TDA1013B [NXP]
4 W audio power amplifier with DC volume control; 4 W音频功率放大器直流音量控制
| 型号： | TDA1013B |
| 厂家： | 
NXP |
| 描述： | 4 W audio power amplifier with DC volume control |
| 文件： | 总11页 (文件大小：115K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA1013B
4 W audio power amplifier with
DC volume control
July 1994
Product specification
File under Integrated Circuits, IC01
Philips Semiconductors
Product specification
4 W audio power amplifier with
DC volume control
TDA1013B
GENERAL DESCRIPTION
The TDA1013B is an integrated audio amplifier circuit with DC volume control, encapsulated in a 9-lead single in-line
(SIL) plastic package. The wide supply voltage range makes this circuit ideal for applications in mains and battery-fed
apparatus such as television receivers and record players.
The DC volume control stage has a logarithmic control characteristic with a range of more than 80 dB; control is by means
of a DC voltage variable between 2 and 6.5 V.
The audio amplifier has a well defined open loop gain and a fixed integrated closed loop. This device requires only a few
external components and offers stability and performance.
Features
• Few external components
• Wide supply voltage range
• Wide control range
• Fixed gain
• High signal-to-noise ratio
• Thermal protection
• Pin compatible with TDA1013A
QUICK REFERENCE DATA
PARAMETER
CONDITIONS
SYMBOL
MIN.
10
TYP.
18
MAX.
40
UNIT
Supply voltage
Repetitive peak output
current
V
V
A
P
I
−
−
1.5
69
ORM
Total sensitivity
P = 2.5 W;
o
DC control at max. gain
V
44
55
mV
i
Audio amplifier
Output power
THD = 10%; R = 8 Ω
P
4.0
−
4.2
−
W
L
o
Total harmonic distortion
Sensitivity
P = 2.5 W; R = 8 Ω
THD
0.15
125
0.1
160
%
o
L
P = 2.5 W
V
100
mV
o
i
DC volume control unit
Gain control range
Signal handling
|∆G |
80
−
−
−
dB
V
v
THD < 1%;
DC control = 0 dB
V
1.2
1.7
i
Sensitivity (pin 6)
V = 125 mV;
o
max. voltage gain
V
39
23
45
29
55
35
mV
i
Input impedance (pin 8)
|Z |
kΩ
i
PACKAGE OUTLINE
9-lead SIL; plastic (SOT110B); SOT110-1; 1996 July 23.
July 1994
2
Philips Semiconductors
Product specification
4 W audio power amplifier with
DC volume control
TDA1013B
Fig.1 Block diagram.
PINNING
1. power ground
2. amplifier output
3. supply voltage
4. electronic filter
5. amplifier input
6. control unit output
7. control voltage
8. control unit input
9. signal ground (substrate)
July 1994
3
Philips Semiconductors
Product specification
4 W audio power amplifier with
DC volume control
TDA1013B
RATINGS
Limiting values in accordance with the Absolute Maximum System (IEC 134)
SYMBOL
PARAMETER
Supply voltage
MIN.
MAX.
UNIT
V
−
40
V
P
I
I
Non-repetitive peak output current
Repetitive peak output current
Storage temperature range
Crystal temperature
−
3
A
OSM
ORM
−
1.5
+150
+150
A
T
T
−55
−
°C
°C
stg
c
P
Total power dissipation
see Fig.2
tot
Fig.2 Power derating curve.
HEATSINK DESIGN EXAMPLE
Assume V = 18 V; R = 8 Ω; T
= 60 °C; T = 150 °C (max.); for a 4 W application, the maximum dissipation is
P
L
amb
c
approximately 2.5 W. The thermal resistance from junction to ambient can be expressed as:
R
= R
+ R
+ R
th tab-h th h-a =
th j-a
th j-tab
T
j max – Tamb max
150 – 60
----------------------
2.5
=
= 36 K/W
------------------------------------------
Pmax
Since R
= 9 K/W and R
= 1 K/W, R = 36 − (9 + 1) = 26 K/W.
th h-a
th j-tab
th tab-h
July 1994
4
Philips Semiconductors
Product specification
4 W audio power amplifier with
DC volume control
TDA1013B
CHARACTERISTICS
V = 18 V; R = 8 Ω; f = 1 kHz; T
= 25 °C; see Fig.10; unless otherwise specified
P
L
amb
PARAMETER
CONDITIONS
SYMBOL
MIN.
10
TYP.
