Schmitt-trigger input pins

V_th(LH)

V_th(HL)

V_hys

positive-going threshold voltage

1.4

0.9

0.4

-

1.9

1.5

0.7

V

negative-going threshold voltage

hysteresis voltage

Overcurrent detection pins OC1_N to OC4_N

∆V_tripovercurrent detection trip voltage

Digital output pins

∆V = V_CC− V_{OCn_N}

-

84

-

mV

V_OL

V_OH

LOW-level output voltage

HIGH-level output voltage

-

0.4

-

V

2.4

Open-drain output pins

I_OZ

OFF-state output current

−1

-

+1

µA

[1] All pins are 5 V tolerant.

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Table 38: Static characteristics: I²C-bus interface block

V_CC= 3.0 V to 3.6 V; T_amb= 0 °C to 70 °C; unless otherwise speciﬁed.

Symbol Parameter

Conditions

Min

Typ

Max

Unit

Input pin SCL and input/output pin SDA^[1]

V_IL

V_IH

V_hys

V_OL

t_f

LOW-level input voltage

HIGH-level input voltage

hysteresis voltage

-

0.9

-

V

2.1

-

V

0.15

-

V

LOW-level output voltage

output fall time V_IHto V_IL

-

0.4

250

V

[2]

10 < C_b= 10 pF to 400 pF

0

ns

[1] All pins are 5 V tolerant.

[2] The bus capacitance (C_b) is speciﬁed in pF. To meet the speciﬁcation for V_OLand the maximum rise time (300 ns), use an external

pull-up resistor with R_max= 850/C_bkΩ and R_min= (V_CC− 0.4)/3 kΩ.

Table 39: Static characteristics: USB interface block (DP0 to DP4 and DM0 to DM4)

V_CC= 3.0 V to 3.6 V; T_amb= 0 °C to 70 °C; unless otherwise speciﬁed.

Symbol Parameter

Conditions

Min

Typ

Max

Unit

Input levels for high-speed

V_HSSQ

squelch detection threshold

(differential signal amplitude)

squelch detected

-

100

-

mV

no squelch detected

150

−50

V_HSCM

data signaling common-mode

voltage range

+500

Output levels for high-speed

V_HSOI

idle state

−10

360

−10

700

−900

-

+10

mV

V_HSOH

V_HSOL

V_CHIRPJ

data signaling HIGH

data signaling LOW

chirp J level (differential voltage)

440

+10

[1]

1100

−500

V_CHIRPKchirp K level (differential voltage)

Input levels for full-speed and low-speed

V_IL

LOW-level input voltage

-

0.8

-

V

V_IH

HIGH-level input voltage (drive)

HIGH-level input voltage (ﬂoating)

differential input sensitivity

2.0

2.7

0.2

0.8

V_IHZ

V_DI

3.6

-

|DP − DM|

V_CM

differential common-mode range

2.5

Output levels for full-speed and low-speed

V_OL

LOW-level output voltage

HIGH-level output voltage

0

-

0.3

3.6

2.0

V

V_OH

V_CRS

2.8

1.3

[2]

output signal crossover point

voltage

Leakage current

I_LZ

OFF-state leakage current

−1

-

+1

20

µA

Capacitance

C_IN

transceiver capacitance

pin to GND

-

pF

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Table 39: Static characteristics: USB interface block (DP0 to DP4 and DM0 to DM4)…continued

V_CC= 3.0 V to 3.6 V; T_amb= 0 °C to 70 °C; unless otherwise speciﬁed.

Symbol Parameter

Resistance

Conditions

Min

Typ

Max

-

Unit

MΩ

V

Z_INP

input impedance

10

-

Termination

[3]

V_TERM

termination voltage for pull-up

resistor on pin RPU

3.0

3.6

[1] For minimum value, the HS termination resistor is disabled and the pull-up resistor is connected. Only during reset, when both the hub

and the device are capable of high-speed operation.

[2] Characterized only, not tested. Limits guaranteed by design.

[3] In the suspend mode, the minimum voltage is 2.7 V.

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16. Dynamic characteristics

Table 40: Dynamic characteristics: system clock timing

Symbol

Reset

Parameter

Conditions

Min

Typ

Max

Unit

t_W(POR)

internal power-on reset pulse

width

0.2

-

1

-

µs

t_{W(RESET_N)}

pulse width on pin RESET_N

Crystal oscillator

[1][2]

f_clk

clock frequency

crystal

-

12

50

-

MHz

%

External clock input

δ

clock duty cycle

[1] Recommended accuracy of the clock frequency is 500 ppm for the crystal.

