SAA7811HL [NXP]
Single-chip DVD-ROM; 单芯片DVD-ROM
| 型号： | SAA7811HL |
| 厂家： | 
NXP |
| 描述： | Single-chip DVD-ROM |
| 文件： | 总20页 (文件大小：90K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
SAA7811HL
Single-chip DVD-ROM
Preliminary specification
1999 Oct 05
File under Integrated Circuits, IC22
Philips Semiconductors
Preliminary specification
Single-chip DVD-ROM
SAA7811HL
FEATURES
Host interface
• Enhanced Integrated Drive Electronics (IDE) Advanced
Technology Attachment Program Interface (ATAPI) host
interface
• Built-in 12-byte ATAPI Packet command First-In,
First-Out (FIFO)
• On-chip CD error corrector memory with ±8 frame jitter
margin
• Supports Advanced Technology Attachment (ATA) and
ATA-2 PIO and multi-word Direct Memory Access
(DMA) data transfer modes
• Built-in hardware for double pass DVD error corrector;
(can correct 5 errors in C1 frame and 16 errors in
C2 frame)
• Supports ATA/ATAPI-4 Ultra DMA transfer modes with
data rate up to 33 MBytes/s
• Error corrector monitor signal available
• I2C-bus output available via programmable vampire
pins.
• Configurable as generic DMA interface, for use with
external host interface devices
• Automatic sequencing of ATAPI packet command
Spindle motor control
protocol; including command termination
• Advanced motor control loop allows Constant Angular
Velocity (CAV), Constant Linear Velocity (CLV) and
pseudo-CLV playback
• Automatic determination of block length for mode2,
form 1 and form 2 sectors (block length transferred is
programmable).
• Support for 3-pin and 1-pin tacho control
• Motor control via incoming bit stream or tacho.
Block decoder
• Supports CD-ROM, CD-R and CD-R/W; CD-DA and
DVD-ROM formats
Speed operation
• Supports up to 56 × CD-ROM playback
• Supports up to 10 × DVD-ROM playback.
• Supports real time error detection and correction in
hardware for CD-ROM mode
• CD-ROM error corrector switchable between single or
dual pass (both with Error Detection/Correction [EDC])
Multimedia functions and built-in DAC
• Supports audio playback via DRAM buffer; allows audio
discs to be played at higher speeds
• Internal registers are memory-mapped
• Embedded DVD-video authentication module.
• IEC958 (SPDIF, AES/EBU and DOBM) output with
Q to W subcode bits and programmable category code,
output at n = 1 rate
Buffer memory controller
• Supports up to 2 MBytes of DRAM buffer
• Block based sector addressing.
• Built-in digital audio DAC including: −4 × oversampling
filter
• Built-in digital volume control, attenuator and
single-sample interpolator
Channel decoder
• Selectable differential and single-ended HF inputs;
compatible with TZA1033 (DVDalas2plus) and
TZA1020A (Aeger2); single-ended input has
bypassable AGC
• Separate left and right channel routing and mute control.
Microcontroller interface
• Embedded microcontroller can operate as 33 MHz or
67 MHz equivalent 80C51
• Internal 6-bit ADC
• Digital PLL and slicer for HF clock regeneration
• Embedded co-processor for fast multiply, divide, shift,
and normalize instructions; supported by C-compilers
• Supports Eight-to-Fourteen Modulation
(EFM) and EFM+ demodulation
• Co-processor for MSF calculations
• Memory mapped interfaces to sub functions
• External microcontroller support
• Full CD error correction strategy; t = 2 and e = 4
1999 Oct 05
2
Philips Semiconductors
Preliminary specification
Single-chip DVD-ROM
SAA7811HL
• Embedded SRAM (1.5 kbytes Xdata, 512 bytes Idata,
• Sledge motor servo loop with enhanced Position Control
224 bytes data and registers)
Sledge (PCS) support
• 4 banks: on Idata and registers; for better multi-tasking
support
• Sledge stepper motor support
• Adaptive Repetitive Control (ARC)
• Debug interface for servo.
• External flash EPROM programming support
– Serial boot possible with empty flash EPROM
– Internal program upload support.
Clock multiplier
• On-chip clock multipliers allows the use of 8.4672 MHz
• Code space support up to 1 Mbyte through built-in bank
crystal.
switching
• Debug interface for embedded microcontroller.
Disclaimer
Servo processor
Supply of this Compact Disc IC does not convey an implied
license under any patent right to use this IC in any
Compact Disc application.
• Switched current analog-to-digital converters for diode
and error signal inputs
• Selectable servo error or servo diode inputs
• Focus and radial servo loops
GENERAL DESCRIPTION
The SAA7811 is a single-chip device for high speed
DVD-ROM applications. The device contains the following
blocks previously contained in separate ICs:
• Automatic closed loop gain control available for focus
and radial loops
• Built-in access procedure with fast track count input
• channel decoder
• block decoder
• servo processor
• microcontroller.
