PESD5V0F1USF,315 [NXP]
PESD5V0F1USF - Extremely low capacitance unidirectional ESD protection diode;
| 型号： | PESD5V0F1USF,315 |
| 厂家： | 
NXP |
| 描述： | PESD5V0F1USF - Extremely low capacitance unidirectional ESD protection diode 局域网 二极管 |
| 文件： | 总12页 (文件大小：289K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PESD5V0F1USF
Extremely low capacitance unidirectional ESD protection
diode
Rev. 1 — 11 December 2012
Product data sheet
1. Product profile
1.1 General description
Extremely low capacitance unidirectional ElectroStatic Discharge (ESD) protection diode
in a DSN0603-2 (SOD962) leadless ultra small Surface-Mounted Device (SMD) package
designed to protect one signal line from the damage caused by ESD and other transients.
1.2 Features and benefits
Unidirectional ESD protection of one line
Extremely low diode capacitance Cd = 0.6 pF
ESD protection up to 10 kV according to IEC 61000-4-2
Ultra low leakage current IRM = 1 nA
Ultra small SMD package
1.3 Applications
Cellular handsets and accessories
Portable electronics
Communication systems
Computers and peripherals
1.4 Quick reference data
Table 1.
Quick reference data
Tamb = 25 C unless otherwise specified.
Symbol Parameter Conditions
Min
Typ
-
Max
5
Unit
V
VRWM
Cd
reverse standoff voltage
diode capacitance
-
-
f = 1 MHz; VR = 0 V
0.6
0.75
pF
PESD5V0F1USF
NXP Semiconductors
Extremely low capacitance unidirectional ESD protection diode
2. Pinning information
Table 2.
Pinning
Pin
1
Description
cathode
Simplified outline
Graphic symbol
[1]
2
anode
2
1
1
2
006aaa152
Transparent
top view
[1] The marking bar indicates the cathode.
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
PESD5V0F1USF
DSN0603-2 leadless ultra small package; 2 terminals;
SOD962
body 0.6 0.3 0.3 mm
4. Marking
Table 4.
Marking codes
Type number
PESD5V0F1USF
Marking code
4
5. Limiting values
Table 5.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
IPPM
Tj
Parameter
Conditions
Min
-
Max
3
Unit
A
[1]
rated peak pulse current
junction temperature
ambient temperature
storage temperature
tp = 8/20 s
-
150
C
Tamb
Tstg
55
65
+150
+150
C
C
[1] Non-repetitive current pulse 8/20 s exponentially decaying waveform according to IEC61000-4-5 and
IEC61643-321.
Table 6.
Symbol
VESD
ESD maximum ratings
Parameter
Conditions
Min
Max Unit
[1]
[1]
electrostatic
discharge voltage
IEC 61000-4-2 (contact discharge)
IEC 61000-4-2 (air discharge)
machine model
-
-
-
-
10
kV
kV
V
10
400
10
MIL-STD-883 (human body model)
kV
[1] Device stressed with ten non-repetitive ESD pulses.
PESD5V0F1USF
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 11 December 2012
2 of 12
PESD5V0F1USF
NXP Semiconductors
Extremely low capacitance unidirectional ESD protection diode
Table 7.
ESD standards compliance
Standard
Conditions
> 8 kV (contact)
> 8 kV
IEC 61000-4-2, level 4 (ESD)
MIL-STD-883; class 3B (human body model)
001aaa631
I
PP
001aaa630
120
100 %
90 %
100 % I ; 8 μs
PP
I
PP
(%)
80
−t
e
50 % I ; 20 μs
PP
40
10 %
t
t = 0.7 ns to 1 ns
r
0
30 ns
60 ns
0
10
20
30
40
t (μs)
Fig 1. 8/20 s pulse waveform according to
Fig 2. ESD pulse waveform according to
IEC 61000-4-2
IEC 61000-4-5
6. Characteristics
Table 8.
Characteristics
Tamb = 25 C unless otherwise specified.
Symbol Parameter
VRWM reverse standoff
Conditions
Min
Typ
Max
Unit
-
-
5
V
voltage
IRM
reverse leakage
current
VRWM = 5 V
-
1
100
nA
[1]
[2]
VCL
VBR
Cd
clamping voltage
breakdown voltage
diode capacitance
dynamic resistance
IPPM = 3 A
-
-
10
10
0.75
-
V
IR = 5 mA
6
-
8
V
f = 1 MHz; VR = 0 V
IR = 10 A
0.6
0.7
pF
rdyn
-
[1] Non-repetitive current pulse 8/20 s exponential decay waveform according to IEC 61000-4-5 and
IEC61643-321.
[2] Non-repetitive current pulse, Transmission Line Pulse (TLP) tp = 100 ns; square pulse;
ANS/IESD STM5.1-2008.
