SSL21082T [NXP]

GreenChip drivers for LED lighting; 绿色芯片驱动LED照明
SSL21082T
型号: SSL21082T
厂家: NXP    NXP
描述:

GreenChip drivers for LED lighting
绿色芯片驱动LED照明

驱动
文件: 总24页 (文件大小:813K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
SSL21081T/2T/3T/4T  
GreenChip drivers for LED lighting  
Rev. 2 — 6 December 2011  
Preliminary data sheet  
1. General description  
The SSL2108X is a range of high-voltage Integrated Circuits (ICs), intended to drive LED  
lamps in general lighting applications.  
The main benefits of the product family are:  
Small Printed-Circuit Board (PCB) footprint, and compact solution  
High efficiency (up to 95 %)  
Ease of integration  
Low electronic Bill Of Material (BOM)  
The product family is made of ICs with a range of internal HV switches for easy power  
scaling.  
The ICs work as boundary conduction mode converters, typically in buck configuration.  
The IC range has been designed to start up directly from the HV supply by an internal  
high-voltage current source. Thereafter, the dV/dt supply is used with capacitive coupling  
from the drain, or any other auxiliary supply. This functionality provides full flexibility in the  
application design. The IC consumes 1.3 mA of supply current with an internal clamp  
limiting the supply voltage.  
The ICs provide accurate output current control with LED current accuracy within 5%. The  
ICs can be operated using Pulse-Width Modulation (PWM) dimming and has many  
protection features including easy LED temperature feedback.  
2. Features and benefits  
LED driver IC family driving strings of LEDs from a rectified mains supply  
High-efficiency switch mode buck driver product family:  
Drivers with integrated 300 V (SSL21081 and SSL21082) or 600 V (SSL21083 and  
SSL21084) power switches  
Controller with power-efficient boundary conduction mode of operation with:  
No reverse recovery losses in freewheel diode  
Zero Current Switching (ZCS) for turn-on of switch  
Zero voltage or valley switching for turn-on of switch  
Minimal required inductance value and size  
Direct PWM dimming possible  
Fast transient response through cycle-by-cycle current control:  
Negligible AC mains ripple at LED current and minimal total capacitor value  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
No over or undershoots in the LED current  
No binning on LED forward voltage required  
Internal Protections:  
UnderVoltage LockOut (UVLO)  
Leading-Edge Blanking (LEB)  
OverCurrent Protection (OCP)  
Short-Winding Protection (SWP)  
Internal OverTemperature Protection (OTP)  
Brownout protection  
Output Short Protection (OSP)  
Low component count (see Figure 4) LED driver solution:  
No Schottky diode required due to ZCS  
No dim switch and high-side driver required for PWM dimming  
Easy external temperature protection with a single NTC resistor  
Option for soft-start function  
Compatible with wall switches with built-in indication light during standby1  
IC lifetime easily matches or surpasses LED lamp lifetime  
3. Applications  
SSL2108X products are intended for compact LED lighting applications with accurate  
fixed current output for single mains input voltages. Mains input voltages include 100 V,  
120 V and 230 V (AC). The output signal can be modulated using a PWM signal.  
4. Quick reference data  
Table 1.  
Quick reference data  
Symbol  
VCC  
Parameter  
Conditions  
Min  
8.0  
4.0  
Typ  
-
Max  
15.5  
6.0  
Unit  
V
supply voltage  
RDSon  
drain-source on-state  
resistance  
SSL21083T,  
SSL21084T,  
TJ = 25 C  
5.0  
SSL21083T,  
SSL21084T,  
TJ = 125 C  
6.0  
7.5  
2.3  
3.45  
-
9.0  
SSL21081T,  
SSL21082T,  
TJ = 25 C  
2.05  
3.05  
25  
2.55  
3.8  
SSL21081T,  
SSL21082T,  
TJ = 125 C  
fconv  
conversion frequency  
200  
kHz  
1. The Hotaru switch is a well known wall switch with built-in light  
SSL21081T_2T_3T_4T  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Preliminary data sheet  
Rev. 2 — 6 December 2011  
2 of 24  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
Table 1.  
Quick reference data …continued  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
IDRAIN  
current on pin DRAIN  
SSL21083T,  
SSL21084T  
1  
-
1
A
SSL21081T,  
SSL21082T  
2  
-
-
-
-
-
2
A
VDRAIN  
voltage on pin DRAIN  
high on-time  
SSL21083T,  
SSL21084T  
600  
300  
17.5  
V
SSL21081T,  
SSL21082T  
-
V
ton(high)  
-
s  
5. Ordering information  
Table 2.  
Ordering information  
Type number Package  
Name  
Description  
Version  
SSL21081T  
SSL21083T  
SO8  
plastic small package outline body; 8 leads; body width SOT96-1  
3.9 mm  
SSL21082T  
SSL21084T  
SO12  
plastic small package outline body; 12 leads; body width SOT1196-1  
3.9 mm  
5.1 Ordering options  
Remark: All voltages unless otherwise specified are in V (AC).  
Table 3.  
Ordering options  
SSL2108X  
platform variants  
Input voltage  
Internal MOSFET Package  
characteristics  
Brownout  
protection  
selectable  
SSL21081T  
SSL21082T  
SSL21083T  
100 V; 120 V  
100 V; 120 V  
300 V; 2   
300 V; 2   
600 V; 5   
SO8  
SO12  
SO8  
no  
yes  
no  
100 V; 120 V;  
230 V  
SSL21084T  
100 V; 120 V;  
230 V  
600 V; 5   
SO12  
yes  
[1] The SO12 package variants have more so called fused leads than the SO8 variants and can be used when  
higher output power is required.  
SSL21081T_2T_3T_4T  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Preliminary data sheet  
Rev. 2 — 6 December 2011  
3 of 24  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
6. Block diagram  
1 (1)  
3 (4)  
HV  
JFET  
5 (9)  
dV/dT  
DVDT  
SUPPLY  
SUPPLY:  
INTERNAL  
REGULATOR  
AND  
VCC  
BANDGAP  
8 (12)  
(8)  
VALLEY  
DETECTION  
DRAIN  
LOGIC  
TOFFMAX  
TONMAX  
4 (5)  
NTC  
NTC  
FUNCTION  
TONMAX  
LOGIC  
CONTROL  
AND  
THERMAL  
SHUTDOWN  
BLANK  
2 (3)  
SOURCE  
PROTECTION  
POR  
1.5 V  
GND  
6, 7  
(2, 6, 7, 10, 11)  
0.5 V < >0.25 V  
001aan694  
