TDA8579T [NXP]
Dual common-mode rejection differential line receiver; 双共模抑制差分线路接收机
| 型号： | TDA8579T |
| 厂家： | 
NXP |
| 描述： | Dual common-mode rejection differential line receiver |
| 文件： | 总13页 (文件大小：70K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA8579
Dual common-mode rejection
differential line receiver
1995 Dec 15
Product specification
Supersedes data of January 1994
File under Integrated Circuits, IC01
Philips Semiconductors
Product specification
Dual common-mode rejection
differential line receiver
TDA8579
FEATURES
GENERAL DESCRIPTION
• Excellent common-mode rejection, up to high
frequencies
The TDA8579 is a two channel differential amplifier with
0 dB gain and low distortion. The device has been
primarily developed for car radio applications where long
connections between signal sources and amplifiers (or
boosters) are necessary and where ground noise has to be
eliminated. The device is intended to be used to receive
line inputs in audio applications that require a high level of
common-mode rejection. The device is contained in an
8-pin small outline (SO) or dual in-line (DIP) package.
• Elimination of source resistance dependency in the
common-mode rejection
• Few external components
• High supply voltage ripple rejection
• Low noise
• Low distortion
• All pins protected against electrostatic discharge
• AC and DC short-circuit safe to ground and VCC
• Fast DC settling.
QUICK REFERENCE DATA
SYMBOL
VCC
PARAMETER
supply voltage
CONDITIONS
MIN.
5.0
TYP.
8.5
MAX.
18
UNIT
V
ICC
supply current
VCC = 8.5 V
−
11
14
+0.5
−
mA
dB
dB
µV
kΩ
dB
Gv
voltage gain
−0.5
55
−
0
SVRR
Vno
supply voltage ripple rejection
noise output voltage
input impedance
60
3.7
240
80
5.0
−
Zi
100
−
CMRR
common-mode rejection ratio
Rs = 0 Ω
−
ORDERING INFORMATION
TYPE
PACKAGE
DESCRIPTION
plastic dual in-line package; 8 leads (300 mil)
plastic small outline package; 8 leads; body width 3.9 mm
NUMBER
NAME
VERSION
TDA8579
DIP8
SO8
SOT97-1
SOT96-1
TDA8579T
1995 Dec 15
2
Philips Semiconductors
Product specification
Dual common-mode rejection
differential line receiver
TDA8579
BLOCK DIAGRAM
FUNCTIONAL DESCRIPTION
The TDA8579 contains two identical differential amplifiers
with a voltage gain of 0 dB. The device is intended to
receive line input signals for audio applications. The
TDA8579 has a very high level of common-mode rejection
and thus eliminates ground noise. The common-mode
rejection remains constant up to high frequencies (the
amplifier gain is fixed at 0 dB). The inputs have a high input
impedance. The output stage is a class AB stage with a
low output impedance. For a large common-mode
rejection, also at low frequencies, an electrolytic capacitor
connected to the negative input is advised. Because the
input impedance is relatively high, this results in a large
settling time of the DC input voltage. Therefore a
quick-charge circuit is included to charge the input
capacitor within 0.2 seconds.
V
CC
8
1
INL
IN
7
OUTL
SVRR
OUTR
V
CC
2
3
4
TDA8579
6
INR
5
MBD230
GND
All input and output pins are protected against high
electrostatic discharge conditions (4000 V, 150 pF, 150 Ω).
Fig.1 Block diagram.
PINNING
SYMBOL PIN
DESCRIPTION
positive input left
INL+
IN−
1
2
3
4
5
6
7
8
V
INL
IN
1
2
3
4
8
7
6
5
CC
common negative input
positive input right
half supply voltage
ground
OUTL
OUTR
INR+
SVRR
GND
OUTR
OUTL
VCC
TDA8579
INR
SVRR
GND
output right
MBD231
output left
Fig.2 Pin configuration.
supply voltage
1995 Dec 15
3
Philips Semiconductors
Product specification
Dual common-mode rejection
differential line receiver
TDA8579
LIMITING VALUES
in accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VCC
IORM
Vsc
PARAMETER
CONDITIONS
operating
MIN.
MAX.
18
UNIT
supply voltage
−
−
−
V
repetitive peak output current
AC and DC short-circuit safe voltage
storage temperature
40
mA
V
18
Tstg
Tamb
Tj
−55
−40
−
+150
+85
+150
°C
°C
°C
operating ambient temperature
maximum junction temperature
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
VALUE
UNIT
Rth j-a
thermal resistance from junction to ambient in free air
TDA8579 (DIP8)
110
160
K/W
K/W
TDA8579T (SO8)
1995 Dec 15
4
Philips Semiconductors
Product specification
Dual common-mode rejection
differential line receiver
TDA8579
CHARACTERISTICS
V
CC = 8.5 V; Tamb = 25 °C; f = 1 kHz; measured in test circuit of Fig.3; unless otherwise specified.
