MPXA4250AC6T1_技术文档

MPX4250A, MPXA4250A

20 to 250 kPa, Manifold absolute pressure sensor, on-chip

signal conditioned, temperature compensated and calibrated

Rev. 8.0 — 25 July 2017

Data sheet: technical data

1 General description

The MPX4250A/MPXA4250A Manifold Absolute Pressure (MAP) sensor for engine

control is designed to sense absolute air pressure within the intake manifold. This

measurement can be used to compute the amount of fuel required for each cylinder.

The MPX4250A/MPXA4250A piezoresistive transducer is a state-of-the-art monolithic

silicon pressure sensor designed for a wide range of applications, particularly those

employing a microcontroller or microprocessor with A/D inputs. This transducer combines

advanced micromachining techniques, thin-film metallization, and bipolar processing to

provide an accurate, high-level analog output signal that is proportional to the applied

pressure. The small form factor and high reliability of on-chip integration make the NXP

sensor a logical and economical choice for the automotive system engineer.

2 Features

• 1.5 % maximum error over 0 °C to 85 °C

• Specifically designed for intake manifold absolute pressure sensing in engine control

systems

• Patented silicon shear stress strain gauge

• Temperature compensated over –40 °C to +125 °C

• Offers reduction in weight and volume compared to existing hybrid modules

• Durable epoxy unibody element or thermoplastic small outline, surface mount package

• Ideal for non-automotive applications

• Available in three small outline packages and two unibody packages

MPXA4250A6U

98ASB17756C

CASE 482-01

MPXA4250AC6U/C6T1

98ASB17757C

MPX4250A

98ASB42793B

CASE 867-08

MPX4250AP

98ASB42796B

CASE 867B-04

CASE 482A-01

Figure 1.ꢀSmall outline and unibody packages

3 Typical applications

• Turbo boost engine control

• Ideally suited for microprocessor or microcontroller-based systems

NXP Semiconductors

MPX4250A, MPXA4250A

20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature

compensated and calibrated

4 Ordering information

Table 1.ꢀOrdering information

# of Ports

Pressure type

Differential

Package

Device name

Package

Name

Device

marking

Options

None Single Dual Gauge

Absolute

Small outline package (MPXA4250A series)

MPXA4250A6U

Rail

98ASB17756C

98ASB17757C

•

MPXA4250A

MPXA4250AC6U

MPXA4250AC6T1 Tape and Reel 98ASB17757C

Unibody package (MPX4250A series)

MPX4250A

Tray

98ASB42793B

98ASB42796B

•

MPX4250A

MPX4250AP

•

5 Block diagram

V

CC

2 (Small outline package)

3 (Unibody)

Sensing

Element

Gain Stage #2

Thin Film

Temperature

Compensation

and

and Ground

Reference

Shift

V

OUT

1 (Unibody)

4 (Small outline package)

Circuitry

Gain Stage #1

Pins 4, 5 and 6 are NO CONNECTS

for unibody package devices.

2 (Unibody)

3 (Small outline package)

GND

Pins 1, 5, 6, 7, and 8 are NO CONNECTS

for small outline package devices.

Figure 2.ꢀBlock diagram

6 Pinning information

6.1 Pinning

MPX4250A

(unibody)

MPXA4250A

(SOP)

1

2

3

4

DNC

5

6

7

8

DNC

V

CC

GND

V

OUT

1

2

3

4

5

6

Figure 3.ꢀPinning diagram

MPx4250A

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Data sheet: technical data

Rev. 8.0 — 25 July 2017

2 / 16

NXP Semiconductors

MPX4250A, MPXA4250A

20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature

compensated and calibrated

6.2 Pin description

Table 2.ꢀPin descriptions — Unibody package

Symbol

V_OUT

GND

V_CC

Pin Description

1

2

3

4

5

6

Output voltage

Ground

Voltage supply

DNC

Do not connect to external circuitry or ground

DNC

Table 3.ꢀPin descriptions — Small outline package

Symbol

DNC

V_CC

Pin Description

1

2

3

4

5

6

7

8

Do no connect to external circuitry or ground

Voltage supply

GND

V_OUT

DNC

Ground

Output voltage

Do not connect to external circuitry or ground

7 Mechanical and electrical specifications

7.1 Maximum ratings

Table 4.ꢀMaximum ratings

T_A= 25 °C unless otherwise noted. Exposure beyond the specified limits may cause permanent

damage or degradation to the device.