[2] Suggested values for external capacitors when using a crystal are 22 to 27 pF.

Table 41: Dynamic characteristics: overcurrent sense timing

V_CC= 3.0 V to 3.6 V; T_amb= 0 °C to 70 °C; unless otherwise speciﬁed.

Symbol Parameter

Conditions

Min

Typ

Max

Unit

Overcurrent sense pins OC1_N to OC4_N

t_trip

overcurrent trip response time from see Figure 9

OCn_N LOW to PSWn_N HIGH

-

15

ms

V

CC

∆V

trip

overcurrent

input

0 V

t

trip

V

CC

power switch

output

mbl032

0 V

Overcurrent input: pins OCn_N; power switch output: pins PSWn_N.

Fig 9. Overcurrent trip response timing.

Table 42: Dynamic characteristics: digital pins^[1]

V_CC= 3.0 V to 3.6 V; T_amb= 0 °C to 70 °C; unless otherwise speciﬁed.

Symbol Parameter

t_t(HL)output transition time

t_t(LH)

Conditions

Min

Typ

Max

15

Unit

ns

,

4

-

[1] All pins are 5 V tolerant.

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Table 43: Dynamic characteristics: high-speed source electrical characteristics

V_CC= 3.0 V to 3.6 V; T_amb= 0 °C to 70 °C; test circuit Figure 21; unless otherwise speciﬁed.

Symbol Parameter

Driver characteristics

Conditions

Min

Typ

Max

Unit

t_HSR

t_HSF

rise time

fall time

10 % to 90 %

90 % to 10 %

500

-

ps

Clock timing

t_HSDRAT

t_HSFRAM

t_HSRFI

data rate

479.76

-

480.24

Mbit/s

microframe interval

124.9375 -

125.0625

µs

consecutive microframe interval

difference

1

-

four high-speed ns

bit times

Table 44: Dynamic characteristics: full-speed source electrical characteristics

V_CC= 3.0 V to 3.6 V; T_amb= 0 °C to 70 °C; test circuit Figure 22; unless otherwise speciﬁed.

Symbol Parameter

Driver characteristics

Conditions

Min

Typ

Max

Unit

t_FR

rise time

C_L= 50 pF; 10 % to 90 % of

4

-

20

ns

%

Ω

|V_OH− V_OL

C_L= 50 pF; 90 % to 10 % of

|V_OH− V_OL

|

t_FF

fall time

4

20

|

[1]

t_FRFM

Z_DRV

V_CRS

differential rise and fall time

matching

90

28

1.3

111.1

44

driver output resistance

for the driver that is not

high-speed capable

[1][2]

output signal crossover voltage

2.0

V

Data source timing^[2]

[1]

t_DJ1source differential jitter for

see Figure 10

−3.5

−4

-

+3.5

+4

ns

consecutive transitions

t_DJ2

source differential jitter for paired

transitions

t_FEOPT

t_FDEOP

source SE0 interval of EOP

see Figure 11

160

-

175

ns

source differential data-to-EOP

transition skew

−2

+5

Receiver timing^[2]

t_JR1

receiver data jitter tolerance for

consecutive transitions

see Figure 12

−18.5

−9

-

+18.5 ns

t_JR2

receiver data jitter tolerance for

paired transitions

+9

-

ns

t_FEOPR

t_FST

receiver SE0 width

accepted as EOP; see

Figure 11

82

width of SE0 interval during

differential transaction

rejected as EOP; see Figure 13

-

14

Hub timing (downstream ports conﬁgured as full-speed)^[2]

t_FHDD

hub differential data delay (without see Figure 14; C_L= 0 pF

cable)

-

44

ns

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Table 44: Dynamic characteristics: full-speed source electrical characteristics…continued

V_CC= 3.0 V to 3.6 V; T_amb= 0 °C to 70 °C; test circuit Figure 22; unless otherwise speciﬁed.

Symbol Parameter

Conditions

Min

−5

Typ

Max

+5

Unit

ns

t_FSOP

data bit width distortion after SOP

see Figure 14

see Figure 15

-

t_FEOPD

t_FHESK

hub EOP delay relative to t_HDD

hub EOP output width skew

0

15

ns

−15

+15

ns

[1] Excluding the ﬁrst transition from Idle state.

[2] Characterized only, not tested. Limits guaranteed by design.