SYMBOL PARAMETER CONDITIONS MIN. TYP.
VCC supply voltage 5.0 8.5
MAX.
18
UNIT
V
ICC
VO
tset
Gv
supply current
−
11
4.3
0.2
0
14
−
mA
V
DC output voltage
DC input voltage settling time
voltage gain
note 1
−
−
−
s
−0.5
70
−
+0.5
−
dB
dB
dB
Hz
kHz
kΩ
Ω
αcs
channel separation
channel unbalance
low frequency roll-off
high frequency roll-off
input impedance
Rs = 5 kΩ
80
−
∆Gv
0.5
−
fL
−1 dB; note 2
−1 dB
20
20
100
−
−
fH
−
−
Zi
240
−
−
Zo
output impedance
maximum input voltage
noise output voltage
10
−
Vi(max)
Vno
THD = 1%
−
2.0
3.7
−
V
Rs = 0 Ω; note 3
−
5.0
1.0
µV
V
VCM(rms)
common-mode input voltage
(RMS value)
−
CMRR
SVRR
THD
common-mode rejection ratio
supply voltage ripple rejection
total harmonic distortion
Rs = 5 kΩ
Rs = 0 Ω; note 4
note 5
66
−
70
80
65
60
0.02
−
−
dB
dB
dB
dB
%
−
55
−
−
note 6
−
Vi = 1 V;
−
−
Vi = 1 V;
−
0.1
%
f = 20 Hz to 20 kHz
THDmax
total harmonic distortion at
maximum output current
Vi = 1 V; RL = 150 Ω
−
−
1
%
Notes
1. The DC output voltage with respect to ground is approximately 0.5VCC
2. The frequency response is externally fixed by the input coupling capacitors.
3. The noise output voltage is measured in a bandwidth of 20 Hz to 20 kHz (unweighted).
.
4. The common-mode rejection ratio is measured at the output with a voltage source 1 V (RMS) in accordance with the
test circuit (see Fig.3) while VINL and VINR are short-circuited. Frequencies between 100 Hz and 100 kHz.
5. The ripple rejection is measured at the output, with Rs = 2 kΩ, f = 1 kHz and a ripple amplitude of 2 V (p-p).
6. The ripple rejection is measured at the output, with Rs = 0 to 2 kΩ, f = 100 Hz to 20 kHz and a maximum ripple
amplitude of 2 V (p-p).
1995 Dec 15
5
Philips Semiconductors
Product specification
Dual common-mode rejection
differential line receiver
TDA8579
8.5 V
100 nF
220 nF
R
s
8
V
2.2 µ
47 µ
F
F
F
1
2
INL
5 k
Ω
7
OUTL
V
CC
22 µ
F
TDA8579
4
SVRR
V
V
2.2 µ
INR
CM
6
OUTR
220 nF
R
s
3
R
R
L
L
5
5 kΩ
10 k
10 k
Ω
Ω
MBD232
Fig.3 Test and application circuit.
MBD215
1
10
THD
(%)
2
10
3
10
2
3
4
5
10
10
10
10
10
f (Hz)
Fig.4 Total harmonic distortion as a function of frequency; Vi = 1 V (RMS).
6
1995 Dec 15
Philips Semiconductors
Product specification
Dual common-mode rejection
differential line receiver
TDA8579
MBD216
0
CMR
(dB)
20
40
60
(1)
(2)
80
(3)
100
2
3
4
5
10
10
10
10
10
f (Hz)
(1) Rs = 5 kΩ.
(2) Rs = 2 kΩ.
(3) Rs = 0 kΩ.
Fig.5 Common-mode rejection ratio as a function of frequency; VCM = 1 V (RMS).
MBD213
1
THD
(%)
1
10
2
10
3
10
2
3
4
10
10
10
10
V
(mV)
i (rms)
Fig.6 Total harmonic distortion as a function of input voltage; f = 1 kHz.
7
1995 Dec 15
Philips Semiconductors
Product specification
Dual common-mode rejection
differential line receiver
TDA8579
MBD214
40
CMR
(dB)
50
60
70
80
90
100
300
500
700
900
1100
1300
V
(mV)
CM (rms)
Fig.7 Common-mode rejection ratio as a function of common-mode input voltage; f = 1 kHz (Rs = 0 Ω).
MBD211
0
CMR
(dB)
20
40
60
(1)
(2)
(3)
80
100
2
3
4
5
10
10
10
10
10
f (Hz)
(1) C2 = 22 µF.
(2) C2 = 47 µF.
(3) C2 = 100 µF.