Fig 1. Block diagram SSL2108X  
7. Pinning information  
7.1 Pinning  
1
12  
HV  
DRAIN  
1
2
3
4
8
7
6
5
HV  
DRAIN  
GND  
2
3
4
5
6
11  
10  
9
GND  
SOURCE  
VCC  
GND  
SOURCE  
VCC  
SSL2108X  
SSL2108X  
GND  
GND  
DVDT  
TONMAX  
GND  
NTC  
DVDT  
8
NTC  
001aan702  
7
GND  
001aan703  
Fig 2. Pin configuration for SSL2108X  
(SO8)  
Fig 3. Pin configuration for SSL2108X  
(SO12)  
SSL21081T_2T_3T_4T  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Preliminary data sheet  
Rev. 2 — 6 December 2011  
4 of 24  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
7.2 Pin description  
Table 4.  
Symbol  
Pin description  
Pin (SO8)  
SSL2108X  
Pin (SO12)  
SSL2108X  
Description  
HV  
1
1
high-voltage supply pin  
low-side internal switch  
supply voltage  
SOURCE  
VCC  
2
3
3
4
NTC  
4
5
LED temperature protection input  
ground  
GND  
6, 7  
5
2,6,7,10,11  
DVDT  
TONMAX  
DRAIN  
9
AC supply pin  
-
8
brownout protection timer input  
high-side internal switch  
8
12  
8. Functional description  
8.1 Converter operation  
The converter in the SSL2108X is a Boundary Conduction Mode (BCM), peak current  
controlled system. For the basic application diagram see Figure 4, for the waveforms see  
Figure 5. This converter type operates at the boundary between continuous and  
discontinuous mode. Energy is stored in inductor L each period that the switch is on. The  
inductor current IL is zero when the internal MOSFET switch is switched on. Thereafter,  
the amplitude of the current build-up in L is proportional to VIN VOUT and the time that the  
internal MOSFET switch is on. When the internal MOSFET switch is switched off, the  
current continues to flow through the freewheel diode and the output capacitor. The  
current then falls at a rate proportional to the value of VOUT. The LED current ILED is  
almost equal to half the peak switch current. A new cycle is started, as soon as the  
inductor current IL is zero.  
R
inrush  
V
sec  
LEDs  
L
DVDT  
DRAIN  
8
5
HV  
1
3
SSL2108X  
VCC  
6, 7  
GND  
4
2
NTC  
NTC  
SOURCE  
R
sense  
001aan693  
Fig 4. Basic application diagram SSL2108X (SO8 variant)  
SSL21081T_2T_3T_4T  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Preliminary data sheet  
Rev. 2 — 6 December 2011  
5 of 24  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
8.2 Conversion frequency  
The conversion frequency must be limited to below 200 kHz. Therefore, select an  
inductance value so that the conversion frequency is always within limits, given the supply  
voltage, LED voltage and component spread.  
8.3 Valley detection  
A new cycle is started when the primary switch is switched on (see Figure 5). Following  
time t1, when the peak current is detected on the SOURCE pin, the switch is turned off  
and the secondary stroke starts (3). When the secondary stroke is complete and the coil  
current at t3 equals zero, the drain voltage starts to oscillate around the VIN VOUT level.  
The amplitude equals VOUT. A special feature, called valley detection is an integrated part  
of the SSL2108X circuitry. Dedicated built-in circuitry connected to the DRAIN pin, senses  
when the voltage on the drain of the switch has reached its lowest value. The next cycle is  
then started and as a result the capacitive switching losses are reduced. A valley is  
detected and accepted if both the frequency of the oscillations and the voltage swing are  
within the range specified (fring and Vvrec(min)) for detection. If a valid valley is not  
detected, the secondary stroke is continued until the maximum off-time (toff(high)) is  
reached, then the next cycle is started.  
V
GATE  
internal MOSFET switch  
V
OUT  
V
D
V
IN  
valley  
0
magnetization  
demagnetization  
I
L
0
2
1
3
4
t
00  
t
0
t
t
2
t
3
1
T
001aan699  
Fig 5. Buck waveforms and valley detection  
8.4 Protections  
The IC has the following protections:  
UnderVoltage LockOut (UVLO)  
Leading-Edge Blanking (LEB)  
OverCurrent Protection (OCP)  
SSL21081T_2T_3T_4T  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Preliminary data sheet  
Rev. 2 — 6 December 2011  
6 of 24  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
Internal OverTemperature Protection (OTP)  
Brownout protection  
Short-Winding Protection (SWP)  
Output Short Protection (OSP)  
LED overtemperature control and protection  
The SWP and the OSP are latched protections. These protections cause the IC to halt  
until a reset (a result of power cycling) is executed. When Vcc drops lower than Vcc(rst), the  
IC resets the latch protection mode. The internal OTP and LED over temperature  
protections are safe-restart protections. The IC halts, causing VCC to fall lower than  
VCC(stop), and instigates start-up. Switching starts only when no fault condition exists.  
8.4.1 UnderVoltage LockOut (UVLO)  
When the voltage on the VCC pin drops lower than Vcc(stop), the IC stops switching. An  
attempt is then made to restart by supplying VCC from the HV pin voltage.  
8.4.2 Leading-Edge Blanking (LEB)  
To prevent false detection of the short-winding or overcurrent, a blanking time following  
switch-on is implemented. When the internal MOSFET switch turns on there can be a  
short current spike due to capacitive discharge of voltage over the drain and source.  
During the LEB time (tleb), the spike is disregarded.  
8.4.3 OverCurrent Protection (OCP)  
The SSL2108X contains a highly accurate peak current detector. It triggers when the  
voltage at the SOURCE pin reaches the peak-level Vth(ocp)SOURCE. The current through  
the switch is sensed using a resistor connected to the SOURCE pin. The sense circuit is  
activated following LEB time tleb. As the LED current is half the peak current (by design), it  
automatically provides protection for maximum LED current during operation. There is a  
propagation delay between overcurrent detection and the actual closure of the switch  
