TDA4670_技术文档

INTEGRATED CIRCUITS

DATA SHEET

TDA4670

Picture Signal Improvement (PSI)

circuit

1996 Dec 11

Product speciﬁcation

Supersedes data of May 1991

File under Integrated Circuits, IC02

Philips Semiconductors

Product speciﬁcation

Picture Signal Improvement (PSI) circuit

TDA4670

FEATURES

• Luminance signal delay from 20 to 1100 ns (minimum

step 45 ns)

• Luminance signal peaking with selectable symmetrical

overshoots

• 2.6 or 5 MHz peaking centre frequency and selectable

degree of peaking (−3, 0, +3 and +6 dB)

GENERAL DESCRIPTION

• Selectable noise reduction by coring

The TDA4670 delays the luminance signal and improves

colour-difference signal transients. Additionally, the

luminance signal can be improved by peaking and noise

reduction (coring).

• Handles negative and positive colour-difference signals

• Selectable Colour Transient Improvement (CTI) to

decrease the colour-difference signal transient times to

those of the high frequency luminance signals

• Selectable 5 or 12 V sandcastle input voltage

• All controls selected via the I²C-bus

• Timing pulse generation for clamping and delay time

control synchronized by sandcastle pulse

• Automatic luminance signal delay correction using a

control loop

• Luminance and colour-difference input signal clamping

with coupling capacitor

• 4.5 to 8.8 V supply voltage range

• Minimum of external components required.

QUICK REFERENCE DATA

SYMBOL

V_P

PARAMETER

supply voltage (pins 1 and 5)

MIN.

4.5

TYP.

MAX.

8.8

UNIT

5

V

I_P(tot)

total supply current

31

20

−

41

−

52

mA

ns

t_d(Y)

Y signal delay time

1130

640

V_i(VBS)

V_i(CD)(p-p)

composite Y input signal (peak-to-peak value, pin 16)

colour-difference input signal (peak-to-peak value)

±(R − Y) on pin 3

450

mV

−

0

1.05

1.33

−1

1.48

1.88

−

V

±(R − Y) on pin 7

V

G_Y

gain of Y channel

dB

°C

G_CD

T_amb

gain of colour-difference channel

operating ambient temperature

0

−

70

ORDERING INFORMATION

TYPE

PACKAGE

NUMBER

NAME

DESCRIPTION

VERSION

TDA4670

DIP18

plastic dual in-line package; 18 leads (300 mil)

SOT102-1

1996 Dec 11

2

Philips Semiconductors

Product speciﬁcation

Picture Signal Improvement (PSI) circuit

TDA4670

BLOCK DIAGRAM

SM5A7

h a n d b o o k , f u l l p a g e w i d t h

1996 Dec 11

3

Philips Semiconductors

Product speciﬁcation

Picture Signal Improvement (PSI) circuit

TDA4670

PINNING

SYMBOL PIN

DESCRIPTION

V_P1

1

2

3

4

positive supply voltage 1

C_DL

capacitor of delay time control

±(R − Y) colour-difference input signal

V_{i(R − Y)}

V_{o(R − Y)}

handbook, halfpage

±(R − Y) colour-difference output

V

C

GND1

SAND

1

2

3

4

5

6

7

8

9

18

17

16

15

14

13

12

11

10

P1

signal

DL

i(R − Y)

o(R − Y)

V_P2

5

6

positive supply voltage 2

V

iY

V_{o(B − Y)}

±(B − Y) colour-difference output

signal

V

C

ref

V_{i(B − Y)}

GND2

SDA

7

8

9

±(B − Y) colour-difference input signal

ground 2 (0 V)

I²C-bus serial data input/output

C

V

TDA4670

CLP2

P2

C

V

CLP1

o(B − Y)

V

i(B − Y)

oY

SCL

10 I²C-bus serial clock input

C

GND2

COR

C_COR

V_oY

11 coring capacitor

SDA

SCL

12 delayed luminance output signal

13 black level clamping capacitor 1

14 black level clamping capacitor 2

15 capacitor of reference voltage

16 luminance input signal

MEH188

C_CLP1

C_CLP2

C_ref

V_iY

SAND

GND1

17 sandcastle pulse input

Fig.2 Pin configuration.

