PCA9922N_技术文档

PCA9922

8-channel constant current LED driver with output error

detection

Rev. 01 — 15 January 2009

Product data sheet

1. General description

The PCA9922 is an 8-channel constant current LED driver designed for LED signage and

display applications. The output current is adjustable from 15 mA to 60 mA controlled by

an external series resistor. The outputs are controlled via a serial interface with a

maximum clock frequency of 25 MHz to allow for the system requirement of high volume

data transmission. Each of the 8 channel outputs has edge rate control to limit the change

in current when the outputs are enabled or disabled.

The device has built-in circuitry for detecting LED open-circuit and output short to ground.

After signaling the speciﬁed error detect sequence on the input control lines, error status

can be read out of the device via the serial data out.

The device is designed such that it may be cascaded with other similar devices. The SDO

pin contains the output of the shift register which may be used for cascading to the SDI pin

of the next device in the series. SDO changes state on the falling edge of CLK. SDI

captures data on the rising edge of CLK.

The PCA9922 is a pin-to-pin functionally equivalent 5 V alternative (exception: error data

is inverted; see Section 7.2.1, Section 7.2.2 and Section 7.2.7) for the ST2221A and

STP08CDC596.

The PCA9922 is available in DIP16, TSSOP16 and HVQFN20 packages and is speciﬁed

over the −40 °C to +85 °C industrial temperature range.

2. Features

I 25 MHz serial interface

I 3.3 V to 5.5 V operation

I 8 LED low side constant current outputs

I Global control for the 8 LED outputs variable between 15 mA to 60 mA

I 15 mA to 60 mA maximum current for all 8 output channels set by an external resistor

I Constant current matching at 25 °C, V_DD= 5.0 V

I Bit-to-bit: ±6 %

I Chip-to-chip: ±10 %

I Gradual turn-on/turn-off output to limit EMI

I Error detection mode for line open, output short to ground, LED open and LED short

I −40 °C to +85 °C operation

I ESD protection exceeds 2000 V HBM per JESD22-A114, 200 V MM per

JESD22-A115, and 1000 V CDM per JESD22-C101

I Latch-up testing is done to JEDEC Standard JESD78 which exceeds 100 mA

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

I Packages offered: DIP16, TSSOP16, HVQFN20

3. Applications

I Full color, multi-color, monochrome LED signs

I LED billboard displays

I Trafﬁc display signs

I Transportation and commercial LED signs

4. Ordering information

Table 1.

Ordering information

Type number

Package

Name

Description

Version

PCA9922N

PCA9922PW

PCA9922BS

DIP16

plastic dual in-line package; 16 leads (300 mil)

SOT38-4

SOT403-1

TSSOP16 plastic thin shrink small outline package; 16 leads; body width 4.4 mm

HVQFN20 plastic thermal enhanced very thin quad ﬂat package; no leads; 20 terminals; SOT662-1

body 5 × 5 × 0.85 mm

4.1 Ordering options

Table 2.

Ordering options

Type number

PCA9922N

Topside mark

PCA9922N

PCA9922

P9922

Temperature range

T_amb= −40 °C to +85 °C

PCA9922PW

PCA9922BS

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

2 of 26

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

5. Block diagram

LED0

LED1

LED7

V

DD

ERROR

DETECT

R_EXT

CURRENT REGULATOR

V

DD

PCA9922

OE

LE

OUTPUT ENABLE

AUTO SHUTDOWN

AND

AUTO POWER-UP

8× DATA LATCH

V

SS

SDI

8× SHIFT REGISTER

SDO

CLK

V

SS

ERROR CONTROL

002aad311

Fig 1. Block diagram of PCA9922

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

3 of 26

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

6. Pinning information

6.1 Pinning

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

V

DD

SS

SDI

CLK

R_EXT

SDO

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

V

DD

SS

LE/DM1

LED0

LED1

LED2

LED3

OE/DM2

LED7

LED6

LED5

LED4

SDI

CLK

R_EXT

SDO

PCA9922N

LE/DM1

LED0

LED1

LED2

LED3

OE/DM2

LED7

LED6

LED5

LED4

PCA9922PW

002aad161

002aad163

Fig 2. Pin conﬁguration for DIP16

Fig 3. Pin conﬁguration for TSSOP16

terminal 1

index area

1

2

3

4

5

15

14

13

12

11

CLK

LE/DM1

LED0

SDO

OE/DM2

LED7

LED6

LED5

PCA9922BS

LED1

LED2

002aad349

Transparent top view

Fig 4. Pin conﬁguration for HVQFN20

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

4 of 26

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

6.2 Pin description

Table 3.

Pin description

I = input; O = output.

