PCF50603HN [NXP]
Controller for power supply and battery management; 控制器，用于电源和电池管理
| 型号： | PCF50603HN |
| 厂家： | 
NXP |
| 描述： | Controller for power supply and battery management |
| 文件： | 总28页 (文件大小：147K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
PCF50603
Controller for power supply
and battery management
Preliminary specification
2003 Oct 31
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
CONTENTS
8.6
Backup battery charger (BBC)
8.7
8.8
8.9
8.10
8.11
8.12
8.13
SIM card interface (SIMI)
1
FEATURES
Battery voltage monitor (BVM)
Temperature high sensor (TS)
Real time clock (RTC)
Pulse-width modulator (PWM1 and PWM2)
LED modulator (LED1 and LED2)
General purpose outputs (GPO)
1.1
1.2
1.3
1.4
System control
Supply voltage generation
Battery management
Subscriber identity module card interface
2
3
4
5
6
7
8
APPLICATIONS
9
LIMITING VALUES
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAM
10
11
12
13
13.1
CHARACTERISTICS
APPLICATION INFORMATION
PACKAGE OUTLINE
SOLDERING
PINNING
Introduction to soldering surface mount
packages
Reflow soldering
Wave soldering
Manual soldering
FUNCTIONAL DESCRIPTION
8.1
On/off control
Operating states
Reset generation
Watchdog timer
Automatic restart after battery removal
Debounce filters
Serial interface (I2C-bus)
Interrupt controller (INT)
Power supply modules
Main battery charger (MBC)
Supported charger plugs
External components
13.2
13.3
13.4
13.5
8.1.1
8.1.2
8.1.3
8.1.4
8.1.5
8.2
8.3
8.4
8.5
8.5.1
8.5.2
Suitability of surface mount IC packages for
wave and reflow soldering methods
14
15
16
17
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
PURCHASE OF PHILIPS I2C COMPONENTS
2003 Oct 31
2
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
1
FEATURES
1.1
System control
• Serial 400 kHz I2C-bus interface to transfer the control
data between the PCF50603 and the host controller
• On/Off Control (OOC) module to control the power
ramp-up and ramp-down sequences for the handset.
Furthermore it determines the supported system
operating states: NOPOWER, SAVE, STANDBY and
ACTIVE to realize minimum power consumption in all
states.
1.2
Supply voltage generation
• The power supplies have three programmable activity
modes (OFF, ECO and ON). In the ACTIVE state, the
operation modes can be selected by the two external
pins PWREN1 and PWREN2.
• Internal Current Controlled Oscillator (CCO) generates
the internal high clock frequency. The generated
frequency is typically 3.6 MHz.
• One Charge Pump (CP) with programmable output
voltage for the supply of white or blue LEDs
• An accurate 32.768 kHz oscillator. This oscillator can be
used to supply the 32 kHz clock domains in the system,
to improve the accuracy of the internal clock and to
reduce the power consumption of the PCF50603.
• Two 100 mA LDO voltage regulators (RF1REG and
RF2REG) with fixed output voltage (mask
programmable) for RF supplies. RF1REG and RF2REG
are optimized for low noise, high power supply rejection
and excellent load regulation.
• Interrupt controller (INT) that generates the interrupt
request for the host controller. All interrupt sources can
be masked.
• Two 150 mA LDO voltage regulators (D1REG and
D2REG) optimized for small external capacitors.
D1REG provides a programmable output voltage,
D2REG provides a fixed output voltage (mask
programmable).
• The Real Time Clock (RTC) module uses the 32 kHz
clock to provide time reference and alarm functions with
wake up control for the handset
• One 150 mA LDO voltage regulator (IOREG) dedicated
for the supply of the I/O pads. IOREG has a fixed output
voltage (mask programmable) and is optimized for a
small external capacitor.
• One accessory recognition pin with debounce filters and
capability to start up the system (REC1_N)
• One accessory detection comparator input pin with
programmable threshold levels that issues an interrupt
when an accessory is connected (REC2_N)
• One 100 mA LDO voltage regulator (LPREG) with fixed
output voltage (mask programmable). In low power
operation (ECO) mode LPREG can be used to
permanently supply parts in the system in all activity
states.
• Two Pulse-Width Modulators (PWM1 and PWM2) which
generate an output voltage with programmable duty
cycle and frequency
• Two LED modulators (LED1 and LED2) capable of
generating eight different blinking patterns with eight
different repetition periods
• One 100 mA LDO voltage regulator (D3REG) with
programmable output voltage. D3REG is optimized for a
small external capacitor.
• Three General Purpose Outputs (GPO) programmable
via the serial interface. The GPOs are open-drain
NMOST outputs, capable of handling the full battery
voltage range and high sink currents. The GPOs can be
programmed to be continuously active LOW or 3-state,
in addition the GPO outputs can be controlled by the
LED or PWM modulators.
• One 250 mA LDO voltage regulator (HCREG) with
programmable output voltage. The high current HCREG
is optimized for applications like hands-free audio.
• D1REG, D2REG, D3REG, IOREG and LPREG support
ECO mode. In this mode the output current is limited to
1 mA and the internal power consumption is reduced
significantly.
• Watchdog timer that can be activated by software.
• The Temperature high Sensor (TS) provides thermal
protection for the whole chip
• Enhanced ESD protection on all pins that connect to the
main battery pack
• Microphone bias voltage generator with low noise and
high power supply rejection (MBGEN).