td(ocp-swoff). Due to the delay, the actual peak current is slightly higher than the OCP level  
set by the resistor in series to the SOURCE pin.  
8.4.4 OverTemperature Protection (OTP)  
When the internal OTP function is triggered at a certain IC temperature (Tth(act)otp), the  
converter stops operating. The OTP safe-restart protection and the IC restarts again with  
switching resuming when the IC temperature drops lower than Tth(rel)otp  
.
8.4.5 Brownout protection  
Brownout protection is designed to limit the lamp power when the input voltage drops  
close to the output voltage level. Since the input power has to remain constant, the input  
current would otherwise increase to a level that is too large for the input circuitry. For the  
SSL2108X, there is a maximum limit on the on-time of the switch ton(high). The rate of  
current rise in the coil during the on-phase is proportional to the difference between input  
voltage and output voltage. Therefore, the peak current cannot be reached before ton(high)  
and as a result the average output current to the LEDs is reduced.  
Using the SO12 package, the ton(high) can be lowered by connecting a capacitor to the  
TONMAX pin. The external capacitor is charged during the primary stroke with ITONMAX. If  
V
TONMAX level is reached before the ton(high) time, the switch is turned off and the  
SSL21081T_2T_3T_4T  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Preliminary data sheet  
Rev. 2 — 6 December 2011  
7 of 24  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
secondary stroke starts. When no capacitor is connected to the pin, VTONMAX is reached  
quickly, shorter than the minimum limit of one microsecond. In this case, or in case the  
TONMAX pin is grounded, the internal time constant, ton(high) determines the maximum  
on-time.  
8.4.6 Short-Winding Protection (SWP)  
SWP activates if there is a steep rising current through the MOSFET and thus through the  
external resistor connected to the SOURCE pin. This current can occur when there is a  
short from the freewheel diode. Additionally, it occurs due to a small/shorted inductor  
between the input voltage and the DRAIN pin. If the voltage on the SOURCE pin is greater  
than 1.5 V, latched protection is triggered following LEB time tleb. In addition, if Vcc drops  
lower than VCC(rst) the IC resets the latched protection mode.  
8.4.7 Output Short Protection (OSP)  
During the second stroke (switch-of time), if a valley is not detected within the off-time limit  
(toff(high)), then typically the output voltage is less than the minimum limit allowed in the  
application. This condition can occur either during starting up or due to a short. A timer is  
started when toff(high) is detected, and is stopped only if a valid valley-detection occurs in  
one of the subsequent cycles. If no valley is detected for tdet(sc), it is concluded that a real  
short-circuit exists and not start-up. The IC enters latched protection. If Vcc drops lower  
than VCC(rst), the IC resets the latched protection mode. During PWM dimming, the OSP  
timer is paused during the off-cycle of the PWM signal.  
8.5 VCC supply  
The SSL2108X can be supplied using three methods:  
Under normal operation, the voltage swing on the DVDT pin is rectified within the IC  
providing current towards the VCC pin  
At start-up, there is an internal current source connected to the HV pin. The current  
source provides internal power until either the dV/dt supply or an external current on  
the VCC pin provides the supply  
An external voltage source can be connected to the VCC pin  
The IC starts up when the voltage at the VCC pin is higher than VCC(startup). The IC locks  
out (stops switching) when the voltage at the VCC pin is lower than VCC(stop). The  
hysteresis between the start and stop levels allows the IC to be supplied by a buffer  
capacitor until the dV/dt supply is settled. The SSL2108X has an internal Vcc clamp, which  
is an internal active Zener (or shunt regulator). This internal active Zener limits the voltage  
on the supply VCC pin to the maximum value of Vcc. If the maximum current of the dV/dt  
supply minus the current consumption of the IC (determined by the load on the gate  
drivers), is lower than the maximum value of IDD no external Zener diode is needed in the  
dV/dt supply circuit.  
8.6 DVDT supply  
The DVDT pin is connected to an internal single-sided rectification stage. When an  
alternating voltage with sufficient amplitude is supplied to the pin, the IC can be powered  
without any other external power connection. This solution provides an effective method  
SSL21081T_2T_3T_4T  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Preliminary data sheet  
Rev. 2 — 6 December 2011  
8 of 24  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
to prevent the additional high-power losses, which would result if a regulator were used for  
continuously powering the IC. Unlike an auxiliary supply, additional inductor windings are  
not needed.  
8.7 VCC regulator  
During supply dips, the input voltage can drop too low to supply the required IC current  
through the DVDT pin. Under these conditions, if the VCC voltage drops lower than  
V
CC(swon)reg level, another regulator with a current capability of up to IHVhigh(oper) is started.  
The job of the regulator is to fill in the required supply current, which the DVDT supply  
does not deliver, thus preventing the IC going into UVLO. When the VCC voltage is higher  
than VCC(swon)reg level, the regulator is turned off.  
8.8 NTC functionality and PWM dimming  
The NTC pin can be used as a control method for LED thermal protection. Alternatively,  
the pin can be used as an input to disable/enable light output using a digital signal (PWM  
dimming). The pin has an internal current source that generates the current of Ioffset(NTC)  
