KMZ41,118 [NXP]
KMZ41 - Magnetic field sensor SOIC 8-Pin;
| 型号： | KMZ41,118 |
| 厂家： | 
NXP |
| 描述： | KMZ41 - Magnetic field sensor SOIC 8-Pin 传感器 换能器 |
| 文件： | 总10页 (文件大小：62K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
KMZ41
Magnetic field sensor
Rev. 05 — 27 November 2006
Product data sheet
1. Product profile
1.1 General description
The KMZ41 is a sensitive magnetic field sensor, employing the magneto-resistive effect of
thin film permalloy. The sensor contains two galvanic separated Wheatstone bridges,
which enclose an angle of 45 degrees.
A rotating magnetic field strength > 40 kA/m (recommended field strength > 100 kA/m) in
the surface parallel to the chip (x-y plane) will deliver two independent sinusoidal output
signals, one following a cos(2α) and the second following a sin(2α) function.
The sensor can be operated at any frequency between DC and 1 MHz.
Application notes AN00023 (contactless angle measurement using KMZ41 and UZZ9000)
and AN00004 (contactless angle measurement using KMZ41 and UZZ9001) are
available.
1.2 Features
I Accurate and reliable angle measurement
I Mechanical robustness, contactless principle
I Wear-free operation
I Accuracy independent on mechanical tolerances
I Extended temperature range
1.3 Quick reference data
Table 1.
Quick reference data
Tamb = 25 °C and Hext = 100 kA/m, VCC = 5 V unless otherwise specified.
Symbol Parameter
Conditions
Min
-
Typ
5
Max Unit
[1]
[1]
[1]
VCC
supply voltage
peak voltage
offset voltage
9
V
Vpeak
Voffset
see Figure 2
70
−2
78
-
86
+2
mV
mV/V
per supply voltage;
see Figure 2
[1][2]
Rbridge
bridge resistance
2.0
2.5
3.0
kΩ
[1] Applicable for bridge 1 and bridge 2.
[2] Bridge resistance between pin 4 to pin 8, pin 3 to pin 7, pin 5 to pin 1 and pin 6 to pin 2.
KMZ41
NXP Semiconductors
Magnetic field sensor
2. Pinning information
Table 2.
Pinning
Pin Symbol
Description
Simplified outline
1
2
3
4
5
6
7
8
ON1
ON2
VCC2
VCC1
OP1
output voltage bridge 1
output voltage bridge 2
supply voltage bridge 2
supply voltage bridge 1
output voltage bridge 1
output voltage bridge 2
supply voltage bridge 2
supply voltage bridge 1
8
5
x
y
1
4
mgd790
OP2
GND2
GND1
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
SO8
Description
Version
KMZ41
plastic small outline package; 8 leads; body width 3.9 mm SOT96-1
4. Circuit diagram
KMZ41
bridge 1
bridge 2
cos
R12
sin
R22
R11
R21
R13
R14
R23
R24
V
OP1
GND1 ON1
OP2
GND2 ON2
V
CC2
CC1
V
V
O1
O2
V
V
V
V
V
V
V
V
CC2
CC1
OP1
ON1
OP2
ON2
V
V
V
V
006aaa529
Fig 1. Device and test circuit diagram
KMZ41_5
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 05 — 27 November 2006
2 of 10
KMZ41
NXP Semiconductors
Magnetic field sensor
5. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VCC
Parameter
Conditions
Min
-
Max
9
Unit
V
[1]
supply voltage
Hext
external magnetic field strength
ambient temperature
storage temperature
40
-
kA/m
°C
Tamb
Tstg
−40
−65
+150
+150
°C
[1] Applicable for bridge 1 and bridge 2.
6. Thermal characteristics
Table 5.
Thermal characteristics
Symbol
Parameter
Conditions
Typ
155
Unit
K/W
Rth(j-a)
thermal resistance from junction
to ambient
KMZ41_5
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 05 — 27 November 2006
3 of 10
KMZ41
NXP Semiconductors
Magnetic field sensor
7. Characteristics
Table 6.
Characteristics
Tamb = 25 °C and Hext = 100 kA/m, VCC = 5 V unless otherwise specified.
Symbol
VCC
Parameter
Conditions
Min
-
Typ
5
Max
9
Unit
V
[1]
[1]
supply voltage
peak voltage
Vpeak
see Figure 2
70
78
86
mV
%/K
[1][2]
TCVpeak
temperature coefficient of peak Tamb = −40 °C to +150 °C
−0.38
−0.41
−0.44
voltage
[1][3]
[1][4]
Rbridge
bridge resistance
2.0
2.5
3.0
kΩ
TCRbridge
temperature coefficient of
bridge resistance
Tamb = −40 °C to +150 °C
0.31
0.33
0.35
%/K
[1]
Voffset
offset voltage
per supply voltage;
see Figure 2
−2
−2
-
-
+2
+2
mV/V
[1][5]
TCVoffset
temperature coefficient of
offset voltage
per supply voltage;
(µV/V)/K
T
amb = −40 °C to +150 °C;
see Figure 2
[1][6]
[7]
FH
k
hysteresis of output voltage
amplitude synchronism
see Figure 3
0
0.01
100
0
0.04
101
%FS
%
99
[8]
TCk
temperature coefficient of
amplitude synchronism
Tamb = −40 °C to +150 °C
−0.005
+0.005 %/K
[9]
∆α
angular inaccuracy
0
0.1
0.25 deg
[1] Applicable for bridge 1 and bridge 2.
