TDA8579T/N1,112 [NXP]
TDA8579T - Dual common-mode rejection differential line receiver SOIC 8-Pin;
| 型号： | TDA8579T/N1,112 |
| 厂家： | 
NXP |
| 描述： | TDA8579T - Dual common-mode rejection differential line receiver SOIC 8-Pin |
| 文件： | 总16页 (文件大小：543K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TDA8579T
Dual common-mode rejection differential line receiver
Rev. 4 — 23 September 2013
Product data sheet
1. General description
The TDA8579T is a two channel differential amplifier with 0 dB gain and low distortion.
The device has been primarily developed for car radio applications where long
connections between signal sources and amplifiers (or boosters) are necessary and
where ground noise has to be eliminated. The device is intended to be used to receive line
inputs in audio applications that require a high level of common-mode rejection. The
device is contained in an 8-pin Small Outline (SO) package.
2. Features and benefits
Excellent common-mode rejection, up to high frequencies
Elimination of source resistance dependency in the common-mode rejection
Few external components
High supply voltage ripple rejection
Low noise
Low distortion
All pins protected against electrostatic discharge
AC and DC short-circuit safe to ground and VCC
Fast DC settling
3. Quick reference data
Table 1.
Symbol
VCC
Quick reference data
Parameter
Conditions
Min
5.0
-
Typ Max Unit
supply voltage
8.5 18
V
ICC
supply current
VCC = 8.5 V
11
0
14
mA
GV
voltage gain
0.5
55
-
+0.5 dB
SVRR
Vno
supply voltage ripple rejection
noise output voltage
input impedance
60
-
dB
V
k
dB
3.7 5.0
|Zi|
100
-
240
80
-
-
CMRR
common-mode rejection ratio
Rs = 0
TDA8579T
NXP Semiconductors
Dual common-mode rejection differential line receiver
4. Ordering information
Table 2.
Ordering information
Type number
Package
Name
SO8
Description
plastic small outline package; 8 leads; body width 3.9 mm
Version
TDA8579T
SOT96-1
5. Block diagram
V
CC
8
1
2
3
7
4
6
INL+
IN-
OUTL
SVRR
V
CC
TDA8579T
OUTR
INR+
5
GND
aaa-008045
Fig 1. Block diagram
6. Pinning information
6.1 Pinning
1
2
3
4
8
INL+
VCC
7
6
5
IN-
OUTL
OUTR
GND
TDA8579T
INR+
SVRR
aaa-008040
Fig 2. Pin configuration
TDA8579T
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 23 September 2013
2 of 16
TDA8579T
NXP Semiconductors
Dual common-mode rejection differential line receiver
6.2 Pin description
Table 3.
Symbol
INL+
Pin description
Pin Description
1
2
3
4
5
6
7
8
positive input left
common negative input
IN
INR+
SVRR
GND
positive input right
half supply voltage
ground
OUTR
OUTL
Vcc
output right
output left
supply voltage
7. Functional description
The TDA8579T contains two identical differential amplifiers with a voltage gain of 0 dB.
The device is intended to receive line input signals for audio applications. The TDA8579T
has a very high level of common-mode rejection and thus eliminates ground noise. The
common-mode rejection remains constant up to high frequencies (the amplifier gain is
fixed at 0 dB). The inputs have a high input impedance. The output stage is a class AB
stage with a low output impedance. For a large common-mode rejection, also at low
frequencies, an electrolytic capacitor connected to the negative input is advised. Because
the input impedance is relatively high, this results in a large settling time of the DC input
voltage. Therefore a quick-charge circuit is included to charge the input capacitor within
0.2 seconds.
All input and output pins are protected against high electrostatic discharge conditions
(4000 V, 150 pF, 150 ).
TDA8579T
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 23 September 2013
3 of 16
TDA8579T
NXP Semiconductors
Dual common-mode rejection differential line receiver
8. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages and currents
are referenced to GND unless otherwise specified.
Symbol Parameter
Conditions
Min
Max
18
Unit
V
VCC
IORM
Vsc
supply voltage
-
repetitive peak output current
AC and DC short-circuit safe voltage
storage temperature
-
40
mA
V
-
18
Tstg
Tamb
Tj
55
40
-
+150
+85
150
C
C
C
ambient temperature
maximum junction temperature
9. Thermal characteristics
Table 5.
Thermal characteristics
According to IEC 60747-1.
Symbol Parameter
Conditions
Value
160
Unit
K/W
Rth(j-a)
thermal resistance from junction to ambient in free air
TDA8579T
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 23 September 2013
4 of 16
TDA8579T
NXP Semiconductors
Dual common-mode rejection differential line receiver
10. Characteristics
Table 6.
Electrical characteristics
VCC = 8.5 V; Tamb = 25 C; test circuit (see Figure 3); unless otherwise specified.