• High-speed track crossing velocity measurement
(>350 kHz) for CD and DVD
• Special DVD track crossing support
• Fast radial brake circuitry
• EFM actuator damping circuitry
QUICK REFERENCE DATA
SYMBOL
VDDD(CO)
PARAMETER
MIN.
3.0
TYP.
3.3
MAX.
3.6
UNIT
supply voltage digital part core; note 1
supply voltage digital part pad cells 3 V
supply voltage digital part pad cells 5 V
supply voltage analog part; note 1
supply current
V
V
V
V
VDDD1(3P)
VDDD2(5P)
VDDA
3.0
4.5
3.0
−
3.3
5.0
3.3
tbf
3.6
5.5
3.6
−
IDD
mA
MHz
°C
fXTAL
crystal frequency
8
8.4672
−
35
Tamb
operating ambient temperature
storage temperature
0
60
Tstg
−55
−
+125
°C
Note
1. The analog and digital core supply pins (VDDA and VDDD(CO)) must be connected to the same external supply.
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
SAA7811HL
1999 Oct 05
LQFP208 plastic low profile quad flat package; 208 leads; body 28 × 28 × 1.4 mm
SOT459-1
3
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CD/DVD
ERROR
CORRECTOR
CHANNEL DECODER
BLOCK DECODER
DRAM
INTERFACE
BIT DETECTOR
AND DEMODULATOR
DRIVE
INTERFACE
HOST
INTERFACE
ADC
MEMORY
PROCESSOR
MEMORY
PROCESSOR
MULTIMEDIA
INTERFACE
ERROR
CORRECTOR
MOTOR/
TACHO INTERFACE
DAC
SUBCODE
INTERFACE
CSS
MODULE
SAA7811
CONTROL
REGISTERS
CPU INTERFACE
SERVO
ADDRESS
DECODER
CPU
ADC
ADC
PCS
ACCELERATOR
RAM
1.5 KBYTES ROM
736-BYTE RAM
PORT REGS
SERVO
PROCESSOR
SERVO
ACCELERATOR
1.5 KBYTES
AUXILIARY RAM
SFRs
MICROCONTROLLER
FCE404
Fig.1 Block diagram.
ahdnbok,uflapegwidt
Philips Semiconductors
Preliminary specification
Single-chip DVD-ROM
SAA7811HL
PINNING
See note 1
SYMBOL
VDDD1(3P)
VSSD1(3P)
T1
PIN
DESCRIPTION
1
pad digital supply (3.3 V)
pad digital ground (3.3 V)
tacho 1 input, tcb_tck_pregate
tacho 2 input
2
3
T2
4
T3
5
tacho 3 input
DAC/RP
DAC/RN
DAC_VPOS
DAC_VNEG
DAC_LP
DAC_LN
TEST1
TEST2
CRIN
6
DAC differential output right (positive)/debug signal from MACE (opc_int)
DAC differential output right (negative)/debug signal from MACE (servo_int)
DAC Vref (positive)
7
8
9
DAC Vref (negative)
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
37
38
39
DAC differential output left (positive)/debug signal from MACE (dakota_int0)
DAC differential output left (negative)/debug signal from MACE (dakota_int1)
test input, tcb_tms and tcb_tdi connected to an internal pull-down resistor
test input, tcb_trstn connected to an internal pull-down resistor
clock input
CROUT
VDDA
clock output
analog supply (3.3 V)
VSSA
analog supply ground
HFIN_DN
HFIN_DP
HFIN_SE
VCOM
Iref
differential HF in (negative)
differential HF in (positive)
single-ended HF in (AGC)
common mode reference signal (DVDalas2plus)
analog current reference
WREFLO
TEST3
VSSA
Vref low; connect to VSSA via capacitor
test input; connect to VSSA
analog supply ground
VDDA
analog supply (3.3 V)
SIN_PHI
COS_PHI
TEST4
XDET
sine input from hall detectors
cosine input from hall detectors
test input; connect to VSSA
auxiliary ADC input
ACT_EMFP
ACT_EMFN
TEST5
TEST6
TEST7
UOPB
EMF of the actuator; positive input
EMF of the actuator; negative input
test input; connect to VSSA
test input; connect to VSSA
test input; connect to VSSA
decoupling point for ADC ladder
upper reference voltage for ADC ladder
gain control for TZA1030 (DROPPI)
analog supply ground
UOPT
ALPHA0
VSSA
1999 Oct 05
5
Philips Semiconductors
Preliminary specification
Single-chip DVD-ROM
SAA7811HL
SYMBOL
VDDA
PIN
DESCRIPTION
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
80
analog supply (3.3 V)
diode input
D1
D2/TLN
D3/REN
D4/FEN
S1/MIRN
S2
diode input (normalized); track-loss signal
diode input (normalized); radial error signal
diode input (normalized); focus error signal
satellite diode (normalized); mirror signal
satellite diode
VRIN
I/O voltage reference; for servo ADC