V peak(at 150 °C) – V peak(at –40 °C)
[2] TCV peak = 100 ×
----------------------------------------------------------------------------------------------------
peak(at 25 °C) × (150 °C – (–40 °C))
V
[3] Bridge resistance between pin 4 to pin 8, pin 3 to pin 7, pin 5 to pin 1 and pin 6 to pin 2.
Rbridge(at 150 °C) – Rbridge(at –40 °C)
[4] TCRbridge = 100 ×
-------------------------------------------------------------------------------------------------------
R
bridge(at 25 °C) × (150 °C – (–40 °C))
Voffset(at 150 °C) – Voffset(at –40 °C)
[5] TCVoffset
=
---------------------------------------------------------------------------------------------------
150 °C – (–40 °C)
V
O1(67.5°)135°→45° – VO1(67.5°)45°→135°
-----------------------------------------------------------------------------------------------------------------------
2 × V peak1
[6] FH1 = 100 ×
FH2 = 100 ×
VO2(22.5°)90°→0° – VO2(22.5°)0°→90°
-----------------------------------------------------------------------------------------------------------
2 × V peak2
V peak1
[7] k = 100 ×
----------------
V peak2
k(at 150 °C) – k(at –40 °C)
----------------------------------------------------------------------------------------
k(at 25 °C) × (150 °C – (–40 °C))
[8] TCk = 100 ×
[9] ∆α = |αreal − αmeas|; Voffset = 0 V; inaccuracy of angular measurement due to deviations from ideal sinusoidal characteristics, calculated
from the third and fifth harmonies of the spectrum of VO.
KMZ41_5
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 05 — 27 November 2006
4 of 10
KMZ41
NXP Semiconductors
Magnetic field sensor
V
O
(mV)
α = 0°
V
O2
direction of
magnetic field
α
V
peak2
ON1
ON2
GND1
GND2
OP2
V
offset2
0
V
CC2
CC1
V
OP1
V
O1
mgu175
0
90
180
270
360
α (deg)
Fig 2. Output signals related to the direction of the magnetic field
006aaa530
V
O
(mV)
FH
2
FH
1
V
V
O2
O1
0
0
45
90
135
α (deg)
Fig 3. Definition of hysteresis
KMZ41_5
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 05 — 27 November 2006
5 of 10
KMZ41
NXP Semiconductors
Magnetic field sensor
8. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
c
y
H
v
M
A
E
Z
5
8
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
4
e
w
M
detail X
b
p
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches 0.069
0.01 0.004
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT96-1
076E03
MS-012
Fig 4. Package outline SOT96-1 (SO8/MS-012)
KMZ41_5
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 05 — 27 November 2006
6 of 10
KMZ41
NXP Semiconductors
Magnetic field sensor
9. Packing information
Table 7.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
2500
KMZ41
SOT96-1
8 mm pitch, 12 mm tape and reel
-118
[1] 12NC ordering code: 9340 372 10118. For further information and the availability of packing methods,
see Section 12.
KMZ41_5
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 05 — 27 November 2006
7 of 10
KMZ41
NXP Semiconductors
Magnetic field sensor
10. Revision history
Table 8.
Revision history
Document ID
KMZ41_5
Release date
Data sheet status
Change notice
Supersedes
20061127
Product data sheet
-
KMZ41_4
Modifications:
• The format of this data sheet has been redesigned to comply with the new identity
guidelines of NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
• Section 1.1 “General description”: amended
• Section 1.2 “Features”: added
• Table 1 “Quick reference data”: Vpeak peak voltage added
• Table 1: Rbridge bridge resistance Table note 2 added
• Table 2 “Pinning”: amended
• Section 3 “Ordering information”: added
• Figure 1 “Device and test circuit diagram”: amended
• Table 4 “Limiting values”: Hext external magnetic field strength added
• Table 4: Tbridge bridge operating temperature redefined to Tamb ambient temperature
• Table 6 “Characteristics”: Hrotation redefined to Hext external magnetic field strength
• Figure 3 “Definition of hysteresis”: added
• Section 9 “Packing information”: added
KMZ41_4
20000418
Preliminary specification
-
KMZ41_3
KMZ41_5
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 05 — 27 November 2006
8 of 10
KMZ41
NXP Semiconductors
Magnetic field sensor
11. Legal information
11.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
malfunction of a NXP Semiconductors product can reasonably be expected to
11.2 Definitions
result in personal injury, death or severe property or environmental damage.
NXP Semiconductors accepts no liability for inclusion and/or use of NXP
Semiconductors products in such equipment or applications and therefore
such inclusion and/or use is at the customer’s own risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
11.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
11.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
12. Contact information
For additional information, please visit: http://www.nxp.com
For sales office addresses, send an email to: salesaddresses@nxp.com
KMZ41_5
© NXP B.V. 2006. All rights reserved.
Product data sheet
Rev. 05 — 27 November 2006
9 of 10
KMZ41
NXP Semiconductors
Magnetic field sensor
13. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Circuit diagram. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Packing information. . . . . . . . . . . . . . . . . . . . . . 7
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8
3
4
5
6
7
8
9
10
11
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
11.1
11.2
11.3
11.4
12
13
Contact information. . . . . . . . . . . . . . . . . . . . . . 9
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2006.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 27 November 2006
Document identifier: KMZ41_5
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