TDA8010AM-T

更新时间:2024-10-29 13:00:47
品牌:NXP
描述:IC SPECIALTY TELECOM CIRCUIT, PDSO20, Telecom IC:Other

TDA8010AM-T 概述

IC SPECIALTY TELECOM CIRCUIT, PDSO20, Telecom IC:Other 其他电信集成电路

TDA8010AM-T 规格参数

生命周期:Obsolete包装说明:LSSOP,
Reach Compliance Code:unknownHTS代码:8542.39.00.01
风险等级:5.82JESD-30 代码:R-PDSO-G20
长度:6.5 mm功能数量:1
端子数量:20最高工作温度:80 °C
最低工作温度:-20 °C封装主体材料:PLASTIC/EPOXY
封装代码:LSSOP封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, LOW PROFILE, SHRINK PITCH认证状态:Not Qualified
座面最大高度:1.5 mm标称供电电压:5 V
表面贴装:YES电信集成电路类型:TELECOM CIRCUIT
温度等级:COMMERCIAL EXTENDED端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
宽度:4.4 mmBase Number Matches:1

TDA8010AM-T 数据手册

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INTEGRATED CIRCUITS  
DATA SHEET  
TDA8010M; TDA8010AM  
Low power mixers/oscillators  
for satellite tuners  
1996 Oct 24  
Objective specification  
Supersedes data of 1996 Oct 08  
File under Integrated Circuits, IC02  
Philips Semiconductors  
Objective specification  
Low power mixers/oscillators  
for satellite tuners  
TDA8010M;  
TDA8010AM  
FEATURES  
GENERAL DESCRIPTION  
Fully balanced mixer with common base input  
Wide input power and frequency range  
One-band 2 pin oscillator  
The TDA8010M; TDA8010AM are integrated circuits that  
perform the mixer/oscillator function in satellite tuners.  
The devices include a gain controlled IF amplifier that can  
directly drive two single-ended SAW filters or a differential  
SAW filter using a three function switchable output.  
They contain an internal LO prescaler and buffer that is  
compatible with the input of a terrestrial or satellite  
frequency synthesizer. They are also suitable for digital TV  
tuners. These devices are available in small outline  
packages that give the designer the capability to design an  
economical and physically small satellite tuner.  
Local oscillator buffer and prescaler  
SAW filter IF preamplifier with gain control input and  
switchable output  
Bandgap voltage stabilizer for oscillator stability  
External IF filter between the mixer output and the IF  
amplifier input.  
APPLICATIONS  
Down frequency conversion in DBS (Direct  
Broadcasting Satellite) satellite receivers.  
QUICK REFERENCE DATA  
SYMBOL  
VCC  
PARAMETER  
supply voltage  
CONDITIONS  
MIN.  
4.5  
TYP.  
5.0  
MAX.  
5.5  
UNIT  
V
ICC  
supply current  
70  
mA  
MHz  
MHz  
dB  
fRF  
RF frequency range  
oscillator frequency  
mixer noise figure  
maximum total gain  
minimum total gain  
700  
1380  
2150  
fosc  
2650  
NFM  
Gmax  
Gmin  
corrected for image  
mixer plus IF  
10  
40  
17  
dB  
mixer plus IF  
dB  
ORDERING INFORMATION  
TYPE  
PACKAGE  
NUMBER  
NAME  
DESCRIPTION  
VERSION  
TDA8010M  
SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm  
SOT266-1  
TDA8010AM  
1996 Oct 24  
2
Philips Semiconductors  
Objective specification  
Low power mixers/oscillators  
for satellite tuners  
TDA8010M; TDA8010AM  
BLOCK DIAGRAM  
(20) 1  
SC  
20 (1)  
LOOUT2  
DIVIDE-BY-2  
PRE-SCALER  
19 (2)  
(19) 2  
LOOUT1  
STABILIZER  
V
CCM  
LO  
BUFFER  
18 (3)  
(18) 3  
(17) 4  
(16) 5  
(15) 6  
(14) 7  
LOGND  
RFIN1  
RFIN2  
MGND  
MOUT1  
MOUT2  
RF INPUT  
STAGE  
17 (4)  
16 (5)  
OSC2  
OSC1  
OSCILLATOR  
15 (6)  
