PMBD914_09 [NXP]
Single high-speed switching diode; 单个高速开关二极管
| 型号： | PMBD914_09 |
| 厂家： | 
NXP |
| 描述： | Single high-speed switching diode |
| 文件： | 总10页 (文件大小：67K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PMBD914
Single high-speed switching diode
Rev. 06 — 11 February 2009
Product data sheet
1. Product profile
1.1 General description
Single high-speed switching diode, fabricated in planar technology, and encapsulated in a
small Surface-Mounted Device (SMD) plastic package.
Table 1.
Product overview
Type number[1]
Package
NXP
JEDEC
PMBD914
SOT23
TO-236AB
PMBD914/DG
[1] /DG: halogen-free
1.2 Features
I High switching speed: trr ≤ 4 ns
I Low leakage current
I Low capacitance: Cd ≤ 1.5 pF
I Reverse voltage: VR ≤ 100 V
I Small SMD plastic package
I Repetitive peak reverse voltage:
V
RRM ≤ 100 V
1.3 Applications
I High-speed switching
1.4 Quick reference data
Table 2.
Quick reference data
Parameter
Symbol
Conditions
Min
Typ
Max
215
100
4
Unit
mA
V
[1]
[2]
IF
forward current
-
-
-
-
-
-
VR
trr
reverse voltage
reverse recovery time
ns
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] When switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA.
PMBD914
NXP Semiconductors
Single high-speed switching diode
2. Pinning information
Table 3.
Pinning
Pin
1
Description
anode
Simplified outline
Graphic symbol
3
3
2
not connected
cathode
1
2
3
006aaa764
1
2
3. Ordering information
Table 4.
Ordering information
Type number[1] Package
Name
Description
Version
PMBD914
-
plastic surface-mounted package; 3 leads
SOT23
PMBD914/DG
[1] /DG: halogen-free
4. Marking
Table 5.
Marking codes
Type number
PMBD914
Marking code[1]
*5D
YB*
PMBD914/DG
[1] * = -: made in Hong Kong
* = p: made in Hong Kong
* = t: made in Malaysia
* = W: made in China
5. Limiting values
Table 6.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Parameter
Conditions
Min
Max
Unit
VRRM
repetitive peak reverse
voltage
-
100
V
VR
IF
reverse voltage
forward current
-
-
-
100
215
500
V
[1]
[2]
mA
mA
IFRM
repetitive peak forward
current
IFSM
non-repetitive peak forward square wave
current
tp = 1 µs
-
-
-
4
A
A
A
tp = 1 ms
tp = 1 s
1
0.5
PMBD914_6
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 06 — 11 February 2009
2 of 10
PMBD914
NXP Semiconductors
Single high-speed switching diode
Table 6.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
Ptot
Parameter
Conditions
amb ≤ 25 °C
Min
Max
250
Unit
mW
°C
[1][3]
total power dissipation
junction temperature
storage temperature
T
-
Tj
-
150
Tstg
−65
+150
°C
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Tj = 25 °C prior to surge.
[3] Soldering point of cathode tab.
6. Thermal characteristics
Table 7.
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max Unit
[1]
[2]
Rth(j-a)
thermal resistance from
junction to ambient
in free air
-
-
500
K/W
Rth(j-t)
thermal resistance from
junction to tie-point
-
-
330
K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Soldering point of cathode tab.
7. Characteristics
Table 8.
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions
VF forward voltage
Min
Typ
Max Unit
IF = 1 mA
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
715
855
1
mV
mV
V
IF = 10 mA
IF = 50 mA
IF = 150 mA
1.25
25
V
IR
reverse current
VR = 25 V
nA
µA
µA
µA
pF
ns
V
VR = 75 V
1
VR = 25 V; Tj = 150 °C
VR = 75 V; Tj = 150 °C
f = 1 MHz; VR = 0 V
30
50
Cd
trr
diode capacitance
1.5
4
[1]
[2]
reverse recovery time
forward recovery voltage
VFR
1.75
[1] When switched from IF = 10 mA to IR = 10 mA; RL = 100 Ω; measured at IR = 1 mA.
[2] When switched from IF = 10 mA; tr = 20 ns.
PMBD914_6
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 06 — 11 February 2009
3 of 10
PMBD914
NXP Semiconductors
Single high-speed switching diode
mbg704
mbg382
2
10
300
I
I
F
FSM
(A)
)
(mA
(1)
(2)
(3)
10
200
100
0
1
−1
10
2
3
4
0
1
2
1
10
10
10
10
V
(V)
F
t
(µs)
p
(1) Tamb = 150 °C; typical values
(2) Tamb = 25 °C; typical values
(3) Tamb = 25 °C; maximum values
Based on square wave currents.
Tj = 25 °C; prior to surge
Fig 1. Forward current as a function of forward
voltage
Fig 2. Non-repetitive peak forward current as a
function of pulse duration; maximum values
mbg446
mga884
5
0.8
10
C
(pF
d
I
R
)
(nA)
(1)
4
0.6
0.4
10
(2)
(3)
3
10
2
0.2
0
10
10
0
4
8
12
16
0
100
200
T (°C)
j
V (V)
R
(1) VR = 75 V; maximum values
(2) VR = 75 V; typical values
(3) VR = 25 V; typical values
f = 1 MHz; Tamb = 25 °C
Fig 3. Reverse current as a function of junction
temperature
Fig 4. Diode capacitance as a function of reverse
voltage; typical values
PMBD914_6
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 06 — 11 February 2009
4 of 10
PMBD914
NXP Semiconductors
Single high-speed switching diode
msa562
250
I
F
(mA)
200
150
100
50
0
0
50
100
150
200
(°C)
T
amb
FR4 PCB, standard footprint
Fig 5. Forward current as a function of ambient temperature; derating curve
8. Test information
t
t
p
r
t
D.U.T.