Symbol

Type

Description

DIP16,

HVQFN20

TSSOP16

V_SS

SDI

CLK

1

2

3

19^[1]

20

1

power supply

supply ground

serial data in

I

serial data clock used to shift data on SDI

into the shift register

LE/DM1

4

2

I

latch enable with internal pull-down

resistor; active HIGH signal used to

capture data in the shift register to present

to the outputs

Detection Mode 1

LED0

LED1

LED2

LED3

LED4

LED5

LED6

LED7

OE/DM2

5

3

O

I

constant current LED output driver 0

constant current LED output driver 1

constant current LED output driver 2

constant current LED output driver 3

constant current LED output driver 4

constant current LED output driver 5

constant current LED output driver 6

constant current LED output driver 7

6

4

7

5

8

6

9

10

11

12

13

14

10

11

12

13

output enable with internal pull-up resistor;

active LOW signal used to allow data

captured in the latch to be presented to

the constant current outputs

Detection Mode 2

serial data output

external resistor input

supply voltage

SDO

R_EXT

V_DD

14

15

16

-

15

O

16

analog input

power supply

-

17

n.c.

7, 8, 9, 18

not connected

[1] HVQFN20 package die supply ground is connected to both V_SSpin and exposed center pad. V_SSpin must

be connected to supply ground for proper device operation. For enhanced thermal, electrical, and board

level performance, the exposed pad needs to be soldered to the board using a corresponding thermal pad

on the board and for proper heat conduction through the board, thermal vias need to be incorporated in the

PCB in the thermal pad region.

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

5 of 26

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

7. Functional description

The PCA9922 is an 8-channel constant current LED driver with built-in LED output error

detection. The PCA9922 contains an 8-bit shift register and data latches, which convert

serial input data into parallel output data.

At the output stage, 8 regulated current sinks are designed to provide constant and

uniform current through LEDs with different forward voltages (V_F).

Refer to Figure 1 “Block diagram of PCA9922”.

7.1 System interface

During normal operation, serial data can be transferred into the PCA9922 through SDI,

shifted into the shift register, and out through the SDO. Data shifts from the SDI pin into

the next sequential bit in the shift register on each rising edge of the CLK input. The MSB

is the ﬁrst bit to be clocked in. Data shifts out of the shift register and is presented on the

SDO pin on the falling edge of CLK. The exception to this is during the error detect

sequence, at which time the error status is loaded in a parallel fashion into the shift

register. The shift register is never disabled. It is either shifting or it is loading the error

status on every rising edge of CLK. Additionally, the device is designed such that it may be

cascaded with other similar devices. The SDO pin contains the output of the shift register

which may be used for cascading to the SDI pin of the next device in the series.

Data is parallel loaded from the serial shift register to an output control register when LE

(Latch Enable) is asserted HIGH (serial-to-parallel conversion). The output control register

will continue to reﬂect the shift register data, even if changes occur in the shift register

data, as long as LE is HIGH. When LE is LOW the latch is closed and changes in the shift

register data no longer effect the output control register. Applications where the latches

are bypassed (LE tied HIGH) will require that the OE input be HIGH during serial data

entry.

The data in the output control register is then used to drive the constant current output

drivers when the outputs are enabled. The outputs are globally enabled or disabled

through the OE. A LOW level on the OE will enable the output drivers, LED0 to LED7, to

reﬂect the data contained in the output control register.

An example timing diagram of expected normal operation of the device is shown in

Figure 5.

Remark: It is recommended that OE and LE pulse widths be at least two clocks wide

when CLK is running to avoid inadvertent entry into the error detect modes.

There is no synchronization logic in the design between CLK, LE and OE. It is the user’s

responsibility to meet the timing presented in Table 10 in order to guarantee proper

operation.

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

6 of 26

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

CLK

SDI

LE

OE

LED0

LED1

LED2

LED3

LED4

LED5

LED6

LED7

002aad203

For each LEDn 0 is on, 1 is off.

Fig 5. Normal function timing diagram

7.2 LED output error detection

The PCA9922 has built-in circuitry for detecting LED open-circuit and output short

conditions. A predeﬁned set of signal sequence on the input control lines must be initiated

to perform the output error detection. Once the error data is captured by this sequence,

error status can be read out of the device via the serial interface.

The error detection mode is entered by the user via speciﬁc timing sequences presented

on the CLK, OE and LE pins. There are three key sequences to be generated by the user:

enter error detect, capture faults, and exit error detect. It is the responsibility of the user to

enable all outputs that the user wants to test during the error detect sequence.

Performing an error mode detection sequence consists of several operations:

1. Entering error detect mode.

2. Setting all bits that you want to test by enabling all outputs to logical 1s in the output

latch.

3. Capture fault data.

4. Exit error detect.

7.2.1 Open-circuit detection principle

The LED open-circuit detection compares the effective current level I_Owith the open load

detection threshold current I_th(det). If I_Ois below I_th(det), the PCA9922 detects an open-load

condition. This error status can be read as an error status code in the error detect mode.

For open-circuit error detection, a channel must be on.