track count input
FTCH
P5_7/DEFO
P5_6/DEFI
P5_5/TL
P5_4/RP/FOK
P5_3/CE1
P5_2/CLO
P5/SDA
P5_0/SCL
RA
defect output (active LOW)/general purpose I/O
defect input (active LOW)/general purpose I/O
track-loss means output/general purpose I/O
radial polarity/focus OK/general purpose I/O
CS external SRAM/programmable I/O
servo clock output/alpha0 step pulse for LADIC
I2C-bus data/general purpose I/O
I2C-bus clock/general purpose I/O
radial output (3-state during reset)
SL
sledge output (3-state during reset)
focus output (3-state during reset)
FO
RAC_SW
REF_SIN
REF_COS
VDDD1(3P)
VSSD1(3P)
P4_7/PXT2EN
P4_6/PXT2
P4_5/PXT0
P4_4/PXT
VDDD(3CO)
VSSD(3CO)
P4_3/A19
P4_2/A18
P4_1/A17
P4_0/A16
UA15
disconnects radial actuator (active HIGH)
pulse density modulated reference signal; removes DC offset from sin_phi
pulse density modulated reference signal; removes DC offset from cos_phi
pad digital supply (3.3 V)
pad digital ground (3.3 V)
timer 2 input enable/SIDA for DVDalas2plus
timer 2 clock input/SICL for DVDalas2plus
timer 1 clock input/SILD for DVDalas2plus
timer 0 clock input/CS2 for external device
core digital supply (3.3 V)
core digital ground
A19 to EPROM
A18 to EPROM
A17 to EPROM
A16 to EPROM
port 2; upper microcontroller address lines
port 2; upper microcontroller address lines
port 2; upper microcontroller address lines
port 2; upper microcontroller address lines
port 2; upper microcontroller address lines
port 2; upper microcontroller address lines
UA14
UA13
UA12
UA11
UA10
1999 Oct 05
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Philips Semiconductors
Preliminary specification
Single-chip DVD-ROM
SAA7811HL
SYMBOL
UA9
PIN
DESCRIPTION
port 2; upper microcontroller address lines
81
82
UA8
port 2; upper microcontroller address lines
pad digital supply (3.3 V)
VDDD1(3P)
VSSD1(3P)
EA_WAIT
DSDEN_SRST
SCCLK
83
84
pad digital ground (3.3 V)
85
address input/wait output internal pull-up resistor (active LOW)
microcontroller reset
86
87
microcontroller clock for testing
PSENN_CS
ALE_ASTB
VDDD(3CO)
VSSD(3CO)
UA7_P1_7
UA6_P1_6
UA5_P1_5
UA4_P1_4
UA3_P1_3
UA2_P1_2
UA1_P1_1
UA0_P1_0
VDDD1(3P)
VSSD1(3P)
UDA0
88
programme strobe enable/output enable for external device internal pull-up resistor
address latch; chip select internal pull-up resistor
core digital supply (3.3 V)
89
90
91
core digital ground
92
port 1; demultiplexed lower microcontroller address lines (mode3 = vampire7; V4)
port 1; demultiplexed lower microcontroller address lines (mode3 = vampire6; SYNC)
port 1; demultiplexed lower microcontroller address lines (mode3 = MON_D)
port 1; demultiplexed lower microcontroller address lines (mode3 = MON_A)
port 1; demultiplexed lower microcontroller address lines (mode3 = DEB_OUT)
port 1; demultiplexed lower microcontroller address lines (mode3 = OTD)
port 1; demultiplexed lower microcontroller address lines
port 1; demultiplexed lower microcontroller address lines
pad digital supply (3.3 V)
93
94
95
96
97
98
99
100
101
102
103
104
105
106
107
108
109
110
111
112
113
114
115
116
117
118
119
120
121
pad digital ground (3.3 V)
port 0; multiplexed microcontroller data/lower address lines
port 0; multiplexed microcontroller data/lower address lines
port 0; multiplexed microcontroller data/lower address lines
port 0; multiplexed microcontroller data/lower address lines
port 0; multiplexed microcontroller data/lower address lines
port 0; multiplexed microcontroller data/lower address lines
port 0; multiplexed microcontroller data/lower address lines
port 0; multiplexed microcontroller data/lower address lines
read signal (active LOW)
UDA1
UDA2
UDA3
UDA4
UDA5
UDA6
UDA7
P3_7/RD
P3_6/WR
P3_5/TXD2
P3_4/RXD2
VDDD1(3P)
VSSD1(3P)
P3_3/INT1
P3_2/INT0
P3_1/TXD1
P3_0/RXD1
HRESET
VDDD2(5P)