2003 Oct 31
3
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
1.3
Battery management
1.4
Subscriber identity module card interface
• Operates from a three cell NiCd/NiMH or a one cell
• Two different modes that can be selected with the
Li-ion battery pack
Subscriber Identity Module card Interface (SIMI):
• Battery Voltage Monitor (BVM) to detect a too low main
battery voltage with programmable threshold levels.
A low battery condition is reported via the interrupt
mechanism.
– Transparent interface including an arbiter and signal
level translators
– Subscriber Identity Module (SIM) card interface with
integrated sequencer, arbiter and signal level
translators. The sequencer supports and controls
card activation and de-activation, warm reset and
controlled clock stop for power-down modes.
• Charger control. There is an option between two
different charger control functions, depending on the
configuration:
– Configuration Constant Current Constant Voltage
(CCCV). Linear charger control supporting Li-ion as
well as NiCd/NiMH battery types for a wide range of
battery capacities.
• Dedicated SIM supply (SIMREG). Supports
3.0 V and 1.8 V cards, including a power saving ECO
mode for the power-down mode of the SIM card.
• Enhanced ESD protection on all pins that connect to the
– Configuration BATMAX comparator that compares
the battery voltage against a programmable
SIM card contact pins.
threshold voltage. This function can be activated by
software and is used to detect the end-of-charge.
2
APPLICATIONS
• Mobile phones.
• Supports the use of a backup battery that powers at
empty main battery situations. The backup battery is
used to supply the RTC, the internal state and the
LPVDD supply in it’s ECO mode. Goldcaps, Li and Li-ion
cells are supported.
3
GENERAL DESCRIPTION
The PCF50603 is a highly integrated solution for power
supply generation, battery management including
charging and a SIM card interface including supply
generation. The device is controlled by a host controller via
a 400 kHz I2C-bus serial interface.
• Includes a Backup Battery Charger (BBC).
A rechargeable backup battery or backup capacitor can
be charged from the main battery. For charging, a
programmable constant voltage mode is supported.
4
QUICK REFERENCE DATA
VSS = REFGND = GND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
SYMBOL
VBAT
PARAMETER
main battery input voltage
backup battery input voltage
charger input voltage
CONDITIONS
MIN.
TYP.
MAX.
5.7
UNIT
0
0
0
0
−
−
−
−
V
VSAVE
VCHG
5.7
V
V
V
DC
15.0
20.0
rectified sine wave;
100 Hz to 120 Hz; note 1
VCHGMIN
minimum charger voltage
enabling MBC module
−
2.7
3.6
−
V
fCLKCCO
high clock frequency
32 kHz clock available
3.42
3.78
MHz
Note
1. Not allowed in CCCV configuration.
2003 Oct 31
4
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
5
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
PCF50603HN
HVQFN48 plastic thermal enhanced very thin quad flat package; no leads;
SOT778-1
48 terminals; body 6 × 6 × 0.85 mm
2003 Oct 31
5
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g
IRQ_N
10
ONKEY_N RSTHC_N CLK32K PWREN1 PWREN2 REC1_N
27 11
4
6
5
1
26
25
PCF50603
INT
32kHz
OSCILLATOR
OSCI
OOC
CONTROLLER
OSCO
TS
operation modes
temp_ok
CLOCK
GENERATOR
UNIT
system clocks
RTC AND
ALARM
2
3
BBC
2
SCL
SDA
control data
status data
I C-BUS
INTERFACE
33
34
CHGDRV
BATMAX
COMPARATOR
AND
reference voltage
bias currents
28
CHGCUR/
BATMAX
ON-CHIP
REFERENCE
REFC
MBC
12
13
MICBIAS
REC2_N
AUDIO
DETECTION
31
BVM
V
BAT
48
47
46
GPO1
GPO2
GPO3
INTERNAL
SUPPLY
MODULE
30
32
PWM1 AND PWM2
LED1 AND LED2
V
GPO
SAVE
V
CHG
internal supply
29
VINT
8
SIMCKHC
SIMIOHC
36
37
38
35
CPVBAT
SCP
9
7
CP
SIMRSHC_N
SIMCKCD
SCN
SIMI
43
42
44
CPVDD
SIMIOCD
SIMRSCD_N
45
41
SIMEN
SIMREG
D3REG
IOREG
D2REG
D1REG
21
LPREG
RF1REG
22
RF2REG
HCREG
SIMVCC
40
39
14
15
16
20
19
23
24
18
17
MDB679
SIMD3VBAT
IOVDD IOD2VBAT D2VDD
LPD1VBAT LPVDD
RF1VDD
RF12VBAT
HCVBAT
D3VDD
D1VDD
RF2VDD
HCVDD
Fig.1 Block diagram.
