SAA8116HL [NXP]
Digital PC-camera signal processor, microcontroller andUSB interface; 数字PC的相机信号处理器，微控制器andUSB接口
| 型号： | SAA8116HL |
| 厂家： | 
NXP |
| 描述： | Digital PC-camera signal processor, microcontroller andUSB interface |
| 文件： | 总20页 (文件大小：109K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
SAA8116HL
Digital PC-camera signal
processor, microcontroller and USB
interface
Objective specification
2000 Apr 13
File under Integrated Circuits, IC22
Philips Semiconductors
Objective specification
Digital PC-camera signal processor,
microcontroller and USB interface
SAA8116HL
FEATURES
• High precision digital processing with 10-bit input
• Embedded microcontroller (80C51 core based) for
control loops Auto Optical Black (AOB), Auto White
Balance (AWB), Auto Exposure (AE) and USB interface
control
• Compliant for VGA CCD and VGA CMOS sensors
(RGB Bayer)
• USB 1.1 compliant core
• RGB processing
APPLICATIONS
• Optical black processing
• USB PC-camera (video and audio).
• Defect pixel concealment
• Programmable colour matrix
• RGB to YUV transform
GENERAL DESCRIPTION
The SAA8116HL is a highly integrated third generation of
USB PC-camera ICs. It is the successor of the
SAA8112HL and SAA8115HL. It processes the digitized
sensor data and converts it to a high quality, compressed
YUV signal. Together with the audio signal, this video
signal is then properly formatted in USB packets.
• Programmable gamma correction (including knee)
• Programmable edge enhancement
• Video formatter with SIF/QSIF downscaler
• Compression engine
• Flexible Measurement Engine (ME) with up to eight
In addition, an 80C51 microcontroller derivative with five
I/O ports, I2C-bus, 512 bytes of RAM and 32 kbytes of
program memory is embedded in the SAA8116HL. The
microcontroller is used in combination with the
programmable statistical measurement capabilities to
provide advanced AE, AWB and AOB. The microcontroller
is also used to control the USB interface.
measurements per frame
• Internal Pulse Pattern Generator (PPG) for wide range
of VGA CCDs (Sony, Sharp and Panasonic) and frame
rate selection
• Programmable H and V timings for the support of
CMOS sensors
• Programmable output pulse for switched mode power
supply of the sensor
• 3-wire interface to control the TDA8787A: Correlated
Double Sampling (CDS) circuit, Automatic Gain Control
(AGC) circuit and 10-bit ADC
• Analog microphone/audio input to USB: Low DropOut
(LDO) supply filter, microphone supply, low noise
amplifier, programmable amplifier, PLL and ADC
• Integrated analog USB driver (ATX)
• Integrated main oscillator including a clock PLL to
increase the crystal frequency (from 12 to 48 MHz)
• USB 1.1 compliant bus-powered USB device with
integrated power management and POR circuit.
2000 Apr 13
2
Philips Semiconductors
Objective specification
Digital PC-camera signal processor,
microcontroller and USB interface
SAA8116HL
QUICK REFERENCE DATA
Measured over full voltage and temperature range: VDD = 3.3 V ±10% and Tamb = 0 to 70 °C; unless otherwise stated.
SYMBOL
VDD
IDD(tot)
Vi
PARAMETER
supply voltage
CONDITIONS
MIN.