14 (7)  
OSCGND  
IFOUT2  
SWITCH  
CONTROL  
13 (8)  
12 (9)  
11 (10)  
IF AMP  
(13) 8  
(12) 9  
V
IFIN1  
IFIN2  
CC  
OUTPUT  
SWITCH  
IFGND  
R
TDA8010M  
TDA8010AM  
AGC  
(11) 10  
V
AGC  
IFOUT1  
CC  
MGE506  
The pin numbers given in parenthesis refer to the TDA8010AM.  
Fig.1 Block diagram.  
1996 Oct 24  
3
Philips Semiconductors  
Objective specification  
Low power mixers/oscillators  
for satellite tuners  
TDA8010M; TDA8010AM  
PINNING  
PINS  
SYMBOL  
DESCRIPTION  
TDA8010M TDA8010AM  
SC  
1
2
20  
19  
18  
17  
16  
15  
14  
13  
12  
11  
10  
9
IF output switch control  
supply voltage for mixer  
RF input 1  
VCCM  
RFIN1  
RFIN2  
MGND  
MOUT1  
MOUT2  
IFIN1  
3
4
RF input 2  
5
ground for mixer  
6
mixer output 1  
7
mixer output 2  
8
IF amplifier input 1  
IF amplifier input 2  
IF amplifier gain control input  
IF amplifier output 1  
ground for IF amplifier  
supply voltage  
IFIN2  
9
AGC  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
IFOUT1  
IFGND  
VCC  
8
IFOUT2  
OSCGND  
OSC1  
7
IF amplifier output 2  
ground for oscillator  
6
5
oscillator tuning circuit input 1  
oscillator tuning circuit input 2  
ground for local oscillator buffer  
local oscillator output 1  
OSC2  
4
LOGND  
LOOUT1  
LOOUT2  
3
2
1
local oscillator output 2  
handbook, halfpage  
handbook, halfpage  
SC  
20 LOOUT2  
LOOUT2  
LOOUT1  
LOGND  
OSC2  
20 SC  
1
2
1
2
V
19 LOOUT1  
18 LOGND  
19 V  
CCM  
CCM  
RFIN1  
RFIN2  
3
3
18 RFIN1  
17  
17  
RFIN2  
OSC2  
4
4
MGND  
MOUT1  
MOUT2  
IFIN1  
16 OSC1  
OSC1  
16 MGND  
15 MOUT1  
5
5
TDA8010M  
TDA8010AM  
6
15 OSCGND  
OSCGND  
IFOUT2  
6
IFOUT2  
MOUT2  
7
14  
13  
12  
7
14  
13 IFIN1  
IFIN2  
11 AGC  
8
V
V
8
CC  
CC  
IFIN2  
IFGND  
IFGND  
9
9
12  
AGC  
11 IFOUT1  
IFOUT1  
10  
10  
MGE504  
MGE505  
Fig.2 Pin configuration (TDA8010M).  
Fig.3 Pin configuration (TDA8010AM).  
1996 Oct 24  
4
Philips Semiconductors  
Objective specification  
Low power mixers/oscillators  
for satellite tuners  
TDA8010M; TDA8010AM  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
VCC  
PARAMETER  
MIN.  
0.3  
MAX.  
+6.0  
UNIT  
supply voltage  
maximum input voltage on all pins  
V
Vi(max)  
0.3  
VCC  
10  
V
Isource(max) maximum output source current  
mA  
s
tsc  
maximum short-circuit time on all outputs  
storage temperature  
10  
Tstg  
Tj  
55  
+150  
150  
+80  
°C  
°C  
°C  
junction temperature  
Tamb  
operating ambient temperature  
20  
THERMAL CHARACTERISTICS  
SYMBOL  
PARAMETER  
VALUE  
UNIT  
Rth j-a  
thermal resistance from junction to ambient in free air  
120  
K/W  
HANDLING  
All pins withstand the ESD test in accordance with “UZW-BO/FQ-A302 (human body model)” and with  
“UZW-BO/FQ-B302 (machine model)”.  
1996 Oct 24  
5
Philips Semiconductors  
Objective specification  
Low power mixers/oscillators  
for satellite tuners  
TDA8010M; TDA8010AM  
CHARACTERISTICS  
VCC = 5 V; Tamb = 25 °C; measured in application circuit of Fig.6; unless otherwise specified.  
SYMBOL PARAMETER CONDITIONS MIN. TYP.  
MAX.  
UNIT  
Supplies  
VCC  
ICC  
supply voltage  
4.75  
5.0  
5.25  
V
supply current  
60  
70  
80  
mA  
Mixer  
fRF  
NF  
RF frequency range  
700  
2150  
10  
15  
MHz  
dB  
dB  
dB  
dB  
dB  