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
7
PINNING
SYMBOL
PIN SUPPLY
DESCRIPTION(1)
VSS and
REFGND
−
n.a.
ground and VSS pads of all modules are connected to the ground plane of the
package
REC1_N
1
VINT
accessory recognition input with debounce filter (active LOW); input with internal
pull-up resistor to VINT
SCL
2
3
4
5
IOVDD
IOVDD
IOVDD
IOVDD
I2C-bus clock input
I2C-bus data input and output
SDA
CLK32K
PWREN2
32.768 kHz digital clock output; in ACTIVE state and IOVDD is on
control signal input; selects in combination with PWREN1 the ON, OFF or ECO
mode of the linear regulators
PWREN1
6
IOVDD
control signal input; selects in combination with PWREN2 the ON, OFF or ECO
mode of the linear regulators
SIMRSHC_N
SIMCKHC
SIMIOHC
7
8
9
IOVDD
IOVDD
IOVDD
SIM reset input from host controller (active LOW)
SIM clock input from host controller
SIM I/O data to or from the host controller with an internal pull-up resistor to
IOVDD
IRQ_N
10 IOVDD
interrupt request output to host controller (active LOW); open-drain output with an
internal pull-up resistor to IOVDD
RSTHC_N
MICBIAS
REC2_N
11 IOVDD
12 n.a.
reset output to host controller (active LOW)
microphone bias output voltage
13 MICBIAS accessory recognition input with debounce filter and programmable threshold
(active LOW)
IOVDD
14 n.a.
15 n.a.
16 n.a.
17 n.a.
18 n.a.
19 n.a.
20 n.a.
21 n.a.
22 n.a.
23 n.a.
24 n.a.
25 VINT
26 VINT
27 VINT
28 n.a.
29 n.a.
30 n.a.
31 n.a.
32 n.a.
IOREG output voltage
IOD2VBAT
D2VDD
HCVDD
HCVBAT
LPVDD
LPD1VBAT
D1VDD
RF1VDD
RF12VBAT
RF2VDD
OSCO
IOREG and D2REG input voltage
D2REG output voltage
HCREG output voltage
HCREG input voltage
LPREG output voltage
LPREG and D1REG input voltage
D1REG output voltage
RF1REG output voltage
RF1REG and RF2REG input voltage
RF2REG output voltage
32.768 kHz oscillator output
32.768 kHz oscillator input
On-key (active LOW); input with internal pull-up resistor to VINT
reference voltage bypass capacitor connection
internal supply voltage output
backup battery supply voltage
main battery supply voltage
charger voltage
OSCI
ONKEY_N
REFC
VINT
VSAVE
VBAT
VCHG
2003 Oct 31
7
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
SYMBOL
PIN SUPPLY
DESCRIPTION(1)
CHGDRV
33 n.a.
34 n.a.
drive of external charger circuitry (configuration CCCV)
configuration CCCV: charger current feedback
CHGCUR/
BATMAX
configuration BATMAX: open-drain output of BATMAX comparator
charge pump output voltage
CPVDD
CPVBAT
SCP
35 n.a.
36 n.a.
37 n.a.
38 n.a.
39 n.a.
40 n.a.
41 n.a.
charge pump input voltage
switching capacitor positive side
switching capacitor negative side
D3REG output voltage
SCN
D3VDD
SIMD3VBAT
SIMVCC
SIMIOCD
SIMCKCD
SIMRSCD_N
SIMEN
SIMREG and D3REG input voltage
SIMREG output voltage
42 SIMVCC SIM I/O data to/from the SIM card; internal pull-up resistor to SIMVCC
43 SIMVCC SIM clock output to the SIM card
44 SIMVCC SIM reset output to the SIM card (active LOW)
45 IOVDD
46 n.a.
47 n.a.
48 n.a.
enable SIMI and SIMREG
GPO3
general purpose open-drain output 3
general purpose open-drain output 2
general purpose open-drain output 1
GPO2
GPO1
Note
1. One ESD diode reverse biased to VSS except pin VCHG who has one clamp in series with a 500 Ω resistor connected
between pad and VSS
.
2003 Oct 31
8
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
12
11
10
9
25 OSCO
MICBIAS
RSTHC_N
IRQ_N
OSCI
26
27
28
29
30
31
32
33
34
35
36
ONKEY_N
REFC
SIMIOHC
SIMCKHC
SIMRSHC_N
PWREN1
PWREN2
CLK32K
SDA
8
VINT
7
V
SAVE
PCF50603HN
6
V
BAT
5
V
CHG
4
CHGDRV
3
CHGCUR/BATMAX
CPVDD
2
SCL
1
REC1_N
CPVBAT
MDB680
Bottom view.
All GND and VSS pads are connected to the ground plane.
Fig.2 Pin configuration.
2003 Oct 31
9
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
8
FUNCTIONAL DESCRIPTION
On/off control
8.1
8.1.1
OPERATING STATES
The PCF50603 has four operating states (see Fig.3):
• NOPOWER
• SAVE
• STANDBY
• ACTIVE.
NOPOWER
V
< V
BAT
VERY_LOW_BAT
AND
V
< V
SAVE
VERY_LOW_BACK
AND
SAVE
V
< V
CHG
VERY_LOW_BAT
V
< V
BAT
VERY_LOW_BAT
AND
V
> V
SAVE
VERY_LOW_BACK
OR
V
> V
CHG
VERY_LOW_BAT
STANDBY
V
> V
VERY_LOW_BAT
BAT
ACTIVE
V
> V
BAT
LOW_BAT
MDB681
Fig.3 State diagram.
8.1.2
RESET GENERATION
The RSTHC_N is kept LOW for minimum 10 ms after
entering the ACTIVE state. If the IOREG supply is
switched off, RSTHC_N becomes LOW again (see Fig.4).
The OOC generates an internal and an external reset each
time the system goes from STANDBY to ACTIVE state. All
registers for the regulators and converters are reset to their
default values.