PESD5V0F1USF
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 11 December 2012
3 of 12
PESD5V0F1USF
NXP Semiconductors
Extremely low capacitance unidirectional ESD protection diode
I
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−
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PPM
ꢉ
ꢋꢌꢉꢍ
ꢊ
006aab324
f = 1 MHz; Tamb = 25 C
Fig 3. Diode capacitance as a function of reverse
voltage; typical values
Fig 4. V-I characteristics for a bidirectional
ESD protection diode
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ꢋꢌꢉꢍ
ꢎꢓ
tp = 100 ns; Transmission Line Pulse (TLP)
Fig 5. Dynamic resistance; typical values
PESD5V0F1USF
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 11 December 2012
4 of 12
PESD5V0F1USF
NXP Semiconductors
Extremely low capacitance unidirectional ESD protection diode
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Fig 6. ESD clamping test setup and waveforms
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ꢁꢀ
&ꢁꢀ
&ꢃꢀ
&ꢅꢀ
&ꢒꢀ
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)ꢋꢌ'ꢗꢍ
ꢒꢀ
Fig 7. Clamped +8 kV pulse waveform
(IEC 61000-4-2 network)
Fig 8. Clamped 8 kV pulse waveform
(IEC 61000-4-2 network)
PESD5V0F1USF
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 11 December 2012
5 of 12
PESD5V0F1USF
NXP Semiconductors
Extremely low capacitance unidirectional ESD protection diode
7. Application information
The device is designed for the protection of one unidirectional data or signal line from
surge pulses and ESD damage. The device is suitable on lines where the signal polarities
are either positive or negative with respect to ground.
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ꢛꢝꢘꢋꢐ+#)(")9#'ꢋꢏ9#ꢏ(
ꢜꢘ
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ꢀꢀꢀꢁꢂꢂꢉꢅꢈꢉ
Fig 9. Application diagram
Circuit board layout and protection device placement
Circuit board layout is critical for the suppression of ESD, Electrical Fast Transient (EFT)
and surge transients. The following guidelines are recommended:
1. Place the device as close to the input terminal or connector as possible.
2. Minimize the path length between the device and the protected line.
3. Keep parallel signal paths to a minimum.
4. Avoid running protected conductors in parallel with unprotected conductors.
5. Minimize all Printed-Circuit Board (PCB) conductive loops including power and
ground loops.
6. Minimize the length of the transient return path to ground.
7. Avoid using shared transient return paths to a common ground point.
8. Use ground planes whenever possible. For multilayer PCBs, use ground vias.
PESD5V0F1USF
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 11 December 2012
6 of 12
PESD5V0F1USF
NXP Semiconductors
Extremely low capacitance unidirectional ESD protection diode
8. Package outline
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ꢁ
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ꢘ95('ꢗ9#'ꢗꢋ9'ꢋ55
ꢁꢂ&ꢀꢃ&ꢂꢇ
Fig 10. Package outline DSN0603-2 (SOD962)
9. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number
Package
Description
Packing quantity
9000
PESD5V0F1USF
DSN0603-2 2 mm pitch, 8 mm tape and reel
(SOD962)
-315
[1] For further information and the availability of packing methods, see Section 13.
PESD5V0F1USF
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 11 December 2012
7 of 12
PESD5V0F1USF
NXP Semiconductors
Extremely low capacitance unidirectional ESD protection diode
10. Soldering
Footprint information for reflow soldering of leadless ultra small package; 2 terminals
SOD962
0.85
0.4
R0.025 (8×)
0.22
0.4
(2×)
0.12
(2×)
0.2
(2×)
solder land
solder land plus solder paste
solder paste deposit
solder resist
Dimensions in mm
sod962_fr
Fig 11. Reflow soldering footprint DSN0603-2 (SOD962)
PESD5V0F1USF
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 11 December 2012
8 of 12
PESD5V0F1USF
NXP Semiconductors
Extremely low capacitance unidirectional ESD protection diode
11. Revision history
Table 10. Revision history
Document ID
Release date
20121211
Data sheet status
Change notice
Supersedes
PESD5V0F1USF v.1
Product data sheet
-
-
PESD5V0F1USF
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 11 December 2012
9 of 12
PESD5V0F1USF
NXP Semiconductors
Extremely low capacitance unidirectional ESD protection diode
12. Legal information
12.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
12.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
12.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
PESD5V0F1USF
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 11 December 2012
10 of 12
PESD5V0F1USF
NXP Semiconductors
Extremely low capacitance unidirectional ESD protection diode
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
12.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
13. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PESD5V0F1USF
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© NXP B.V. 2012. All rights reserved.
Product data sheet
Rev. 1 — 11 December 2012
11 of 12
PESD5V0F1USF
NXP Semiconductors
Extremely low capacitance unidirectional ESD protection diode
14. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits. . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Application information. . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 7
Packing information . . . . . . . . . . . . . . . . . . . . . 7
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 9
3
4
5
6
7
8
9
10
11
12
Legal information. . . . . . . . . . . . . . . . . . . . . . . 10
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 11
12.1
12.2
12.3
12.4
13
14
Contact information. . . . . . . . . . . . . . . . . . . . . 11
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 11 December 2012
Document identifier: PESD5V0F1USF
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