An NTC resistor to monitor the LED temperature can be directly connected to the NTC  
pin. Depending on the resistance value and the corresponding voltage on the NTC pin,  
the converter reacts as shown in Figure 6.  
.
Peak Current  
Ip  
Vth(ocp)SOURCE = 500 mV  
Vth(ocp)SOURCE = 250 mV  
Ip / 2  
1
2
3
4
5
V
NTC  
001aan700  
Fig 6. NTC control curve  
When the voltage on the NTC pin is higher than Vth(high)NTC see Figure 6 (4), the converter  
delivers nominal output current. When the voltage is lower than this level, the peak current  
is gradually reduced until Vth(low)NTC is reached, see Figure 6 (3). The peak current is now  
half the peak current of nominal operation. When Vact(tmr)NTC is passed, see Figure 6 (2) a  
timer starts to run to distinguish between the following situations:  
If the low-level Vdeact(tmr)NTC is not reached within time tto(deact)NTC, Figure 6 (1) LED  
overtemperature is detected. The IC stops switching and attempts to restart from the  
HV pin voltage. Restart takes place when the voltage on NTC pin is higher than  
V
th(high)NTC, see Figure 6 (4). It is assumed that the reduction in peak current did not  
result in a lower NTC temperature and LED OTP is activated.  
SSL21081T_2T_3T_4T  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Preliminary data sheet  
Rev. 2 — 6 December 2011  
9 of 24  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
If the low-level Vdeact(tmr)NTC is reached within the time tto(deact)NTC, Figure 6 (1) it is  
assumed that the pin is pulled down externally. The restart function is not triggered.  
Instead, the output current is reduced to zero. PWM dimming can be implemented this  
way. The output current rises again when the voltage is higher than Vdeact(tmr)NTC  
.
8.8.1 Soft-start function  
The NTC pin can be used to make a soft start function. During switch-on, the level on the  
NTC pin is low. By connecting a capacitor (in parallel with the NTC resistor), a time  
constant can be defined. The time constant causes the level on the NTC pin to increase  
slowly. When passing level Vth(low)NTC Figure 6 (3), the convertor starts with half of the  
maximum current. The output current slowly increases to maximum when Vth(high)NTC  
Figure 6 (4) is reached.  
8.9 Heat sink  
For SSL2108X (SO12) applications, the copper of the PCB acts as the heat sink. The  
SSL2108X (SO12) uses thermal leads (pins 2, 6, 10 and 11) for enhanced heat transfer  
from die to the PCB copper heat sink. The thermal lead connection can drastically reduce  
thermal resistance.  
Equation 1 shows the relation between the maximum allowable power dissipation P and  
the thermal resistance from junction to ambient.  
Rthj a= TjmaxTamb  P  
(1)  
Where:  
Rth(j-a) = thermal resistance from junction to ambient  
Tj(max) = maximum junction temperature  
Tamb = ambient temperature  
P = power dissipation  
SSL21081T_2T_3T_4T  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Preliminary data sheet  
Rev. 2 — 6 December 2011  
10 of 24  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
9. Limiting values  
Table 5.  
Limiting values  
In accordance with the Absolute Maximum Rating System (IEC 60134).  
Symbol  
General  
SR  
Parameter  
Conditions  
Min  
Max  
Unit  
slew rate  
on pin DRAIN  
5  
25  
-
+5  
V/ns  
kHz  
W
fconv  
conversion frequency  
total power dissipation  
200  
0.6  
Ptot  
SO8 package  
SO12 package  
-
1
W
Tamb  
Tj  
ambient temperature  
junction temperature  
storage temperature  
40  
40  
55  
+125  
+150  
+150  
C  
C  
Tstg  
C  
Voltages  
VCC  
supply voltage  
continuous [3]  
600 V version  
300 V version  
current limited  
current limited  
current limited  
current limited  
0.4  
0.4  
0.4  
0.4  
0.4  
0.4  
0.4  
+14  
V
V
V
V
V
V
V
VDRAIN  
voltage on pin DRAIN  
+600  
+300  
+600  
+5.2  
+5.2  
+5.2  
VHV  
voltage on pin HV  
VSENSE  
VNTC  
voltage on pin SENSE  
voltage on pin NTC  
voltage on pin TONMAX  
VTONMAX  
Currents  
IDD  
supply current  
at pin VCC [3]  
600 V version  
300 V version  
600 V version  
300 V version  
-
20  
1
mA  
A
IDRAIN  
current on pin DRAIN  
1  
2  
1  
2  
-
2
A
ISOURCE  
current on pin SOURCE  
current on pin DVDT  
1
A
2
A
IDVDT  
VESD  
1.3  
+2.0  
A
[1]  
electrostatic discharge  
voltage  
human body  
model; (for all pins  
except DRAIN and  
HV)  
2.0  
KV  
human body  
model for DRAIN  
and HV  
-1.0  
+1.0  
KV  
V
[2]  
charged device  
500  
+500  
[1] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 kseries resistor.  
[2] Charged device model: equivalent to charging the IC up to 1 kV and the subsequent discharging of each  
pin down to 0 V over a 1 resistor.  
[3] An internal clamp sets the supply voltage and current limits.  
SSL21081T_2T_3T_4T  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Preliminary data sheet  
Rev. 2 — 6 December 2011  
11 of 24  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
10. Thermal characteristics  
Table 6.  
Symbol  
Rth(j-a)  
Thermal characteristics  
Parameter  
thermal resistance from junction in free air; SO8  
Conditions  
Typ  
Unit  
152  
K/W  
to ambient  
package, PCB:  
2 cm 3 cm, 2-layer,  
35 m Cu per layer  
in free air; SO12  
package, PCB: 2  
cm 3 cm, 2-layer, 35  
m Cu per layer  
121  
K/W  
11. Characteristics  
Table 7.  
Symbol  
Characteristics  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
High-voltage  
Ileak(DRAIN)  
leakage current on pin DRAIN  
leakage current on pin HV  
VDRAIN = 600 V  
-
-
-
-
-
-
-
-
10  
10  
30  
30  
A  
A  
A  
A  
V
DRAIN = 300 V  
Ileak(HV)  
VHV = 600 V  
VHV = 300 V  
Supply  
VCC(startup)  
start-up supply voltage  
stop supply voltage  
11  
12  
13  
10  
-
V
V
V
V
V
V
V
V
VCC(stop)  
8
9
VCC(hys)  
hysteresis of supply voltage  
reset supply voltage  
between VCC(startup)  
and VCC(stop)  
2.0  
4.5  
8.75  
9.5  
0.3  
0.3  
-
VCC(rst)  
5
5.5  
9.75  
10.5  
-
VCC(swon)reg  
VCC(swoff)reg  