Rating

Symbol

P_MAX

T_STG

Value

1000

Unit

kPa

°C

Maximum pressure (P1 > P2)

Storage temperature

–40 to +125

Operating temperature

T_A

°C

Figure 2 shows a block diagram of the internal circuitry integrated on a pressure sensor

chip.

MPx4250A

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Data sheet: technical data

Rev. 8.0 — 25 July 2017

3 / 16

NXP Semiconductors

MPX4250A, MPXA4250A

20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature

compensated and calibrated

7.2 Operating characteristics

Table 5.ꢀOperating characteristics

(V_CC= 5.1 Vdc, T_A= 25 °C unless otherwise noted, P1 > P2. Decoupling circuit shown in Figure 5

required to meet electrical specifications.)

Symbol

P_OP

V_CC

I_o

Characteristic

Pressure range^[1]

Supply voltage^[2]

Min

20

Typ

—

Max

250

5.35

10

Unit

kPa

4.85

—

5.1

7.0

Vdc

Supply current

mAdc

Vdc

V_off

Minimum pressure offset^[3](0 °C to 85 °C)

Full scale output^[4](0 °C to 85 °C)

Full scale span^[5](0 °C to 85 °C)

Accuracy^[6](0 °C to 85 °C)

Sensitivity

0.133 0.204 0.274

4.826 4.896 4.966

V_FSO

V_FSS

—

Vdc

—

4.692

—

±1.5

—-

Vdc

%V_FSS

mV/kPa

ms

ΔV/ΔP

t_R

20

Response time^[7]

1.0

0.1

20

I_o+

Output source current at full scale output

Warm-up time^[8]

Offset stability^[9]

mAdc

ms

—

±ꢀ0.5

%V_FSS

[1] 1.0 kPa (kiloPascal) equals 0.145 psi.

[2] Device is ratiometric within this specified excitation range.

[3] Offset (V_off) is defined as the output voltage at the minimum rated pressure.

[4] Full scale output (V_FSO) is defined as the output voltage at the maximum or full rated pressure.

[5] Full scale span (V_FSS) is defined as the algebraic difference between the output voltage at full rated pressure and the

output voltage at the minimum rated pressure.

[6] Accuracy (error budget) consists of the following:

•

Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.

Temperature hysteresis: Output deviation at any temperature within the operating temperature range, after the

temperature is cycled to and from the minimum or maximum operating temperature points, with zero pressure applied.

•

Pressure hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and

from the minimum or maximum rated pressure, at 25 °C.

•

TcSpan: Output deviation over the temperature range of 0 °C to 85 °C, relative to 25 °C.

TcOffset: Output deviation with minimum rated pressure applied, over the temperature range of 0 °C to 85 °C, relative

to 25 °C.

Variation from nominal: The variation from nominal values, for offset or full scale span, as a percent of V_FSS, at 25 °C.

[7] Response time is defined as the time for the incremental change in the output to go from 10 % to 90 % of its final value

when subjected to a specified step change in pressure.

[8] Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has

been stabilized.

[9] Offset stability is the product's output deviation when subjected to 1000 hours of pulsed pressure, temperature cycling

with bias test.

8 On-chip temperature compensation and calibration

Figure 4 illustrates the absolute pressure sensing chip in the basic chip carrier

(98ASB42793B). A fluorosilicone gel isolates the die surface and wire bonds from

the environment, while allowing the pressure signal to be transmitted to the sensor

diaphragm.

The MPX4250A/MPXA4250A pressure sensor operating characteristics and internal

reliability and qualification tests are based on use of dry air as the pressure media.

Media, other than dry air, may have adverse effects on sensor performance and long-

MPx4250A

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Data sheet: technical data

Rev. 8.0 — 25 July 2017

4 / 16

NXP Semiconductors

MPX4250A, MPXA4250A

20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature

compensated and calibrated

term reliability. Contact the factory for information regarding media compatibility in your

application.