Fig.8 Common-mode rejection ratio as a function of frequency; VCM = 1 V (RMS).
8
1995 Dec 15
Philips Semiconductors
Product specification
Dual common-mode rejection
differential line receiver
TDA8579
MBD212
30
SVR
(dB)
40
50
60
70
2
3
4
10
10
10
10
f (Hz)
Fig.9 Supply voltage ripple rejection as a function of frequency; Vripple = 2 V (p-p), Rs = 2 kΩ.
1995 Dec 15
9
Philips Semiconductors
Product specification
Dual common-mode rejection
differential line receiver
TDA8579
PACKAGE OUTLINES
DIP8: plastic dual in-line package; 8 leads (300 mil)
SOT97-1
D
M
E
A
2
A
A
1
L
c
w M
Z
b
1
e
(e )
1
M
H
b
b
2
8
5
pin 1 index
E
1
4
0
5
10 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
(1)
Z
A
A
A
2
(1)
(1)
1
w
UNIT
mm
b
b
b
c
D
E
e
e
L
M
M
H
1
2
1
E
max.
min.
max.
max.
1.73
1.14
0.53
0.38
1.07
0.89
0.36
0.23
9.8
9.2
6.48
6.20
3.60
3.05
8.25
7.80
10.0
8.3
4.2
0.51
3.2
2.54
0.10
7.62
0.30
0.254
0.01
1.15
0.068 0.021 0.042 0.014
0.045 0.015 0.035 0.009
0.39
0.36
0.26
0.24
0.14
0.12
0.32
0.31
0.39
0.33
inches
0.17
0.020
0.13
0.045
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
92-11-17
95-02-04
SOT97-1
050G01
MO-001AN
1995 Dec 15
10
Philips Semiconductors
Product specification
Dual common-mode rejection
differential line receiver
TDA8579
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
v
c
y
H
M
A
E
Z
5
8
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
4
e
w
M
detail X
b
p
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.050
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches 0.069
0.01 0.004
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
95-02-04
97-05-22
SOT96-1
076E03S
MS-012AA
1995 Dec 15
11
Philips Semiconductors
Product specification
Dual common-mode rejection
differential line receiver
TDA8579
Several techniques exist for reflowing; for example,
SOLDERING
Introduction
thermal conduction by heated belt. Dwell times vary
between 50 and 300 seconds depending on heating
method. Typical reflow temperatures range from
215 to 250 °C.
There is no soldering method that is ideal for all IC
packages. Wave soldering is often preferred when
through-hole and surface mounted components are mixed
on one printed-circuit board. However, wave soldering is
not always suitable for surface mounted ICs, or for
printed-circuits with high population densities. In these
situations reflow soldering is often used.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 minutes at
45 °C.
WAVE SOLDERING
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “IC Package Databook” (order code 9398 652 90011).
Wave soldering techniques can be used for all SO
packages if the following conditions are observed:
• A double-wave (a turbulent wave with high upward
pressure followed by a smooth laminar wave) soldering
technique should be used.
DIP
SOLDERING BY DIPPING OR BY WAVE
• The longitudinal axis of the package footprint must be
parallel to the solder flow.
The maximum permissible temperature of the solder is
260 °C; solder at this temperature must not be in contact
with the joint for more than 5 seconds. The total contact
time of successive solder waves must not exceed
5 seconds.
• The package footprint must incorporate solder thieves at
the downstream end.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
The device may be mounted up to the seating plane, but
the temperature of the plastic body must not exceed the
specified maximum storage temperature (Tstg max). If the
printed-circuit board has been pre-heated, forced cooling
may be necessary immediately after soldering to keep the
temperature within the permissible limit.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder is
10 seconds, if cooled to less than 150 °C within
6 seconds. Typical dwell time is 4 seconds at 250 °C.
REPAIRING SOLDERED JOINTS
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Apply a low voltage soldering iron (less than 24 V) to the
lead(s) of the package, below the seating plane or not
more than 2 mm above it. If the temperature of the
soldering iron bit is less than 300 °C it may remain in
contact for up to 10 seconds. If the bit temperature is
between 300 and 400 °C, contact may be up to 5 seconds.
REPAIRING SOLDERED JOINTS
Fix the component by first soldering two diagonally-
opposite end leads. Use only a low voltage soldering iron
(less than 24 V) applied to the flat part of the lead. Contact
time must be limited to 10 seconds at up to 300 °C. When
using a dedicated tool, all other leads can be soldered in
one operation within 2 to 5 seconds between
270 and 320 °C.
SO
REFLOW SOLDERING
Reflow soldering techniques are suitable for all SO
packages.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
1995 Dec 15
12
Philips Semiconductors
Product specification
Dual common-mode rejection
differential line receiver
TDA8579
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1995 Dec 15
13
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