VCC(reg)hys  
regulator switch-on supply  
voltage  
insufficient dV/dt  
supply  
9.25  
regulator switch-off supply  
voltage  
insufficient dV/dt  
supply  
10  
-
regulator supply voltage  
hysteresis  
VCC(swoff)reg VCC(s  
won)reg  
VCC(regswon-stop) supply voltage difference  
between regulator switch-on and  
stop  
VCC(swon)reg VCC(st  
op)  
-
-
Consumption  
Istb(HV)  
standby current on pin HV  
supply current  
during start-up or in  
protection;  
VHV = 100 V  
300  
-
350  
1.3  
400  
-
A  
ICC  
normal operation  
mA  
SSL21081T_2T_3T_4T  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Preliminary data sheet  
Rev. 2 — 6 December 2011  
12 of 24  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
Table 7.  
Characteristics …continued  
Symbol  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
Capability  
Isup(high)HV  
high supply current on pin HV  
Standby:  
1
1.3  
1.6  
mA  
VHV = 40 V;  
VCC < VCC(stop)  
Regulator On:  
2
2.3  
2.6  
mA  
V
HV = 40 V; VCC <  
VCC(swon)reg after  
start-up  
Current and SWP  
Vth(ocp)SOURCE overcurrent protection threshold V/t = 0.1 V/s  
480  
230  
-
500  
250  
75  
520  
270  
100  
340  
290  
-
mV  
mV  
ns  
voltage on pin SOURCE  
V/t = 0.1 V/s  
VNTC = 0.325 V  
td(ocp-swoff)  
tleb  
delay time from overcurrent  
protection to switch-off  
V/t = 0.1 V/s  
leading edge blanking time  
overcurrent  
protection  
260  
210  
30  
300  
250  
50  
ns  
short-winding  
protection  
ns  
tleb  
leading edge blanking time  
difference  
between tleb for  
overcurrent  
ns  
protection and  
short-winding  
protection  
Vth(swp)SOURCE short-winding protection  
threshold voltage on pin  
SOURCE  
1.4  
1.5  
1.6  
V
Valley detection  
(V/t)vrec  
valley recognition voltage change on pin DRAIN  
with time  
30  
200  
15  
-
20  
550  
20  
10  
1000  
25  
V/s  
kHz  
V
fring  
ringing frequency  
Vvrec(min)  
td(vrec-swon)  
minimum valley recognition  
voltage difference  
voltage drop on pin  
DRAIN  
valley recognition to switch-on  
delay time  
100  
-
ns  
Brownout detection  
Vth(TONMAX)  
threshold voltage on pin  
3.75  
4
4.25  
V
TONMAX  
Ioffset(TONMAX)  
ton(high)  
offset current on pin TONMAX  
high on-time  
37  
43  
48  
A  
s  
12.5  
15  
17.5  
MOSFET output stage  
VBR(DRAIN)  
breakdown voltage on pin DRAIN 600 V version;  
600  
300  
-
-
-
-
V
V
Tj > 0 C  
300 V version;  
Tj > 0 C  
SSL21081T_2T_3T_4T  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Preliminary data sheet  
Rev. 2 — 6 December 2011  
13 of 24  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
Table 7.  
Symbol  
RDSon  
Characteristics …continued  
Parameter  
Conditions  
Min  
Typ  
Max  
Unit  
drain-source on-state resistance 600 V version;  
4.0  
5.0  
6.0  
Tj = 25 C  
600 V version;  
Tj = 125 C  
6.0  
2.05  
3.05  
-
7.5  
2.3  
3.45  
1.2  
9.0  
2.55  
3.85  
-
300 V version;  
Tj = 25 C  
300 V version;  
Tj = 125 C  
[1]  
dV/dt(DRAIN)  
fall rate of change of voltage on  
pin DRAIN  
300 V version;  
V/ns  
CDRAIN = 150 pF,  
RSOURCE = 2.2   
600 V version;  
CDRAIN = 75 pF,  
RSOURCE = 1.2   
-
1.5  
-
V/ns  
NTC functionality  
Vth(high)NTC  
high threshold voltage on pin  
0.47  
0.5  
0.53  
V
NTC  
Vth(low)NTC  
Vact(tmr)NTC  
low threshold voltage on pin NTC  
0.325  
0.27  
0.35  
0.3  
0.375  
0.325  
V
V
timer activation voltage on pin  
NTC  
Vdeact(tmr)NTC  
tto(deact)NTC  
timer deactivation voltage on pin  
NTC  
0.15  
32  
0.2  
44  
0.25  
56  
V
deactivation time-out time on pin  
NTC  
s  
A  
Ioffset(NTC)  
OSP  
offset current on pin NTC  
47  
tdet(sc)  
short-circuit detection time  
high off-time  
16  
30  
20  
36  
24  
42  
ms  
toff(high)  
s  
Temperature protections  
Tth(act)otp overtemperature protection  
160  
90  
170  
100  
180  
110  
C  
C  
activation threshold temperature  
Tth(rel)otp  
overtemperature protection  
release threshold temperature  
[1] This parameter is not tested during production, by design it is guaranteed.  
SSL21081T_2T_3T_4T  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Preliminary data sheet  
Rev. 2 — 6 December 2011  
14 of 24  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
12. SSL2108X buck configuration  
L1  
LED+  
fused resistor  
L1  
10 Ω  
D1  
to  
C1  
RGND  
mains  
C2  
C3  
LED1...n  
D2  
D3  
N
LED-  
L2  
IC1  
HV  
DRAIN  
GND  
1
2
3
4
8
7
6
5
R1  
SOURCE  
VCC  
SSL21081  
SSL21083  
C4  
GND  
NTC  
DVDT  
RT1  
NTC  
C5  
C6  
RGND  
001aan696  
Fig 7. Buck configuration for SSL21081/SSL21083  
L1  
LED+  
fused resistor  
L1  
10 Ω  
D1  
to  
C1  
RGND  
C2  
C3  
LED1...n  
mains  
D3  
D2  
N
LED-  
L2  
IC1  
HV  
DRAIN  
1
12  
GND  
GND  
GND  
DVDT  
2
3
4
5
6
11  
10  
9
C4  
R1  
SOURCE  
VCC  
SSL21082  
SSL21084  
NTC  
TONMAX  
GND  
8
GND  
RT1  
NTC  
7
C5  
C6  
C7  
RGND  
001aan697  
Fig 8. Buck configuration for SSL21082/SSL21084  
Further application information can be found in the SSL2108X application note.  
SSL21081T_2T_3T_4T  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Preliminary data sheet  
Rev. 2 — 6 December 2011  
15 of 24  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
13. Package outline  
SO8: plastic small outline package; 8 leads; body width 3.9 mm  
SOT96-1  
D
E
A
X
v
c
y
H
M
A
E
Z
5
8
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
4
e
w
M
detail X  
b
p
0
2.5  
5 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
(1)  
(1)  
(2)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
0.25  
0.10  
1.45  
1.25  
0.49  
0.36  
0.25  
0.19  
5.0  
4.8  
4.0  
3.8  
6.2  
5.8  
1.0  
0.4  
0.7  
0.6  
0.7  
0.3  
mm  
1.27  
0.05  
1.05  
0.041  
1.75  
0.25  
0.01  
0.25  
0.01  
0.25  
0.1  
8o  
0o  
0.010 0.057  
0.004 0.049  
0.019 0.0100 0.20  
0.014 0.0075 0.19  
0.16  
0.15  
0.244  
0.228  
0.039 0.028  
0.016 0.024  
0.028  
0.012  
inches 0.069  
0.01 0.004  
Notes  