write signal (active LOW)
UART 2 transmit data line
UART 2 receive data line
pad digital supply (3.3 V)
pad digital ground (3.3 V)
interrupt 1 input/programmable I/O
interrupt 0 input/programmable I/O
UART 1 transmit data line
UART 1 receive data line
host reset
pad digital supply (5.0 V)
1999 Oct 05
7
Philips Semiconductors
Preliminary specification
Single-chip DVD-ROM
SAA7811HL
SYMBOL
VSSD5(pad3)
PIN
DESCRIPTION
122
123
124
125
126
127
128
129
130
131
132
133
134
135
136
137
138
139
140
141
142
143
144
145
146
147
148
149
150
151
152
153
154
155
156
157
158
159
160
161
162
pad digital ground (5.0 V)
host interface; generic DMA
DD7
DD8
host interface; generic DMA (mode1 = MEAS1_CFLG)
host interface; generic DMA
DD6
DD9
host interface; generic DMA (mode1 = MEAS1)
host interface; generic DMA
DD5
DD10
host interface; generic DMA (mode1 = MON_A)
host interface; generic DMA
DD4
DD11
host interface; generic DMA (mode1 = MON_D)
host interface; generic DMA
DD3
DD12
host interface; generic DMA (mode1 = DEB_OUT)
host interface; generic DMA
DD2
DD13
host interface; generic DMA (mode1 = OTD)
host interface; generic DMA
DD1
DD14
host interface; generic DMA
DD0
host interface; generic DMA
DD15
host interface; generic DMA
VDDD2(5P)
VSSD2(5P)
DMARQ/GACK
DIOW
pad digital supply (5.0 V)
pad digital ground (5.0 V)
host DMA request; generic DMA acknowledge
host interface write strobe
DIOR
host interface read strobe
IORDY
DMACK/GRQ
INTRQ
IOCS16
DA1_GWR
PDIAG
DA0
host interface ready
host DMA acknowledge; generic DMA request
host interface interrupt request
host interface 8⁄16 bit port
host add bit 1; generic write
host interface passed test (mode1 = vampire6; SYNC)
host add bit 0
DA2_GRD
VDDD2(5P)
VSSD2(5P)
CS0
host add bit 2; generic read
pad digital supply (5.0 V)
pad digital ground (5.0 V)
host interface chip select 0
CS1
host interface chip select 1
DASP
host interface active slave present (mode1 = vampire7; V4)
pad digital supply (3.3 V)
VDDD1(3P)
VSSD1(3P)
XDA0
pad digital ground (3.3 V)
DRAM address
XDA1
DRAM address
XDA2
DRAM address
XDA3
DRAM address
1999 Oct 05
8
Philips Semiconductors
Preliminary specification
Single-chip DVD-ROM
SAA7811HL
SYMBOL
XDA4
PIN
DESCRIPTION
163
164
165
166
167
168
169
170
171
172
173
174
175
176
177
178
179
180
181
182
183
184
185
186
187
188
189
190
191
192
193
194
195
196
197
198
199
200
201
202
203
DRAM address
XDA5
DRAM address
XDA6
DRAM address
XDA7
DRAM address
XDA8
DRAM address
XDA9
DRAM address
VDDD(3CO)
VSSD(3CO)
XRAS
core digital supply (3.3 V)
core digital ground
DRAM RAS strobe
DRAM CAS strobe
DRAM CAS strobe
DRAM write strobe
pad digital supply (3.3 V)
pad digital ground (3.3 V)
DRAM data bus
XCAS_HI
XCAS_LO
XWR
VDDD1(3P)
VSSD1(3P)
XDD0
XDD1
DRAM data bus
XDD2
DRAM data bus
XDD3
DRAM data bus
XDD4
DRAM data bus
XDD5
DRAM data bus
XDD6
DRAM data bus
XDD7
DRAM data bus
XDD8
DRAM data bus
XDD9
DRAM data bus
XDD10
XDD11
XDD12
XDD13
XDD14
XDD15
VSSD1(3P)
VDDD1(3P)
IECO/CL1
MCK
DRAM data bus
DRAM data bus
DRAM data bus
DRAM data bus
DRAM data bus
DRAM data bus
pad digital ground (3.3 V)
pad digital supply (3.3 V)
IEC958 output/CL1 output from HDr62
multimedia master clock input/output (mode2 = MEAS_CFLG)
core digital supply (3.3 V)
VDDD(3CO)
VSSD(3CO)
WCLK_WSI
BCLK_SCKI
DATA_SDI
FLAG
core digital ground
I2C-bus word clock output/input (mode2 = MEAS1)
I2C-bus bit clock output/input (mode2 = MON_D)
I2C-bus data output/input (mode2 = MON_A)
I2C-bus flag output/input (mode2 = DEB_OUT)
test output; leave unconnected
TEST8
1999 Oct 05
9
Philips Semiconductors
Preliminary specification
Single-chip DVD-ROM
SAA7811HL
SYMBOL
TEST9
PIN
DESCRIPTION
204
205
206
207
208
test output; leave unconnected
test output; leave unconnected
Power-on reset (active LOW)