10 %
I
+ I
F
t
F
rr
R
S
= 50 Ω
SAMPLING
OSCILLOSCOPE
t
R
i
= 50 Ω
V = V + I × R
S
R
F
(1)
90 %
V
R
mga881
input signal
output signal
(1) IR = 1 mA
Fig 6. Reverse recovery time test circuit and waveforms
I
1 kΩ
450 Ω
I
V
90 %
R
S
= 50 Ω
OSCILLOSCOPE
= 50 Ω
V
FR
D.U.T.
R
i
10 %
t
t
t
t
p
r
input signal
output signal
mga882
Fig 7. Forward recovery voltage test circuit and waveforms
PMBD914_6
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 06 — 11 February 2009
5 of 10
PMBD914
NXP Semiconductors
Single high-speed switching diode
9. Package outline
3.0
2.8
1.1
0.9
3
0.45
0.15
2.5 1.4
2.1 1.2
1
2
0.48
0.38
0.15
0.09
1.9
Dimensions in mm
04-11-04
Fig 8. Package outline SOT23 (TO-236AB)
10. Packing information
Table 9.
Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number[2] Package
Description
Packing quantity
3000
-215
10000
PMBD914
SOT23
4 mm pitch, 8 mm tape and reel
-235
PMBD914/DG
[1] For further information and the availability of packing methods, see Section 14.
[2] /DG: halogen-free
PMBD914_6
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 06 — 11 February 2009
6 of 10
PMBD914
NXP Semiconductors
Single high-speed switching diode
11. Soldering
3.3
2.9
1.9
solder lands
solder resist
2
3
1.7
solder paste
occupied area
0.6
0.7
(3×)
(3×)
Dimensions in mm
0.5
(3×)
0.6
(3×)
1
sot023_fr
Fig 9. Reflow soldering footprint SOT23 (TO-236AB)
2.2
1.2
(2×)
1.4
(2×)
solder lands
solder resist
2.6
4.6
occupied area
Dimensions in mm
1.4
preferred transport direction during soldering
sot023_fw
2.8
4.5
Fig 10. Wave soldering footprint SOT23 (TO-236AB)
PMBD914_6
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 06 — 11 February 2009
7 of 10
PMBD914
NXP Semiconductors
Single high-speed switching diode
12. Revision history
Table 10. Revision history
Document ID
PMBD914_6
Modifications:
Release date
20090211
Data sheet status
Change notice
Supersedes
Product data sheet
-
PMBD914_5
• Type number PMBD914/DG added
• Section 13 “Legal information”: updated
PMBD914_5
PMBD914_4
PMBD914_3
PMBD914_2
PMBD914_1
20071126
20040106
19990511
19960918
19960404
Product data sheet
Product specification
Product specification
Product specification
Product specification
-
-
-
-
-
PMBD914_4
PMBD914_3
PMBD914_2
PMBD914_1
-
PMBD914_6
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 06 — 11 February 2009
8 of 10
PMBD914
NXP Semiconductors
Single high-speed switching diode
13. Legal information
13.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
damage. NXP Semiconductors accepts no liability for inclusion and/or use of
NXP Semiconductors products in such equipment or applications and
therefore such inclusion and/or use is at the customer’s own risk.
13.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) may cause permanent
damage to the device. Limiting values are stress ratings only and operation of
the device at these or any other conditions above those given in the
Characteristics sections of this document is not implied. Exposure to limiting
values for extended periods may affect device reliability.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Terms and conditions of sale — NXP Semiconductors products are sold
subject to the general terms and conditions of commercial sale, as published
at http://www.nxp.com/profile/terms, including those pertaining to warranty,
intellectual property rights infringement and limitation of liability, unless
explicitly otherwise agreed to in writing by NXP Semiconductors. In case of
any inconsistency or conflict between information in this document and such
terms and conditions, the latter will prevail.
13.3 Disclaimers
General — Information in this document is believed to be accurate and
reliable. However, NXP Semiconductors does not give any representations or
warranties, expressed or implied, as to the accuracy or completeness of such
information and shall have no liability for the consequences of use of such
information.
No offer to sell or license — Nothing in this document may be interpreted
or construed as an offer to sell products that is open for acceptance or the
grant, conveyance or implication of any license under any copyrights, patents
or other industrial or intellectual property rights.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in medical, military, aircraft,
space or life support equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
13.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
14. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
PMBD914_6
© NXP B.V. 2009. All rights reserved.
Product data sheet
Rev. 06 — 11 February 2009
9 of 10
PMBD914
NXP Semiconductors
Single high-speed switching diode
15. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Test information. . . . . . . . . . . . . . . . . . . . . . . . . 5
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 6
Packing information. . . . . . . . . . . . . . . . . . . . . . 6
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 8
3
4
5
6
7
8
9
10
11
12
13
Legal information. . . . . . . . . . . . . . . . . . . . . . . . 9
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 9
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
13.1
13.2
13.3
13.4
14
15
Contact information. . . . . . . . . . . . . . . . . . . . . . 9
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 11 February 2009
Document identifier: PMBD914_6
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