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.  
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
JEITA  
99-12-27  
03-02-18  
SOT96-1  
076E03  
MS-012  
Fig 9. Package outline SOT96-1 (SOT8)  
SSL21081T_2T_3T_4T  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Preliminary data sheet  
Rev. 2 — 6 December 2011  
16 of 24  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
SO12: plastic small outline package; 12 leads; body width 3.9 mm  
SOT1196-1  
D
E
A
X
c
H
v
A
E
y
Z
12  
7
A
2
A
A
3
A
1
pin 1 index  
θ
L
p
L
1
6
e
e
2
1
w
detail X  
b
p
0
1
2
2
3
4
5 mm  
scale  
Dimensions  
Unit  
(1)  
(1)  
(2)  
A
A
1
A
2
A
b
c
D
E
e
1
e
H
L
L
p
Q
v
w
y
Z
θ
3
p
E
°
°
°
8
4
0
max 1.75 0.25 1.45  
0.49 0.25 8.75 4.0  
0.18 1.35 0.25 0.43 0.22 8.65 3.9 2.54 1.27 6.0 1.05 0.7 0.65 0.25 0.25 0.1 0.5  
0.10 1.25 0.36 0.10 8.55 3.8 5.8 0.4 0.60 0.3  
6.2  
1.0 0.70  
0.7  
mm nom  
min  
Note  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.  
sot1196-1_po  
References  
Outline  
version  
European  
projection  
Issue date  
IEC  
- - -  
JEDEC  
JEITA  
- - -  
11-02-15  
11-02-16  
SOT1196-1  
MS-012 Compliant  
Fig 10. Package outline SOT1196-1 (SOT12)  
SSL21081T_2T_3T_4T  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Preliminary data sheet  
Rev. 2 — 6 December 2011  
17 of 24  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
14. Abbreviations  
Table 8.  
Abbreviations  
Description  
Acronym  
BCM  
Boundary Conduction Mode  
Bill Of Materials  
BOM  
LED  
Light Emitting Diode  
Leading-Edge Blanking  
LEB  
MOSFET  
OCP  
Metal-Oxide Semiconductor Field-Effect Transistor  
OverCurrent Protection  
OSP  
Output Short Protection  
OTP  
OverTemperature Protection  
Printed-Circuit Board  
PCB  
PWM  
SWP  
UVLO  
ZCS  
Pulse-Width Modulation  
Short-Winding Protection  
UnderVoltage LockOut  
Zero Current Switching  
15. References  
[1] SSL2108X Drivers for LED lighting - application note  
SSL21081T_2T_3T_4T  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Preliminary data sheet  
Rev. 2 — 6 December 2011  
18 of 24  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
16. Revision history  
Table 9.  
Revision history  
Document ID  
Release date  
Data sheet status  
Change notice  
Supersedes  
SSL21081T_2T_3T_4T v.2  
20111206  
Preliminary data sheet  
-
SSL2108X v.1  
SSL21081T_2T_3T_4T  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Preliminary data sheet  
Rev. 2 — 6 December 2011  
19 of 24  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
17. Legal information  
17.1 Data sheet status  
Document status[1][2]  
Product status[3]  
Development  
Definition  
Objective [short] data sheet  
This document contains data from the objective specification for product development.  
This document contains data from the preliminary specification.  
This document contains the product specification.  
Preliminary [short] data sheet Qualification  
Product [short] data sheet Production  
[1]  
[2]  
[3]  
Please consult the most recently issued document before initiating or completing a design.  
The term ‘short data sheet’ is explained in section “Definitions”.  
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status  
information is available on the Internet at URL http://www.nxp.com.  
malfunction of an NXP Semiconductors product can reasonably be expected  
17.2 Definitions  
to result in personal injury, death or severe property or environmental  
damage. NXP Semiconductors accepts no liability for inclusion and/or use of  
NXP Semiconductors products in such equipment or applications and  
therefore such inclusion and/or use is at the customer’s own risk.  
Draft — The document is a draft version only. The content is still under  
internal review and subject to formal approval, which may result in  
modifications or additions. NXP Semiconductors does not give any  
representations or warranties as to the accuracy or completeness of  
information included herein and shall have no liability for the consequences of  
use of such information.  
Applications — Applications that are described herein for any of these  
products are for illustrative purposes only. NXP Semiconductors makes no  
representation or warranty that such applications will be suitable for the  
specified use without further testing or modification.  
Short data sheet — A short data sheet is an extract from a full data sheet  
with the same product type number(s) and title. A short data sheet is intended  
for quick reference only and should not be relied upon to contain detailed and  
full information. For detailed and full information see the relevant full data  
sheet, which is available on request via the local NXP Semiconductors sales  
office. In case of any inconsistency or conflict with the short data sheet, the  
full data sheet shall prevail.  
Customers are responsible for the design and operation of their applications  
and products using NXP Semiconductors products, and NXP Semiconductors  
accepts no liability for any assistance with applications or customer product  
design. It is customer’s sole responsibility to determine whether the NXP  
Semiconductors product is suitable and fit for the customer’s applications and  
products planned, as well as for the planned application and use of  
customer’s third party customer(s). Customers should provide appropriate  
design and operating safeguards to minimize the risks associated with their  
applications and products.  
Product specification — The information and data provided in a Product  
data sheet shall define the specification of the product as agreed between  
NXP Semiconductors and its customer, unless NXP Semiconductors and  
customer have explicitly agreed otherwise in writing. In no event however,  
shall an agreement be valid in which the NXP Semiconductors product is  
deemed to offer functions and qualities beyond those described in the  