BCA input
TEST10
POR
BCA
MOTO1
motor control output
Note
1. All supply pins must be connected to the same external power supply voltage.
handbook, halfpage
1
156
105
SAA7811HL
52
FCE405
Fig.2 Pin configuration.
1999 Oct 05
10
Philips Semiconductors
Preliminary specification
Single-chip DVD-ROM
SAA7811HL
CHARACTERISTICS
VDDD(3CO) = 3.0 to 3.6 V; VDDD1(3P) = 3.0 to 3.6 V; VDDA = 3.0 to 3.6 V; VDDD2(5P) = 4.5 to 5.5 V; VSS = 0 V;
amb = 0 to 60 °C; unless otherwise specified.
T
SYMBOL PARAMETER
Pins: HFIN_DN and HFIN_DP
CONDITIONS
MIN.
TYP.
MAX.
UNIT
fclk(sample)
clock frequency sample
rate
−
−
140
MHz
MHz
Brec
recovered bandwidth
effective number of bits
1⁄3 Nyquist
−
−
−
46.6
5
−
−
Nbit(eff)
Vi(dif)(p-p)
fclk(sample) = 140 MHz
differential input signal
voltage (peak-to-peak
value)
0 dB; depends on VDDA
1.4
1.4VDDA
V
V
Vi(se)(p-p)
single-ended input signal
voltage (peak-to-peak
voltage)
0 dB; depends on VDDA
−
0.7
1.7VDDA
Voffset(dif)
Voffset(cm)
differential offset voltage
VHFIN_DP; VHFIN_DN
−100
−200
−
−
+100
+100
mV
mV
common mode offset
voltage
Voffset(ADC)
Ci
ADC offset voltage
−60
−
−
7
3
∞
−
+60
−
mV
pF
pF
kΩ
ps
static input capacitance
input to ground
input to input
−
−
Ri
input resistance
group delay
−
−
td(g)
−
100
Pin: HFIN_SE
fclk(sample)
clock frequency sample
rate
−
−
−
MHz
Brec
recovered bandwidth
AGC gain (32 steps)
total harmonic distortion
−
35
−
−
MHz
dB
GAGC
THD
−2.1
−
+11.4
−35
signal = 25 MHz; at
Vdif = 1.4 V(p-p)
−
dB
S/N
signal to noise ratio and
distortion of AGC
−
−
50
−
dB
V
Vi(se)(p-p)
single-ended input signal
voltage (peak-to-peak
voltage)
0 dB; depends on VDDA
0.7
0.7VDDA
Ci
static input capacitance
input resistance
input to ground
0 to 35 MHz
−
−
−
7
−
pF
kΩ
ps
Ri
8.6
−
−
td(g)
group delay flatness
600
Pins: D1, D2/TL, D3/RE, S1/MIR and S2
Ii/o(max)
maximum input/output
current
selectable via gain;
note 1
1
−
16
µA
Vi
voltage at input
gain tolerance
−
VVRIN
0
−
V
Gtol
−20
+20
%
1999 Oct 05
11
Philips Semiconductors
Preliminary specification
Single-chip DVD-ROM
SAA7811HL
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
∆G
variation of gain between
channels (D1 to D2/TL,
D3/RE to
−2
−
+2
25
%
D4/FE and S1/MIR to S2)
Cpar(max)
maximum parasitic
capacitance connected to
input
−
−
−
pF
fclk
clock frequency sample
rate
8.4672 −
MHz
Brec
recovered bandwidth
−
−
20
−
kHz
dB
(THD + N)/S
total harmonic
distortion-plus-noise to
signal ratio
I
I
sink or Isource = 6 µA
−
−30
DR
dynamic range
sink or Isource = 6 µA
50
−
−
dB
V
Pin: VRIN
Vo(VRIN)