A special condition occurs when the main battery voltage
drops below the VVERY_LOW_BAT limit of typically 2.7 V; the
RSTHC_N is asserted in order to shut down the host
controller immediately (see Fig.5).
2003 Oct 31
10
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
system
STANDBY
state
ACTIVE
STANDBY
t
= 10 ms
reset
RSTHC_N
xxVDD
32 kHz
oscillator
CLK32K
MDB682
Before the supplies are turned on, the internal 32 kHz clock is already stable. After
power up of the IOVDD supply the external clock on pin CLK32K becomes available.
Fig.4 Reset generation timing diagram (STANDBY - ACTIVE - STANDBY transition).
system
state
STANDBY
ACTIVE
STANDBY
t
= 10 ms
reset
RSTHC_N
SIM emergency deactivation
SIM activation
xxVDD
32 kHz
oscillator
CLK32K
MDB683
Before the supplies are turned on, the internal 32 kHz clock is already stable. After
power up of the IOVDD supply the external clock on pin CLK32K becomes available.
Fig.5 Reset generation timing diagram (STANDBY - ACTIVE - STANDBY transition).
11
2003 Oct 31
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
8.1.3
WATCHDOG TIMER
phone due to mechanical bounce on the battery. The
automatic restart is enabled or disabled by control
bit BATRM_EN in the OOCC register. By default this
automatic restart feature is disabled.
The OOC contains a WatchDog Timer (WDT). By default
it is not activated. It can be activated by setting
bit WDT_RST in the OOCC register to logic 1. Once this
bit has been set, the watchdog is enabled, and needs to be
cleared once every eight seconds. If the watchdog is not
reset in time, the PCF50603 automatically goes to the
STANDBY state when the watchdog timer expires. Status
bit WDTEXP is set when the watchdog timer expires. After
each ACTIVE to STANDBY transition the WDT is disabled
and needs to be activated again by software when
entering the ACTIVE state.
Status bit BATRMSTAT in the OOCS2 register indicates
whether the PMU returned to ACTIVE state due to a restart
after battery removal. The status bit remains active until
the PMU returns to STANDBY or SAVE state.
Figure 6 shows the timing for an automatic restart due to
battery removal.
This feature is only triggered by battery removal
(VBAT < 2.7 V). All other shut-down conditions like, low
battery, high temperature, programming GO_STDBY do
not trigger this function.
8.1.4
AUTOMATIC RESTART AFTER BATTERY REMOVAL
The PMU allows for an automatic restart from SAVE to
ACTIVE state when the main battery is removed for a
period less than two seconds (tBATRMLIM). This feature is
especially convenient to avoid accidental switch-off of the
This feature is only applicable upon the condition that a
BBC (VSAVE > VVERY_LOW_BACK) is available in the system.
system
ACTIVE
SAVE
ACTIVE
state
<t
BATRMLIM
V
V
LOW_BAT
V
BAT
VERY_LOW_BAT
V
SAVE
V
LOW_BACK
CLK32K
RSTHC_N
xxVDD
BATRMSTAT
(internal status bit)
t
reset
MCE539
Fig.6 Automatic restart after battery removal.
12
2003 Oct 31
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
8.1.5
DEBOUNCE FILTERS
Fig.7 is applicable for all debounce filters in the PCF50603.
un-debounced
t
t
debounce
debounce
debounced
interrupts
falling edge
rising edge
MDB684
The debounced signal keeps the old value until the new value has been stable for at least the applicable debounce time. Any spike (>30 ms) in the
original signal will reset the debounce timer again. This filter suppresses all signal changes that are shorter than the debounce time.
Fig.7 Definition of debounce filter.
Serial interface (I2C-bus)
The interrupt module is powered in all states (except
NOPOWER) and retains the register values. Events that
occur in the STANDBY state, are captured and can be
read out by the system controller once the system is in the
ACTIVE state.
8.2
The I2C-bus is the serial interface of the PCF50603.
A detailed description of the I2C-bus specification,
including applications, is given in the brochure: The
I2C-bus and how to use it, order no. 9398 393 40011 or
I2C-bus Peripherals Data Handbook IC12.
The IRQ_N signal is asserted in the ACTIVE state
whenever one or more PCF50603 interrupts are active.
8.3
Interrupt controller (INT)
Each interrupt register (8-bits) is cleared when it is read
(R&C) through the I2C-bus interface. New interrupts that
occur during a R&C action are captured in an intermediate
register (see Figs.8 and 9).
The PCF50603 uses the interrupt controller to indicate to
the system controller if the status of the PCF50603 change
and that an action of the system controller is required.
Interrupts can be generated by several modules of the
PCF50603. The interrupt generator handles all interrupts
with the same priority. Priority setting shall be done by the
system controller software.
All interrupts related to shut-down conditions (LOWBAT,
ONKEY1S and HIGHTMP) are automatically cleared on a
transition from ACTIVE to STANDBY state.
All interrupts can be masked: this effectively prevents that
IRQ_N is asserted for masked interrupts. Masking is
implemented with a mask bit in the mask registers for each
interrupt source. Nevertheless, the interrupt status
registers still provide the actual interrupt status of the
masked interrupts, which allows polling of the interrupt
status registers. Note that if the mask bit is cleared for an
active interrupt, the IRQ_N line goes LOW at the next
falling edge of the output pin CLK32K.
There are no timing requirements for interrupt service
response times. All events that require immediate actions
are performed by the PCF50603 without any action by the
system controller.
