TDA8718 [NXP]
8-bit high-speed analog-to-digital converter; 8位高速模拟数字转换器
| 型号： | TDA8718 |
| 厂家： | 
NXP |
| 描述： | 8-bit high-speed analog-to-digital converter |
| 文件： | 总16页 (文件大小：113K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA8718
8-bit high-speed analog-to-digital
converter
June 1994
Product specification
Supersedes data of April 1993
File under Integrated Circuits, IC02
Philips Semiconductors
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
FEATURES
GENERAL DESCRIPTION
The TDA8718 is an 8-bit analog-to-digital converter (ADC)
designed for professional applications. The device
converts the analog input signal into 8-bit binary coded
digital words at a sampling rate of 600 MHz. It has an
effective bandwidth capability up to 150 MHz full-scale
sine wave. All digital outputs are ECL compatible.
• 8-bit resolution
• Sampling rate up to 600 MHz
• ECL (100K family) compatible for digital inputs and
outputs
• Overflow/Underflow output
• 50 Ω load drive capability
• Low input capacitance (5 pF typ.).
APPLICATIONS
• High speed analog-to-digital conversion
• Industrial instrumentation
• Data communication
• RF communication.
QUICK REFERENCE DATA
Measured over full voltage and temperature ranges, unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
−4.2
TYP.
−4.5
MAX.
UNIT
VEEA
VEED
Iref
analog supply voltage
digital supply voltage
−4.8
−4.8
60
V
−4.2
30
30
100
40
155
−
−4.5
45
V
resistive ladder current
analog supply current
R = 48 Ω
mA
mA
mA
mA
mA
LSB
LSB
bits
IEEA
42
54
IEED
IEEO(L)
IEEO(H)
ILE
digital supply current
120
70
150
90
LOW level output supply current
HIGH level output supply current
DC integral linearity error
DC differential linearity error
effective bits
RL = 50 Ω
RL = 50 Ω
170
±0.7
±0.3
7.5
185
±1.0
±0.5
−
DLE
EB
−
fi = 4.43 MHz; Iref = 45 mA;
fclk = 100 MHz
−
fi = 4.43 MHz; Iref = 45 mA;
fclk = 100 MHz
−
6.5
−
bits
fclk(max)
Ptot
maximum clock frequency
total power dissipation
600
−
−
MHz
mW
−
990
1250
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
PINS
PIN POSITION
MATERIAL
CODE
SOT261-2
TDA8718K
28
PLCC28
plastic
June 1994
2
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
BLOCK DIAGRAM
clock inputs
analog negative
supply voltage
digital negative
supply voltage
V
V
CLK
9
CLK
8
EEA
EED
28
23
TDA8718
V
2
18
6
output
ground
RM
OGND2
OF
reference
CLOCK DRIVER
voltage middle
V
RT
5
overflow
output
reference
voltage TOP
10 D7
13 D6
MSB
8 Ω
INPUT
AND
OUTPUT
D5
14
RESISTOR
LADDER
15 D4
16 D3
17 D2
19 D1
20 D0
V
I
LATCHES
3
analog
&
data outputs
ECL OUTPUTS
voltage input
32 Ω
8 Ω
&
ANALOG SIGNAL
PROCESSING
DIGITAL
DECODING
LSB
V
RB
1
reference
21 UF
underflow
output
voltage BOTTOM
24
12
11
27
AGND
DGND
V
MBB854 - 2
BB
analog ground
digital ground
OGND1
Fig.1 Block diagram.
June 1994
3
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
PINNING
SYMB
PIN
DESCRIPTION
OL
VRB
1
2
3
4
5
6
7
8
9
reference voltage BOTTOM
reference voltage MIDDLE decoupling
analog input voltage
not connected
VRM
VI
n.c.
VRT
OF
reference voltage TOP
overflow digital output
not connected
handbook, halfpage
n.c.
CLK
CLK
D7
clock input
complementary clock input
V
5
6
7
8
9
25 n.c.
RT
OF
10 digital output; bit 7 (MSB)
11 ECL reference voltage
24 DGND
VBB
V
23
22
21
20
n.c.
EED
OGND1 12 output ground 1 (0 V)
n.c.
CLK
TDA8718
D6
D5
D4
D3
D2
13 digital output; bit 6
14 digital output; bit 5
15 digital output; bit 4
16 digital output; bit 3
17 digital output; bit 2
CLK
UF
D0
D7 10
V
11
19 D1
BB
MBB850 - 2
OGND2 18 output ground 2 (0 V)
D1
19 digital output; bit 1
20 digital output; bit 0 (LSB)
21 underflow digital output
22 not connected
D0
UF
n.c.
VEED
DGND
n.c.
23 digital supply voltage (−4.5 V)
24 digital ground
25 not connected
n.c.
26 not connected
AGND
VEEA
27 analog ground
Fig.2 Pin configuration.