Vi(VRIN)
output voltage
input voltage
0.75
1.0
0.9
1.05
1⁄2VDDA + 0.1 V
−
Pin: FTCH
V(comp)(offset)(FTC) comparator FTC offset
voltage
−20
−10
−
+20
+10
−
mV
V(comp)(hys)(FTC)
comparator FTC
hysteresis voltage
−
mV
Vcm
fsample
Ci
common mode voltage
sample rate
−
1.2
V
−
8.4672 −
MHz
pF
input capacitance
input resistance
input to ground
−
7
−
−
Ri
100
−
kΩ
Pins: UOPB and UOPT
Vi(UOPB) input voltage on UOPB
Vi(UOPT) input voltage on UOPT
Pins: ACT_EMFP and ACT_EMFN
−
−
0
−
−
V
V
2.9
Vi
input voltage
0
−
Vi(UOPT)
V
Vcm
G
common mode voltage
gain
−
tbf
5
−
V
note 2
−
−
V
B
bandwidth
−
265
100
7
−
kHz
kΩ
pF
Ri
Ci
input resistance
static input capacitance
80
−
120
−
Pins: SIN_PHI, COS_PHI, XDET and ACT_EMFP; note 3
Vi
input voltage
0
−
−
V(UOPT)
+1
V
∆G
gain matching between
channels
−1
%
Ri
input resistance
−
−
∞
−
−
kΩ
Ci(static)
static input capacitance
7
pF
1999 Oct 05
12
Philips Semiconductors
Preliminary specification
Single-chip DVD-ROM
SAA7811HL
SYMBOL
Ci(dynamic)
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
dynamic input capacitance
−
−
5
−
−
pF
fclk(sample)
clock frequency sample
rate
1.05
MHz
Brec
recovered bandwidth
5
−
0
−
−
kHz
Nbit(eff)
CODEminvi
effective number of bits
at 1.05 MHz
7.2
5
−
output code for Vi(UOPB)
input
10
CODEmaxvi
output code for Vi(UOPT)
input
251
253
255
Pin: ALPHA0
fclk
clock frequency sample
rate
−
1.05
−
MHz
Vo
CL
RL
output voltage
load capacitance
load resistance
0
−
−
−
Vi(UOPT)
25
V
−
pF
kΩ
10
30
Pins: DAC_LN, DAC_LP, DAC/RN and DAC/RP
fclk
clock frequency sample
rate
−
4.236
−
MHz
B
frequency bandwidth
−
−
−
20
kHz
dB
S/NAW
A-weighted signal-to-noise note 4
ratio
90
−
THD
total harmonic distortion
note 4
−
−
−80
dB
Digital inputs
POR, HRESET AND BCA (SCHMITT TRIGGERS) TTL INPUT WITH HYSTERESIS
Vsw(th)(r)
switching threshold voltage
(rising)
1.4
−
−
1.9
V
V
Vsw(th)(f)
switching threshold voltage
(falling)
0.9
1.45
Vhys
CI
hysteresis voltage
input capacitance
0.4
−
−
0.7
10
V
−
pF
DESIGNATED BY ‘T’ TTL INPUT; note 5
VIL
VIH
ILI
LOW-level input voltage
−
−
−
−
−
0.8
−
V
HIGH-level input voltage
input leakage current
input capacitance
2.0
−10
−
V
VLI = 0 to VDDD1(3P)
+10
10
µA
pF
Ci
Digital outputs
DESIGNATED BY ‘L’ (CMOS LEVELS)
VOL
VOH
CL
LOW-level output voltage
HIGH-level output voltage IOH = −2 mA
load capacitance
IOL = 2 mA
−
−
−
−
0.4
−
V
0.85VDDD1(3P)
V
−
20
pF
1999 Oct 05
13
Philips Semiconductors
Preliminary specification
Single-chip DVD-ROM
SAA7811HL
SYMBOL
PARAMETER
CONDITIONS
CL = 20 pF;
MIN.
TYP.
MAX.
