MPXA6115AC6T_技术文档

MOTOROLA

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by MPXA6115A

SEMICONDUCTOR TECHNICAL DATA

High Temperature Accuracy

Integrated Silicon Pressure Sensor

for Measuring Absolute Pressure,

On-Chip Signal Conditioned,

Temperature Compensated

and Calibrated

MPXA6115A

MPXH6115A

SERIES

INTEGRATED

PRESSURE SENSOR

15 to 115 kPa (2.2 to 16.7 psi)

0.2 to 4.8 Volts Output

Motorola’s MPXA6115A/MPXH6115A series sensor integrates on--chip, bipolar op amp

circuitry and thin film resistor networks to provide a high output signal and temperature

compensation. The small form factor and high reliability of on--chip integration make the

Motorola pressure sensor a logical and economical

choice for the system designer.

SUPER SMALL OUTLINE

PACKAGE

SMALL OUTLINE PACKAGE

The MPXA6115A/MPXH6115A series piezoresistive

transducer is a state--of--the--art, monolithic, signal

conditioned, silicon pressure sensor. This sensor

combines advanced micromachining techniques, thin

film metallization, and bipolar semiconductor processing

to provide an accurate, high level analog output signal

that is proportional to applied pressure.

MPXA6115A6U

CASE 482

MPXH6115A6U

CASE 1317

Figure 1 shows a block diagram of the internal

circuitry integrated on a pressure sensor chip.

Features

•

Improved Accuracy at High Temperature

Available in Small and Super Small Outline

Packages

•

1.5% Maximum Error over 0° to 85°C

Ideally suited for Microprocessor or

Microcontroller--Based Systems

Temperature Compensated from --40° to +125°C

Durable Thermoplastic (PPS) Surface Mount

Package

MPXA6115AC6U

CASE 482A

MPXH6115AC6U

CASE 1317A

J

•

PIN NUMBER

1

2

3

4

N/C

5

6

7

8

N/C

Application Examples

V

S

•

Aviation Altimeters

Industrial Controls

Engine Control/Manifold Absolute Pressure (MAP)

Weather Station and Weather Reporting Device

Barometers

MPXV5004G7U

CASE 482B

Gnd

V

out

NOTE: Pins 1, 5, 6, 7, and 8 are

internal device connections. Do not

connect to external circuitry or

ground. Pin 1 is denoted by the

chamfered corner of the package.

V

S

MPXV5004GC7U

CASE 482C

THIN FILM

TEMPERATURE

COMPENSATION

AND

GAIN STAGE #2

AND

GROUND

REFERENCE

SHIFT CIRCUITRY

PIN NUMBER

SENSING

ELEMENT

V

out

1

2

3

4

N/C

5

6

7

8

N/C

V

S

GAIN STAGE #1

Gnd

V

out

PINS 1, 5, 6, 7 AND 8 ARE NO CONNECTS

NOTE: Pins 1, 5, 6, 7, and 8 are

internal device connections. Do not

connect to external circuitry or

ground. Pin 1 is denoted by the notch

in the lead.

GND

Figure 1. Fully Integrated Pressure Sensor

Schematic

REV 2

Motorola Sensor Device Data

MPXA6115A MPXH6115A SERIES

 Motorola, Inc. 2003

1

MAXIMUM RATINGS⁽¹⁾

Parametrics

Symbol

Value

400

Units

kPa

Maximum Pressure (P1 > P2)

Storage Temperature

P

max

T

stg

-- 4 0 ° to +125°

0.5

°C

Operating Temperature

T

A

°C

(2)

Output Source Current @ Full Scale Output

I +

o

mAdc

(2)

Output Sink Current @ Minimum Pressure Offset

NOTES:

1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.

2. Maximum Output Current is controlled by effective impedance from V to Gnd or V to V in the application circuit.

I --

o

-- 0 . 5

out

S

OPERATING CHARACTERISTICS (V = 5.0 Vdc, T = 25°C unless otherwise noted, P1 > P2.)

S

A

Characteristic

Symbol

Min

Typ

—

Max

115

Unit

kPa

Vdc

Pressure Range

P

OP

15

(1)

Supply Voltage

V

4.75

—

5.0

5.25

10

S

Supply Current

I

6.0

mAdc

Vdc

o

(2)

Minimum Pressure Offset

(0 to 85°C)

V

off

0.133

0.200

0.268

@ V = 5.0 Volts

S

(3)

Full Scale Output

V

4.633

4.433

4.700

4.500

4.768

4.568

Vdc

FSO

@ V = 5.0 Volts

S

(4)

Full Scale Span

V

FSS

@ V = 5.0 Volts

S

(5)

Accuracy

—

45

±1.5

—

%V

FSS

Sensitivity

V/P

mV/kPa

ms

(6)

Response Time

t

1.0

—

R

(7)

Warm--Up Time

—

20

—

ms

(8)

Offset Stability

±0.25

—

%V

FSS

NOTES:

1. Device is ratiometric within this specified excitation range.

2. Offset (V ) is defined as the output voltage at the minimum rated pressure.

off

3. Full Scale Output (V

) is defined as the output voltage at the maximum or full rated pressure.