18 ground 1 (0 V)

1996 Dec 11

4

Philips Semiconductors

Product speciﬁcation

Picture Signal Improvement (PSI) circuit

TDA4670

The output buffer stage ensures a low-ohmic VBS output

signal on pin 12 (<160 Ω). The gain of the luminance

signal path from pin 16 to pin 12 is unity.

FUNCTIONAL DESCRIPTION

The TDA4670 contains luminance signal processing and

colour-difference signal processing. The luminance signal

section comprises a variable integrated luminance delay

line with luminance signal peaking and noise reduction by

coring.

An oscillation signal of the delay time control loop is

present on output pin 12 instead of the VBS signal during

the vertical blanking interval in lines 16 (330) to 18 (332).

Therefore, this output signal should not be applied for

synchronization.

The colour-difference section consists of a transient

improvement circuit to decrease the rise and fall times of

the colour-difference signal transients. All functions and

parameters are controlled via the I²C-bus.

Colour-difference signal paths

The colour-difference input signals (on pins 3 and 7) are

clamped to a reference voltage.

Y-signal path

Each colour-difference signal is fed to a transient detector

and to an analog signal switch with an attached voltage

storage stage.

The video and blanking signal is AC-coupled to the input

at pin 16. Its black porch is clamped to a DC reference

voltage to ensure the correct operating range of the

luminance delay stage.

The transient detectors consist of differentiators and

full-wave rectifiers. The output voltages of both transient

detectors are added and then compared in a comparator.

This comparator controls both following analog signal

switches simultaneously.

The luminance delay line consists of all-pass filter sections

with delay times of 45, 90, 100, 180 and 450 ns

(see Fig.1). The luminance signal delay is controlled via

the I²C-bus in steps of 45 ns in the range of 20 to 1100 ns,

this ensures that the maximum delay difference between

the luminance and colour-difference signals is ±22.5 ns.

The analog signal switches are in an open position at a

certain value of transient time; the held value (held by

storage capacitors) is then applied to the outputs.

The switches close to rapidly accept the actual signal

levels at the end of these transients. The improved

transient time is approximately 100 ns long and

independent of the input signal transient time.

An automatic luminance delay time adjustment in an

internal control loop (with the horizontal frequency as a

reference) is used to correct changes in the delay time,

due to component tolerances. The control loop is

automatically enabled between the burst key pulses of

lines 16 (330) and 17 (331) during the vertical blanking

interval. The control voltage is stored in the capacitor C_DL

connected to pin 2.

Colour-difference paths are independent of the input

signal polarity and have a gain of unity.

The CTI functions are switched on and off via the I²C-bus.

The peaking section uses a transversal filter circuit with

selectable centre frequencies of 2.6 and 5 MHz.

It provides selectable degrees of peaking of −3, 0, +3

and +6 dB and a noise reduction by coring, which

attenuates the high-frequency noise introduced by

peaking.

1996 Dec 11

5

Philips Semiconductors

Product speciﬁcation

Picture Signal Improvement (PSI) circuit

TDA4670

LIMITING VALUES

In accordance with the Absolute Maximum Rating System (IEC 134). V_P1and V_P2as well as GND1 and GND2

connected together.

SYMBOL

V_P1

PARAMETER

supply voltage (pin 1)

CONDITIONS

MIN.

MAX.

8.8

UNIT

0

V

V_P2

supply voltage (pin 5)

total power dissipation

storage temperature

operating ambient temperature

electrostatic handling

for pins 9 and 10

8.8

V

P_tot

0.97

+150

70

W

°C

T_stg

−25

T_amb

V_ESD

0

note 1

−

+300

−500

±500

V

for other pins

Note

1. Equivalent to discharging a 200 pF capacitor through a 0 Ω series resistor.

THERMAL CHARACTERISTICS

SYMBOL

R_{th j-a}

PARAMETER

VALUE

82

UNIT

thermal resistance from junction to ambient in free air

K/W

CHARACTERISTICS

_P1= V_P2= 5 V; nominal video amplitude V_VB= 315 mV; t_H= 64 µs; t_BK= 4 µs (burst key); T_amb= 25 °C;

measurements taken in Fig.4; unless otherwise speciﬁed.