UNIT
to(r)
to(f)
output rise time
−
−
−
20
20
ns
10% to 90% levels
output fall time
CL = 20 pF;
−
ns
90% to 10% levels
DESIGNATED BY ‘M’ (CMOS LEVELS)
VOL
VOH
CL
LOW-level output voltage
IOL = 4 mA
−
−
−
−
−
0.4
−
V
HIGH-level output voltage IOH = −4 mA
0.85VDDD1(3P)
V
load capacitance
output rise time
−
−
20
20
pF
ns
to(r)
CL = 20 pF;
10% to 90% levels
to(f)
output fall time
CL = 20 pF;
90% to 10% levels
−
−
−
20
ns
IL(3-state)
3-state leakage current
VLI = 0 to VDDD1(3P)
−10
+10
µA
DESIGNATED BY ‘AL’ (ATA DATA BUS LEVELS)
VOL
VOH
CL
LOW-level output voltage
IOL = 4 mA
−
−
−
−
−
0.5
−
V
HIGH-level output voltage IOH = −4 mA
0.9VDDD2(5P)
V
load capacitance
−
100
−
pF
ns
to(r)
output rise time
CL = 100 pF;
5
0.5 V to 90% VDDD2(5P)
to(f)
output fall time
CL = 100 pF;
5
−
−
ns
90% VDDD2(5P) to 0.5 V
DESIGNATED BY ‘AH’ (ATA LEVELS)
VOL
VOH
CL
LOW-level output voltage
IOL = 12 mA
−
−
−
−
−
0.5
−
V
HIGH-level output voltage IOH = −4 mA
0.9VDDD2(5P)
V
load capacitance
output rise time
−
100
−
pF
ns
to(r)
CL = 100 pF;
5
0.5 V to 90% VDDD2(5P)
to(f)
output fall time
CL = 100 pF;
5
−
−
ns
90% VDDD2(5P) to 0.5 V
Input: CRIN (external clock)
VIL
VIH
tIH
ILI
LOW-level input voltage
−0.3
2.0
45
−
−
−
−
−
+0.5
V
HIGH-level input voltage
input HIGH time
VDDA + 0.3
V
relative to period
55
+10
7
%
µA
pF
input leakage current
input capacitance
−10
−
Ci
Output: CROUT
fXTAL
crystal frequency
note 6
−
−
8.4672 −
17
MHz
gm(mutual)
mutual conductance at
start-up
−
mA/V
1999 Oct 05
14
Philips Semiconductors
Preliminary specification
Single-chip DVD-ROM
SAA7811HL
SYMBOL
C(feedback)
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
feedback capacitance
output capacitance
internal bias resistor
−
−
−
−
2
7
−
pF
pF
kΩ
Co
−
Rbias
200
Notes
1. Clips at maximum gain setting; input can handle two times the maximum signal amplitude.
2. Gain depends on application components.
3. Pin ACT_EMFP operating in bypass mode.
4. Performance largely determined by application circuit.
5. Does not apply to pins EA_WAIT, PSENN_CS and ALE_ASTB as they have internal pull-up resistors.
6. It is recommended that the nominal running series resistance of the crystal or ceramic resonator is ≤ 60 Ω.
1999 Oct 05
15
Philips Semiconductors
Preliminary specification
Single-chip DVD-ROM
SAA7811HL
PACKAGE OUTLINE
LQFP208; plastic low profile quad flat package; 208 leads; body 28 x 28 x 1.4 mm
SOT459-1
y
X
A
105
104
156
157
Z
E
e
H
E
E
(A )
3
A
2
A
A
1
w M
p
θ
L
p
b
L
detail X
pin 1 index
53
208
1
52
v
M
B
A
Z
w M
D
b
p
e
D
B
H
v
M
D
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
v
w
y
Z
Z
E
θ
1
2
3
p
E
p
D
max.
7o
0o
0.15 1.45
0.05 1.35
0.27 0.20 28.1 28.1
0.17 0.09 27.9 27.9
30.15 30.15
29.85 29.85
0.75
0.45
1.43 1.43
1.08 1.08
mm
1.6
0.25
1.0
0.12 0.15 0.1
0.5
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
97-10-02
98-06-17
SOT459-1
1999 Oct 05
16
Philips Semiconductors
Preliminary specification
Single-chip DVD-ROM
SAA7811HL
SOLDERING
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
Introduction to soldering surface mount packages
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Manual soldering
Wave soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
If wave soldering is used the following conditions must be
observed for optimal results:
1999 Oct 05
17
Philips Semiconductors
Preliminary specification
Single-chip DVD-ROM
SAA7811HL
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
REFLOW(1)
BGA, SQFP
not suitable
suitable
suitable
suitable
suitable
suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable(2)
PLCC(3), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
not recommended(3)(4)
not recommended(5)
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
1999 Oct 05
18
Philips Semiconductors
Preliminary specification
Single-chip DVD-ROM
SAA7811HL
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
1999 Oct 05
19
Philips Semiconductors – a worldwide company
Argentina: see South America
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB,
Tel. +31 40 27 82785, Fax. +31 40 27 88399
Australia: 3 Figtree Drive, HOMEBUSH, NSW 2140,
Tel. +61 2 9704 8141, Fax. +61 2 9704 8139
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. +64 9 849 4160, Fax. +64 9 849 7811
Austria: Computerstr. 6, A-1101 WIEN, P.O. Box 213,
Tel. +43 1 60 101 1248, Fax. +43 1 60 101 1210
Norway: Box 1, Manglerud 0612, OSLO,
Tel. +47 22 74 8000, Fax. +47 22 74 8341