The function of the interrupt module is to capture, mask
and combine the interrupt signals from the modules that
can generate an interrupt. All interrupts are combined in
the interrupt signal IRQ_N. The IRQ_N signal is
implemented as an open-drain output with an internal
pull-up resistor.
2003 Oct 31
13
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
IRQ_N
(1)
read request &
address
read
INT1
read
INT2
read
INT3
2
I C-bus
MDB685
Read access can be done with or without incremental addressing.
(1) IRQ_N becomes inactive high as soon as the read sequence of the last INTx register containing an active interrupt starts.
Fig.8 Interrupt timing; no interrupt captured during read sequence.
minimal 1 CLK32
(1)
IRQ_N
read request &
address
read
INT1
read
INT2
read
INT3
2
I C-bus
MDB686
Read access can be done with or without incremental addressing.
(1) IRQ_N becomes inactive high as soon as the read sequence of the last INTx register containing an active interrupt starts.
Fig.9 Interrupt timing; interrupt captured during read sequence.
2003 Oct 31
14
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
8.4
Power supply modules
In total 11 power supply modules are available in the PCF50603; see Table 1:
• Three regulators for supplying the digital and analog circuitry (D1REG, D2REG and D3REG). These regulators support
the ECO mode
• One regulator for high current supply (HCREG)
• One regulator for the SIMI supply (SIMREG)
• One charge pump (CP)
• One regulator for supplying the I/O pads (IOREG). This regulator supports the ECO mode
• One regulator for low power supply (LPREG). This regulator supports the ECO mode, the LPREG is the only regulator
that can be enabled in SAVE and STANDBY state (ECO mode only)
• Two low-noise regulators for RF supply (RF1REG and RF2REG)
• One ultra low-noise regulator for supplying a microphone (MBGEN).
Table 1 Power supply modules; VSS = REFGND = GND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
NOMINAL MINIMUM MAXIMUM VOLTAGE
RESET
VOLTAGE
(V)
SIZEEXTERNAL
CAPACITOR(2)
(nF)
SUPPLY
NAME
ECO
MODE
PSRR(1)
(dB)
CURRENT VOLTAGE VOLTAGE
STEPS
(mV)
(mA)
(V)
(V)
Programmable power supplies
D1REG
D3REG
HCREG
SIMREG
CP
150
100
250(4)
1.20
1.20
2.60
1.80
3.50
3.20
3.20
3.20
3.00
5.00
100
100
200
−
note 3
note 3
note 3
1.8
yes
yes
no
60
60
60
60
−
470
470
4700
20
75(6)
yes(5)
1000
220/4700(7)
500
note 3
no
Fixed power supplies, mask programmable
D2REG
150
150
100
100
100
1.20
1.20
1.20
2.60
2.60
3.20
3.20
3.20
3.00
3.00
100
100
100
100
100
note 3
note 3
note 3
note 3
note 3
yes
yes
yes
no
60
60
60
70
70
470
470
IOREG
LPREG
470
RF1REG(8)
RF2REG(8)
4700
4700
no
Fixed power supply
MBGEN
1.5
2.15
2.15
−
2.15
yes
110
4700
Notes
1. Typical value, 100 Hz < f < 1000 Hz.
2. Typical values assume X5R or X7R type of capacitor.
3. Mask programmable for reset settings of different types.
4. Under specific conditions a nominal current of 300 mA can be delivered.
5. When SIMI is in Power-down mode.
6. Maximum current depends on the selected output voltage. At 3.50 V, 4.00 V and 4.50 V the maximum output current
is 75 mA. At 5.00 V output voltage the maximum output current is 50 mA.
7. The CP module requires both a switching capacitor as well as an output capacitor.
8. Optimized for low noise (30 µV RMS value, 400 Hz < f < 80 kHz).
2003 Oct 31
15
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
8.5
Main battery charger (MBC)
The fast charge current is determined by the value of the
external sense resistor. The charge current in the pre and
trickle charge phase is programmable as a ratio of the fast
charge current.
The main battery charger (MBC) module provides a
complete constant-current/constant-voltage linear charger
controller for lithium-ion (Li-ion) batteries (in CCCV
configuration) or a programmable battery threshold level
detector for end-of-charge indication (configuration
BATMAX). Nickel-cadmium (NiCd) and Nickel metal
hydride (NiMH) batteries can also be charged with
constant current.
In BATMAX configuration an end-of-charge indication is
available on the BATMAX pin.
8.5.1
SUPPORTED CHARGER PLUGS
The PCF50603 charger circuitry supports the following
type of charger plugs (see Fig.10):
Only an external power PNP transistor is required to
control the charge current. The CC and CCCV control
circuitry is fully integrated in the PCF50603 charging
module.
• Regulated charger plugs with output voltage at least
0.5 V above the battery voltage with a maximum of 10 V
and with current limitation up to 3C of the used battery
(CCCV and BATMAX configuration)
In CCCV configuration the charging process for
Li-ion/Li-pol batteries is performed under control of the
host controller. The communication between the
PCF50603 charger module and the host controller is
interrupt based, which simplifies the control of the
PCF50603.
• Non regulated charger plugs with peak output voltages
up to 20 V with a duration of less than 14 ms and with
current limitation up to 3C of the used battery (BATMAX
configuration only).
V
V
CHG
CHG
< 14 ms
< 14 ms
15 V
10 V
10 V
2.7 V
2.7 V
I
t
CHG
MDB687
Regulated charger plug.