V

SYMBOL

V_P1

PARAMETER

CONDITIONS

MIN.

4.5

TYP.

MAX.

8.8

UNIT

supply voltage (pin 1)

supply voltage (pin 5)

total supply current

5

V

V_P2

4.5

31

8.8

52

V

I_P(tot)

41

mA

Y-signal path

V_i(Y)(p-p)

VBS input signal on pin 16

(peak-to-peak value)

−

450

640

mV

V₁₆

I₁₆

black level clamping voltage

input current

−

3.1

−

V

during clamping

±95

±190

±0.1

−

µA

MΩ

pF

ns

outside clamping

−

R₁₆

input resistance

5

−

C₁₆

input capacitance

−

3

10

t_d(Y)(max)

t_d(Y)(min)

maximum Y delay time

minimum Y delay time

set via I²C-bus

1070

1100

20

1130

−

1996 Dec 11

6

Philips Semiconductors

Product speciﬁcation

Picture Signal Improvement (PSI) circuit

TDA4670

SYMBOL

PARAMETER

minimum delay step

group delay time difference

CONDITIONS

set via I²C-bus

MIN.

40

TYP.

45

MAX.

50

UNIT

ns

∆ t_d(Y)

f = 0.5 to 5 MHz;

maximum delay

−

0

±25

ns

delay time difference between Y Y delay; CTI and peaking off 70

and colour-difference signals

100

130

ns

t_d(peak)(min)

G_Y

minimum delay time for peaking

185

215

245

0

ns

VBS signal gain measured on

output pin 12 (composite signal,

peak-to-peak value)

V_o/V_i; f = 500 kHz;

maximum delay

−2

−1

dB

I₁₂

output current (emitter-follower

with constant current source)

source current

sink current

−1

0.4

−

mA

Ω

−

R₁₂

f_res

output resistance

160

frequency response for

maximum delay

f = 0.5 to 3 MHz

f = 0.5 to 5 MHz

−2

−4

−1

−3

0

dB

−1

LIN

signal linearity for

α_min/α_max;

video contents of 315 mV (p-p)

video contents of 450 mV (p-p)

V_VBS= 450 mV (p-p)

V_VBS= 640 mV (p-p)

0.85

0.60

−

Luminance peaking, selected via I²C-bus

f_peak

peaking frequency

f_C1; LCF-bit = 0

f_C2; LCF-bit = 1

4.5

2.3

5

5.5

2.9

MHz

2.6

V_peak

peaking amplitude for grade of

peaking (f_Camplitude/0.5 MHz

amplitude)

selectable values

−

−3

0

−

dB

%

+3

+6

20

limitation of peaking (positive

amplitude of correction signal

referenced to 315 mV)

V_n(rms)

COR

noise voltage on pin 12

(RMS value)

without peaking;

f = 0 to 5 MHz

−

1

mV

%

coring of peaking (coring part

referenced to 315 mV)

COR-bit = 1

20

−

1996 Dec 11

7

Philips Semiconductors

Product speciﬁcation

Picture Signal Improvement (PSI) circuit

TDA4670

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX. UNIT

Colour-difference paths measured with transient times t_r= t_f= 1 µs; t_{p H}≥ 1 µs; V_i= 1.33 V (p-p) on

pins 3 and 7 and with burst key pulse t_BK= 4 µs

V_i(CD)(p-p)

±(R − Y) input signal

(peak-to-peak value; pin 3)

75% colour bar

V_3,7/δt

−

1.05

1.48

V

±(B − Y) input signal

(peak-to-peak value; pin 7)