Product data sheet.  
NXP Semiconductors does not accept any liability related to any default,  
damage, costs or problem which is based on any weakness or default in the  
customer’s applications or products, or the application or use by customer’s  
third party customer(s). Customer is responsible for doing all necessary  
testing for the customer’s applications and products using NXP  
Semiconductors products in order to avoid a default of the applications and  
the products or of the application or use by customer’s third party  
customer(s). NXP does not accept any liability in this respect.  
17.3 Disclaimers  
Limiting values — Stress above one or more limiting values (as defined in  
the Absolute Maximum Ratings System of IEC 60134) will cause permanent  
damage to the device. Limiting values are stress ratings only and (proper)  
operation of the device at these or any other conditions above those given in  
the Recommended operating conditions section (if present) or the  
Characteristics sections of this document is not warranted. Constant or  
repeated exposure to limiting values will permanently and irreversibly affect  
the quality and reliability of the device.  
Limited warranty and liability — Information in this document is believed to  
be accurate and reliable. However, NXP Semiconductors does not give any  
representations or warranties, expressed or implied, as to the accuracy or  
completeness of such information and shall have no liability for the  
consequences of use of such information.  
In no event shall NXP Semiconductors be liable for any indirect, incidental,  
punitive, special or consequential damages (including - without limitation - lost  
profits, lost savings, business interruption, costs related to the removal or  
replacement of any products or rework charges) whether or not such  
damages are based on tort (including negligence), warranty, breach of  
contract or any other legal theory.  
Terms and conditions of commercial sale — NXP Semiconductors  
products are sold subject to the general terms and conditions of commercial  
sale, as published at http://www.nxp.com/profile/terms, unless otherwise  
agreed in a valid written individual agreement. In case an individual  
agreement is concluded only the terms and conditions of the respective  
agreement shall apply. NXP Semiconductors hereby expressly objects to  
applying the customer’s general terms and conditions with regard to the  
purchase of NXP Semiconductors products by customer.  
Notwithstanding any damages that customer might incur for any reason  
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards  
customer for the products described herein shall be limited in accordance  
with the Terms and conditions of commercial sale of NXP Semiconductors.  
Right to make changes — NXP Semiconductors reserves the right to make  
changes to information published in this document, including without  
limitation specifications and product descriptions, at any time and without  
notice. This document supersedes and replaces all information supplied prior  
to the publication hereof.  
No offer to sell or license — Nothing in this document may be interpreted or  
construed as an offer to sell products that is open for acceptance or the grant,  
conveyance or implication of any license under any copyrights, patents or  
other industrial or intellectual property rights.  
Export control — This document as well as the item(s) described herein  
may be subject to export control regulations. Export might require a prior  
authorization from competent authorities.  
Suitability for use — NXP Semiconductors products are not designed,  
authorized or warranted to be suitable for use in life support, life-critical or  
safety-critical systems or equipment, nor in applications where failure or  
SSL21081T_2T_3T_4T  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Preliminary data sheet  
Rev. 2 — 6 December 2011  
20 of 24  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
Quick reference data — The Quick reference data is an extract of the  
product data given in the Limiting values and Characteristics sections of this  
document, and as such is not complete, exhaustive or legally binding.  
product for such automotive applications, use and specifications, and (b)  
whenever customer uses the product for automotive applications beyond  
NXP Semiconductors’ specifications such use shall be solely at customer’s  
own risk, and (c) customer fully indemnifies NXP Semiconductors for any  
liability, damages or failed product claims resulting from customer design and  
use of the product for automotive applications beyond NXP Semiconductors’  
standard warranty and NXP Semiconductors’ product specifications.  
Non-automotive qualified products — Unless this data sheet expressly  
states that this specific NXP Semiconductors product is automotive qualified,  
the product is not suitable for automotive use. It is neither qualified nor tested  
in accordance with automotive testing or application requirements. NXP  
Semiconductors accepts no liability for inclusion and/or use of  
non-automotive qualified products in automotive equipment or applications.  
17.4 Trademarks  
Notice: All referenced brands, product names, service names and trademarks  
are the property of their respective owners.  
In the event that customer uses the product for design-in and use in  
automotive applications to automotive specifications and standards, customer  
(a) shall use the product without NXP Semiconductors’ warranty of the  
18. Contact information  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
SSL21081T_2T_3T_4T  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Preliminary data sheet  
Rev. 2 — 6 December 2011  
21 of 24  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
19. Tables  
Table 1. Quick reference data . . . . . . . . . . . . . . . . . . . . .2  