3.0
TYP. MAX. UNIT
3.3
3.6
tbf
V
total supply current
input voltage
VDD = 3.6 V; Tamb = 70 °C
−
−
mA
V
3.0 V < VDD < 3.6 V
low voltage TTL
compatible
Vo
output voltage
3.0 V < VDD < 3.6 V
low voltage TTL
compatible
V
f(i)xtal
δ
crystal input frequency
crystal frequency duty factor
total power dissipation
storage temperature
−
12
50
−
−
MHz
%
−
−
Ptot
Tstg
Tamb
Tj
VDD = 3.3 V; Tamb = 25 °C
−
300
mW
−55
0
−
+150 °C
ambient temperature
junction temperature
25
−
70
°C
°C
Tamb = 70 °C
−
125
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
SAA8116HL
LQFP100
plastic low profile quad flat package; 100 leads;
SOT407-1
body 14 × 14 × 1.4 mm
2000 Apr 13
3
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FV3, FV4
FV1, FV2 FH1, FH2
ROG
RG
BCP, DCP
SMP RESERVED1
RESERVED2, RESERVED3
H
V
ASCLK PCLK
10
CRST FS, FCDS
95
96
9
1, 2 3, 98 91, 92 93 97 92
5, 6 23, 24 94
64
83, 84
VSP
ANALOG MODULES
57
58
59
LDOIN
LDO
SUPPLY
FILTER
WINDOW TIMING AND
CONTROL REFERENCE TIMING
MODE
DECODER
PULSE PATTERN GENERATOR
LDOFIL
LDOOUT
11, 12,
13, 14,
15, 16,
17, 18,
19, 20
Y
MICROPHONE
SUPPLY
60
MICSUPPLY
PROCESSING
4 : 2 : 2
FORMATTER
PRE-
PROCESSING
RGB
RGB
PROCESSING
RGB TO
YUV
PXL9 to PXL0
RECONSTRUCTION
UV
AUDIO
LOW NOISE
AMPLIFIER
61
62
MICIN
PROCESSING
LNAOUT
25
27
26
STROBE
SDATA
SCLK
PRE-PROCESSING
MEASUREMENT ENGINE
INTERFACE
PROGRAMMABLE
AUDIO GAIN
63
PGAININ
AMPLIFIER
AUDIO PLL
AUDIO ADC
34
70
71
4
GPI1
GPI2
GPI3
VIDEO
FORMATTER
COMPRESSION
ENGINE
TRANSFER
BUFFER
AUDIO
DECIMATION
LED
85
74
73
89
XSEL
XIN
XOUT
FULLPOWER
SNAPRES
PRIVRES
SDA, SCL
OSCILLATOR
AND CPLL
28
29
33, 32
VFC
80C51
MICROCONTROLLER
54
49, 50
80
79
82
USB
INTERFACE
ATXDP
ATXDN
DELAYATT
EA
ALE, PSEN
ATX
48, 51, 47,
52, 46, 53,
45
86
69
AD14 to AD8
P0.7 to P0.0
SAA8116HL
PSEL
POWER
MANAGEMENT
39, 38, 40,
37, 41, 35,
42, 36
POR
PORE
2
3
2
6
8
8, 31, 44, 77,
88, 100, 55, 22
7, 30, 43,
76, 87, 99
72, 81
75, 78, 68
56, 21
FCE673
V
V
V
DD1
to
AGND1 to
AGND3
GND1 to
GND8
DDA1,
DDD1,
V
V
V
DDA2
DDD2
DD6
Fig.1 Block diagram.
Philips Semiconductors
Objective specification
Digital PC-camera signal processor,
microcontroller and USB interface
SAA8116HL
PINNING
PIN
SYMBOL
TYPE(1)
DESCRIPTION
vertical CCD transfer pulse output
1
FV1
FV2
O
O
O
O
O
O
P
P
I
2
vertical CCD transfer pulse output
vertical CCD transfer pulse output
output to drive LED
3
FV3
4
LED
5
FS
data sample-and-hold pulse output to TDA8787A (SHD)
preset sample-and-hold pulse output to TDA8787A (SHP)
supply voltage 1 for output buffers
ground 1 for output buffers
6
FCDS
VDD1
7
8
GND1
PCLK
ASCLK
PXL9
PXL8
PXL7
PXL6
PXL5
PXL4
PXL3
PXL2
PXL1
PXL0
VDDD2
GND8
BCP
9
pixel input clock
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
O
I
clock1 (pixel clock) or clock2 (2 × pixel clock) output for ADC or CMOS sensor
pixel data input; bit 9
I
pixel data input; bit 8
I
pixel data input; bit 7
I
pixel data input; bit 6
I
pixel data input; bit 5
I
pixel data input; bit 4
I
pixel data input; bit 3
I
pixel data input; bit 2
I
pixel data input; bit 1
I
pixel data input; bit 0
P
P
O
O
O
supply voltage 2 for the digital core