−

1.33

1.88

input transient sensitivity

internal clamping voltage level

input current

0.15

−

V/µs

V

V_3,7

I_3,7

−

2.45

−

outside clamping

during clamping

−

±1

±190

12

−

µA

pF

V

±100

−

C_3,7

V_4,6

input capacitance

DC output voltage

output offset voltage

−

6

2

∆V_4,6

R_S≤ 300 Ω; note 1

−

±5

±18

±30

mV

during and after storage time

−

V_spike

I_4,6

spurious spike signals on pins 4 R_S≤ 300 Ω; note 1

and 6

−

output current (emitter-follower

with constant current source)

source current

sink current

−1

0.4

−

0

−

mA

Ω

−

R_4,6

G_v

output resistance

100

+1

±0.3

signal gain in each path

gain difference −(R − Y)/−(B − Y)

signal linearity for

V_o/V_i

−1

−

dB

∆G_v

LIN

α_min/α_max

;

nominal signal

V_i= 1.33 V (p-p)

V_i= 1.88 V (p-p)

0.90

0.65

−1.5

−

+3 dB signal

−

∆V_o

signal reduction at higher

frequency (output signal ratio

V_i/V_o)

signal with t_{p H}= 50 ns;

t_r= t_f= 1 µs

dB

Sandcastle pulse, input voltage selectable via I²C-bus

V₁₇

input voltage threshold for

H and V sync

SC5-bit = 0 (+12 V)

1.1

1.5

1.9

V

input voltage threshold for burst SC5-bit = 0 (+12 V)

5.5

1.1

6.5

1.5

7.5

1.9

V

input voltage threshold for

H and V sync

SC5-bit = 1 (+5 V)

input voltage threshold for burst SC5-bit = 1 (+5 V)

3.0

30

15

−

3.5

40

20

4

4.0

50

25

8

V

R₁₇

input resistance

+12 V input level

+5 V input level

kΩ

pF

µs

C₁₇

t_BK

t_d

input capacitance

burst key pulse width

3.0

−

4.0

1

4.6

−

leading edge delay for clamping referenced to t_BK

pulse

n_p

number of required burst key

pulses vertical blanking interval

note 2

4

−

31

−

1996 Dec 11

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Philips Semiconductors

Product speciﬁcation

Picture Signal Improvement (PSI) circuit

TDA4670

SYMBOL

PARAMETER

CONDITIONS

MIN.

TYP.

MAX.

UNIT

I²C-bus control, SDA and SCL

V_IH

HIGH level input voltage on

3

−

5

V

pins 9 and 10

V_IL

LOW level input voltage

input current

0

−

1.5

±10

0.4

V

I_9,10

µA

V

V_o(ACK)

output voltage at acknowledge on I_o(ACK)= 3 mA

pin 9

I_o(ACK)

output current at acknowledge on sink current

pin 9

3

−

mA

Notes

1. Crosstalk on output, measured in the unused channel when the other channel is provided with a nominal input signal

(CTI active).

2. A number of more than 31 burst key pulses repeats the counter cycle of delay time control.

I²C-BUS FORMAT

S⁽¹⁾

SLAVE ADDRESS⁽²⁾

ACK⁽³⁾

SUBADDRESS⁽⁴⁾

ACK⁽³⁾

DATA⁽⁵⁾

P⁽⁶⁾

Notes

1. S = START condition.

2. SLAVE ADDRESS = 1000 100X.

3. ACK = acknowledge, generated by the slave.

4. SUBADDRESS = subaddress byte, see Table 1.

5. DATA = data byte, see Table 1.

6. P = STOP condition.

7. X = read/write control bit.

X = 0, to write (the circuit is slave receiver only).

If more than 1 byte DATA is transmitted, then auto-increment of the subaddress is performed.