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

7 of 26

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

Table 4.

Open-circuit detection

Condition of

State of

Error status code

Meaning

output port

output current

off

on

I_O= 0 mA

0

detection not possible

open circuit

[1]

I_O< I_th(det)

1

[1]

I_O≥ I_th(det)

channel n error status bit 0

normal

[1] I_th(det)= 0.5 × I_O(target) (typical).

7.2.2 Short-circuit detection principle

The LED short-circuit detection compares the effective voltage level (V_O) with the

shorted-load detection threshold voltages V_th(det)scand V_th(norm). If V_Ois above the

V_th(det)scthreshold, the PCA9922 detects a shorted-load condition. If V_Ois below the

V_th(norm)threshold, no error is detected or error bit is reset. This error status can be read

as an error status code in the Special mode. For short-circuit error detection, a channel

must be on.

Table 5.

Shorted-load detection

State of

Condition of

Error status code

Meaning

output port

output voltage

off

on

I_O= 0 mA

0

detection not possible

short circuit

V_O≥ V_th(det)sc

1

V_O< V_th(norm)

channel n error status bit 0

normal

7.2.3 Entering error detect mode

Entering the error detect mode consists of a 5-clock sequence involving CLK, OE and LE

as shown in Figure 6. The user must meet the set-up and hold times for OE and LE as

detailed inTable 10 to guarantee proper operation of the error detect circuitry. It should be

noted that the act of driving LE HIGH around the rising edge of clock 4 opens the latch in

the current control register block and data captured in the shift register at that point in time

is moved into the output control register. It should also be noted that the output logic was

enabled for a brief period of time while OE is LOW around the rising edge of clock 2. The

outputs LED[7:0] will glitch during this period.

CLK

LE

OE

002aad204

Fig 6. Timing for ‘Enter Error Detect Mode’ command

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

8 of 26

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

7.2.4 Setting the outputs to test

Before the Capture Fault sequence may be performed, the outputs must be set up. A logic

HIGH must be sent to the output control register for all eight bits. This is done after the

Enter Error Detect sequence is performed as a normal data load sequence as seen in

Figure 5. Please note that this process is completely destructive to the data that is stored

in the output control register (and the LED[7:0] pins). The output control register will have

to be restored to its proper values by the user after the error detect sequence has been

completed.

7.2.5 Capturing the fault/output error data

The Capture Fault/Error Data sequence can only follow the Enter Error Detect sequence.

If the Error Detect sequence has not occurred, this sequence will be treated as a normal

operational sequence. Once the Capture Fault sequence has occurred, an Exit Error

Detect sequence should be performed. There can be no more Capture Sequences until

another Enter Error Detect sequence has occurred.

The Capture Fault Sequence consists of holding OE LOW for no less than 3 clocks (CLK)

and for a minimum of 2 µs, whichever is longer. During this period of time, the shift register

is being loaded with the fault status. As such, data presented to the device via SDI will not

be captured. Bit 7 of the fault data will be present on SDO by the ﬁrst falling edge CLK

after the user de-asserts OE for this cycle. An error condition is output as a 1 (HIGH bit),

and a 0 (LOW bit) designates a normal status. Timing for this sequence is shown in

Figure 7.

CLK

LE

OE

OE = 1'b0 for minimum of 3 clocks

or 2 µs, whichever is longer

SDO

previous serial data

fault data MSB

resume shift

with fault data

002aad205

Fig 7. Timing for ‘Capture Fault Mode’ command

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

9 of 26

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

7.2.6 Exit error detect mode

The ‘Exit error detect mode’ sequence is used to exit the error detect mode of operation

and resume normal mode. This is a 5-clock timing sequence using CLK, OE and LE. This

sequence consists of LE being held inactive for all ﬁve clocks. OE is active in the second

clock for one and only one clock. Figure 8 shows the timing for this sequence.

CLK

LE

OE

002aad206

Fig 8. Timing for ‘Exit Error Detect Mode’ command

7.2.7 Error detection data

The PCA9922 will return a logical 1 for each output pin that has an error condition

detected as described in Table 4 and Table 5. An error condition may be either an

open circuit or short-circuit at the output pin. Once the Capture Fault sequence has

completed, the resultant fault/output error data may be shifted out of the device by issuing

8 clocks and reading the data at the SDO pin. If more than one device is connected in

series, then more than 8 clocks will be needed to shift all of the data from all of the devices

through to the last SDO pin in the chain.

Figure 9 shows a complete error detection sequence.