ground 8 for input buffers and predrivers
optical black clamp pulse output to TDA8787A
dummy clamp pulse output to TDA8787A
DCP
STROBE
strobe signal output to TDA8787A or general purpose output of the
microcontroller
26
27
28
29
30
31
32
33
34
35
36
37
38
39
SCLK
SDATA
SNAPRES
PRIVRES
VDD2
O
O
serial clock output to TDA8787A or general purpose output of the microcontroller
serial data output to TDA8787A or general purpose output of the microcontroller
snapshot input or remote wake-up trigger input (programmable)
privacy shutter input or remote wake-up trigger input (programmable)
supply voltage 2 for input buffers and predrivers
I
I
P
GND2
SCL
P
ground 2 for input buffers and predrivers
I2C-bus clock input/output (master/slave)
I2C-bus data input/output (master/slave)
I/O
I/O
I
SDA
GPI1
general purpose input 1 (Port 4; bit 6)
P0.2
I/O
I/O
I/O
I/O
I/O
microcontroller Port 0 bidirectional (data - address); bit 2
microcontroller Port 0 bidirectional (data - address); bit 0
microcontroller Port 0 bidirectional (data - address); bit 4
microcontroller Port 0 bidirectional (data - address); bit 6
microcontroller Port 0 bidirectional (data - address); bit 7
P0.0
P0.4
P0.6
P0.7
2000 Apr 13
5
Philips Semiconductors
Objective specification
Digital PC-camera signal processor,
microcontroller and USB interface
SAA8116HL
PIN
SYMBOL
TYPE(1)
DESCRIPTION
40
41
42
43
44
45
46
47
48
49
50
51
52
53
54
55
56
57
58
59
P0.5
P0.3
I/O
I/O
I/O
P
microcontroller Port 0 bidirectional (data - address); bit 5
microcontroller Port 0 bidirectional (data - address); bit 3
microcontroller Port 0 bidirectional (data - address); bit 1
supply voltage 3 for output buffers
P0.1
VDD3
GND3
AD8
P
ground 3 for output buffers
O
O
O
O
O
O
O
O
O
I
microcontroller Port 2 output (address); bit 0
microcontroller Port 2 output (address); bit 2
microcontroller Port 2 output (address); bit 4
microcontroller Port 2 output (address); bit 6
address latch enable output for external latch
AD10
AD12
AD14
ALE
PSEN
AD13
AD11
AD9
program store enable output for external memory (active LOW)
microcontroller Port 2 output (address); bit 5
microcontroller Port 2 output (address); bit 3
microcontroller Port 2 output (address); bit 1
external access select input - internal or external program memory (active LOW)
ground 7 for input buffers and predrivers
EA
GND7
VDDD1
LDOIN
LDOFIL
LDOOUT
P
P
supply voltage 1 for the digital core
P
analog supply voltage for LDO supply filter
−
external capacitor connection (filter of LDO)
−
external capacitor connection (internal analog supply voltage for PLL, amplifier
and ADC)
60
61
62
63
64
65
66
67
68
69
70
71
72
73
74
75
76
77
78
79
MICSUPPLY
MICIN
O
I
microphone supply output
microphone input
LNAOUT
PGAININ
RESERVED1
REF1
O
I
low noise amplifier output
programmable gain amplifier input
test pin 1 (should not be used)
O
I
reference voltage 1 (used in the amplifier and the ADC)
reference voltage 2 (used in the ADC)
reference voltage 3 (used in the ADC)
analog ground 3 for PLL, amplifier and ADC
external Power-on reset (backup)
REF2
I