Table 2. Ordering information . . . . . . . . . . . . . . . . . . . . .3  
Table 3. Ordering options . . . . . . . . . . . . . . . . . . . . . . . .3  
Table 4. Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .5  
Table 5. Limiting values . . . . . . . . . . . . . . . . . . . . . . . .11  
Table 6. Thermal characteristics . . . . . . . . . . . . . . . . . .12  
Table 7. Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .12  
Table 8. Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .18  
Table 9. Revision history . . . . . . . . . . . . . . . . . . . . . . . .19  
continued >>  
SSL21081T_2T_3T_4T  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Preliminary data sheet  
Rev. 2 — 6 December 2011  
22 of 24  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
20. Figures  
Fig 1. Block diagram SSL2108X . . . . . . . . . . . . . . . . . . .4  
Fig 2. Pin configuration for SSL2108X (SO8) . . . . . . . . .4  
Fig 3. Pin configuration for SSL2108X (SO12) . . . . . . . .4  
Fig 4. Basic application diagram SSL2108X   
(SO8 variant) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .5  
Fig 5. Buck waveforms and valley detection . . . . . . . . . .6  
Fig 6. NTC control curve . . . . . . . . . . . . . . . . . . . . . . . . .9  
Fig 7. Buck configuration for SSL21081/SSL21083 . . .15  
Fig 8. Buck configuration for SSL21082/SSL21084 . . .15  
Fig 9. Package outline SOT96-1 (SOT8). . . . . . . . . . . .16  
Fig 10. Package outline SOT1196-1 (SOT12) . . . . . . . . .17  
continued >>  
SSL21081T_2T_3T_4T  
All information provided in this document is subject to legal disclaimers.  
© NXP B.V. 2011. All rights reserved.  
Preliminary data sheet  
Rev. 2 — 6 December 2011  
23 of 24  
SSL21081T/2T/3T/4T  
NXP Semiconductors  
GreenChip drivers for LED lighting  
21. Contents  
1
General description . . . . . . . . . . . . . . . . . . . . . . 1  
21  
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24  
2
Features and benefits . . . . . . . . . . . . . . . . . . . . 1  
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2  
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2  
Ordering information. . . . . . . . . . . . . . . . . . . . . 3  
Ordering options. . . . . . . . . . . . . . . . . . . . . . . . 3  
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
3
4
5
5.1  
6
7
7.1  
7.2  
Pinning information. . . . . . . . . . . . . . . . . . . . . . 4  
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4  
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5  
8
8.1  
8.2  
8.3  
Functional description . . . . . . . . . . . . . . . . . . . 5  
Converter operation . . . . . . . . . . . . . . . . . . . . . 5  
Conversion frequency. . . . . . . . . . . . . . . . . . . . 6  
Valley detection. . . . . . . . . . . . . . . . . . . . . . . . . 6  
Protections . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6  
UnderVoltage LockOut (UVLO) . . . . . . . . . . . . 7  
Leading-Edge Blanking (LEB) . . . . . . . . . . . . . 7  
OverCurrent Protection (OCP) . . . . . . . . . . . . . 7  
OverTemperature Protection (OTP) . . . . . . . . . 7  
Brownout protection . . . . . . . . . . . . . . . . . . . . . 7  
Short-Winding Protection (SWP) . . . . . . . . . . . 8  
Output Short Protection (OSP). . . . . . . . . . . . . 8  
VCC supply. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
DVDT supply . . . . . . . . . . . . . . . . . . . . . . . . . . 8  
VCC regulator. . . . . . . . . . . . . . . . . . . . . . . . . . 9  
NTC functionality and PWM dimming. . . . . . . . 9  
Soft-start function . . . . . . . . . . . . . . . . . . . . . . 10  
Heat sink. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10  
8.4  
8.4.1  
8.4.2  
8.4.3  
8.4.4  
8.4.5  
8.4.6  
8.4.7  
8.5  
8.6  
8.7  
8.8  
8.8.1  
8.9  
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11  
Thermal characteristics . . . . . . . . . . . . . . . . . 12  
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . 12  
SSL2108X buck configuration . . . . . . . . . . . . 15  
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16  
Abbreviations. . . . . . . . . . . . . . . . . . . . . . . . . . 18  
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18  
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 19  
10  
11  
12  
13  
14  
15  
16  
17  
Legal information. . . . . . . . . . . . . . . . . . . . . . . 20  
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 20  
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 20  
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 21  
17.1  
17.2  
17.3  
17.4  
18  
19  
20  
Contact information. . . . . . . . . . . . . . . . . . . . . 21  
Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22  
Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23  
Please be aware that important notices concerning this document and the product(s)  
described herein, have been included in section ‘Legal information’.  
© NXP B.V. 2011.  
All rights reserved.  
For more information, please visit: http://www.nxp.com  
For sales office addresses, please send an email to: salesaddresses@nxp.com  
Date of release: 6 December 2011  
Document identifier: SSL21081T_2T_3T_4T  

相关型号:

SSL21082T/1,118

Dimmable LED driver IC SOP 12-Pin
NXP

SSL21083

IC LED DISPLAY DRIVER, PDSO8, 3.90 MM, PLASTIC, MS-012, SOT96-1, SOP-8, Display Driver
NXP

SSL21083T

GreenChip drivers for LED lighting
NXP

SSL21084

IC LED DISPLAY DRIVER, PDSO12, 3.90 MM, PLASTIC, MS-012, SOT1196-1, SOP-12, Display Driver
NXP

SSL21084AT

IC LED DISPLAY DRIVER, Display Driver
NXP

SSL21084AT/1,118

Dimmable LED driver IC SOP 12-Pin
NXP

SSL21084T

GreenChip drivers for LED lighting
NXP

SSL2108X/UBA3070

NXP LED照明解决方案快速入门指导
ETC

SSL2109

GreenChip controller for LED lighting
NXP

SSL2109AT

SSL2109AT
NXP

SSL2109AT/1,118

Compact non-dimmable LED controller IC SOIC 8-Pin
NXP

SSL2109T

GreenChip controller for LED lighting
NXP