dB  
total noise figure (mixer plus IF); VAGC = 0.9VCC; fi = 920 MHz  
not corrected for image  
8
VAGC = 0.9VCC; fi = 2150 MHz  
13  
10  
40  
38  
30  
GM  
available power gain for mixer  
RL = 2.2 kΩ  
Gmax1  
maximum total gain  
(mixer + IFOUT1)  
fi = 920 MHz; notes 1 and 2  
fi = 2150 MHz; notes 1 and 2  
notes 1 and 2  
37  
36  
Gmin1  
Gmax2  
minimum total gain  
(mixer + IFOUT1)  
14  
maximum total gain  
(mixer + IFOUT2)  
fi = 920 MHz; notes 1 and 2  
fi = 2150 MHz; notes 1 and 2  
notes 1 and 2  
36  
35  
39  
dB  
dB  
dB  
37  
Gmin2  
ZI(RF)  
minimum total gain  
(mixer + IFOUT2)  
30  
15  
input impedance (Rs + Ls)  
from 920 to 2150 MHz  
fIF = 480 MHz  
20  
5
30  
40  
10  
16  
650  
7.5  
12  
nH  
kΩ  
fF  
ZO(RF)  
output impedance (Rp//Cp)  
(open collector)  
8
450  
2  
10  
550  
+2  
IP3  
IP2  
third-order interception point  
see Fig.4  
dBm  
dBm  
second-order interception point see Fig.5  
25  
Local oscillator output  
VLO  
output voltage  
RL = 50 Ω  
87  
90  
93  
dBµV  
SRF  
spurious signal on LO output  
RL = 50 ; note 3  
35  
10  
dB  
with respect to LO output signal  
LOleak  
local oscillator leakage  
RF input  
50  
35  
dBm  
dBm  
IF output (mixer)  
Oscillator  
fosc  
oscillator frequency range  
VCC = 4.5 to 5.5 V;  
1380  
2650  
MHz  
Tamb = 20 to +80 °C  
fosc(max)  
fshift  
maximum oscillator frequency  
oscillator frequency shift  
2700  
MHz  
kHz  
VCC = 4.75 to 5.25 V;  
at 2550 MHz  
±350  
±500  
VCC = 4.75 to 5.25 V;  
at 2650 MHz  
±400  
±600  
kHz  
fdrift  
oscillator frequency drift  
T = 25 °C; at 2550 MHz  
T = 25 °C; at 2650 MHz  
8  
8  
15  
16  
MHz  
MHz  
1996 Oct 24  
6
Philips Semiconductors  
Objective specification  
Low power mixers/oscillators  
for satellite tuners  
TDA8010M; TDA8010AM  
SYMBOL  
PARAMETER  
CONDITIONS  
at 100 kHz  
MIN.  
88  
TYP.  
92  
MAX.  
UNIT  
dBc  
ΦN  
oscillator phase noise  
at 10 kHz  
62  
69  
dBc  
IF amplifier  
fIF  
IF frequency range  
maximum voltage gain  
minimum voltage gain  
IF noise figure  
60  
625  
MHz  
dB  
dB  
dB  
dBµV  
Gv(max)  
Gv(min)  
NFIF  
VoIF  
note 1  
note 2  
note 4  
40  
30  
8
output voltage level  
output impedance  
85  
ZO(IF)  
ZI(IF)  
single-ended  
50  
33  
7
input impedance (Rp//Lp)  
30  
36  
5
9
nH  
dB  
V
SWiso  
VSW  
switch isolation  
note 5  
33  
36  
switch control voltage  
IF1 on; IF2 off  
IF1 off; IF2 on  
differential output  
see Fig.6  
0.8VCC  
VCC  
0.2VCC  
0.6VCC  
0.07VCC  
V
0
V
RI(AGC)  
AGC input resistance  
4
kΩ  
Notes  
1. Maximum gain: VAGC = 0.9VCC; fIF = 480 MHz; IF output single-ended.  
2. Minimum gain: VAGC = 0.1VCC; fIF = 480 MHz; IF output single-ended.  
3. RF input power range = 70 to 20 dBm.  
4. VAGC = 0.9VCC; fIF = 480 MHz; Rsource = 100 .  
5. Switch isolation is defined at an IF output level of 77 dBµV; fIF = 480 MHz.  
handbook, halfpage  
REF  
handbook, halfpage  
IM2  
IM3  
LO F1 LO F2  
(F1 + F2) LO  
2F1 F2  
390  
F1  
420  
F2  
450  
2F2 F1  
480 (MHz)  
FI  
RF  
478  
964  
480  
962  
484 (MHz)  
1926 (MHz)  
MGE507  
MGE508  
REF is the level if F1 or F2 were at 480 MHz.  
IP3 = IM3/2 + input level.  
IP2 = IM2 + input level.  
Input level: 2 × −23 dBm.  
Input level: 2 × −23 dBm.  