Table 45: Dynamic characteristics: low-speed source electrical characteristics

V_CC= 3.0 V to 3.6 V; T_amb= 0 °C to 70 °C; test circuit Figure 22; unless otherwise speciﬁed.

Symbol Parameter

Driver characteristics

Conditions

Min

Typ

Max

Unit

t_LR

rise time

fall time

75

80

-

300

125

ns

%

t_LF

[1]

t_LRFM

differential rise and fall time

matching

[1][2]

V_CRS

output signal crossover voltage

1.3

-

2.0

V

Hub timing (downstream ports conﬁgured as full-speed)

t_LHDD

t_LSOP

t_LEOPD

t_LHESK

hub differential data delay

see Figure 14

see Figure 15

-

300

+60

200

+300

ns

[2]

data bit width distortion after SOP

hub EOP delay relative to t_HDD

hub EOP output width skew

−60

0

−300

[1] Excluding the ﬁrst transition from Idle state.

[2] Characterized only, not tested. Limits guaranteed by design.

T

PERIOD

+3.3 V

crossover point

differential

data lines

0 V

mgr870

consecutive

transitions

N × T + t

PERIOD

DJ1

paired

transitions

N × T

+ t

PERIOD

DJ2

T_PERIODis the bit duration corresponding with the USB data rate.

Fig 10. Source differential data jitter.

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T

PERIOD

+3.3 V

crossover point

extended

crossover point

differential

data lines

0 V

differential data to

SE0/EOP skew

N × T + t

source EOP width: t

EOPT

receiver EOP width: t

EOPR

mgr776

PERIOD

DEOP

T_PERIODis the bit duration corresponding with the USB data rate.

Full-speed timing symbols have a subscript preﬁx ‘F’, low-speed timing a preﬁx ‘L’.

Fig 11. Source differential data-to-EOP transition skew and EOP width.

T

PERIOD

+3.3 V

differential

data lines

0 V

mgr871

t

JR2

JR

JR1

consecutive

transitions

N × T

+ t

PERIOD

JR1

paired

transitions

N × T

+ t

PERIOD

JR2

T_PERIODis the bit duration corresponding with the USB data rate.

t_JRis the jitter reference point.

Fig 12. Receiver differential data jitter.

t

FST

+3.3 V

V

IH(min)

differential

data lines

0 V

mgr872

Fig 13. Receiver SE0 width tolerance.

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+3.3 V

crossover

point

crossover

point

upstream

differential

data lines

downstream

differential

data

0 V

hub delay

downstream

hub delay

upstream

t

HDD

+3.3 V

crossover

point

crossover

point

downstream

differential

data lines

upstream

differential

data

0 V

mgr777

(A) downstream hub delay

(B) upstream hub delay

SOP distortion:

= t

t

− t

HDD(SOP)

SOP

HDD (next J)

Full-speed timing symbols have a subscript preﬁx ‘F’, low-speed timing a preﬁx ‘L’.

Fig 14. Hub differential data delay and SOP distortion.

+3.3 V

crossover

point

extended

crossover

point

extended

upstream

differential

data lines

downstream

port

0 V

t

EOP+

EOP−

EOP+

EOP−

+3.3 V

crossover

point

extended

crossover

point

extended

downstream

differential

data lines

upstream

end of cable

0 V

mgr778

(A) downstream EOP delay

(B) upstream EOP delay

EOP delay:

t

= max (t

, t )

EOP− EOP+

EOP

EOP delay relative to t

:

HDD

− t

EOP HDD

t

= t

EOPD

EOP skew:

t

= t

− t

EOP+ EOP−

HESK

Full-speed timing symbols have a subscript preﬁx ‘F’, low-speed timing a preﬁx ‘L’.

Fig 15. Hub EOP delay and EOP skew.

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Table 46: Dynamic characteristics: I²C-bus (pins SDA and SCL)

V_CCand T_ambwithin recommended operating range; V_DD= +5 V; V_SS= V_GND; V_ILand V_IHbetween V_SSand V_DD

.