Symbol Parameter
Conditions
Min
Typ
8.5
11
4.3
0.2
0
Max Unit
VCC
supply voltage
5.0
18
14
-
V
ICC
VO
supply current
-
mA
V
[1]
[2]
[3]
output voltage
-
tset
DC input voltage settling time
voltage gain
-
-
s
Gv
0.5
+0.5 dB
cs
|Gv|
fL
channel separation
channel unbalance
LOW frequency roll-off
HIGH frequency roll-off
input impedance
Rs = 5 k
70
80
-
-
dB
dB
Hz
kHz
k
-
0.5
-
1 dB
1 dB
20
-
fH
20
-
-
|Zi|
100
240
-
-
|Zo|
Vi(max)
Vno
output impedance
maximum input voltage
noise output voltage
-
-
-
-
10
-
THD = 1 %
2.0
3.7
-
V
Rs = 0
5.0
1.0
V
V
VCM(rms) common-mode input voltage
(RMS value)
CMRR common-mode rejection ratio
Rs = 5 k
Rs = 0
66
-
70
80
65
60
0.02
-
-
dB
dB
dB
dB
%
[4]
[5]
[6]
-
SVRR
THD
supply voltage ripple rejection
total harmonic distortion
55
-
-
-
Vi = 1 V;
-
-
Vi = 1 V;
-
0.1
%
f = 20 Hz to 20 kHz
THDmax total harmonic distortion at
maximum output current
Vi = 1 V; RL = 150
-
-
1
%
[1] The DC output voltage with respect to ground is approximately 0.5VCC
.
[2] The input coupling capacitors set the frequency response externally.
[3] The noise output voltage is measured in a bandwidth of 20 Hz to 20 kHz (unweighted).
[4] The common-mode rejection ratio is measured at the output with a voltage source 1 V (RMS) in
accordance with the test circuit (see Figure 3). VINL and VINR are short-circuited. Frequencies are between
100 Hz and 100 kHz.
[5] The ripple rejection is measured at the output, with Rs = 2 k, f = 1 kHz and a ripple amplitude of 2 V (p-p).
[6] The ripple rejection is measured at the output. Rs = 0 to 2 k, f = 100 Hz to 20 kHz and a maximum
ripple amplitude of 2 V (p-p).
TDA8579T
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 23 September 2013
5 of 16
TDA8579T
NXP Semiconductors
Dual common-mode rejection differential line receiver
11. Application information
V
CC
100 nF
R
s
220 nF
5 kΩ
8
1
2
2.2 μF
47 μF
2.2 μF
7
4
6
+
-
OUTL
V
CC
V
INL
TDA8579T
C2
SVRR
V
V
INR
CM
-
+
R
s
OUTR
220 nF
5 kΩ
3
R
R
L
L
5
10 kΩ
10 kΩ
aaa-007782
C2 = nominal 22 F
Fig 3. Test and application circuit
mbd215
-1
10
THD
(%)
-2
10
-3
10
2
3
4
5
10
10
10
10
10
f (Hz)
Fig 4. Total harmonic distortion as a function of frequency; Vi = 1 V (RMS)
TDA8579T
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 23 September 2013
6 of 16
TDA8579T
NXP Semiconductors
Dual common-mode rejection differential line receiver
mbd216
0
CMR
(dB)
-20
-40
-60
-80
(1)
(2)
(3)
-100
10
2
3
4
5
10
10
10
10
f (Hz)
(1) Rs = 5 k
(2) Rs = 2 k
(3) Rs = 0 k
Fig 5. Common-mode rejection ratio as a function of frequency; VCM = 1 V (RMS)
mbd213
1
THD
(%)
-1
10
-2
10
-3
10
2
3
4
10
10
10
10
V
(mV)
i(rms)
Fig 6. Total harmonic distortion as a function of input voltage; f = 1 kHz
TDA8579T
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 23 September 2013
7 of 16
TDA8579T
NXP Semiconductors
Dual common-mode rejection differential line receiver
mbd214
-40
CMR
(dB)
-50
-60
-70
-80
-90
100
300
500
700
900
1100
1300
V
(mV)
CM(rms)
Fig 7. Common-mode rejection ratio as a function of common-mode input voltage; f = 1 kHz, Rs = 0
mbd211
0
CMR
(dB)
-20
-40
(1)
(2)
(3)
-60
-80
-100
2
3
4
5
10
10
10
10
10
f (Hz)
(1) C2 = 22 F
(2) C2 = 47 F
(3) C2 = 100 F
Fig 8. Common-mode rejection ratio as a function of frequency; VCM = 1 V (RMS)
TDA8579T
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 23 September 2013
8 of 16
TDA8579T
NXP Semiconductors
Dual common-mode rejection differential line receiver
mbd212
-30
SVR
(dB)
-40
-50
-60
-70
10
2
3
4
10
10
10
f (Hz)
Fig 9. Supply voltage ripple rejection as a function of frequency; Vripple = 2 V (p-p), Rs = 2 k
TDA8579T
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 23 September 2013
9 of 16
TDA8579T
NXP Semiconductors
Dual common-mode rejection differential line receiver
12. Package outline
SO8: plastic small outline package; 8 leads; body width 3.9 mm
SOT96-1
D
E
A
X
v
c
y
H
M
A
E
Z
5
8
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
4
e
w
M
detail X
b
p
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(2)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
5.0
4.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.05
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.20
0.014 0.0075 0.19
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches 0.069
0.01 0.004
Notes
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
2. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
JEITA
99-12-27
03-02-18
SOT96-1
076E03
MS-012
Fig 10. Package outline SOT96-1 (SO8)
TDA8579T
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 23 September 2013
10 of 16
TDA8579T
NXP Semiconductors
Dual common-mode rejection differential line receiver
13. Handling information
All input and output pins are protected against ElectroStatic Discharge (ESD) under
normal handling. When handling ensure that the appropriate precautions are taken as
described in JESD625-A or equivalent standards.
14. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
14.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
14.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
• Board specifications, including the board finish, solder masks and vias
• Package footprints, including solder thieves and orientation
• The moisture sensitivity level of the packages
• Package placement
• Inspection and repair
• Lead-free soldering versus SnPb soldering
14.3 Wave soldering
Key characteristics in wave soldering are:
TDA8579T
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 23 September 2013
11 of 16
TDA8579T
NXP Semiconductors
Dual common-mode rejection differential line receiver
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
14.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 11) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 7 and 8
Table 7.
SnPb eutectic process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350
350
220
< 2.5
235
220
2.5
220
Table 8.
Lead-free process (from J-STD-020D)
Package thickness (mm) Package reflow temperature (C)
Volume (mm3)
< 350
260
350 to 2000
> 2000
260
< 1.6
260
250
245
1.6 to 2.5
> 2.5
260
245
250
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 11.
TDA8579T
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 23 September 2013
12 of 16
TDA8579T
NXP Semiconductors
Dual common-mode rejection differential line receiver
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 11. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
15. Revision history
Table 9.
Revision history
Document ID
TDA8579T v.4
Modifications:
TDA8579T v.3
Modifications:
Release date
Data sheet status
Change notice
Supersedes
20130923
Product data sheet
-
TDA8579 v.3
•
Security status changed from company confidential to company public.
20130606 Product data sheet
-
TDA8579 v.2
• The format of this document has been redesigned to comply with the new identity guidelines of
NXP Semiconductors.
• Legal texts have been adapted to the new company name where appropriate.
TDA8579 v.2
TDA8579 v.1
19951215
Product data sheet
-
TDA8579 v.1
19940125
Product data sheet
-
-
TDA8579T
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© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 23 September 2013
13 of 16
TDA8579T
NXP Semiconductors
Dual common-mode rejection differential line receiver
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Development
Definition
Objective [short] data sheet
This document contains data from the objective specification for product development.
This document contains data from the preliminary specification.
This document contains the product specification.
Preliminary [short] data sheet Qualification
Product [short] data sheet Production
[1]
[2]
[3]
Please consult the most recently issued document before initiating or completing a design.
The term ‘short data sheet’ is explained in section “Definitions”.
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
Suitability for use — NXP Semiconductors products are not designed,
16.2 Definitions
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
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Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
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TDA8579T
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 23 September 2013
14 of 16
TDA8579T
NXP Semiconductors
Dual common-mode rejection differential line receiver
Export control — This document as well as the item(s) described herein
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Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
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Quick reference data — The Quick reference data is an extract of the
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Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
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non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
TDA8579T
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2013. All rights reserved.
Product data sheet
Rev. 4 — 23 September 2013
15 of 16
TDA8579T
NXP Semiconductors
Dual common-mode rejection differential line receiver
18. Contents
1
2
3
4
5
General description. . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . . 1
Ordering information. . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6
6.1
6.2
Pinning information. . . . . . . . . . . . . . . . . . . . . . 2
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 3
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Thermal characteristics . . . . . . . . . . . . . . . . . . 4
Characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . 5
Application information. . . . . . . . . . . . . . . . . . . 6
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 10
Handling information. . . . . . . . . . . . . . . . . . . . 11
8
9
10
11
12
13
14
Soldering of SMD packages . . . . . . . . . . . . . . 11
Introduction to soldering . . . . . . . . . . . . . . . . . 11
Wave and reflow soldering . . . . . . . . . . . . . . . 11
Wave soldering. . . . . . . . . . . . . . . . . . . . . . . . 11
Reflow soldering. . . . . . . . . . . . . . . . . . . . . . . 12
14.1
14.2
14.3
14.4
15
Revision history. . . . . . . . . . . . . . . . . . . . . . . . 13
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 14
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 14
Definitions. . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 15
16.1
16.2
16.3
16.4
17
18
Contact information. . . . . . . . . . . . . . . . . . . . . 15
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 23 September 2013
Document identifier: TDA8579T
相关型号：
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