Output level: 2 × 74 dBµV.  
Output level: 2 × 74 dBµV.  
Fig.4 IP3 measurement method.  
Fig.5 IP2 measurement method.  
1996 Oct 24  
7
Philips Semiconductors  
Objective specification  
Low power mixers/oscillators  
for satellite tuners  
TDA8010M; TDA8010AM  
APPLICATION INFORMATION  
GM5E09  
b
1996 Oct 24  
8
Philips Semiconductors  
Objective specification  
Low power mixers/oscillators  
for satellite tuners  
TDA8010M; TDA8010AM  
PACKAGE OUTLINE  
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm  
SOT266-1  
D
E
A
X
c
y
H
v
M
A
E
Z
11  
20  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
10  
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
10o  
0o  
0.15  
0
1.4  
1.2  
0.32  
0.20  
0.20  
0.13  
6.6  
6.4  
4.5  
4.3  
6.6  
6.2  
0.75  
0.45  
0.65  
0.45  
0.48  
0.18  
mm  
1.5  
0.65  
1.0  
0.2  
0.25  
0.13  
0.1  
Note  
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
90-04-05  
95-02-25  
SOT266-1  
1996 Oct 24  
9
Philips Semiconductors  
Objective specification  
Low power mixers/oscillators  
for satellite tuners  
TDA8010M; TDA8010AM  
If wave soldering cannot be avoided, the following  
conditions must be observed:  
SOLDERING  
Introduction  
A double-wave (a turbulent wave with high upward  
pressure followed by a smooth laminar wave)  
soldering technique should be used.  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
The longitudinal axis of the package footprint must  
be parallel to the solder flow and must incorporate  
solder thieves at the downstream end.  
Even with these conditions, only consider wave  
soldering SSOP packages that have a body width of  
4.4 mm, that is SSOP16 (SOT369-1) or  
SSOP20 (SOT266-1).  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
Reflow soldering  
Reflow soldering techniques are suitable for all SSOP  
packages.  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder is  
10 seconds, if cooled to less than 150 °C within  
6 seconds. Typical dwell time is 4 seconds at 250 °C.  
Several techniques exist for reflowing; for example,  
thermal conduction by heated belt. Dwell times vary  
between 50 and 300 seconds depending on heating  
method. Typical reflow temperatures range from  
215 to 250 °C.  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
Repairing soldered joints  
Fix the component by first soldering two diagonally-  
opposite end leads. Use only a low voltage soldering iron  
(less than 24 V) applied to the flat part of the lead. Contact  
time must be limited to 10 seconds at up to 300 °C. When  
using a dedicated tool, all other leads can be soldered in  
one operation within 2 to 5 seconds between  
270 and 320 °C.  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 minutes at  
45 °C.  
Wave soldering  
Wave soldering is not recommended for SSOP packages.  
This is because of the likelihood of solder bridging due to  
closely-spaced leads and the possibility of incomplete  
solder penetration in multi-lead devices.  
1996 Oct 24  
10  
Philips Semiconductors  
Objective specification  
Low power mixers/oscillators  
for satellite tuners  
TDA8010M; TDA8010AM  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
1996 Oct 24  
11  

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