Symbol Parameter

Clock frequency

Conditions

Min

Typ

Max

Unit

[1]

[2]

f_SCL

SCL clock frequency

f_XTAL= 12 MHz

0

93.75 100

kHz

General timing

t_LOW

t_HIGH

t_r

SCL LOW time

4.7

-

µs

ns

pF

SCL HIGH time

4.0

-

SCL and SDA rise time

SCL and SDA fall time

capacitive load for each bus line

-

1000

300

400

t_f

C_b

SDA timing

t_BUF

bus free time

4.7

-

µs

t_SU;STA

set-up time for (repeated) START

condition

t_HD;STA

t_SU;DAT

t_HD;DAT

t_SU;STO

hold time (repeated) START condition

data set-up time

4.0

250

0

-

µs

ns

µs

data hold time

set-up time for STOP condition

4.0

Additional I²C-bus timing

t_VD;DAT

SCL LOW to data-out valid time

-

0.4

µs

[1] f_SCL= ¹⁄₆₄× f_XTAL

.

[2] Rise time is determined by C_band pull-up resistor value R_p(typical 4.7 kΩ).

SDA

t

f

t

BUF

r

SCL

P

S

Sr

t

HD;STA

SU;DAT HD;DAT

HIGH

LOW

SU;STA

SU;STO

004aaa485

Fig 16. I²C-bus timing.

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17. Application information

17.1 Descriptor conﬁguration selection

upstream

facing port

GoodLink

2

I C-bus

ROM

ISP1520

external microcontroller

2

acting as I C-bus master

EEPROM

green and

USB function

amber LEDs, amber LEDs, amber LEDs, amber LEDs,

(1)

port 1

port 2

port 3

port 4

004aaa303

4 USB downstream facing ports

The I²C-bus cannot be shared between the EEPROM and the external microcontroller; see Table 11.

(1) The function on port 4, which is a non-removable port, is optional.

Fig 17. Descriptors conﬁguration selection application diagram.

17.2 Overcurrent detection limit adjustment

For an overcurrent limit of 500 mA per port, a PMOS with R_DSONof approximately

100 mΩ is required. If a PMOS with a lower R_DSONis used, analog overcurrent

detection can be adjusted by using a series resistor; see Figure 18.

∆V_PMOS= ∆V_trip= ∆V_{trip(intrinsic)}− (I_OC(nom)× R_td), where:

∆V_PMOS= voltage drop on PMOS

I_OC(nom)= 0.6 µA.

5 V

I

OC

(1)

R

td

V

PSWn_N

REF(5V0)

OCn_N

ISP1520

004aaa259

(1) R_tdis optional.

Fig 18. Adjusting analog overcurrent detection limit (optional).

9397 750 11689

Product data

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ISP1520

Hi-Speed USB hub controller

Philips Semiconductors

17.3 Self-powered hub conﬁgurations

+4.85 V (min)

+

−

5 V ± 3 %

POWER SUPPLY

3.3 V LDO

VOLTAGE

REGULATOR

downstream

port connector

T1

ferrite bead

V

BUS

+4.75 V

(min)

V

D+

CC

120 µF

0.1 µF

47 kΩ

1

D−

V

REF(5V0)

PSW1_N

OC1_N

GND

SHIELD

GND

PSW2_N

OC2_N

port 2

to

HP

port 3

ISP1520

PSW3_N

OC3_N

SP/BP_N

ferrite bead

+4.75 V

T4

V

BUS

D+

(min)

120 µF

0.1 µF

47 kΩ

4

D−

PSW4_N

OC4_N

GND

SHIELD

ADOC

3.3 V

004aaa305

Fig 19. Self-powered hub; individual port power switching; individual overcurrent

detection.

9397 750 11689

Product data

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ISP1520

Hi-Speed USB hub controller

Philips Semiconductors

+4.95 V (min)

5.1 V ± 3 %

POWER SUPPLY

(kick-up)

+

−

low-ohmic

sense resistor

for overcurrent

detection

3.3 V LDO

VOLTAGE

REGULATOR

downstream

V

port connector

CC

T1

ferrite bead

OC1_N

V

REF(5V0)

GND

BUS

+4.75 V

(min)

D+

120 µF

0.1 µF

47 kΩ

1

D−

PSW1_N

GND

SHIELD

PSW2_N

PSW3_N

PSW4_N

HP

port 2

to

port 3

ISP1520

SP/BP_N

ferrite bead

+4.75 V

OC2_N

OC3_N

OC4_N

V

BUS

+ 5 V

D+

(min)

120 µF

4

D−

ADOC

GND

SHIELD

3.3 V

004aaa307

Fig 20. Self-powered hub; ganged port power switching; global overcurrent

detection.