Table 1 I²C-bus transmission; see Table 2

DATA

FUNCTION

SUBADDRESS

D7

0

D6

D5

CTI

LCF

D4

DL4

0

D3

DL3

0

D2

DL2

0

D1

DL1

D0

Y delay/CTI/SC

00010000

00010001

SC5

DL0

Peaking and coring

COR

PEAK

PCON1 PCON0

1996 Dec 11

9

Philips Semiconductors

Product speciﬁcation

Picture Signal Improvement (PSI) circuit

TDA4670

Table 2 Function of the bits

DATA

FUNCTION

set delay in luminance channel

LOGIC 1

LOGIC 0

DL0

DL1

DL2

DL3

DL4

CTI

45 ns

90 ns

0 ns

180 ns

450 ns

active

+5 V

0 ns

set colour transient improvement

select sandcastle pulse voltage

set peaking frequency response

set peaking delay

inactive

+12 V

5.0 MHz

inactive

SC5

LCF

PEAK

COR

2.6 MHz

active

set coring control

PCONx

set peaking ampliﬁcation

see Table 3

Table 3 Peaking ampliﬁcation

GRADE OF PEAKING

PCON1 PCON0

(dB)

−3

0

1

0

1

0

1

+3

+6

Remarks to the subaddress bytes

Subaddresses 00H to 0FH are reserved for colour decoders and RGB processors.

Subaddresses 10 and 11 only are acknowledged.

General call address is not acknowledged.

Power-on-reset: D7 to D1 bits of data bytes are set to logic 0, D0 bit is set to logic 1.

1996 Dec 11

10

Philips Semiconductors

Product speciﬁcation

Picture Signal Improvement (PSI) circuit

TDA4670

INTERNAL CIRCUITRY

EM2H38

h a n d b o o k , f u l l p a g e w i d t h

1996 Dec 11

11

Philips Semiconductors

Product speciﬁcation

Picture Signal Improvement (PSI) circuit

TDA4670

TEST AND APPLICATION INFORMATION

SDA

handbook, full pagewidth

2

I C-bus

SDA

SCL

10

11

12

13

14

15

16

17

18

9

8

7

6

5

4

3

2

C

COR

GND2

0.1 µF

V

oY

i(B − Y)

(VBS)

10 nF

C

V

CLP1

CLP2

o(B − Y)

0.1 µF

C

P2

TDA4670

0.1 µF

C

V

ref

o(R − Y)

i(R − Y)

V

iY

(VBS)

10 nF

C

SAND

DL

sandcastle

pulse input

47 µF

15 Ω

0.1 µF

+5 V

V

GND1

P1

1

MEH189

V

B

Fig.4 Test and application circuit.

12

1996 Dec 11

Philips Semiconductors

Product speciﬁcation

Picture Signal Improvement (PSI) circuit

TDA4670

PACKAGE OUTLINE

DIP18: plastic dual in-line package; 18 leads (300 mil)

SOT102-1

D

M

E

A

2

A

1

L

c

e

w M

Z

b

1

(e )

1

b

2

18

10

M

H

pin 1 index

E

1

9

0

5

10 mm

scale

DIMENSIONS (inch dimensions are derived from the original mm dimensions)

(1)

Z

A

2

(1)

1

w

UNIT

mm

b

c

D

E

e

L

M

H

1

2

1

E

max.

min.

max.

1.40

1.14

0.53

0.38

1.40

1.14

0.32

0.23

21.8

21.4

6.48

6.20

3.9

3.4

8.25

7.80

9.5

8.3

4.7

0.51

3.7

2.54

0.10

7.62

0.30

0.254

0.01

0.85

0.055 0.021 0.055 0.013

0.044 0.015 0.044 0.009

0.86

0.84

0.26

0.24

0.15

0.13

0.32

0.31

0.37

0.33

inches

0.19

0.020

0.15

0.033

Note

1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.

REFERENCES

OUTLINE

EUROPEAN

PROJECTION

ISSUE DATE

VERSION

IEC

JEDEC

EIAJ

93-10-14

95-01-23

SOT102-1

1996 Dec 11

13

Philips Semiconductors

Product speciﬁcation

Picture Signal Improvement (PSI) circuit

TDA4670

with the joint for more than 5 seconds.

The total contact time of successive solder waves must not

exceed 5 seconds.