Non regulated charger plug.
Fig.10 Characteristics of the supported charger plugs.
2003 Oct 31
16
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
8.5.2
EXTERNAL COMPONENTS
A small discrete circuit must be used to control the charge current (see Fig.11).
V
handbook, halfpage
CHG
CHGDRV
CHGCUR
(1)
BC869
R
0.15 Ω
sense
V
BAT
MDB688
(1) The charge switch requires a current gain in the range of 50 to 400 for stable loop operation.
Fig.11 Charge current external circuitry.
8.6
Backup battery charger (BBC)
• In transparent mode the SIMEN input allows the host
controller to have direct control over the SIM card
supply. In sequencer mode the SIMEN input indicates
the presence of a SIM card.
The BBC is implemented as a voltage limited current
source with a selectable output resistor. It offers the
following features:
• Enhanced ESD protection on all SIM contact pins
• Selectable output resistor to reduce the current at higher
• The SIMI and SIMREG can be enabled in the ACTIVE
state. In all other states the SIMI and SIMREG are
disabled.
voltages
• Four programmable charge currents
• Two programmable maximum limiting voltages
8.8
Battery voltage monitor (BVM)
• The BBC can be enabled in the ACTIVE state; in all
other states the BBC is disabled.
The BVM monitors the main battery voltage. It offers the
following features:
8.7
SIM card interface (SIMI)
• Programmable low battery threshold (VLOW_BAT
)
The SIMI provides the facilities to communicate with SIM.
It offers the following features:
• Hysteresis and selectable debounce filter built in to
prevent fast cycling
• Support for transparent mode. The host controller
controls the communication with the SIM card, including
the activation and deactivation sequences.
• The BVM is enabled in all activity states.
The BVM observes permanently the main battery voltage
and generates a LOWBAT interrupt if the battery voltage
drops below the programmed threshold voltage VLOW_BAT
(see Fig.12). When a LOWBAT interrupt is generated in
ACTIVE state, the host controller should initiate a
transition to STANDBY state. In case the host controller
does not initiate a transition to the STANDBY state within
eight seconds after the interrupt occurred, the OOC forces
the PCF50603 to the STANDBY state in order to prevent a
too deep discharge of the battery.
• Support for sequencer mode. The internal sequencer of
the PCF50603 performs the activation and deactivation
sequences.
• Includes a dedicated linear regulator for the SIM card
supply (SIMREG) supporting both 1.8 V and 3.0 V cards
• Provides level-shifters for the SIM interfacing signals.
The level-shifters translate the host controller signal
levels (IOVDD) to SIM card signal levels (SIMVCC) and
vice versa.
2003 Oct 31
17
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
V
V
BAT
V
hys
V
LOW_BAT
t
debounce
LOWBAT
interrupt
t
MDB689
Fig.12 BVM and LOWBAT behaviour.
8.9
Temperature high sensor (TS)
A HIGHTMP interrupt is generated when the temperature
threshold is passed for more than 62 ms (debouncing
time). When a HIGHTMP interrupt is generated the host
controller should initiate a transition to STANDBY state.
In case the host controller does not initiate a transition to
the STANDBY state within 1 second after the interrupt
occurred, the OOC forces the PCF50603 to the STANDBY
state in order to prevent damage to the circuit.
The TS monitors the junction temperature of the
PCF50603. It offers the following features:
• Fixed temperature threshold
• Hysteresis and debounce filter built in to prevent fast
cycling
• The TS is enabled in ACTIVE state, in all other states
the TS is disabled.
The hysteresis and debounce time have been built in to
prevent fast cycling of the HIGHTMP signal.
The behaviour of the TS is shown in Figure 13.
The TS can not be disabled via the I2C-bus.
T
j
150 °C
130 °C
T
hys
t
t
debounce
debounce
HIGHTMP
interrupt
t
MDB690
Fig.13 TS behaviour.
18
2003 Oct 31
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
8.10 Real time clock (RTC)
8.12 LED modulator (LED1 and LED2)
The RTC module provides the time information to the
handset based on a 1 Hz clock frequency. Basically it is a
32-bit counter counting elapsed seconds.
The PCF50603 contains two LED modulators (LED1 and
LED2), which can be selected as input for any of the GPO
outputs. The LED modulator of the PCF50603 is used for
the control of the indicator LEDs. They offer the following
features:
• The RTC module contains one alarm function that
generates an interrupt if the actual RTC time equals the
content of the alarm register. The alarm registers are
preset to all 1 s which effectively disables the alarm;
effectively no alarm interrupt will be generated as long
as the RTC counter does not overflow. It is
recommended to mask the ALARM interrupt before a
new value is written to the alarm registers, in order to
prevent interrupts during the write actions (a new setting
may require up to 4 register writes).
• The LED driver can select eight different repetition
periods
• Capable of generating eight different blinking patterns.
The selected pattern is generated once per repetition
period
• The LED can be used as a status indicator during the
ACTIVE state or when a charger is connected.
• The RTC module is able to generate an interrupt each
second (SECOND interrupt) as well as each minute
(MINUTE interrupt). When the RTC starts up the first
time (after transition from NOPOWER state) the minute
interrupt is aligned with each 60 seconds crossing. If the
synchronization with the 60 second crossing is required
after reprogramming the RTC time registers it is up to
the software to program the RTC time registers with a
modulo 60 value.
