TDA1010A [NXP]
6 W audio power amplifier in car applications 10 W audio power amplifier in mains-fed applications; 在市电馈电的应用在汽车应用中6 W音频功率放大器10瓦音频功率放大器
| 型号： | TDA1010A |
| 厂家： | 
NXP |
| 描述： | 6 W audio power amplifier in car applications 10 W audio power amplifier in mains-fed applications |
| 文件： | 总22页 (文件大小：591K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA1010A
6 W audio power amplifier in car
applications
10 W audio power amplifier in
mains-fed applications
November 1982
Product specification
File under Integrated Circuits, IC01
Philips Semiconductors
Product specification
6 W audio power amplifier in car applications
10 W audio power amplifier in mains-fed
TDA1010A
The TDA1010A is a monolithic integrated class-B audio amplifier circuit in a 9-lead single in-line (SIL) plastic package.
The device is primarily developed as a 6 W car radio amplifier for use with 4 Ω and 2 Ω load impedances. The wide supply
voltage range and the flexibility of the IC make it an attractive proposition for record players and tape recorders with
output powers up to 10 W.
Special features are:
• single in-line (SIL) construction for easy mounting
• separated preamplifier and power amplifier
• high output power
• low-cost external components
• good ripple rejection
• thermal protection
QUICK REFERENCE DATA
Supply voltage range
VP
6 to 24
3
V
A
Repetitive peak output current
Output power at pin 2; dtot = 10%
VP = 14,4 V; RL = 2 Ω
IORM
max.
Po
Po
Po
typ.
typ.
typ.
6,4
6,2
3,4
W
W
W
VP = 14,4 V; RL = 4 Ω
VP = 14,4 V; RL = 8 Ω
VP = 14,4 V; RL = 2 Ω; with additional bootstrap resistor of 220 Ω between
pins 3 and 4
Po
typ.
typ.
9
W
%
Total harmonic distortion at Po = 1 W; RL = 4 Ω
Input impedance
dtot
0,2
preamplifier (pin 8)
Zi
Zi
typ.
typ.
typ.
typ.
30
20
31
10
kΩ
kΩ
mA
mV
°C
power amplifier (pin 6)
Total quiescent current at VP = 14,4 V
Sensitivity for Po = 5,8 W; RL = 4 Ω
Operating ambient temperature
Storage temperature
Itot
Vi
Tamb
Tstg
−25 to + 150
−55 to + 150
°C
PACKAGE OUTLINE
9-lead SIL; plastic (SOT110B); SOT110-1; 1996 Sepetember 06.
November 1982
2
Philips Semiconductors
Product specification
6 W audio power amplifier in car applications
10 W audio power amplifier in mains-fed applications
TDA1010A
November 1982
3
Philips Semiconductors
Product specification
6 W audio power amplifier in car applications
10 W audio power amplifier in mains-fed applications
TDA1010A
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
Supply voltage
VP
max.
max.
24
5
V
A
A
Peak output current
IOM
Repetitive peak output current
Total power dissipation
Storage temperature
IORM max.
3
see derating curve Fig.2
Tstg −55 to +150
Tamb −25 to +150
°C
Operating ambient temperature
°C
A.C. short-circuit duration of load during sine-wave drive; without heatsink at
VP = 14,4 V
tsc
max.
100
hours
Fig.2 Power derating curve.
HEATSINK DESIGN
Assume VP = 14,4 V; RL = 2 Ω; Tamb = 60 °C maximum; thermal shut-down starts at Tj = 150 °C. The maximum sine-wave
dissipation in a 2 Ω load is about 5,2 W. The maximum dissipation for music drive will be about 75% of the worst-case
sine-wave dissipation, so this will be 3,9 W. Consequently, the total resistance from junction to ambient
150 – 60
Rth j-a = Rth j-tab + Rth tab-h + Rth h-a
=
= 23 K/W .
----------------------
3, 9
Since Rth j-tab = 10 K/W and Rth tab-h = 1 K/W,
Rth h-a = 23 − (10 + 1) = 12 K/W.
November 1982
4
Philips Semiconductors
Product specification
6 W audio power amplifier in car applications
10 W audio power amplifier in mains-fed applications
TDA1010A
D.C. CHARACTERISTICS
Supply voltage range
VP
6 to 24 V
Repetitive peak output current
Total quiescent current at VP = 14,4 V
IORM
Itot
<
3
A
typ.