SOLDERING

Introduction

There is no soldering method that is ideal for all IC

packages. Wave soldering is often preferred when

through-hole and surface mounted components are mixed

on one printed-circuit board. However, wave soldering is

not always suitable for surface mounted ICs, or for

printed-circuits with high population densities. In these

situations reflow soldering is often used.

The device may be mounted up to the seating plane, but

the temperature of the plastic body must not exceed the

specified maximum storage temperature (T_{stg max}). If the

printed-circuit board has been pre-heated, forced cooling

may be necessary immediately after soldering to keep the

temperature within the permissible limit.

Repairing soldered joints

This text gives a very brief insight to a complex technology.

A more in-depth account of soldering ICs can be found in

our “IC Package Databook” (order code 9398 652 90011).

Apply a low voltage soldering iron (less than 24 V) to the

lead(s) of the package, below the seating plane or not

more than 2 mm above it. If the temperature of the

soldering iron bit is less than 300 °C it may remain in

contact for up to 10 seconds. If the bit temperature is

between 300 and 400 °C, contact may be up to 5 seconds.

Soldering by dipping or by wave

The maximum permissible temperature of the solder is

260 °C; solder at this temperature must not be in contact

DEFINITIONS

Data sheet status

Objective speciﬁcation

Preliminary speciﬁcation

Product speciﬁcation

This data sheet contains target or goal speciﬁcations for product development.

This data sheet contains preliminary data; supplementary data may be published later.

This data sheet contains ﬁnal product speciﬁcations.

Limiting values

Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or

more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation

of the device at these or at any other conditions above those given in the Characteristics sections of the speciﬁcation

is not implied. Exposure to limiting values for extended periods may affect device reliability.

Application information

Where application information is given, it is advisory and does not form part of the speciﬁcation.

LIFE SUPPORT APPLICATIONS

These products are not designed for use in life support appliances, devices, or systems where malfunction of these

products can reasonably be expected to result in personal injury. Philips customers using or selling these products for

use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such

improper use or sale.

PURCHASE OF PHILIPS I²C COMPONENTS

Purchase of Philips I²C components conveys a license under the Philips’ I²C patent to use the

components in the I²C system provided the system conforms to the I²C specification defined by

Philips. This specification can be ordered using the code 9398 393 40011.