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

10 of 26

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

8. Application design-in information

5 V

C

10 µF

3.3 V to 5.5 V

LED0 LED1 LED2 LED3

LED7

OE

V

DD

PCA9922

R_EXT

SDI

SDO

to next stage

CLK

LE

V

SS

PWM

OR

BLANKING

INPUT

MICROCONTROLLER

SDO from last stage

002aad312

Fig 10. Typical application

V

= 3 V 4 V

LED

+

V

CE

V

−

DD

scan

R

OE

CLK

LE

V

I

O

LED0

LED7

CPU

PCA9922

SDI

R_EXT

V

SDO

SS

OE

CLK

LE

V

I

O

LED0

LED7

PCA9922

SDI

R_EXT

V

SDO

SS

002aad504

Fig 11. The PCA9922 in a typical multi-device architecture

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

12 of 26

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

9. Limiting values

Table 6.

Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol

V_DD

Parameter

Conditions

Min

−0.5

−0.4

-

Max

+6.0

V_DD+ 0.4

485

Unit

V

supply voltage

V_O(LED)

V_O(SDO)

V_I

LED output voltage

output voltage on pin SDO

input voltage

pins LED0 to LED7

V

I_SS

ground supply current

output current on pin LEDn

clock frequency

mA

MHz

°C

I_O(LEDn)

f_clk

-

60

operating

-

25

T_stg

storage temperature

junction temperature

total power dissipation

−65

−40

+150

+125

T_j

P_tot

T_amb= 25 °C

DIP16

-

1.12

W

TSSOP16

HVQFN20

0.625

3.125

10. Recommended operating conditions

Table 7.

Symbol

V_DD

Operating conditions

Parameter

Conditions

Min

Max

Unit

supply voltage

3.3

5.5

V

V_O(LED)

LED output voltage

pins LED0 to LED7

inactive

-

5.5

2.2

60

V

output active

-

V

I_O(LEDn)

V_O(SDO)

P_tot

output current on pin LEDn

output voltage on pin SDO

total power dissipation

15

-

mA

V

5.5

T_amb= 85 °C

DIP16

-

0.44

0.25

1.25

+85

W

°C

TSSOP16

HVQFN20

-

T_oper

operating temperature

−40

11. Thermal characteristics

Table 8.

Symbol

R_th(j-a)

Thermal characteristics

Parameter

Conditions

Typ

Unit

thermal resistance from junction

to ambient

DIP16

89

°C/W

TSSOP16

HVQFN20

160

32

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

13 of 26

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

12. Static characteristics

Table 9.

Static characteristics

V_DD= 5.0 V; T_amb= 25 °C; unless otherwise speciﬁed.

Symbol

Parameter

Conditions

Min

Typ

Max

Unit

V_th(det)sc

short-circuit detection threshold

voltage

for short-error detection;

I_O(target) = 5 mA to

120 mA

2.4

2.5

2.6

V

V_th(norm)

normal mode threshold voltage

for short-error detection;

I_O(target) = 5 mA to

120 mA

2.3

-

V

Control interface (OE, LE, CLK, SDI, SDO)

[1]

V_IH

V_IL

V_OL

V_OH

I_LI

HIGH-level input voltage

LOW-level input voltage

LOW-level output voltage

HIGH-level output voltage

input leakage current

input capacitance

0.7V_DD

−0.3

-

V_DD+ 0.3

V

-

0.3V_DD

0.4

-

V

I_OL= 1 mA

-

V

I_OL= −1 mA

V_I= V_DDor V_SS(CLK, SDI)

V_I= V_DDor 0 V

OE pin

V_DD− 0.4

-

V

−1

-

+1

µA

pF

kΩ

C_i

1.5

300

200

5

R_PU

R_pd

pull-up resistance

150

100

600

400

pull-down resistance

LE pin

Current controlled outputs (LED[7:0])

I_OL

LOW-level output current

V_O= 0.7 V; R_ext= 910 Ω

V_O= 0.7 V; R_ext= 470 Ω

17.5

35.4

19.5

38.1

21.7

40.8

mA

∆I_OL

LOW-level output current variation between bits

V_O= 0.7 V; R_ext= 910 Ω

-

±3.0

±1.5

0.7

±7

%

V_O= 0.7 V; R_ext= 470 Ω

R_ext= open; LED[7:0] = off

R_ext= 910 Ω; LED[7:0] = off

R_ext= 470 Ω; LED[7:0] = off

R_ext= 910 Ω; LED[7:0] = on

R_ext= 470 Ω; LED[7:0] = on

±4

%

I_DD

supply current

1.05

6.0

9.0

6.0

9.0

mA

3.6

6.2

3.6

6.2

[1] OE must be held active LOW for at least the duration of the rise/fall time of the LEDn pins. This pulse width does not apply to

active LOW times for executing error detect sequences.