9397 750 11689

Product data

Rev. 02 — 04 May 2004

44 of 51

ISP1520

Hi-Speed USB hub controller

Philips Semiconductors

18. Test information

V

CC

15.8 Ω

DPn

50 Ω coax D+

(1)

DUT

DMn

GND

50 Ω coax D−

mdb273

143 Ω

(1) Transmitter: connected to 50 Ω inputs of a high-speed differential oscilloscope.

Receiver: connected to 50 Ω outputs of a high-speed differential data generator.

Fig 21. High-speed transmitter and receiver test circuit.

3.3 V

1.5 kΩ ± 5%

RPU

full-

speed

(1)

DPn

DMn

test point

DUT

(1)

C

15 kΩ

L

test point

mdb274

L

(1) C_L= 50 pF for full-speed.

Fig 22. Full-speed test circuit.

9397 750 11689

Product data

Rev. 02 — 04 May 2004

45 of 51

ISP1520

Hi-Speed USB hub controller

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19. Package outline

LQFP64: plastic low profile quad flat package; 64 leads; body 10 x 10 x 1.4 mm

SOT314-2

y

X

A

48

33

Z

49

32

E

e

H

A

E

2

E

A

(A )

3

A

1

w M

p

θ

b

L

p

pin 1 index

L

64

17

detail X

1

16

Z

v

M

A

D

e

w M

b

p

D

B

H

v

M

B

D

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

A

(1)

UNIT

A

b

c

D

E

e

H

L

v

w

y

Z

E

θ

1

2

3

p

D

E

p

D

max.

7^o

0^o

0.20 1.45

0.05 1.35

0.27 0.18 10.1 10.1

0.17 0.12 9.9 9.9

12.15 12.15

11.85 11.85

0.75

0.45

1.45 1.45

1.05 1.05

1.6

mm

0.25

0.5

1

0.2 0.12 0.1

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

00-01-19

03-02-25

SOT314-2

136E10

MS-026

Fig 23. LQFP64 package outline.

9397 750 11689

Product data

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46 of 51

ISP1520

Hi-Speed USB hub controller

Philips Semiconductors

20. Soldering

20.1 Introduction to soldering surface mount packages

This text gives a very brief insight to a complex technology. A more in-depth account

of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit

Packages (document order number 9398 652 90011).

There is no soldering method that is ideal for all surface mount IC packages. Wave

soldering can still be used for certain surface mount ICs, but it is not suitable for ﬁne

pitch SMDs. In these situations reﬂow soldering is recommended. In these situations

reﬂow soldering is recommended.

20.2 Reﬂow soldering

Reﬂow soldering requires solder paste (a suspension of ﬁne solder particles, ﬂux and

binding agent) to be applied to the printed-circuit board by screen printing, stencilling

or pressure-syringe dispensing before package placement. Driven by legislation and

environmental forces the worldwide use of lead-free solder pastes is increasing.

Several methods exist for reﬂowing; for example, convection or convection/infrared

heating in a conveyor type oven. Throughput times (preheating, soldering and

cooling) vary between 100 and 200 seconds depending on heating method.

Typical reﬂow peak temperatures range from 215 to 270 °C depending on solder

paste material. The top-surface temperature of the packages should preferably be

kept:

• below 225 °C (SnPb process) or below 245 °C (Pb-free process)

– for all BGA, HTSSON..T and SSOP..T packages

– for packages with a thickness ≥ 2.5 mm

– for packages with a thickness < 2.5 mm and a volume ≥ 350 mm³so called

thick/large packages.

• below 240 °C (SnPb process) or below 260 °C (Pb-free process) for packages with

a thickness < 2.5 mm and a volume < 350 mm³so called small/thin packages.

Moisture sensitivity precautions, as indicated on packing, must be respected at all

times.

20.3 Wave soldering

Conventional single wave soldering is not recommended for surface mount devices

(SMDs) or printed-circuit boards with a high component density, as solder bridging

and non-wetting can present major problems.

To overcome these problems the double-wave soldering method was speciﬁcally

developed.

If wave soldering is used the following conditions must be observed for optimal

results:

• Use a double-wave soldering method comprising a turbulent wave with high

upward pressure followed by a smooth laminar wave.

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ISP1520

Hi-Speed USB hub controller

Philips Semiconductors

• For packages with leads on two sides and a pitch (e):

– larger than or equal to 1.27 mm, the footprint longitudinal axis is preferred to be

parallel to the transport direction of the printed-circuit board;

– smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the

transport direction of the printed-circuit board.

The footprint must incorporate solder thieves at the downstream end.