8.13 General purpose outputs (GPO)
The PCF50603 contains three high current (100 mA)
open-drain GPOs. They offer the following features:
• Each GPO can be configured as a constant LOW level,
a high impedance, a LED modulator output, a PWM
output or as the complementary PWM output PWM
• The GPOs can sink 100 mA from any supply or battery
voltage.
8.11 Pulse-width modulator (PWM1 and PWM2)
The two PWMs (PWM1 and PWM2) offer the following
features:
• Programmable frequency and duty cycle
• Any of the GPOs can be connected to either the PWMs
or the inverse of the PWMs
• The PWMs can be independently enabled in ACTIVE
state. In all other states the PWMs are disabled.
2003 Oct 31
19
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
9
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134).
SYMBOL
PARAMETER
CONDITIONS
MIN.
−0.5
MAX.
+6.5
UNIT
VBAT
VSAVE
VCHG
VI
main battery voltage
V
V
V
V
backup battery input voltage
charger input voltage
−0.5
−0.5
−0.5
+6.5
+20
input voltage on any pin with
respect to REFGND
+6.5
II
input current at any input
output current at any output
total power dissipation
−10
−10
−
+10
+10
2000
+85
mA
mA
mW
°C
IO
Ptot
Tamb
operating ambient
temperature
−40
Tstg
storage temperature
−55
+150
°C
Vesd
electrostatic discharge
voltage
HBM; note 1
pins SIMEN, IOD2VBAT, SIMD3VBAT,
SIMRSCD_N, SIMCKCD, SIMIOCD,
−
±6000
V
VBAT, VSAVE, CPVBAT, LPD1VBAT,
REC1_N, SIMVCC, RF12VBAT,
HCVBAT, REC2_N
pin VCHG
other pins
MM; note 2
−
−
−
±4000
±2000
±200
V
V
V
Notes
1. Human Body Model: equivalent to discharging a 100 pF capacitor via a 1.5 kΩ resistor.
2. Machine Model: equivalent to discharging a 200 pF capacitor via a 0 Ω resistor.
10 CHARACTERISTICS
VSS = REFGND = GND = 0 V; Tamb = −40 °C to +85 °C; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VBAT
main battery input voltage
backup battery input voltage
charger input voltage
0
0
0
0
−
−
−
−
5.7
V
V
V
V
VSAVE
VCHG
5.7
DC
15.0
20.0
rectified sine wave;
100 Hz to 120 Hz; note 1
VCHGMIN
minimum charger voltage
enabling MBC module
−
2.7
3.6
−
V
fCLKCCO
high clock frequency
32 kHz clock available
3.42
3.78
MHz
D1 regulator
VO
IO
output voltage
output current
1.20
−
−
3.20
150
V
−
mA
2003 Oct 31
20
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
D3 regulator
VO
IO
output voltage
output current
1.20
−
−
3.20
V
−
100
mA
HC regulator
VO
IO
output voltage
output current
2.60
−
−
3.20
250
V
note 1
−
mA
SIM regulator
VO
IO
output voltage
output current
1.80
−
−
3.00
20
V
−
mA
CP regulator
VO
IO
output voltage
3.50
−
−
5.00
75
V
output current
note 2
−
mA
D2 regulator
VO
IO
output voltage
output current
1.20
−
−
3.20
150
V
−
mA
IO regulator
VO
IO
output voltage
output current
1.20
−
−
3.20
150
V
−
mA
LP regulator
VO
IO
output voltage
output current
1.20
−
−
3.20
100
V
−
mA
RF1 regulator
VO
IO
output voltage
output current
2.60
−
−
3.00
100
V
−
mA
RF2 regulator
VO
IO
output voltage
output current
2.60
−
−
3.00
100
V
−
mA
MBGEN regulator
VO
IO
output voltage
output current
2.15
−
−
2.15
1.5
V
−
mA
Notes
1. Under specific conditions a nominal current of 300 mA can be delivered.
2. Maximum current depends on the selected output voltage. At 3.50 V, 4.00 V and 4.50 V the maximum output current
is 75 mA. At 5.00 V output voltage the maximum output current is 50 mA.
2003 Oct 31
21
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
11 APPLICATION INFORMATION
MAIN
BATTERY
RAM 1.8 V
V
BAT RF12VBAT LPD1VBAT IOD2VBAT SIMD3VBAT CPVBAT HCVBAT
2.2 µF
2.2 µF
31
23
20
15
40
36
18
30
V
SAVE
FLASH 1.8 V
AUXADCx
battery
backup
VINT
R
29
28
12
17
19
SENSE
470 nF
100 nF
CHGCUR
34
33
32
REFC
CHGDRV
V
CHG
MICBIAS
HCVDD
LPVDD
+
−
BATTERY
CHARGER
CONSTANT
CURRENT
(3)
4700
nF
(1)
MICP
MICN
4700
nF
on key
ONKEY_N
(2)
27
22
470
nF
RF1VDD
4700 nF
RF2VDD
RF
UNIT
headset
24
4700 nF
REC2_N
REC1_N
D1VDD
13
1
from bottom
connector
SCP
37
VDDA
VDDD
220 nF
21
SCN
38
35
470 nF
470 nF
470 nF
470 nF
CPVDD
IOVDD
D2VDD
D3VDD
14
16
39
4700 nF
PCF50603
PCF5213
GPO3
GPO2
back light
EL lamp
46
VDDE3
VDDA
DC
DC
VDDC
or
VDDE1
47
48
26
VDDE2
back light
GPO1
OSCI
LOWVOLT_N
ONKEY
AUXON_N
GPON0
1 kΩ
1 kΩ
10 pF
10 MΩ
32.768 kHz
PWREN1
PWREN2
10 pF
OSCO
6
5
25
RFSIGx
RSTON
IOVDD
RSTHC_N
IRQ_N
11
10
4
SIMERRN
CLK32I
SDA
10 kΩ
CLK32K
SDA
SIMEN
45
card present
3
SCL
SIMRSCD_N
SIMIOCD
SCL
SIM
CARD
READER
44
42
43
41
2
SIMIOHC
SIMCKHC
SIMIO
9
SIMCKCD
SIMVCC
SIMCLK
GPOx
8
SIMRSHC_N
revmod
7
1000 nF
REFGND/V
MDB691
SS
(1) HCVDD is reserved for hands free audio supply.