Figure 5 shows the recommended decoupling circuit for interfacing the output of the

integrated sensor to the A/D input of a microprocessor or microcontroller.

Figure 6 shows the sensor output signal relative to pressure input. Typical, minimum, and

maximum output curves are shown for operation over a temperature range of 0 °C to 85

°C using the decoupling circuit shown in Figure 5. The output will saturate outside of the

specified pressure range.

Fluoro silicone

Stainless steel

die coat

metal cover

Die

P1

Wire bond

Epoxy case

RTV die bond

Lead frame

Sealed vacuum reference

Figure 4.ꢀCross sectional diagram (not to scale)

ꢁ

+5.1 V

Output

V

out

V

CC

IPS

1.0 µF

GND

470 pF

0.01 µF

For additional output filtering, please refer to Application Note AN1646

Figure 5.ꢀRecommended power supply decoupling and output filtering

ꢁ

5.0

4.5

Transfer Function:

V

= V

x (P x 0.004 – 0.04) ± Error

= 5.1 Vdc

out

CC

4.0

3.5

3.0

Temperature = 0 °C to 85 °C

TYP

MAX

2.5

2.0

1.5

1.0

MIN

0.5

0

Pressure in kPa

Figure 6.ꢀOutput versus absolute pressure

ꢁ

MPx4250A

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Data sheet: technical data

Rev. 8.0 — 25 July 2017

5 / 16

NXP Semiconductors

MPX4250A, MPXA4250A

20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature

compensated and calibrated

Nominal transfer value:

V

= V x (P × 0.004 – 0.04) ± (Pressure error × Temp. Factor × 0.004 x V

CC

= 5.1 ± 0.25 Vdc

)

CC

OUT

CC

Figure 7.ꢀTransfer function

ꢁ

4.0

3.0

2.0

1.0

0.0

Temp °C Multiplier

3

1

3

–40

0 to 85

+125

Temperature

error

factor

–40

–20

0

20

40

60

80

100

120

140

Temperature in °C

Note: The temperature multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C.

Figure 8.ꢀTemperature error band

ꢁ

Figure 9.ꢀPressure error band

9 Package information

9.1 Minimum recommended footprint for surface mounted applications

Surface mount board layout is a critical portion of the total design. The footprint for the

surface mount packages must be the correct size to ensure proper solder connection

interface between the board and the package. With the correct Footprint, the packages

will self align when subjected to a solder reflow process. It is always recommended to

design boards with a solder mask layer to avoid bridging and shorting between solder

pads.

MPx4250A

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Data sheet: technical data

Rev. 8.0 — 25 July 2017

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NXP Semiconductors

MPX4250A, MPXA4250A

20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature

compensated and calibrated

0.100 TYP 8X

2.54

0.660

16.76

0.060 TYP 8X

1.52

0.300

7.62

inch

mm SCALE 2:1

0.100 TYP 8X

2.54

Figure 10.ꢀSOP footprint (Case 482)

MPx4250A

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Data sheet: technical data

Rev. 8.0 — 25 July 2017

7 / 16

NXP Semiconductors

MPX4250A, MPXA4250A

20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature

compensated and calibrated

9.2 Package description

Figure 11.ꢀPackage name 98ASB15576C, Case 482-01 Issue O, Small outline package

MPx4250A

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Data sheet: technical data

Rev. 8.0 — 25 July 2017

8 / 16

NXP Semiconductors

MPX4250A, MPXA4250A

20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature

compensated and calibrated

–A–

D ^{8 PL}

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4

M

S

0.25 (0.010)

T

B

A

5

8

N

–B–

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT.