• For packages with leads on four sides, the footprint must be placed at a 45° angle

to the transport direction of the printed-circuit board. The footprint must

incorporate solder thieves downstream and at the side corners.

During placement and before soldering, the package must be ﬁxed with a droplet of

adhesive. The adhesive can be applied by screen printing, pin transfer or syringe

dispensing. The package can be soldered after the adhesive is cured.

Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or

265 °C, depending on solder material applied, SnPb or Pb-free respectively.

A mildly-activated ﬂux will eliminate the need for removal of corrosive residues in

most applications.

20.4 Manual soldering

Fix the component by ﬁrst soldering two diagonally-opposite end leads. Use a low

voltage (24 V or less) soldering iron applied to the ﬂat part of the lead. Contact time

must be limited to 10 seconds at up to 300 °C.

When using a dedicated tool, all other leads can be soldered in one operation within

2 to 5 seconds between 270 and 320 °C.

20.5 Package related soldering information

Table 47: Suitability of surface mount IC packages for wave and reﬂow soldering

methods

Package^[1]

Soldering method

Wave

Reﬂow^[2]

BGA, HTSSON..T^[3], LBGA, LFBGA, SQFP,

SSOP..T^[3], TFBGA, USON, VFBGA

not suitable

suitable

DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, not suitable^[4]

HSQFP, HSSON, HTQFP, HTSSOP, HVQFN,

HVSON, SMS

suitable

PLCC^[5], SO, SOJ

suitable

LQFP, QFP, TQFP

not recommended^[5][6]

not recommended^[7]

not suitable

suitable

SSOP, TSSOP, VSO, VSSOP

CWQCCN..L^[8], PMFP^[9], WQCCN..L^[8]

suitable

not suitable

[1] For more detailed information on the BGA packages refer to the (LF)BGA Application Note

(AN01026); order a copy from your Philips Semiconductors sales ofﬁce.

[2] All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the

maximum temperature (with respect to time) and body size of the package, there is a risk that internal

or external package cracks may occur due to vaporization of the moisture in them (the so called

popcorn effect). For details, refer to the Drypack information in the Data Handbook IC26; Integrated

Circuit Packages; Section: Packing Methods.

9397 750 11689

Product data

Rev. 02 — 04 May 2004

48 of 51

ISP1520

Hi-Speed USB hub controller

Philips Semiconductors

[3] These transparent plastic packages are extremely sensitive to reﬂow soldering conditions and must

on no account be processed through more than one soldering cycle or subjected to infrared reﬂow

soldering with peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reﬂow

oven. The package body peak temperature must be kept as low as possible.

[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom

side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with

the heatsink on the top side, the solder might be deposited on the heatsink surface.

[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave

direction. The package footprint must incorporate solder thieves downstream and at the side corners.

[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it

is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.

[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSOP packages with a pitch (e) equal to or

larger than 0.65 mm; it is deﬁnitely not suitable for packages with a pitch (e) equal to or smaller than

0.5 mm.

[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered

pre-mounted on ﬂex foil. However, the image sensor package can be mounted by the client on a ﬂex

foil by using a hot bar soldering process. The appropriate soldering proﬁle can be provided on

request.

[9] Hot bar soldering or manual soldering is suitable for PMFP packages.

21. Revision history

Table 48: Revision history

Rev Date

CPCN

-

Description

02 20040504

Product data (9397 750 11689)

Modiﬁcations:

• Removed information on bus-power and hybrid-power

• Changed active LOW pin symbol representation from overscore (for example, NAME) to

underscore N (NAME_N)

• Globally changed V_CC(5V0)to V_REF(5V0)

• Table 2: updated

• Updated Section 9.1.3

• Updated Table 7

• Table 34 and Table 35: changed the value of V_REF(5V0)

• Globally changed the value of T_amb

• Table 36: removed I_CC(5V0)

• Updated Figure 16

• Updated Figure 19 and Figure 20.

Preliminary data (9397 750 10689)

01 20030625

-

9397 750 11689

Product data

Rev. 02 — 04 May 2004

49 of 51

ISP1520

Hi-Speed USB hub controller

Philips Semiconductors

22. Data sheet status

Level Data sheet status^[1]

Product status^[2][3]

Deﬁnition

I

Objective data

Development

This data sheet contains data from the objective speciﬁcation for product development. Philips

Semiconductors reserves the right to change the speciﬁcation in any manner without notice.

