PMEG2015EH [NXP]
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers; 20 V ， 1.5 A非常低VF MEGA肖特基势垒整流器
| 型号： | PMEG2015EH |
| 厂家： | 
NXP |
| 描述： | 20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers |
| 文件： | 总9页 (文件大小：58K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
PMEG2015EH; PMEG2015EJ
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
Rev. 02 — 7 April 2005
Product data sheet
1. Product profile
1.1 General description
Planar Maximum Efficiency General Application (MEGA) Schottky barrier rectifiers with an
integrated guard ring for stress protection encapsulated in small and flat SMD plastic
packages.
Table 1:
Product overview
Type number
Package
Philips
Configuration
JEITA
-
PMEG2015EH
PMEG2015EJ
SOD123F
SOD323F
single diode
single diode
SC-90
1.2 Features
■ Forward current: ≤ 1.5 A
■ Reverse voltage: ≤ 20 V
■ Very low forward voltage
■ Small and flat lead SMD plastic packages
1.3 Applications
■ Low voltage rectification
■ High efficiency DC-to-DC conversion
■ Switch mode power supply
■ Inverse polarity protection
■ Low and medium power general applications
1.4 Quick reference data
Table 2:
Symbol
IF
Quick reference data
Parameter
Conditions
sp ≤ 55 °C
Min
Typ
Max
1.5
20
Unit
A
forward current
reverse voltage
forward voltage
T
-
-
-
-
VR
-
V
[1]
VF
IF = 1.5 A
560
660
mV
[1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
PMEG2015EH; PMEG2015EJ
Philips Semiconductors
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
2. Pinning information
Table 3:
Pinning
Pin
1
Description
cathode
Simplified outline
Symbol
[1]
1
2
2
anode
1
2
sym001
001aab540
[1] The marking bar indicates the cathode.
3. Ordering information
Table 4:
Ordering information
Type number
Package
Name
-
Description
Version
PMEG2015EH
PMEG2015EJ
plastic surface mounted package; 2 leads
plastic surface mounted package; 2 leads
SOD123F
SOD323F
SC-90
4. Marking
Table 5:
Marking codes
Type number
PMEG2015EH
PMEG2015EJ
Marking code
AD
EL
5. Limiting values
Table 6:
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
20
Unit
V
VR
reverse voltage
forward current
repetitive peak forward current tp ≤ 1 ms; δ ≤ 0.25
-
-
-
-
IF
Tsp ≤ 55 °C
1.5
5.5
9
A
IFRM
IFSM
A
[1]
non-repetitive peak forward
current
square wave;
tp = 8 ms
A
Ptot
total power dissipation
PMEG2015EH
Tamb ≤ 25 °C
[1]
[2]
[1]
[2]
-
375
830
360
830
150
+150
mW
mW
mW
mW
°C
-
PMEG2015EJ
-
-
Tj
junction temperature
ambient temperature
-
Tamb
−65
°C
9397 750 14916
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 7 April 2005
2 of 9
PMEG2015EH; PMEG2015EJ
Philips Semiconductors
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
Table 6:
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Tstg storage temperature
Conditions
Min
Max
Unit
−65
+150
°C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
6. Thermal characteristics
Table 7:
Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max Unit
Rth(j-a)
thermal resistance from
junction to ambient
in free air
[1] [2]
[2] [3]
[1] [2]
[2] [3]
PMEG2015EH
-
-
-
-
-
-
-
-
330
150
350
150
K/W
K/W
K/W
K/W
PMEG2015EJ
Rth(j-sp)
thermal resistance from
junction to solder point
PMEG2015EH
PMEG2015EJ
-
-
-
-
60
55
K/W
K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] For Schottky barrier diodes thermal run-away has to be considered, as in some applications the reverse
power losses PR are a significant part of the total power losses. Nomograms for determining the reverse
power losses PR and IF(AV) rating are available on request.
[3] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
7. Characteristics
Table 8:
Characteristics
Tamb = 25 °C unless otherwise specified.
Symbol Parameter Conditions
VF forward voltage
Min
Typ
240
300
400
480
560
5
Max
270
350
460
550
660
10
Unit
mV
mV
mV
mV
mV
µA
[1]
[1]
[1]
[1]
[1]
IF = 10 mA
IF = 100 mA
IF = 500 mA
IF = 1 A
-
-
-
-
-
-
-
-
-
-
-
IF = 1.5 A
VR = 5 V
IR
reverse current
VR = 8 V
7
20
µA
VR = 10 V
VR = 15 V
VR = 20 V
8
30
µA
10
50
µA
15
70
µA
Cd
diode capacitance VR = 1 V; f = 1 MHz
40
50
pF
[1] Pulse test: tp ≤ 300 µs; δ ≤ 0.02.