REF3
I
AGND3
PORE
P
I
GPI2
I
general purpose input 2 (Port 1; bit 4)
general purpose input 3 (Port 3; bit 5)
analog supply voltage 1 for crystal oscillator (12 MHz, fundamental)
oscillator output
GPI3
I
VDDA1
P
O
I
XOUT
XIN
oscillator input
AGND1
VDD4
P
P
P
P
I/O
analog ground 1 for crystal oscillator
supply voltage 4 for input buffers and predrivers
ground 4 for input buffers and predrivers
analog ground 2 for ATX transceiver
negative driver of the differential data pair input/output (ATX)
GND4
AGND2
ATXDN
2000 Apr 13
6
Philips Semiconductors
Objective specification
Digital PC-camera signal processor,
microcontroller and USB interface
SAA8116HL
PIN
SYMBOL
TYPE(1)
DESCRIPTION
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
ATXDP
VDDA2
I/O
P
O
I
positive driver of the differential data pair input/output (ATX)
analog supply voltage 2 for ATX transceiver
DELAYATT
RESERVED2
RESERVED3
XSEL
delay attached control output; connected with pull-up resistor on ATXDP (USB)
test pin 2 (should not be used)
I
test pin 3 (should not be used)
I
crystal selection input (backup)
PSEL
I
POR selection input (backup)
VDD5
P
P
O
O
O
O
O
O
O
I/O
O
O
P
P
supply voltage 5 for output buffers
ground 5 for output buffers
GND5
FULLPOWER
FH2
full power signal output (active LOW)
horizontal CCD transfer pulse output
horizontal CCD transfer pulse output
reset output for CCD output amplifier gate
vertical CCD load pulse output
FH1
RG
ROG
SMP
switch mode pulse output for CCD supply
horizontal synchronization pulse output
vertical synchronization pulse input/output
CCD charge reset output for shutter control
vertical CCD transfer pulse output
supply voltage 6 for output buffers
ground 6 for output buffers
H
V
CRST
FV4
VDD6
GND6
Note
1. I = input, O = output and P = power supply.
2000 Apr 13
7
Philips Semiconductors
Objective specification
Digital PC-camera signal processor,
microcontroller and USB interface
SAA8116HL
FV1
FV2
1
2
3
4
5
6
7
8
9
AGND1
75
74 XIN
73 XOUT
V
FV3
LED
FS
72
71
DDA1
GPI3
FCDS
70 GPI2
V
PORE
AGND3
REF3
69
68
67
CC1
GND1
PCLK
ASCLK 10
PXL9 11
PXL8 12
PXL7 13
PXL6 14
PXL5 15
PXL4 16
PXL3 17
PXL2 18
PXL1 19
PXL0 20
66 REF2
REF1
65
64
63
RESERVED1
PGAININ
SAA8116HL
62 LNAOUT
MICIN
61
60
59
MICSUPPLY
LDOOUT
58 LDOFIL
LDOIN
57
56
V
DDD1
V
21
55 GND7
54 EA
DDD2
GND8 22
BCP 23
AD9
53
52
DCP 24
AD11
STROBE 25
51 AD13
FCE674
Fig.2 Pin configuration.
8
2000 Apr 13
Philips Semiconductors
Objective specification
Digital PC-camera signal processor,
microcontroller and USB interface
SAA8116HL
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); note 1.
SYMBOL
PARAMETER
MIN.
−0.5
MAX.
+4.0
UNIT
VDD
Vn
supply voltage
V
voltage on
pins GND and AGND
all other pins
−0.5
−0.5
−55
0
+4.0
V
VDD + 0.5
V
Tstg
Tamb
Tj
storage temperature
ambient temperature
junction temperature
+150
70
°C
°C
°C
−40
+125
Note
1. Stress beyond these levels may cause permanent damage to the device.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
in free air
53
K/W
CHARACTERISTICS
VDD = VDDD = VDDA = 3.3 V ±10%; Tamb = 0 to 70 °C; unless otherwise stated.