FSO

4. Full Scale Span (V

) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the

FSS

minimum rated pressure.

5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span

at 25°C due to all sources of error including the following:

•

Linearity:

Output deviation from a straight line relationship with pressure over the specified pressure range.

Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is

cycled to and from the minimum or maximum operating temperature points, with zero differential

pressure applied.

•

Pressure Hysteresis:

Output deviation at any pressure within the specified range, when this pressure is cycled to and from

minimum or maximum rated pressure at 25°C.

•

TcSpan:

TcOffset:

Output deviation over the temperature range of 0° to 85°C, relative to 25°C.

Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative

to 25°C.

6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to

a specified step change in pressure.

7. Warm--up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.

8. Offset Stability is the product’s output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.

MPXA6115A MPXH6115A SERIES

2

Motorola Sensor Device Data

DIE

FLUORO SILICONE

GEL DIE COAT

STAINLESS

STEEL CAP

+5.0 V

P1

WIRE BOND

THERMOPLASTIC

CASE

V

Pin 2

S

MPXA6115A

LEAD

FRAME

MPXH6115A

100 nF

V

out

Pin 4

to ADC

47 pF

51 K

GND Pin 3

ABSOLUTE ELEMENT

SEALED VACUUM REFERENCE

DIE BOND

Figure 2. Cross Sectional Diagram SSOP

(not to scale)

Figure 3. Typical Application Circuit

(Output Source Current Operation)

Figure 2 illustrates the absolute sensing chip in the basic

Super Small Outline chip carrier (Case 1317).

Figure 3 shows a typical application circuit (output source

current operation).

5.0

MAX

TRANSFER FUNCTION:

out

4.5

4.0

V

= V * (.009*P--.095) ± Error

s

V = 5.0 Vdc

S

TEMP = 0 to 85°C

3.5

3.0

2.5

TYP

2.0

1.5

1.0

0.5

0

MIN

Pressure (ref: to sealed vacuum) in kPa

Figure 4. Output versus Absolute Pressure

Figure 4 shows the sensor output signal relative to pres-

sure input. Typical minimum and maximum output curves

are shown for operation over 0 to 85°C temperature range.

The output will saturate outside of the rated pressure range.

A fluorosilicone gel isolates the die surface and wire

bonds from the environment, while allowing the pressure

signal to be transmitted to the silicon diaphragm. The

MPXA6115A/MPXH6115A series pressure sensor operating

characteristics, internal reliability and qualification tests are

based on use of dry air as the pressure media. Media other

than dry air may have adverse effects on sensor perfor-

mance and long--term reliability. Contact the factory for

information regarding media compatibility in your application.

MPXA6115A MPXH6115A SERIES

Motorola Sensor Device Data

3

Transfer Function (MPXA6115A/MPXH6115A)

Nominal Transfer Value: V_out= V_Sx (0.009 x P -- 0.095)

± (Pressure Error x Temp. Factor x 0.009 x V_S)

V_S= 5.0 ± 0.25 Vdc

Temperature Error Band

MPXA6115A/MPXH6115A Series

4.0

3.0

2.0

1.0

0.0

Break Points

Temp

Multiplier

-- 4 0

0 to 85

125

3

1

1.75

Temperature

Error

Factor

-- 4 0

-- 2 0

0

2 0

4 0

6 0

80

100

120

140

Temperature in C°

NOTE: The Temperature Multiplier is a linear response from 0°C to --40°C and from 85°C to 125°C

Pressure Error Band

Error Limits for Pressure

3.0

2.0

1.0

0.0

Pressure (in kPa)

20

40

60

80

100

120

-- 1 . 0

Pressure

Error (Max)

-- 2 . 0

-- 3 . 0

15 to 115 (kPa) ± 1.5 (kPa)

ORDERING INFORMATION — SMALL OUTLINE PACKAGE

Device Type

Options

Case No.

482

MPX Series Order No.

MPXA6115A6U

Packing Options

Rails

Marking

MPXA6115A

Basic Element

Absolute, Element Only

Absolute, Axial Port

482

MPXA6115A6T1

MPXA6115AC6U

MPXA6115AC6T1

Tape and Reel

Rails

Ported Element

482A

Tape and Reel

ORDERING INFORMATION — SUPER SMALL OUTLINE PACKAGE

Device Type

Options

Case No.

1317

MPX Series Order No.