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

14 of 26

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

13. Dynamic characteristics

Table 10. Dynamic characteristics

Symbol

t_w(LE)

Parameter

Conditions

Min

10

200

5

Typ

Max

Unit

ns

[1]

[2]

LE pulse width

V_DD= 3.3 V

-

t_w(OE)

OE pulse width

-

ns

t_su(SDI)

t_h(SDI)

SDI set-up time

SDI hold time

from SDI to CLK

from CLK to SDI

-

ns

5

-

ns

f_CLK

frequency on pin CLK

clock duty cycle

CLK HIGH pulse width

CLK LOW pulse width

0

25

MHz

δ

-

50 to 50 60 to 40 %

t_w(CLKH)

t_w(CLKL)

t_PD(CLK-SDO)

16

-

ns

-

propagation delay

from CLK to SDO

10

[3]

t_su(LE)

LE set-up time

OE set-up time

LE hold time

OE hold time

from LE to CLK

from OE to CLK

from CLK to LE

from CLK to OE

20

5

-

ns

t_su(OE)

-

t_h(LE)

-

t_h(OE)

5

-

t_PD(OE-LEDH)

propagation delay

from OE to LED HIGH

pins LED0 to LED7; V_DD= 5.0 V;

C_L= 30 pF; R_L= 15 Ω; V_L= 1.9 V;

I_O= 20.7 mA; R_ext= 910 Ω

-

210

t_PD(OE-LEDL)

propagation delay

from OE to LED LOW

pins LED0 to LED7; V_DD= 5.0 V;

C_L= 30 pF; R_L= 15 Ω; V_L= 1.9 V;

I_O= 20.7 mA; R_ext= 910 Ω

-

210

-

ns

t_PD(LEH-LEDH)

propagation delay

pins LED0 to LED7; V_DD= 5.0 V;

from LE HIGH to LED HIGH C_L= 30 pF; R_L= 15 Ω; V_L= 1.9 V;

I_O= 20.7 mA; R_ext= 910 Ω;

OE = logic 0

t_PD(LEH-LEDL)

propagation delay

from LE HIGH to LED LOW

pins LED0 to LED7; V_DD= 5.0 V;

C_L= 30 pF; R_L= 15 Ω; V_L= 1.9 V;

I_O= 20.7 mA; R_ext= 910 Ω;

OE = logic 0

-

210

-

ns

t_{PD(CLKH-LEDH)}propagation delay

pins LED0 to LED7; V_DD= 5.0 V;

from CLK HIGH to LED HIGH C_L= 30 pF; R_L= 15 Ω; V_L= 1.9 V;

I_O= 20.7 mA; R_ext= 910 Ω;

OE = logic 0; LE = logic 1

t_{PD(CLKH-LEDL)}propagation delay

pins LED0 to LED7; V_DD= 5.0 V;

from CLK HIGH to LED LOW C_L= 30 pF; R_L= 15 Ω; V_L= 1.9 V;

I_O= 20.7 mA; R_ext= 910 Ω;

OE = logic 0; LE = logic 1

t_r

t_f

rise time

fall time

pins LED0 to LED7; V_DD= 5.0 V;

C_L= 30 pF; R_L= 15 Ω; V_L= 1.9 V;

I_O= 20.7 mA; R_ext= 910 Ω

-

175

190

-

ns

pins LED0 to LED7; V_DD= 5.0 V;

C_L= 30 pF; R_L= 15 Ω; V_L= 1.9 V;

I_O= 20.7 mA; R_ext= 910 Ω;

OE = logic 0

[1] Applies to normal device operation. This pulse width does not apply to active HIGH times for executing error detect sequences.

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

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PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

[2] OE must be held active LOW for at least the duration of the rise/fall time of the LEDn pins. This pulse width does not apply to

active LOW times for executing error detect sequences.

[3] Timing required for signaling of error detection sequences. Not necessary for ‘normal’ operation.

f

CLK

t

w(CLKL)

w(CLKH)

CLK

50 %

h(SDI)

t

su(SDI)

SDI

OE

LE

50 %

t

su(OE)

h(OE)

h(LE)

50 %

t

su(LE)

50 %

t

PD(CLK-SDO)

SDO

50 %

002aad209

Fig 12. Timing 1

90 %

10 %

90 %

10 %

LEDn

t

r

f

002aad210

Fig 13. LED[7:0] rise/fall timing

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

16 of 26

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

t

w(OE)

OE

50 %

t

PD(OE-LEDH)

PD(OE-LEDL)

PD(OE-LEDH)

PD(OE-LEDL)

LEDn

LE

50 %

t

w(LE)

50 %

t

PD(LEH-LEDH)

PD(LEH-LEDL)

LEDn

CLK

50 %

t

PD(CLKH-LEDH)

PD(CLKH-LEDL)

LEDn

002aad211

Fig 14. Timing 2

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

17 of 26

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

14. Package outline

DIP16: plastic dual in-line package; 16 leads (300 mil)

SOT38-4

D

M

E

A

2

A

1

L

c

e

w M

Z

b

1

(e )

1

b

2

16

9

M

H

pin 1 index

E

1

8

0

5

10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

(1)

Z

A

2

(1)

1

w

UNIT

mm

b

c

D

E

e

L

M

H

1

2

1

E

max.

min.

max.