(2) LPVDD not used in the system.
(3) Connect VCHG to ground if charger is used in BATMAX configuration.
Fig.14 Application diagram.
22
2003 Oct 31
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
12 PACKAGE OUTLINE
HVQFN48: plastic thermal enhanced very thin quad flat package; no leads;
48 terminals; body 6 x 6 x 0.85 mm
SOT778-1
D
B
A
terminal 1
index area
A
A
1
E
c
detail X
C
e
1
y
y
1/2 e
e
v
M
M
C
1
b
C
C
A B
13
24
w
L
25
12
e
e
E
2
h
1/2 e
1
36
terminal 1
index area
48
37
X
D
h
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
A
(1)
(1)
UNIT
A
b
c
E
e
e
1
e
y
D
D
E
L
v
w
y
1
1
h
2
max.
h
0.05 0.25
0.00 0.15
6.1 4.25 6.1 4.25
5.9 3.95 5.9 3.95
0.5
0.3
mm
0.2
0.05 0.1
1
0.4
4.4
4.4
0.1 0.05
Note
1. Plastic or metal protrusions of 0.075 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
SOT778-1
- - -
- - -
- - -
02-07-05
2003 Oct 31
23
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
13 SOLDERING
with a high component density, as solder bridging and
non-wetting can present major problems.
13.1 Introduction to soldering surface mount
packages
To overcome these problems the double-wave soldering
method was specifically developed.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
If wave soldering is used the following conditions must be
observed for optimal results:
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
13.2 Reflow soldering
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
Driven by legislation and environmental forces the
The footprint must incorporate solder thieves at the
downstream end.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
worldwide use of lead-free solder pastes is increasing.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 270 °C depending on solder paste material. The
top-surface temperature of the packages should
preferably be kept:
Typical dwell time of the leads in the wave ranges from
3 to 4 seconds at 250 °C or 265 °C, depending on solder
material applied, SnPb or Pb-free respectively.
• below 220 °C (SnPb process) or below 245 °C (Pb-free
process)
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
– for all BGA and SSOP-T packages
– for packages with a thickness ≥ 2.5 mm
– for packages with a thickness < 2.5 mm and a
13.4 Manual soldering
volume ≥ 350 mm3 so called thick/large packages.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
• below 235 °C (SnPb process) or below 260 °C (Pb-free
process) for packages with a thickness < 2.5 mm and a
volume < 350 mm3 so called small/thin packages.
Moisture sensitivity precautions, as indicated on packing,
must be respected at all times.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
13.3 Wave soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
2003 Oct 31
24
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
13.5 Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE(1)
WAVE
not suitable
REFLOW(2)
BGA, LBGA, LFBGA, SQFP, SSOP-T(3), TFBGA, VFBGA
suitable
suitable
DHVQFN, HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP,
HTSSOP, HVQFN, HVSON, SMS
not suitable(4)
PLCC(5), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO, VSSOP
PMFP(8)
suitable
suitable
not recommended(5)(6) suitable
not recommended(7)
suitable
not suitable
not suitable
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no account
be processed through more than one soldering cycle or subjected to infrared reflow soldering with peak temperature
exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package body peak temperature
must be kept as low as possible.
4. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
5. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
6. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
7. Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger than
0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
8. Hot bar or manual soldering is suitable for PMFP packages.
2003 Oct 31
25
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
14 DATA SHEET STATUS
DATA SHEET
STATUS(1)
PRODUCT
STATUS(2)(3)
LEVEL
DEFINITION
I
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
II
Preliminary data Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
III
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Relevant changes will
be communicated via a Customer Product/Process Change Notification
(CPCN).
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
15 DEFINITIONS
16 DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes in the products -
including circuits, standard cells, and/or software -
described or contained herein in order to improve design
and/or performance. When the product is in full production
(status ‘Production’), relevant changes will be
Application information
Applications that are
communicated via a Customer Product/Process Change
Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these
products, conveys no licence or title under any patent,
copyright, or mask work right to these products, and
makes no representations or warranties that these
products are free from patent, copyright, or mask work
right infringement, unless otherwise specified.
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2003 Oct 31
26
Philips Semiconductors
Preliminary specification
Controller for power supply
and battery management
PCF50603
17 PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
2003 Oct 31
27
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2003
SCA75
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
R54/01/pp28
Date of release: 2003 Oct 31
Document order number: 9397 750 11771
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