II

Preliminary data

Qualiﬁcation

This data sheet contains data from the preliminary speciﬁcation. Supplementary data will be published

at a later date. Philips Semiconductors reserves the right to change the speciﬁcation without notice, in

order to improve the design and supply the best possible product.

III

Product data

Production

This data sheet contains data from the product speciﬁcation. Philips Semiconductors reserves the

right to make changes at any time in order to improve the design, manufacturing and supply. Relevant

changes will be communicated via a Customer Product/Process Change Notiﬁcation (CPCN).

[1]

[2]

Please consult the most recently issued data sheet before initiating or completing a design.

The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at

URL http://www.semiconductors.philips.com.

[3]

For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.

performance. When the product is in full production (status ‘Production’),

23. Deﬁnitions

relevant changes will be communicated via a Customer Product/Process

Change Notiﬁcation (CPCN). Philips Semiconductors assumes no

responsibility or liability for the use of any of these products, conveys no

licence or title under any patent, copyright, or mask work right to these

products, and makes no representations or warranties that these products are

free from patent, copyright, or mask work right infringement, unless otherwise

speciﬁed.

Short-form speciﬁcation — The data in a short-form speciﬁcation is

extracted from a full data sheet with the same type number and title. For

detailed information see the relevant data sheet or data handbook.

Limiting values deﬁnition — Limiting values given are in accordance with

the Absolute Maximum Rating System (IEC 60134). Stress above one or

more of the limiting values may cause permanent damage to the device.

These are stress ratings only and operation of the device at these or at any

other conditions above those given in the Characteristics sections of the

speciﬁcation is not implied. Exposure to limiting values for extended periods

may affect device reliability.

25. Licenses

Purchase of Philips I²C components

Application information — Applications that are described herein for any

of these products are for illustrative purposes only. Philips Semiconductors

make no representation or warranty that such applications will be suitable for

the speciﬁed use without further testing or modiﬁcation.

Purchase of Philips I²C components conveys a license

under the Philips’ I²C patent to use the components in the

I²C system provided the system conforms to the I²C

speciﬁcation deﬁned by Philips. This speciﬁcation can be

ordered using the code 9398 393 40011.

24. Disclaimers

26. Trademarks

Life support — These products are not designed for use in life support

appliances, devices, or systems where malfunction of these products can

reasonably be expected to result in personal injury. Philips Semiconductors

customers using or selling these products for use in such applications do so

at their own risk and agree to fully indemnify Philips Semiconductors for any

damages resulting from such application.

ACPI — is an open industry speciﬁcation for PC power management,

co-developed by Intel Corp., Microsoft Corp. and Toshiba.

GoodLink — is a trademark of Koninklijke Philips Electronics N.V.

I²C-bus — is a trademark of Koninklijke Philips Electronics N.V.

OnNow — is a trademark of Microsoft Corporation.

Right to make changes — Philips Semiconductors reserves the right to

make changes in the products - including circuits, standard cells, and/or

software - described or contained herein in order to improve design and/or

Intel — is a registered trademark of Intel Corporation.

Contact information

For additional information, please visit http://www.semiconductors.philips.com.

For sales ofﬁce addresses, send e-mail to: sales.addresses@www.semiconductors.philips.com.