1.73

1.30

0.53

0.38

1.25

0.85

0.36

0.23

19.50

18.55

6.48

6.20

3.60

3.05

8.25

7.80

10.0

8.3

4.2

0.51

3.2

2.54

0.1

7.62

0.3

0.254

0.01

0.76

0.068 0.021 0.049 0.014

0.051 0.015 0.033 0.009

0.77

0.73

0.26

0.24

0.14

0.12

0.32

0.31

0.39

0.33

inches

0.17

0.02

0.13

0.03

Note

1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

95-01-14

03-02-13

SOT38-4

Fig 15. Package outline SOT38-4 (DIP16)

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

18 of 26

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

TSSOP16: plastic thin shrink small outline package; 16 leads; body width 4.4 mm

SOT403-1

D

E

A

X

c

y

H

v

M

A

E

Z

9

16

Q

(A )

3

A

2

A

1

pin 1 index

θ

L

p

L

1

8

detail X

w

M

b

p

e

0

2.5

5 mm

scale

DIMENSIONS (mm are the original dimensions)

A

(1)

(2)

(1)

UNIT

A

b

c

D

E

e

H

L

Q

v

w

y

Z

θ

1

2

3

p

E

p

max.

8^o

0^o

0.15

0.05

0.95

0.80

0.30

0.19

0.2

0.1

5.1

4.9

4.5

4.3

6.6

6.2

0.75

0.50

0.4

0.3

0.40

0.06

mm

1.1

0.65

0.25

1

0.2

0.13

0.1

Notes

1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.

2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

99-12-27

03-02-18

SOT403-1

MO-153

Fig 16. Package outline SOT403-1 (TSSOP16)

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

19 of 26

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

HVQFN20: plastic thermal enhanced very thin quad flat package; no leads;

20 terminals; body 5 x 5 x 0.85 mm

SOT662-1

B

A

D

terminal 1

index area

A

1

E

c

detail X

C

e

1

y

e

b

v

M

C

A B

C

1

w

6

10

L

11

5

e

E

h

2

1

15

terminal 1

index area

20

16

X

D

h

0

2.5

scale

5 mm

DIMENSIONS (mm are the original dimensions)

(1)

A

max.

(1)

UNIT

A

b

c

E

e

1

e

2

y

D

E

L

v

w

y

1

h

0.05 0.38

0.00 0.23

5.1

4.9

3.25 5.1

2.95 4.9

3.25

2.95

0.75

0.50

mm

0.05

0.1

1

0.2

0.65

2.6

0.1

0.05

Note

1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

JEITA

01-08-08

02-10-22

SOT662-1

- - -

MO-220

- - -

Fig 17. Package outline SOT662-1 (HVQFN20)

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

20 of 26

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

15. Handling information

All input and output pins are protected against ElectroStatic Discharge (ESD) under

normal handling. When handling ensure that the appropriate precautions are taken as

described in JESD625-A or equivalent standards.

16. Soldering of SMD packages

This text provides a very brief insight into a complex technology. A more in-depth account

of soldering ICs can be found in Application Note AN10365 “Surface mount reﬂow

soldering description”.

16.1 Introduction to soldering

Soldering is one of the most common methods through which packages are attached to

Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both

the mechanical and the electrical connection. There is no single soldering method that is

ideal for all IC packages. Wave soldering is often preferred when through-hole and

Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not

suitable for ﬁne pitch SMDs. Reﬂow soldering is ideal for the small pitches and high

densities that come with increased miniaturization.

16.2 Wave and reﬂow soldering

Wave soldering is a joining technology in which the joints are made by solder coming from

a standing wave of liquid solder. The wave soldering process is suitable for the following:

• Through-hole components

• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board

Not all SMDs can be wave soldered. Packages with solder balls, and some leadless

packages which have solder lands underneath the body, cannot be wave soldered. Also,

leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,

due to an increased probability of bridging.

The reﬂow soldering process involves applying solder paste to a board, followed by

component placement and exposure to a temperature proﬁle. Leaded packages,

packages with solder balls, and leadless packages are all reﬂow solderable.