SYMBOL
Supplies
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
VDD
supply voltage
3.0
3.0
3.0
−
3.3
3.3
3.3
−
3.6
3.6
3.6
75
V
V
V
VDDD
VDDA
IDDD(tot)
supply voltage for digital core
analog supply voltage
total digital supply current
VDD = VDDD = 3.3 V;
mA
Tamb = 25 °C
IDDA(tot)
total analog supply current
VDDA = 3.3 V; Tamb = 25 °C −
−
16
mA
Digital data and control inputs
VIL
VIH
LOW-level input voltage
HIGH-level input voltage
−
−
−
0.8
V
V
2
−
Digital data and control outputs
VOL
VOH
LOW-level output voltage
HIGH-level output voltage
0
−
−
0.1VDD
VDD
V
V
0.9VDD
LDO supply filter
Vref
VO
IO
reference voltage
at 0.5VDDA
−
1.50
3.0
5
−
V
output voltage on pin LDOUT
output current on pin LDOUT
VDDA = 3.0 V
−
−
−
V
10
mA
2000 Apr 13
9
Philips Semiconductors
Objective specification
Digital PC-camera signal processor,
microcontroller and USB interface
SAA8116HL
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Microphone supply
IDDA
Vref
VO
IO
supply current
reference voltage
−
−
−
−
0.85
1.2
mA
at 0.5VDDA
1.50
2.7
−
−
V
output voltage on pin MICSUPPLY VDDA = 3.0 V
output current on pin MICSUPPLY
−
V
2.0
mA
Audio low noise amplifier
TRANSFER FUNCTION
Ri
input resistance
3.5
−
5.0
0.85
30
−
kΩ
mA
dB
IDDA
A
supply current
1.2
32
amplification
28
−
THD
Vo(rms)
VOO
total harmonic distortion
output voltage (RMS value)
output offset voltage
note 1
−70
−
−60
800
1.0
dB
−
mV
mV
−
0.0
BIASING
Iref
reference current
−
10
−
µA
Programmable audio gain amplifier
TRANSFER FUNCTION
Ri
input resistance
supply current
7.0
−
10.5
0.45
1.0
14
25
kΩ
mA
mV
mV
dB
IDDA
VOO
0.6
2.0
30
output offset voltage
A = 0 dB
−
A = 30 dB
−
A
amplification
0.0
−
−
30
THD
total harmonic distortion
A = 0 dB; note 1
A = 30 dB; note 1
−83
−59
−78
−54
dB
−
dB
BIASING
Iref
reference current
−
10
−
µA
Audio phase-locked loop
fi(clk)
clock input frequency
−
−
−
−
−
−
48
−
−
−
−
−
−
MHz
MHz
MHz
MHz
kHz
fo(clk)
clock output frequency
note 2
8.19200
11.2996
12.2880
2.3
B
bandwidth
damping
ζ
0.98
Audio ADC (∑∆ converter)
INPUTS
fi
input signal frequency
input voltage (RMS value)
1
−
20
kHz
mV
Vi(rms)
−
800
−
2000 Apr 13
10
Philips Semiconductors
Objective specification
Digital PC-camera signal processor,
microcontroller and USB interface
SAA8116HL
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
TRANSFER FUNCTION
N
order of the ∑∆
number of output bits
−
−
−
−
−
−
−
3
1
−
−
−
−
Nbit
Nbit(eq)
DRi
fclk
equivalent output resolution (bit)
dynamic range at input
clock frequency
16
note 3
96.6
−
dB
5.6448 MHz
δ
clock frequency duty factor
total harmonic distortion
50
−
%
THD
−70
−55
dB
ATX transceiver full speed mode: pins ATXDP and ATXDN
DRIVER CHARACTERISTICS
tt(rise)
tt(fall)
tt(match)
Vcr
rise transition time
CL = 50 pF
CL = 50 pF
note 4
4
4
−
−
−
−
−
20
ns
ns
%
V
fall transition time
20
transition time matching
output signal crossover voltage
driver output impedance
90
1.3
30
110
2.0
42
Zo
steady state drive
Ω
RECEIVER CHARACTERISTICS
fi(D)