31 mA
A.C. CHARACTERISTICS
Tamb = 25 °C; VP = 14,4 V; RL = 4 Ω; f = 1 kHz unless otherwise specified; see also Fig.3.
A.F. output power (see Fig.4) at dtot = 10%;
measured at pin 2; with bootstrap
VP = 14,4 V; RL = 2 Ω (note 1)
Po
Po
typ.
>
6,4 W
5,9 W
6,2 W
3,4 W
5,7 W
VP = 14,4 V; RL = 4 Ω (note 1 and 2)
typ.
typ.
typ.
typ.
VP = 14,4 V; RL = 8 Ω (note 1)
Po
Po
VP = 14,4 V; RL = 4 Ω; without bootstrap
VP = 14,4 V; RL = 2 Ω; with additional bootstrap resistor of 220 Ω between pins 3 and 4 Po
9
W
Voltage gain
preamplifier (note 3)
power amplifier
total amplifier
Gv1
typ.
typ.
typ.
24 dB
21 to 27 dB
30 dB
Gv2
27 to 33 dB
54 dB
Gv tot
51 to 57 dB
0,2 %
Total harmonic distortion at Po = 1 W
Efficiency at Po = 6 W
dtot
η
typ.
typ.
75
%
Frequency response (−3 dB)
Input impedance
B
80 Hz to 15 kHz
preamplifier (note 4)
Zi
typ.
30 kΩ
20 to 40 kΩ
20 kΩ
power amplifier (note 5)
Zi
typ.
typ.
14 to 26 kΩ
20 kΩ
Output impedance of preamplifier; pin 7 (note 5)
Output voltage preamplifier (r.m.s. value)
Zo
14 to 26 kΩ
d
tot < 1% (pin 7) (note 3)
Vo(rms)
>
0,7 V
Noise output voltage (r.m.s. value; note 6)
RS = 0 Ω
Vn(rms) typ.
Vn(rms) typ.
<
0,3 mV
0,7 mV
1,4 mV
42 dB
37 dB
10 mV
30 mA
RS = 8,2 kΩ
Ripple rejection at f = 1 kHz to 10 kHz (note 7)
at f = 100 Hz; C2 = 1 µF
RR
RR
Vi
>
>
Sensitivity for Po = 5,8 W
typ.
Bootstrap current at onset of clipping; pin 4 (r.m.s. value)
I4(rms) typ.
November 1982
5
Philips Semiconductors
Product specification
6 W audio power amplifier in car applications
10 W audio power amplifier in mains-fed applications
TDA1010A
Notes
1. Measured with an ideal coupling capacitor to the speaker load.
2. Up to Po ≤ 3 W : dtot ≤ 1%.
3. Measured with a load impedance of 20 kΩ.
4. Independent of load impedance of preamplifier.
5. Output impedance of preamplifier ( ZΟ ) is correlated (within 10%) with the input impedance ( Zi ) of the power
amplifier.
6. Unweighted r.m.s. noise voltage measured at a bandwidth of 60 Hz to 15 kHz (12 dB/octave).
7. Ripple rejection measured with a source impedance between 0 and 2 kΩ (maximum ripple amplitude: 2 V).
8. The tab must be electrically floating or connected to the substrate (pin 9).
Fig.3 Test circuit.
November 1982
6
Philips Semiconductors
Product specification
6 W audio power amplifier in car applications
10 W audio power amplifier in mains-fed applications
TDA1010A
Fig.4 Output power of the circuit of Fig.3 as a function of the supply voltage with the load impedance as a
parameter; typical values. Solid lines indicate the power across the load, dashed lines that available at pin
2 of the TDA1010. RL = 2 Ω (1) has been measured with an additional 220 Ω bootstrap resistor between
pins 3 and 4. Measurements were made at f = 1 kHz, dtot = 10%, Tamb = 25 °C.
Fig. 5 See next page.
Total harmonic distortion in the circuit of Fig.3 as a function of the output power with the load impedance as a parameter;
typical values. Solid lines indicate the power across the load, dashed lines that available at pin 2 of the TDA1010.
RL = 2 Ω (1) has been measured with an additional 220 Ω bootstrap resistor between pins 3 and 4. Measurements were
made at f = 1 kHz, VP = 14,4 V.
November 1982
7
Philips Semiconductors
Product specification
6 W audio power amplifier in car applications
10 W audio power amplifier in mains-fed applications
TDA1010A
Fig.5 For caption see preceding page.
Fig.6 Frequency characteristics of the circuit of Fig.3 for three values of load impedance; typical values.