G

INCHES

MILLIMETERS

1

DIM

A

B

C

D

G

H

J

MIN

MAX

0.425

0.520

0.042

MIN

10.54

12.70

0.96

MAX

10.79

13.21

1.07

0.415

0.500

0.038

S

W

0.100 BSC

2.54 BSC

0.002

0.009

0.061

0

0.444

0.709

0.245

0.115

0.010

0.011

0.071

7

0.448

0.725

0.255

0.125

0.05

0.23

1.55

0

11.28

18.01

6.22

2.92

0.25

0.28

1.80

7

11.38

18.41

6.48

3.17

K

V

M

N

S

V

W

C

H

J

–T–

SEATING

PLANE

PIN 1 IDENTIFIER

M

K

Figure 12.ꢀPackage name 98ASB17757C, Case 482A-01, Issue A, small outline package

ꢁ

Figure 13.ꢀPackage name 98ASB42793B, Case 867-08, Issue N, unibody package

MPx4250A

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Data sheet: technical data

Rev. 8.0 — 25 July 2017

9 / 16

NXP Semiconductors

MPX4250A, MPXA4250A

20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature

compensated and calibrated

MPx4250A

All information provided in this document is subject to legal disclaimers.

Data sheet: technical data

Rev. 8.0 — 25 July 2017

10 / 16

NXP Semiconductors

MPX4250A, MPXA4250A

20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature

compensated and calibrated

Figure 14.ꢀPackage name 98ASB42796B, Case 867B-04, Issue J

MPx4250A

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Data sheet: technical data

Rev. 8.0 — 25 July 2017

11 / 16

NXP Semiconductors

MPX4250A, MPXA4250A

20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature

compensated and calibrated

10 Revision history

Table 6.ꢀRevision history

Document ID

MPX4250A v.8.0

Modifications:

Release date

Data sheet status

Change notice

Supercedes

20170725

Technical data

—

MPX4250A v.7.0

• The format of this data sheet has been redesigned to comply with the new identity guidelines of

NXP Semiconductors.

• Legal texts have been adapted to the new company name where appropriate.

• Updated the document title from "Integrated Silicon Pressure Sensor On-Chip Signal

Conditioned, Temperature Compensated and Calibrated" to "0 to 250 kPa, Differential, gauge

pressure sensor, on-chip signal conditioned, temperature compensated."

• Added Figure 1 "Small outline and unibody packages" in Section 2 "Features".

• Updated Table 1 "Ordering information" in Section 4 "Ordering information".

• Revised Figure 2 "Block diagram " in Section 5 "Block diagram" as follows:

– Changed V_Sto V_CC

• Added pinning illustration as Figure 3 "Pinning diagram" in Section 6.1

• Added pin descriptions in Table 2 "Pin descriptions — Unibody package" and Table 3 "Pin

descriptions — Small outline package" in Section 6.2.

• Changed V_Sto V_CCin the description and within the body of Table 5 "Operating characteristics"

in Section 7.2 "Operating characteristics".

• Updated the figures in Section 8 "On-chip temperature compensation and calibration" as

follows:

– Figure 4 "Cross sectional diagram (not to scale)"

– Figure 5 "Recommended power supply decoupling and output filtering"

– Figure 6 "Output versus absolute pressure"

– Figure 7 "Transfer function"

– Figure 9 "Pressure error band"

• Updated the figures and figure titles in Section 9.2 "Package description" as follows:

– Figure 11 "Package name 98ASB15576C, Case 482-01 Issue O, Small outline package"

– Figure 12 "Package name 98ASB17757C, Case 482A-01, Issue A, small outline package"

– Figure 13 "Package name 98ASB42793B, Case 867-08, Issue N, unibody package"

– Figure 14 "Package name 98ASB42796B, Case 867B-04, Issue J"

MPX4250A v.7.0

20090131

Technical data

—

MPX4250A v.6.0

MPx4250A

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Data sheet: technical data

Rev. 8.0 — 25 July 2017

12 / 16

NXP Semiconductors

MPX4250A, MPXA4250A

20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature

compensated and calibrated

11 Legal information

11.1 Data sheet status

Document status^[1][2]

Product status^[3]

Definition

[short] Data sheet: product_preview

Development

This document contains certain information on a product under development.

NXP reserves the right to change or discontinue this product without notice.

{short] Data sheet: advance information

[short] Data sheet: technical data

Qualification

Production

This document contains information on a new product. Specifications and

information herein are subject to change without notice.

This document contains the product specification. NXP Semiconductors

reserves the right to change the detail specifications as may be required to

permit improvements in the design of its products.

[1] Please consult the most recently issued document before initiating or completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple

devices. The latest product status information is available on the Internet at URL http://www.nxp.com.