MAX. UNIT
Supply voltage range
Total quiescent current
Noise output voltage
at maximum gain
at maximum gain
at minimum gain
V
18
25
40
60
V
P
I
−
mA
tot
note 1
R = 0 Ω
V
V
V
−
−
−
0.5
−
mV
mV
mV
S
n
n
n
R = 5 kΩ
0.6
1.4
−
S
R = 0 Ω
0.25
S
Total sensitivity
P = 2.5 W;
o
DC control at max. gain
V
44
55
69
mV
i
Audio amplifier
Repetitive peak output current
Output power
I
−
−
1.5
−
A
ORM
THD = 10%; R = 8 Ω
P
4.0
−
4.2
W
L
o
Total harmonic distortion
Sensitivity
P = 2.5 W; R = 8 Ω
THD
0.15
125
200
30 to
40 000
1.0
160
500
%
o
L
P = 2.5 W
V
100
100
−
mV
kΩ
o
i
Input impedance (pin 5)
Power bandwidth
|Z |
i
B
P
−
Hz
DC volume control unit
Gain control range
Signal handling
|∆G |
80
90
−
−
dB
V
v
THD < 1%;
DC control = 0 dB
V
1.2
1.7
i
i
Sensitivity (pin 6)
V = 125 mV;
o
max. voltage gain
V
39
23
45
44
29
60
55
35
75
mV
kΩ
Ω
Input impedance (pin 8)
Output impedance (pin 6)
|Z |
i
|Z |
o
Note to the characteristics
1. Measured in a bandwidth in accordance with IEC 179, curve ‘A’.
July 1994
5
Philips Semiconductors
Product specification
4 W audio power amplifier with
DC volume control
TDA1013B
APPLICATION INFORMATION
Fig.3 Output power as a function of supply voltage; f = 1 kHz; THD = 10% and control voltage (V ) = 6.5 V.
7
Fig.4 Power dissipation as a function of output power; V = 18 V; f = 1 kHz; R = 8 Ω
P
L
and control voltage (V ) = 6.5 V.
7
July 1994
6
Philips Semiconductors
Product specification
4 W audio power amplifier with
DC volume control
TDA1013B
Fig.5 Power bandwidth; V = 18 V; R = 8 Ω; THD = 10% and control voltage (V ) = 6.5 V.
P
L
7
Fig.6 Total harmonic distortion as a function of frequency;
V = 18 V; R = 8 Ω; P = 2.5 W and control voltage = 6.5 V.
P
L
o
July 1994
7
Philips Semiconductors
Product specification
4 W audio power amplifier with
DC volume control
TDA1013B
Fig.7 Total harmonic distortion as a function of output power; V = 18 V; R = 8 Ω and control voltage = 6.5 V.
P
L
Fig.8 Typical control curve.
8
July 1994
Philips Semiconductors
Product specification
4 W audio power amplifier with
DC volume control
TDA1013B
Fig.9 Noise output voltage as a function of the control voltage; V = 18 V;
P
R = 8 Ω (in accordance with IEC 179, curve ‘A’).
L
Fig.10 Application diagram.
9
July 1994
Philips Semiconductors
Product specification
4 W audio power amplifier with
DC volume control
TDA1013B
PACKAGE OUTLINE
SIL9MPF: plastic single in-line medium power package with fin; 9 leads
SOT110-1
D
D
1
q
A
2
P
P
1
A
3
q
2
q
1
A
A
4
E
pin 1 index
c
L
1
9
b
Q
e
Z
b
w
M
2
b
1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
(1)
Z
max.
A
max.
2
(1)
(1)
E
UNIT
A
A
b
b
b
c
D
D
e
L
P
P
Q
q
q
q
2
w
A
3
4
1
2
1
1
1
18.5
17.8
8.7 15.8 1.40 0.67 1.40 0.48 21.8 21.4 6.48
8.0 15.4 1.14 0.50 1.14 0.38 21.4 20.7 6.20
3.9 2.75 3.4 1.75 15.1
3.4 2.50 3.2 1.55 14.9
4.4
4.2
5.9
5.7
2.54
mm
3.7
0.25 1.0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-25
SOT110-1
July 1994
10
Philips Semiconductors
Product specification
4 W audio power amplifier with
DC volume control
TDA1013B
SOLDERING
Introduction
There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and
surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for
surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often
used.
This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our
“IC Package Databook” (order code 9398 652 90011).
Soldering by dipping or by wave
The maximum permissible temperature of the solder is 260 °C; solder at this temperature must not be in contact with the
joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds.
The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the
specified maximum storage temperature (T
). If the printed-circuit board has been pre-heated, forced cooling may
stg max
be necessary immediately after soldering to keep the temperature within the permissible limit.
Repairing soldered joints
Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more
than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to
10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
July 1994
11
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