Fax: +31 40 27 24825

50 of 51

9397 750 11689

Product data

Rev. 02 — 04 May 2004

ISP1520

Hi-Speed USB hub controller

Philips Semiconductors

Contents

1

2

3

4

5

6

General description . . . . . . . . . . . . . . . . . . . . . . 1

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . . 3

Ordering information. . . . . . . . . . . . . . . . . . . . . 3

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4

12.3.4

12.3.5

12.3.6

12.4

Get endpoint status . . . . . . . . . . . . . . . . . . . . 29

Get hub status . . . . . . . . . . . . . . . . . . . . . . . . 29

Get port status . . . . . . . . . . . . . . . . . . . . . . . . 30

Various get descriptors. . . . . . . . . . . . . . . . . . 31

13

14

15

16

Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 32

Recommended operating conditions . . . . . . 32

Static characteristics . . . . . . . . . . . . . . . . . . . 33

Dynamic characteristics. . . . . . . . . . . . . . . . . 36

7

7.1

7.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 5

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5

17

Application information . . . . . . . . . . . . . . . . . 42

Descriptor conﬁguration selection . . . . . . . . . 42

Overcurrent detection limit adjustment. . . . . . 42

Self-powered hub conﬁgurations . . . . . . . . . . 43

17.1

17.2

17.3

8

8.1

8.2

Functional description . . . . . . . . . . . . . . . . . . . 9

Analog transceivers . . . . . . . . . . . . . . . . . . . . . 9

Hub controller core . . . . . . . . . . . . . . . . . . . . . . 9

Philips serial interface engine. . . . . . . . . . . . . . 9

Routing logic. . . . . . . . . . . . . . . . . . . . . . . . . . . 9

Transaction translator . . . . . . . . . . . . . . . . . . . . 9

Mini-host controller . . . . . . . . . . . . . . . . . . . . . . 9

Hub repeater. . . . . . . . . . . . . . . . . . . . . . . . . . 10

Hub and port controllers . . . . . . . . . . . . . . . . . 10

Bit clock recovery . . . . . . . . . . . . . . . . . . . . . . 10

Phase-locked loop clock multiplier . . . . . . . . . 10

I²C-bus controller . . . . . . . . . . . . . . . . . . . . . . 10

Overcurrent detection circuit. . . . . . . . . . . . . . 10

GoodLink . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10

Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . 11

18

Test information. . . . . . . . . . . . . . . . . . . . . . . . 45

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 46

8.2.1

8.2.2

8.2.3

8.2.4

8.2.5

8.2.6

8.2.7

8.3

8.4

8.5

8.6

8.7

19

20

20.1

Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Introduction to soldering surface mount

packages. . . . . . . . . . . . . . . . . . . . . . . . . . . . 47

Reﬂow soldering. . . . . . . . . . . . . . . . . . . . . . . 47

Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 47

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 48

Package related soldering information. . . . . . 48

20.2

20.3

20.4

20.5

21

22

23

24

25

26

Revision history . . . . . . . . . . . . . . . . . . . . . . . 49

Data sheet status. . . . . . . . . . . . . . . . . . . . . . . 50

Deﬁnitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Licenses. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 50

9

9.1

Conﬁguration selections. . . . . . . . . . . . . . . . . 12

Conﬁguration through I/O pins . . . . . . . . . . . . 12

Number of downstream facing ports. . . . . . . . 12

Power switching . . . . . . . . . . . . . . . . . . . . . . . 13

Overcurrent protection mode . . . . . . . . . . . . . 14

Non-removable port . . . . . . . . . . . . . . . . . . . . 14

Port indicator support . . . . . . . . . . . . . . . . . . . 15

Device descriptors and string descriptors

9.1.1

9.1.2

9.1.3

9.1.4

9.1.5

9.2

settings using I²C-bus . . . . . . . . . . . . . . . . . . 15

Background information on I²C-bus . . . . . . . . 15

Architecture of conﬁgurable hub descriptors . 16

ROM or EEPROM map. . . . . . . . . . . . . . . . . . 17

ROM or EEPROM detailed map. . . . . . . . . . . 17

9.2.1

9.2.2

9.2.3

9.2.4

10

10.1

10.2

Hub controller description . . . . . . . . . . . . . . . 22

Endpoint 0. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

Endpoint 1. . . . . . . . . . . . . . . . . . . . . . . . . . . . 22

11

Descriptors. . . . . . . . . . . . . . . . . . . . . . . . . . . . 23

12

12.1

12.2

12.3

12.3.1

12.3.2

12.3.3

Hub requests . . . . . . . . . . . . . . . . . . . . . . . . . . 26

Standard USB requests . . . . . . . . . . . . . . . . . 26

Hub class requests . . . . . . . . . . . . . . . . . . . . . 27

Detailed responses to hub requests . . . . . . . . 28

Get conﬁguration . . . . . . . . . . . . . . . . . . . . . . 28

Get device status . . . . . . . . . . . . . . . . . . . . . . 29

Get interface status. . . . . . . . . . . . . . . . . . . . . 29

Printed in The Netherlands

All rights are reserved. Reproduction in whole or in part is prohibited without the prior

written consent of the copyright owner.

The information presented in this document does not form part of any quotation or

contract, is believed to be accurate and reliable and may be changed without notice. No

liability will be accepted by the publisher for any consequence of its use. Publication

thereof does not convey nor imply any license under patent- or other industrial or

intellectual property rights.

Date of release: 04 May 2004

Document order number: 9397 750 11689


型号：	ISP1520BD-S
厂家：	NXP
描述：	IC,BUS CONTROLLER,CMOS,QFP,64PIN 控制器
文件：	总51页 (文件大小：248K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

ISP1520BD-S [NXP]

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