9397 750 14916
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 7 April 2005
3 of 9
PMEG2015EH; PMEG2015EJ
Philips Semiconductors
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
006aaa402
006aaa403
4
5
10
F
10
I
R
I
(1)
(2)
(µA)
(mA)
10
4
3
2
10
10
10
3
(3)
2
10
(1)
(2) (3)
(4)
(5)
(4)
10
10
1
1
−1
10
(5)
−1
10
−2
10
10
−2
−3
10
0
0.1
0.2
0.3
0.4
0.5
V
0.6
(V)
0
5
10
15
20
V
(V)
R
F
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(3) Tamb = 85 °C
(4) Tamb = 25 °C
(5) Tamb = −40 °C
(1) Tamb = 150 °C
(2) Tamb = 125 °C
(3) Tamb = 85 °C
(4) Tamb = 25 °C
(5) Tamb = −40 °C
Fig 1. Forward current as a function of forward
voltage; typical values
Fig 2. Reverse current as a function of reverse
voltage; typical values
006aaa404
80
C
d
(pF)
60
40
20
0
0
5
10
15
20
V
(V)
R
Tamb = 25 °C; f = 1 MHz
Fig 3. Diode capacitance as a function of reverse voltage; typical values
9397 750 14916
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 7 April 2005
4 of 9
PMEG2015EH; PMEG2015EJ
Philips Semiconductors
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
8. Package outline
1.7
1.5
1.2
1.0
1.35
1.15
0.80
0.65
0.5
0.3
1
1
0.55
0.35
2.7 1.8
2.3 1.6
3.6 2.7
3.4 2.5
2
2
0.40
0.25
0.25
0.10
0.70
0.55
0.25
0.10
Dimensions in mm
04-11-29
Dimensions in mm
04-09-13
Fig 4. Package outline SOD123F
Fig 5. Package outline SOD323F (SC-90)
9. Packing information
Table 9:
Packing methods
The -xxx numbers are the last three digits of the 12NC ordering code. [1]
Type number
Package
Description
Packing quantity
3000
10000
PMEG2015EH SOD123F
PMEG2015EJ SOD323F
4 mm pitch, 8 mm tape and reel
-115
-135
[1] For further information and the availability of packing methods, see Section 15.
10. Soldering
4.4
4
2.9
1.6
solder lands
solder resist
2.1 1.6
1.1 1.2
solder paste
occupied area
1.1
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 6. Reflow soldering footprint SOD123F
9397 750 14916
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 7 April 2005
5 of 9
PMEG2015EH; PMEG2015EJ
Philips Semiconductors
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
3.05
2.80
2.10
1.60
solder lands
solder resist
1.65 0.95
0.50 0.60
occupied area
solder paste
001aab169
0.50
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 7. Reflow soldering footprint SOD323F (SC-90)
9397 750 14916
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 7 April 2005
6 of 9
PMEG2015EH; PMEG2015EJ
Philips Semiconductors
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
11. Revision history
Table 10: Revision history
Document ID
Release date Data sheet status
Change notice Doc. number
Supersedes
PMEG2015EH_EJ_2 20050407
Product data sheet
-
9397 750 14916 PMEG2015EJ_1
Modifications:
• Type PMEG2015EH added
• Table 6 Ptot values for PMEG2015EJ amended
20050302 Product data sheet
PMEG2015EJ_1
-
9397 750 14594
-
9397 750 14916
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 7 April 2005
7 of 9
PMEG2015EH; PMEG2015EJ
Philips Semiconductors
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
12. Data sheet status
Level Data sheet status[1] Product status[2] [3]
Definition
I
Objective data
Development
This data sheet contains data from the objective specification for product development. Philips
Semiconductors reserves the right to change the specification in any manner without notice.
II
Preliminary data
Qualification
This data sheet contains data from the preliminary specification. Supplementary data will be published
at a later date. Philips Semiconductors reserves the right to change the specification without notice, in
order to improve the design and supply the best possible product.
III
Product data
Production
This data sheet contains data from the product specification. Philips Semiconductors reserves the
right to make changes at any time in order to improve the design, manufacturing and supply. Relevant
changes will be communicated via a Customer Product/Process Change Notification (CPCN).
[1]
[2]
Please consult the most recently issued data sheet before initiating or completing a design.
The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at
URL http://www.semiconductors.philips.com.
[3]
For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status.
13. Definitions
14. Disclaimers
Short-form specification — The data in a short-form specification is
extracted from a full data sheet with the same type number and title. For
detailed information see the relevant data sheet or data handbook.
Life support — These products are not designed for use in life support
appliances, devices, or systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips Semiconductors
customers using or selling these products for use in such applications do so
at their own risk and agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition — Limiting values given are in accordance with
the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device.
These are stress ratings only and operation of the device at these or at any
other conditions above those given in the Characteristics sections of the
specification is not implied. Exposure to limiting values for extended periods
may affect device reliability.
Right to make changes — Philips Semiconductors reserves the right to
make changes in the products - including circuits, standard cells, and/or
software - described or contained herein in order to improve design and/or
performance. When the product is in full production (status ‘Production’),
relevant changes will be communicated via a Customer Product/Process
Change Notification (CPCN). Philips Semiconductors assumes no
responsibility or liability for the use of any of these products, conveys no
license or title under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that these products are
free from patent, copyright, or mask work right infringement, unless otherwise
specified.
Application information — Applications that are described herein for any
of these products are for illustrative purposes only. Philips Semiconductors
make no representation or warranty that such applications will be suitable for
the specified use without further testing or modification.
15. Contact information
For additional information, please visit: http://www.semiconductors.philips.com
For sales office addresses, send an email to: sales.addresses@www.semiconductors.philips.com
9397 750 14916
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
Product data sheet
Rev. 02 — 7 April 2005
8 of 9
PMEG2015EH; PMEG2015EJ
Philips Semiconductors
20 V, 1.5 A very low VF MEGA Schottky barrier rectifiers
16. Contents
1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
1.1
1.2
1.3
1.4
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Quick reference data. . . . . . . . . . . . . . . . . . . . . 1
2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
Thermal characteristics. . . . . . . . . . . . . . . . . . . 3
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 3
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 5
Packing information. . . . . . . . . . . . . . . . . . . . . . 5
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Revision history. . . . . . . . . . . . . . . . . . . . . . . . . 7
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . . 8
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Contact information . . . . . . . . . . . . . . . . . . . . . 8
3
4
5
6
7
8
9
10
11
12
13
14
15
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 7 April 2005
Document number: 9397 750 14916
Published in The Netherlands
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