Key characteristics in both wave and reﬂow soldering are:

• Board speciﬁcations, including the board ﬁnish, solder masks and vias

• Package footprints, including solder thieves and orientation

• The moisture sensitivity level of the packages

• Package placement

• Inspection and repair

• Lead-free soldering versus SnPb soldering

16.3 Wave soldering

Key characteristics in wave soldering are:

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

21 of 26

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

• Process issues, such as application of adhesive and ﬂux, clinching of leads, board

transport, the solder wave parameters, and the time during which components are

exposed to the wave

• Solder bath speciﬁcations, including temperature and impurities

16.4 Reﬂow soldering

Key characteristics in reﬂow soldering are:

• Lead-free versus SnPb soldering; note that a lead-free reﬂow process usually leads to

higher minimum peak temperatures (see Figure 18) than a SnPb process, thus

reducing the process window

• Solder paste printing issues including smearing, release, and adjusting the process

window for a mix of large and small components on one board

• Reﬂow temperature proﬁle; this proﬁle includes preheat, reﬂow (in which the board is

heated to the peak temperature) and cooling down. It is imperative that the peak

temperature is high enough for the solder to make reliable solder joints (a solder paste

characteristic). In addition, the peak temperature must be low enough that the

packages and/or boards are not damaged. The peak temperature of the package

depends on package thickness and volume and is classiﬁed in accordance with

Table 11 and 12

Table 11. SnPb eutectic process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm³)

< 350

235

≥ 350

220

< 2.5

≥ 2.5

220

Table 12. Lead-free process (from J-STD-020C)

Package thickness (mm) Package reﬂow temperature (°C)

Volume (mm³)

< 350

260

350 to 2000

> 2000

260

< 1.6

260

250

245

1.6 to 2.5

> 2.5

260

245

250

245

Moisture sensitivity precautions, as indicated on the packing, must be respected at all

times.

Studies have shown that small packages reach higher temperatures during reﬂow

soldering, see Figure 18.

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

22 of 26

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

maximum peak temperature

= MSL limit, damage level

temperature

minimum peak temperature

= minimum soldering temperature

peak

temperature

time

001aac844

MSL: Moisture Sensitivity Level

Fig 18. Temperature proﬁles for large and small components

For further information on temperature proﬁles, refer to Application Note AN10365

“Surface mount reﬂow soldering description”.

17. Soldering of through-hole mount packages

17.1 Introduction to soldering through-hole mount packages

This text gives a very brief insight into wave, dip and manual soldering.

Wave soldering is the preferred method for mounting of through-hole mount IC packages

on a printed-circuit board.

17.2 Soldering by dipping or by solder wave

Driven by legislation and environmental forces the worldwide use of lead-free solder

pastes is increasing. Typical dwell time of the leads in the wave ranges from

3 seconds to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb

or Pb-free respectively.

The total contact time of successive solder waves must not exceed 5 seconds.

The device may be mounted up to the seating plane, but the temperature of the plastic

body must not exceed the speciﬁed maximum storage temperature (T_stg(max)). If the

printed-circuit board has been pre-heated, forced cooling may be necessary immediately

after soldering to keep the temperature within the permissible limit.

17.3 Manual soldering

Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the

seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is

less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is

between 300 °C and 400 °C, contact may be up to 5 seconds.

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

23 of 26

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

17.4 Package related soldering information

Table 13. Suitability of through-hole mount IC packages for dipping and wave soldering

Package

Soldering method

Dipping

Wave

CPGA, HCPGA

-

suitable

DBS, DIP, HDIP, RDBS, SDIP, SIL

PMFP^[2]

suitable

-

suitable^[1]

not suitable

[1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit

board.

[2] For PMFP packages hot bar soldering or manual soldering is suitable.

18. Abbreviations

Table 14. Abbreviations

Acronym

CDM

EMI

Description

Charged-Device Model

ElectroMagnetic Interference

ElectroStatic Discharge

Human Body Model

Light Emitting Diode

Machine Model

ESD

HBM

LED

MM

MSB

PCB

Most Signiﬁcant Bit

Printed-Circuit Board

Pulse Width Modulator

PWM

19. Revision history

Table 15. Revision history

Document ID

Release date

20090115

Data sheet status

Change notice

Supersedes

PCA9922_1

Product data sheet

-

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

24 of 26

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

20. Legal information

20.1 Data sheet status

Document status^[1][2]

Product status^[3]

Development

Deﬁnition

Objective [short] data sheet

This document contains data from the objective speciﬁcation for product development.

This document contains data from the preliminary speciﬁcation.

This document contains the product speciﬁcation.

Preliminary [short] data sheet Qualiﬁcation

Product [short] data sheet Production

[1]

[2]

[3]

Please consult the most recently issued document before initiating or completing a design.

The term ‘short data sheet’ is explained in section “Deﬁnitions”.

The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status

information is available on the Internet at URL http://www.nxp.com.

malfunction of an NXP Semiconductors product can reasonably be expected

20.2 Deﬁnitions

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors accepts no liability for inclusion and/or use of

NXP Semiconductors products in such equipment or applications and

therefore such inclusion and/or use is at the customer’s own risk.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modiﬁcations or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences of

use of such information.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

speciﬁed use without further testing or modiﬁcation.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is intended

for quick reference only and should not be relied upon to contain detailed and

full information. For detailed and full information see the relevant full data

sheet, which is available on request via the local NXP Semiconductors sales

ofﬁce. In case of any inconsistency or conﬂict with the short data sheet, the

full data sheet shall prevail.