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

11.2 Definitions

to the publication hereof.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes

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no representation or warranty that such applications will be suitable

representations or warranties as to the accuracy or completeness of

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respect.

those described in the technical data data sheet.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those

given in the Recommended operating conditions section (if present) or the

11.3 Disclaimers

Limited warranty and liability — Information in this document is believed

Characteristics sections of this document is not warranted. Constant or

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the quality and reliability of the device.

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takes no responsibility for the content in this document if provided by an

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in accordance with the Terms and conditions of commercial sale of NXP

the grant, conveyance or implication of any license under any copyrights,

Semiconductors.

patents or other industrial or intellectual property rights.

Right to make changes — NXP Semiconductors reserves the right to

make changes to information published in this document, including without

Suitability for use in automotive applications — This NXP

Semiconductors product has been qualified for use in automotive

MPx4250A

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Data sheet: technical data

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NXP Semiconductors

MPX4250A, MPXA4250A

20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature

compensated and calibrated

applications. Unless otherwise agreed in writing, the product is not designed,

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

authorized or warranted to be suitable for use in life support, life-critical or

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Notice: All referenced brands, product names, service names and

trademarks are the property of their respective owners.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

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Freescale — is a trademark of NXP B.V.

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MPx4250A

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Data sheet: technical data

Rev. 8.0 — 25 July 2017

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NXP Semiconductors

MPX4250A, MPXA4250A

20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature

compensated and calibrated

Tables

Tab. 1.

Tab. 2.

Tab. 3.

Ordering information ..........................................2

Pin descriptions — Unibody package ................3

Pin descriptions — Small outline package ........ 3

Tab. 4.

Tab. 5.

Tab. 6.

Maximum ratings ...............................................3

Operating characteristics ...................................4

Revision history ...............................................12

Figures

Fig. 1.

Fig. 2.

Fig. 3.

Fig. 4.

Fig. 5.

Small outline and unibody packages .................1

Fig. 10. SOP footprint (Case 482) ..................................7

Fig. 11. Package name 98ASB15576C, Case

482-01 Issue O, Small outline package .............8

Fig. 12. Package name 98ASB17757C, Case

482A-01, Issue A, small outline package .......... 9

Fig. 13. Package name 98ASB42793B, Case

867-08, Issue N, unibody package ....................9

Fig. 14. Package name 98ASB42796B, Case

867B-04, Issue J .............................................10

Block diagram ................................................... 2

Pinning diagram ................................................ 2

Cross sectional diagram (not to scale) ..............5

Recommended power supply decoupling

and output filtering ............................................ 5

Output versus absolute pressure ...................... 5

Transfer function ............................................... 6

Temperature error band ....................................6

Pressure error band ..........................................6

Fig. 6.

Fig. 7.

Fig. 8.

Fig. 9.

MPx4250A

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Data sheet: technical data

Rev. 8.0 — 25 July 2017

15 / 16

NXP Semiconductors

MPX4250A, MPXA4250A

20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature

compensated and calibrated

Contents

1

2

3

4

5

6

6.1

6.2

7

7.1

7.2

8

General description ............................................ 1

Features ............................................................... 1

Typical applications ............................................1

Ordering information .......................................... 2

Block diagram ..................................................... 2

Pinning information ............................................ 2

Pinning ...............................................................2

Pin description ...................................................3

Mechanical and electrical specifications .......... 3

Maximum ratings ............................................... 3

Operating characteristics ...................................4

On-chip temperature compensation and

calibration ............................................................ 4

Package information ...........................................6

Minimum recommended footprint for surface

9

9.1

mounted applications .........................................6

Package description .......................................... 8

Revision history ................................................ 12

Legal information ..............................................13

9.2

10

11

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section 'Legal information'.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 25 July 2017

Document identifier: MPx4250A


型号：	MPXA4250AC6T1
厂家：	NXP
描述：	20 to 250 kPa, Manifold absolute pressure sensor, on-chip signal conditioned, temperature compensated and calibrated 传感器换能器
文件：	总16页 (文件大小：548K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

MPXA4250AC6T1 [NXP]

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