1996 Dec 11

14

Philips Semiconductors

Product speciﬁcation

Picture Signal Improvement (PSI) circuit

TDA4670

NOTES

1996 Dec 11

15

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Tel. +1 800 234 7381

Russia: Philips Russia, Ul. Usatcheva 35A, 119048 MOSCOW,

Tel. +7 095 247 9145, Fax. +7 095 247 9144

China/Hong Kong: 501 Hong Kong Industrial Technology Centre,

72 Tat Chee Avenue, Kowloon Tong, HONG KONG,

Tel. +852 2319 7888, Fax. +852 2319 7700

Singapore: Lorong 1, Toa Payoh, SINGAPORE 1231,

Tel. +65 350 2538, Fax. +65 251 6500

Colombia: see South America

Czech Republic: see Austria

Slovakia: see Austria

Slovenia: see Italy

Denmark: Prags Boulevard 80, PB 1919, DK-2300 COPENHAGEN S,

Tel. +45 32 88 2636, Fax. +45 31 57 1949

South Africa: S.A. PHILIPS Pty Ltd., 195-215 Main Road Martindale,

2092 JOHANNESBURG, P.O. Box 7430 Johannesburg 2000,

Tel. +27 11 470 5911, Fax. +27 11 470 5494

Finland: Sinikalliontie 3, FIN-02630 ESPOO,

Tel. +358 9 615800, Fax. +358 9 61580/xxx

South America: Rua do Rocio 220, 5th floor, Suite 51,

04552-903 São Paulo, SÃO PAULO - SP, Brazil,

Tel. +55 11 821 2333, Fax. +55 11 829 1849

France: 4 Rue du Port-aux-Vins, BP317, 92156 SURESNES Cedex,

Tel. +33 1 40 99 6161, Fax. +33 1 40 99 6427

Spain: Balmes 22, 08007 BARCELONA,

Tel. +34 3 301 6312, Fax. +34 3 301 4107

Germany: Hammerbrookstraße 69, D-20097 HAMBURG,

Tel. +49 40 23 53 60, Fax. +49 40 23 536 300

Sweden: Kottbygatan 7, Akalla, S-16485 STOCKHOLM,

Tel. +46 8 632 2000, Fax. +46 8 632 2745

Greece: No. 15, 25th March Street, GR 17778 TAVROS/ATHENS,

Tel. +30 1 4894 339/239, Fax. +30 1 4814 240

Switzerland: Allmendstrasse 140, CH-8027 ZÜRICH,

Tel. +41 1 488 2686, Fax. +41 1 481 7730

Hungary: see Austria

India: Philips INDIA Ltd, Shivsagar Estate, A Block, Dr. Annie Besant Rd.

Worli, MUMBAI 400 018, Tel. +91 22 4938 541, Fax. +91 22 4938 722

Taiwan: PHILIPS TAIWAN Ltd., 23-30F, 66,

Chung Hsiao West Road, Sec. 1, P.O. Box 22978,

TAIPEI 100, Tel. +886 2 382 4443, Fax. +886 2 382 4444

Indonesia: see Singapore

Ireland: Newstead, Clonskeagh, DUBLIN 14,

Tel. +353 1 7640 000, Fax. +353 1 7640 200

Thailand: PHILIPS ELECTRONICS (THAILAND) Ltd.,

209/2 Sanpavuth-Bangna Road Prakanong, BANGKOK 10260,

Tel. +66 2 745 4090, Fax. +66 2 398 0793

Israel: RAPAC Electronics, 7 Kehilat Saloniki St, TEL AVIV 61180,

Tel. +972 3 645 0444, Fax. +972 3 649 1007

Turkey: Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,

Tel. +90 212 279 2770, Fax. +90 212 282 6707

Italy: PHILIPS SEMICONDUCTORS, Piazza IV Novembre 3,

20124 MILANO, Tel. +39 2 6752 2531, Fax. +39 2 6752 2557

Ukraine: PHILIPS UKRAINE, 4 Patrice Lumumba str., Building B, Floor 7,

252042 KIEV, Tel. +380 44 264 2776, Fax. +380 44 268 0461

Japan: Philips Bldg 13-37, Kohnan 2-chome, Minato-ku, TOKYO 108,

Tel. +81 3 3740 5130, Fax. +81 3 3740 5077

United Kingdom: Philips Semiconductors Ltd., 276 Bath Road, Hayes,

MIDDLESEX UB3 5BX, Tel. +44 181 730 5000, Fax. +44 181 754 8421

Korea: Philips House, 260-199 Itaewon-dong, Yongsan-ku, SEOUL,

Tel. +82 2 709 1412, Fax. +82 2 709 1415

United States: 811 East Arques Avenue, SUNNYVALE, CA 94088-3409,

Tel. +1 800 234 7381

Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA, SELANGOR,

Tel. +60 3 750 5214, Fax. +60 3 757 4880

Uruguay: see South America

Vietnam: see Singapore

Mexico: 5900 Gateway East, Suite 200, EL PASO, TEXAS 79905,

Tel. +9-5 800 234 7381

Yugoslavia: PHILIPS, Trg N. Pasica 5/v, 11000 BEOGRAD,

Tel. +381 11 625 344, Fax.+381 11 635 777

Middle East: see Italy

For all other countries apply to: Philips Semiconductors, Marketing & Sales Communications,

Internet: http://www.semiconductors.philips.com

Building BE-p, P.O. Box 218, 5600 MD EINDHOVEN, The Netherlands, Fax. +31 40 27 24825

SCA52

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.

The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed

without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license

under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

537021/1200/03/pp16

Date of release: 1996 Dec 11

Document order number: 9397 750 01471


型号：	TDA4670
厂家：	NXP
描述：	Picture Signal Improvement PSI circuit 图像信号PSI改进电路
文件：	总16页 (文件大小：108K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

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