Limiting values — Stress above one or more limiting values (as deﬁned in

the Absolute Maximum Ratings System of IEC 60134) may cause permanent

damage to the device. Limiting values are stress ratings only and operation of

the device at these or any other conditions above those given in the

Characteristics sections of this document is not implied. Exposure to limiting

values for extended periods may affect device reliability.

Terms and conditions of sale — NXP Semiconductors products are sold

subject to the general terms and conditions of commercial sale, as published

at http://www.nxp.com/proﬁle/terms, including those pertaining to warranty,

intellectual property rights infringement and limitation of liability, unless

explicitly otherwise agreed to in writing by NXP Semiconductors. In case of

any inconsistency or conﬂict between information in this document and such

terms and conditions, the latter will prevail.

20.3 Disclaimers

General — Information in this document is believed to be accurate and

reliable. However, NXP Semiconductors does not give any representations or

warranties, expressed or implied, as to the accuracy or completeness of such

information and shall have no liability for the consequences of use of such

information.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Right to make changes — NXP Semiconductors reserves the right to make

changes to information published in this document, including without

limitation speciﬁcations and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

20.4 Trademarks

Notice: All referenced brands, product names, service names and trademarks

are the property of their respective owners.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in medical, military, aircraft,

space or life support equipment, nor in applications where failure or

21. Contact information

For more information, please visit: http://www.nxp.com

For sales ofﬁce addresses, please send an email to: salesaddresses@nxp.com

PCA9922_1

Product data sheet

Rev. 01 — 15 January 2009

25 of 26

PCA9922

NXP Semiconductors

8-channel constant current LED driver with output error detection

22. Contents

1

General description . . . . . . . . . . . . . . . . . . . . . . 1

20.4

21

Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Contact information . . . . . . . . . . . . . . . . . . . . 25

Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26

2

Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1

Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2

Ordering information. . . . . . . . . . . . . . . . . . . . . 2

Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 2

Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3

3

22

4

4.1

5

6

6.1

6.2

Pinning information. . . . . . . . . . . . . . . . . . . . . . 4

Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4

Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5

7

7.1

7.2

7.2.1

7.2.2

7.2.3

7.2.4

7.2.5

7.2.6

7.2.7

Functional description . . . . . . . . . . . . . . . . . . . 6

System interface. . . . . . . . . . . . . . . . . . . . . . . . 6

LED output error detection . . . . . . . . . . . . . . . . 7

Open-circuit detection principle . . . . . . . . . . . . 7

Short-circuit detection principle . . . . . . . . . . . . 8

Entering error detect mode. . . . . . . . . . . . . . . . 8

Setting the outputs to test. . . . . . . . . . . . . . . . . 9

Capturing the fault/output error data. . . . . . . . . 9

Exit error detect mode . . . . . . . . . . . . . . . . . . 10

Error detection data . . . . . . . . . . . . . . . . . . . . 10

8

Application design-in information . . . . . . . . . 12

Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13

Recommended operating conditions. . . . . . . 13

Thermal characteristics. . . . . . . . . . . . . . . . . . 13

Static characteristics. . . . . . . . . . . . . . . . . . . . 14

Dynamic characteristics . . . . . . . . . . . . . . . . . 15

Package outline . . . . . . . . . . . . . . . . . . . . . . . . 18

Handling information. . . . . . . . . . . . . . . . . . . . 21

9

10

11

12

13

14

15

16

Soldering of SMD packages . . . . . . . . . . . . . . 21

Introduction to soldering . . . . . . . . . . . . . . . . . 21

Wave and reﬂow soldering . . . . . . . . . . . . . . . 21

Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21

Reﬂow soldering . . . . . . . . . . . . . . . . . . . . . . . 22

16.1

16.2

16.3

16.4

17

17.1

Soldering of through-hole mount packages . 23

Introduction to soldering through-hole

mount packages . . . . . . . . . . . . . . . . . . . . . . . 23

Soldering by dipping or by solder wave . . . . . 23

Manual soldering . . . . . . . . . . . . . . . . . . . . . . 23

Package related soldering information . . . . . . 24

17.2

17.3

17.4

18

19

Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 24

Revision history. . . . . . . . . . . . . . . . . . . . . . . . 24

20

Legal information. . . . . . . . . . . . . . . . . . . . . . . 25

Data sheet status . . . . . . . . . . . . . . . . . . . . . . 25

Deﬁnitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

20.1

20.2

20.3

Please be aware that important notices concerning this document and the product(s)

described herein, have been included in section ‘Legal information’.

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 15 January 2009

Document identifier: PCA9922_1


型号：	PCA9922N
厂家：	NXP
描述：	8-channel constant current LED driver with output error detection 8通道恒流LED驱动器，具有输出误差检测显示驱动器驱动程序和接口接口集成电路光电二极管
文件：	总26页 (文件大小：136K)
中文：	中文翻译
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