MPXH6115A6U

Packing Options

Rails

Marking

MPXH6115A

Basic Element

Absolute, Element Only

Absolute, Axial Port

1317

MPXH6115A6T1

MPXH6115AC6U

MPXH6115AC6T1

Tape and Reel

Rails

Ported Element

1317A

Tape and Reel

MPXA6115A MPXH6115A SERIES

4

Motorola Sensor Device Data

SURFACE MOUNTING INFORMATION

MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES

Surface mount board layout is a critical portion of the total

design. The footprint for the semiconductor package must

be the correct size to ensure proper solder connection inter-

face between the board and the package. With the correct

pad geometry, the packages will self--align when subjected to

a solder reflow process. It is always recommended to fabri-

cate boards with a solder mask layer to avoid bridging and/or

shorting between solder pads, especially on tight tolerances

and/or tight layouts.

0.100 TYP

2.54

0.660

16.76

0.060 TYP 8X

1.52

0.300

7.62

inch

mm

0.100 TYP 8X

2.54

Figure 5. SOP Footprint (Case 482)

0.050

0.387

9.83

1.27

TYP

0.150

3.81

0.027 TYP 8X

0.69

0.053 TYP 8X

1.35

inch

mm

Figure 6. SSOP Footprint (Case 1317 and 1317A)

MPXA6115A MPXH6115A SERIES

Motorola Sensor Device Data

5

NOTES

MPXA6115A MPXH6115A SERIES

6

Motorola Sensor Device Data

NOTES

MPXA6115A MPXH6115A SERIES

Motorola Sensor Device Data

7

SMALL OUTLINE PACKAGE DIMENSIONS

-- A --

D ^{8 PL}

NOTES:

4

M

S

0.25 (0.010)

T

B

A

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

5

8

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

-- B --

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.

G

1

INCHES

DIM MIN MAX

MILLIMETERS

MIN

10.54

5.38

MAX

10.79

5.84

S

N

A

B

C

D

G

H

J

K

M

N

S

0.415

0.212

0.038

0.425

0.230

0.042

0.96

1.07

0.100 BSC

2.54 BSC

0.002

0.009

0.061

0.010

0.011

0.071

0.05

0.23

1.55

0.25

0.28

1.80

H

C

0

7

0

7

_

J

-- T --

0.405

0.709

0.415

0.725

10.29

18.01

10.54

18.41

SEATING

PLANE

PIN 1 IDENTIFIER

M

K

CASE 482--01

ISSUE O

-- A --

D ^{8 PL}

0.25 (0.010)

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

4

M

S

T

B

A

5

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

N

-- B --

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.

G

INCHES

DIM MIN MAX

MILLIMETERS

8

1

MIN

10.54

12.70

0.96

MAX

10.79

13.21

1.07

A

B

C

D

G

H

J

K

M

N

S

0.415

0.500

0.038

0.425

0.520

0.042

S

W

0.100 BSC

2.54 BSC

0.002

0.009

0.061

0.010

0.011

0.071

0.05

0.23

1.55

0.25

0.28

1.80

V

0

7

0

7

_

0.444

0.709

0.245

0.115

0.448

0.725

0.255

0.125

11.28

18.01

6.22

11.38

18.41

6.48

C

V

W

2.92

3.17

H

J

-- T --

SEATING

PLANE

PIN 1 IDENTIFIER

M

K

CASE 482A--01

ISSUE A

MPXA6115A MPXH6115A SERIES

8

Motorola Sensor Device Data

SMALL OUTLINE PACKAGE DIMENSIONS (CONTINUED)

-- A --

NOTES:

4

1. DIMENSIONING AND TOLERANCING PER ANSI

5

8

Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

-- B --

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.

6. DIMENSION S TO CENTER OF LEAD WHEN

FORMED PARALLEL.

G

D 8 PL

1

M

S

0.25 (0.010)

T

B

A

INCHES

DIM MIN MAX

MILLIMETERS

MIN

10.54

5.33

MAX

10.79

5.59

DETAIL X

A

B

C

D

G

J

K

M

N

S

0.415

0.210

0.026

0.425

0.220

0.034

S

N

PIN 1 IDENTIFIER

0.66

0.864

0.100 BSC

2.54 BSC

0.23

2.54

0.009

0.100

0.011

0.120

0.28

3.05

0

15

0

15

_

C

0.405

0.540

0.415

0.560

10.29

13.72

10.54

14.22

SEATING

PLANE

-- T --

K

M

J

DETAIL X

CASE 482B--03

ISSUE B

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

-- A --

2. CONTROLLING DIMENSION: INCH.

3. DIMENSION A AND B DO NOT INCLUDE MOLD

PROTRUSION.

4

5

8

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).