Po relative to 0 dB = 1 W; VP = 14,4 V.
November 1982
8
Philips Semiconductors
Product specification
6 W audio power amplifier in car applications
10 W audio power amplifier in mains-fed applications
TDA1010A
Fig.7 Total power dissipation (solid lines) and the efficiency (dashed lines) of the circuit of Fig.3 as a function of
the output power with the load impedance as a parameter (for RL = 2 Ω an external bootstrap resistor of
220 Ω has been used); typical values. VP = 14,4 V; f = 1 kHz.
November 1982
9
Philips Semiconductors
Product specification
6 W audio power amplifier in car applications
10 W audio power amplifier in mains-fed applications
TDA1010A
Fig.8 Thermal resistance from heatsink to ambient of a 1,5 mm thick bright aluminium heatsink as a function of
the single-sided area of the heatsink with the total power dissipation as a parameter.
November 1982
10
Philips Semiconductors
Product specification
6 W audio power amplifier in car applications
10 W audio power amplifier in mains-fed applications
TDA1010A
APPLICATION INFORMATION
November 1982
11
Philips Semiconductors
Product specification
6 W audio power amplifier in car applications
10 W audio power amplifier in mains-fed applications
TDA1010A
Fig.10 Track side of printed-circuit board used for the circuit of Fig.9; p.c. board dimensions 92 mm × 52 mm.
Fig.11 Component side of printed-circuit board showing component layout used for the circuit of Fig.9.
November 1982
12
Philips Semiconductors
Product specification
6 W audio power amplifier in car applications
10 W audio power amplifier in mains-fed applications
TDA1010A
November 1982
13
Philips Semiconductors
Product specification
6 W audio power amplifier in car applications
10 W audio power amplifier in mains-fed applications
TDA1010A
Fig.13 Track side of printed-circuit board used for the circuit of Fig.12; p.c. board dimensions 83 mm × 65 mm.
November 1982
14
Philips Semiconductors
Product specification
6 W audio power amplifier in car applications
10 W audio power amplifier in mains-fed applications
TDA1010A
Fig.14 Component side of printed-circuit board showing component layout used for the circuit of Fig.12.
Balance control is not on the p.c. board.
November 1982
15
Philips Semiconductors
Product specification
6 W audio power amplifier in car applications
10 W audio power amplifier in mains-fed applications
TDA1010A
Fig.15 Channel separation of the circuit of Fig.12 as a function of the frequency.
Fig.16 Power supply of circuit of Fig.17.
16
November 1982
Philips Semiconductors
Product specification
6 W audio power amplifier in car applications
10 W audio power amplifier in mains-fed applications
TDA1010A
November 1982
17
Philips Semiconductors
Product specification
6 W audio power amplifier in car applications
10 W audio power amplifier in mains-fed applications
TDA1010A
Fig.18 Track side of printed-circuit board used for the circuit of Fig.17 (Fig.16 partly); p.c. board dimensions
169 mm × 118 mm.
November 1982
18
Philips Semiconductors
Product specification
6 W audio power amplifier in car applications
10 W audio power amplifier in mains-fed applications
TDA1010A
Fig.19 Component side of printed-circuit board showing component layout used for the circuit of Fig.17
(Fig.16 partly).
November 1982
19
Philips Semiconductors
Product specification
6 W audio power amplifier in car applications
10 W audio power amplifier in mains-fed applications
TDA1010A
Fig.20 Channel separation of the circuit of Fig.18 as a function of frequency.
November 1982
20
Philips Semiconductors
Product specification
6 W audio power amplifier in car applications
10 W audio power amplifier in mains-fed applications
TDA1010A
PACKAGE OUTLINE
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1
D
D
1
q
A
2
P
P
1
A
3
q
2
q
1
A
A
4
E
pin 1 index
c
L
1
9
b
Q
e
Z
b
w
M
2
b
1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
Z
max.
A
max.
2
(1)
(1)
E
UNIT
A
A
b
b
b
c
D
D
e
L
P
P
Q
q
q
q
2
w
A
3
4
1
2
1
1
1
18.5
17.8
8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48
8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20
3.9 2.75 3.4 1.75 15.1
3.4 2.50 3.2 1.55 14.9
4.4
4.2
5.9
5.7
2.54
mm
3.7
0.25 1.0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-25
SOT110-1
November 1982
21
Philips Semiconductors
Product specification
6 W audio power amplifier in car
applications
TDA1010A
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
SOLDERING
Introduction
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
November 1982
22
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