Belarus: Hotel Minsk Business Center, Bld. 3, r. 1211, Volodarski Str. 6,
220050 MINSK, Tel. +375 172 20 0733, Fax. +375 172 20 0773
Pakistan: see Singapore
Belgium: see The Netherlands
Brazil: see South America
Philippines: Philips Semiconductors Philippines Inc.,
106 Valero St. Salcedo Village, P.O. Box 2108 MCC, MAKATI,
Metro MANILA, Tel. +63 2 816 6380, Fax. +63 2 817 3474
Bulgaria: Philips Bulgaria Ltd., Energoproject, 15th floor,
51 James Bourchier Blvd., 1407 SOFIA,
Tel. +359 2 68 9211, Fax. +359 2 68 9102
Poland: Al.Jerozolimskie 195 B, 02-222 WARSAW,
Tel. +48 22 5710 000, Fax. +48 22 5710 001
Portugal: see Spain
Romania: see Italy
Canada: PHILIPS SEMICONDUCTORS/COMPONENTS,
Tel. +1 800 234 7381, Fax. +1 800 943 0087
China/Hong Kong: 501 Hong Kong Industrial Technology Centre,
72 Tat Chee Avenue, Kowloon Tong, HONG KONG,
Tel. +852 2319 7888, Fax. +852 2319 7700
Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,
Tel. +7 095 755 6918, Fax. +7 095 755 6919
Singapore: Lorong 1, Toa Payoh, SINGAPORE 319762,
Colombia: see South America
Czech Republic: see Austria
Tel. +65 350 2538, Fax. +65 251 6500
Slovakia: see Austria
Slovenia: see Italy
Denmark: Sydhavnsgade 23, 1780 COPENHAGEN V,
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South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,
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Finland: Sinikalliontie 3, FIN-02630 ESPOO,
Tel. +358 9 615 800, Fax. +358 9 6158 0920
France: 51 Rue Carnot, BP317, 92156 SURESNES Cedex,
Tel. +33 1 4099 6161, Fax. +33 1 4099 6427
South America: Al. Vicente Pinzon, 173, 6th floor,
04547-130 SÃO PAULO, SP, Brazil,
Tel. +55 11 821 2333, Fax. +55 11 821 2382
Germany: Hammerbrookstraße 69, D-20097 HAMBURG,
Tel. +49 40 2353 60, Fax. +49 40 2353 6300
Spain: Balmes 22, 08007 BARCELONA,
Tel. +34 93 301 6312, Fax. +34 93 301 4107
Hungary: see Austria
Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,
Tel. +46 8 5985 2000, Fax. +46 8 5985 2745
India: Philips INDIA Ltd, Band Box Building, 2nd floor,
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Tel. +91 22 493 8541, Fax. +91 22 493 0966
Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,
Tel. +41 1 488 2741 Fax. +41 1 488 3263
Indonesia: PT Philips Development Corporation, Semiconductors Division,
Gedung Philips, Jl. Buncit Raya Kav.99-100, JAKARTA 12510,
Tel. +62 21 794 0040 ext. 2501, Fax. +62 21 794 0080
Taiwan: Philips Semiconductors, 6F, No. 96, Chien Kuo N. Rd., Sec. 1,
TAIPEI, Taiwan Tel. +886 2 2134 2886, Fax. +886 2 2134 2874
Ireland: Newstead, Clonskeagh, DUBLIN 14,
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209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,
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TEL AVIV 61180, Tel. +972 3 645 0444, Fax. +972 3 649 1007
Turkey: Yukari Dudullu, Org. San. Blg., 2.Cad. Nr. 28 81260 Umraniye,
ISTANBUL, Tel. +90 216 522 1500, Fax. +90 216 522 1813
Italy: PHILIPS SEMICONDUCTORS, Via Casati, 23 - 20052 MONZA (MI),
Tel. +39 039 203 6838, Fax +39 039 203 6800
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252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461
Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku,
TOKYO 108-8507, Tel. +81 3 3740 5130, Fax. +81 3 3740 5057
United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,
MIDDLESEX UB3 5BX, Tel. +44 208 730 5000, Fax. +44 208 754 8421
Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,
Tel. +82 2 709 1412, Fax. +82 2 709 1415
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Tel. +1 800 234 7381, Fax. +1 800 943 0087
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,
Tel. +60 3 750 5214, Fax. +60 3 757 4880
Uruguay: see South America
Vietnam: see Singapore
Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,
Tel. +9-5 800 234 7381, Fax +9-5 800 943 0087
Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,
Middle East: see Italy
Tel. +381 11 62 5344, Fax.+381 11 63 5777
For all other countries apply to: Philips Semiconductors,
Internet: http://www.semiconductors.philips.com
International Marketing & Sales Communications, Building BE-p, P.O. Box 218,
5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825
68
SCA
© Philips Electronics N.V. 1999
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
545006/01/pp20
Date of release: 1999 Oct 05
Document order number: 9397 750 06164
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