data input frequency rate
frame interval
−
−
12.00
1.000
−
−
Mbits/s
ms
tframe
Notes
1. The distortion is measured at HIGH level, 1 kHz and Vo = 800 mV (RMS).
2. Frequencies depend on PLL settings.
input voltage
3. Defined here as: 20 × log------------------------------------------------------------------------------
equivalent input noise voltage
t
4. Transition time matching: tt(match)
=
t(rise) × 100%
--------------
tf(fall)
2000 Apr 13
11
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EPROM
EEPROM
(optional)
12 MHz
PCLK
XSEL
ASCLK
PXL9 to PXL0
SDATA
LED
SNAPRES
PRIVRES
PORE
CCD
SENSOR
TDA8787A
SCLK
PSEL
SAA8116HL
DELAYATT
STROBE
ATXDP
ATXDN
USB
5V
BUS
V-DRIVER
FS, FCDS, DCP, BCP
FH1, FH2, RG, ROG
LDO
LDO
FV1, FV2, FV3, FV4, CRST
SMP
FCE675
3.3 V
3.3 V
Fig.3 CCD sensor application.
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EPROM
EEPROM
(optional)
12 MHz
XSEL
LED
SNAPRES
V
CMOS
SENSOR
PRIVRES
PORE
ASCLK
PCLK
PSEL
SAA8116HL
DELAYATT
PXL7 to PXL0
ATXDP
ATXDN
USB
5V
BUS
LDO
LDO
FCE676
3.3 V
3.3 V
Fig.4 CMOS sensor application.
Philips Semiconductors
Objective specification
Digital PC-camera signal processor,
microcontroller and USB interface
SAA8116HL
PACKAGE OUTLINE
LQFP100: plastic low profile quad flat package; 100 leads; body 14 x 14 x 1.4 mm
SOT407-1
y
X
A
51
75
50
26
(1)
76
Z
E
e
H
A
E
2
E
A
(A )
3
A
1
w M
p
θ
b
L
p
L
pin 1 index
detail X
100
1
25
Z
D
v
M
A
B
e
w M
b
p
D
B
H
v M
D
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
D
H
L
L
v
w
y
Z
Z
θ
1
2
3
p
E
p
D
E
max.
7o
0o
0.15 1.45
0.05 1.35
0.27 0.20 14.1 14.1
0.17 0.09 13.9 13.9
16.25 16.25
15.75 15.75
0.75
0.45
1.15 1.15
0.85 0.85
mm
1.6
0.25
0.5
1.0
0.2 0.08 0.08
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
00-01-19
00-02-01
SOT407-1
136E20
MS-026
2000 Apr 13
14
Philips Semiconductors
Objective specification
Digital PC-camera signal processor,
microcontroller and USB interface
SAA8116HL
SOLDERING
If wave soldering is used the following conditions must be
observed for optimal results:
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering is not always suitable
for surface mount ICs, or for printed-circuit boards with
high population densities. In these situations reflow
soldering is often used.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
infrared/convection heating in a conveyor type oven.
Throughput times (preheating, soldering and cooling) vary
between 100 and 200 seconds depending on heating
method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 230 °C.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Wave soldering
Manual soldering
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
2000 Apr 13
15
Philips Semiconductors
Objective specification
Digital PC-camera signal processor,
microcontroller and USB interface
SAA8116HL
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE
WAVE
REFLOW(1)
BGA, SQFP
not suitable
suitable
suitable
suitable
suitable
suitable
HLQFP, HSQFP, HSOP, HTSSOP, SMS not suitable(2)
PLCC(3), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
not recommended(3)(4)
not recommended(5)
Notes
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink
(at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version).
3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8 mm;
it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2000 Apr 13
16
Philips Semiconductors
Objective specification
Digital PC-camera signal processor,
microcontroller and USB interface
SAA8116HL
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
PURCHASE OF PHILIPS I2C COMPONENTS
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the
components in the I2C system provided the system conforms to the I2C specification defined by
Philips. This specification can be ordered using the code 9398 393 40011.
2000 Apr 13
17
Philips Semiconductors
Objective specification
Digital PC-camera signal processor,
microcontroller and USB interface
SAA8116HL
NOTES
2000 Apr 13
18
Philips Semiconductors
Objective specification
Digital PC-camera signal processor,
microcontroller and USB interface
SAA8116HL
NOTES
2000 Apr 13
19
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69
SCA
© Philips Electronics N.V. 2000
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
753505/01/pp20
Date of release: 2000 Apr 13
Document order number: 9397 750 06807
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