5. ALL VERTICAL SURFACES 5_ TYPICAL DRAFT.

6. DIMENSION S TO CENTER OF LEAD WHEN

FORMED PARALLEL.

N

-- B --

D 8 PL

G

M

S

INCHES

DIM MIN MAX

MILLIMETERS

0.25 (0.010)

T

B

A

1

MIN

10.54

12.70

0.66

MAX

10.79

13.21

0.864

A

B

C

D

G

J

0.415

0.500

0.026

0.425

0.520

0.034

DETAIL X

S

W

0.100 BSC

2.54 BSC

0.009

0.100

0

0.011

0.120

15

0.23

2.54

0

0.28

3.05

15

K

M

N

S

PIN 1

V

_

IDENTIFIER

0.444

0.540

0.245

0.115

0.448

0.560

0.255

0.125

11.28

13.72

6.22

11.38

14.22

6.48

C

V

W

2.92

3.17

SEATING

PLANE

-- T --

K

M

J

DETAIL X

CASE 482C--03

ISSUE B

MPXA6115A MPXH6115A SERIES

Motorola Sensor Device Data

9

SUPER SMALL OUTLINE PACKAGE DIMENSIONS

2X

0.006 C

A

B

0.420

0.400

0.050

NOTES:

1. ALL DIMENSIONS ARE IN INCHES.

2. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M--1994.

0.025

3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR

PROTRUSIONS. MOLD FLASH OR PROTRUSIONS

SHALL NOT EXCEED .006 INCHES PER SIDE.

4. ALL VERTICAL SURFACES TO BE 5° MAXIMUM.

5. DIMENSION DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR PROTRUSION

SHALL BE .008 INCHES MAXIMUM.

0.300

0.280

3

0.019

0.014

0.004

8X

5

M

C A B

0.300

0.280

A

B

3

0.298

0.278

.010

GAGE

PLANE

0.165

0.145

0.010

0.002

°

10

0.023

0.013

°

0

0.004

DETAIL E

SEATING

PLANE

C

CASE 1317--03

ISSUE B

MPXA6115A MPXH6115A SERIES

10

Motorola Sensor Device Data

SUPER SMALL OUTLINE PACKAGE DIMENSIONS (CONTINUED)

2X

0.006 C

A

B

NOTES:

0.420

0.400

1. ALL DIMENSIONS ARE IN INCHES.

2. DIMENSIONING AND TOLERANCING PER ASME

Y14.5M--1994.

3. DIMENSIONS DO NOT INCLUDE MOLD FLASH OR

PROTRUSIONS. MOLD FLASH OR PROTRUSIONS

SHALL NOT EXCEED .006 INCHES PER SIDE.

4. ALL VERTICAL SURFACES TO BE 5° MAXIMUM.

5. DIMENSION DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR PROTRUSION

SHALL BE .008 INCHES MAXIMUM.

0.050

0.025

0.345

0.325

0.018

8X

5

0.014

.014

M

0.004

C A B

GAGE

0.345

0.325

PLANE

B

A

0.010

°

10

0.002

0.048

°

0

0.038

DETAIL E

0.130

0.110

0.200

0.180

0.300

0.280

0.390

0.370

3

0.004

0.300

0.280

A

B

DETAIL E

3

SEATING

PLANE

C

BOTTOM VIEW

CASE 1317A--01

ISSUE A

MPXA6115A MPXH6115A SERIES

Motorola Sensor Device Data

11

Information in this document is provided solely to enable system and software implementers to use Motorola products. There are no express or implied copyright

licenses granted hereunder to design or fabricate any integrated circuits or integrated circuits based on the information in this document.

Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding

the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and

specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Motorola

data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including

“Typicals”, must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the

rights of others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other

applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury

or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola

and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees

arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that

Motorola was negligent regarding the design or manufacture of the part.

MOTOROLA and the Stylized M Logo are registered in the US Patent and Trademark Office. All other product or service names are the property of their respective

owners. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.

E Motorola Inc. 2003

HOW TO REACH US:

USA/EUROPE/LOCATIONS NOT LISTED:

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P.O. Box 5405, Denver, Colorado 80217

1--800--521--6274 or 480--768--2130

JAPAN: Motorola Japan Ltd.; SPS, Technical Information Center,

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81--3--3440--3569

ASIA/PACIFIC: Motorola Semiconductors H.K. Ltd.; Silicon Harbour Centre,

2 Dai King Street, Tai Po Industrial Estate, Tai Po, N.T., Hong Kong

852--26668334

HOME PAGE: http://motorola.com/semiconductors

MPXA6115A MPXH6115A SERIES

12

Motorola Sensor Device Data

◊

MPXA6115A


型号：	MPXA6115AC6T
厂家：	NXP
描述：	MPXA6115AC6T
文件：	总12页 (文件大小：236K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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