28 analog supply voltage (−4.5 V)
June 1994
4
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VEEA
PARAMETER
analog supply voltage (pin 28)
digital supply voltage (pin 23)
CONDITIONS
MIN.
−7.0
MAX.
+0.3
UNIT
V
VEED
−7.0
+0.3
+1.0
V
V
∆VEE
supply voltage difference between VEEA
and VEED
−1.00
VI
input voltage (pin 3)
referenced to AGND
VEEA
0
V
V
∆Vclk(p-p)
clock input voltage difference between referenced to VEED
;
−
2.0
CLK and CLK pin 8 to pin 9
(peak-to-peak value)
note 1
IO
output current for each digital output
storage temperature
−
30
mA
°C
°C
°C
Tstg
Tamb
Tj
−55
0
+150
+70
+150
operating ambient temperature
junction temperature
−
Note
1. The circuit has two clock inputs CLK and CLK. Sampling takes place on the falling edge of the clock input signal;
CLK and CLK are two complementary signals.
THERMAL CHARACTERISTICS
SYMBOL
Rth j-a
PARAMETER
VALUE
UNIT
thermal resistance from junction to ambient in free air
55
K/W
MBB851
0
handbook, halfpage
∆ R
th j-a
(%)
10
20
30
40
50
0
200
400
600
800
1000
airflow (LFPM)
Test conditions: PCB (2.24 × 2.24 × 0.062 inches).
LFPM = Linear Foot Per Minute.
Fig.3 Average effect of air flow on Rth j-a
.
June 1994
5
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
CHARACTERISTICS
V
T
EEA = −4.2 to −4.8 V; VEED = −4.2 to −4.8 V; VEEA to VEED = −0.1 to +0.1 V; AGND and DGND shorted together;
amb = 0 to +70 °C; typical values measured at VEEA = −4.5 V, VEED = −4.5 V and Tamb = 25 °C;
unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Supply
VEEA
analog supply voltage (pin 28)
digital supply voltage (pin 23)
analog supply current (pin 28)
digital supply current (pin 23)
LOW level output supply current
HIGH level output supply current
−4.2
−4.5
−4.8
V
V
VEED
IEEA
−4.2
30
−4.5
42
−4.8
54
mA
mA
mA
mA
IEED
100
40
120
70
150
90
IEEO(L)
IEEO(H)
RL = 50 Ω
RL = 50 Ω
155
170
185
Reference voltages for the resistor ladder (see Table 1)
IRT
reference current (pin 5)
reference voltage BOTTOM (pin 1)
reference voltage TOP (pin 5)
resistor ladder
R = 48 Ω
30
−
45
60
−
mA
V
VRB
48 Ω × IRT
VRT
−
0
−
V
RLAD
TCRLAD
−
48
175
−
Ω
temperature coefficient of the
resistor ladder
−
−
MΩ/K
VosB
VosT
voltage offset BOTTOM
voltage offset TOP
note 1
note 1
−
−
8 Ω × IRT
8 Ω × IRT
−
−
mV
mV
Inputs
CLK INPUT (PIN 8); CLK INPUT (PIN 9)
VIL
VIH
IIL
LOW level input voltage
HIGH level input voltage
LOW level input current
HIGH level input current
input resistance
−
−
−
−
−
−
−
−1.8
−0.8
0
−
−
−
−
−
−
−
V
V
Vclk = −1.8 V
Vclk = −0.8 V
fclk = 100 MHz
fclk = 100 MHz
µA
µA
kΩ
pF
mV
IIH
RI
120
1.5
3.5
900
CI
input capacitance
∆Vclk(p-p) clock input voltage difference
between CLK and CLK pin 8 to
pin 9 (peak-to-peak value)
ANALOG INPUT (PIN 3); NOTE 2
IIL
IIH
RI
CI
LOW level input current
HIGH level input current
input resistance
data output = 00
data output = FF
20
100
−
40
200
10
5
80
400
−
µA
µA
kΩ
pF
input capacitance
−
−
June 1994
6
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX.
UNIT
Outputs (RL = 50 Ω)
DIGITAL 100K ECL OUTPUTS (D0 TO D7; OF; UF)
VOL
VOH
VECL
IOL
LOW level output voltage
HIGH level output voltage
ECL reference voltage
Tamb = 25 °C
−
−1770
−1650
mV
Tamb = 25 °C
−1300
−1550
4
−1150
−1450
6
−
mV
mV
mA
mA
−1350
8
LOW level output current
HIGH level output current
IOH
10
20
25
Switching characteristics
fclk(max) maximum clock frequency
600
−
−
−
MHz
ps
(pins 8 and 9)
tr; tf
rise and fall times
fi = 100 MHz
−
750
Analog signal processing (fclk = 500 MHz)
HARMONICS (FULL SCALE)
h1
h2
h3
fundamental harmonics
second harmonics
third harmonics
fi = 100 MHz
fi = 100 MHz
fi = 100 MHz
−
−
−
0
−
−
−
dB
dB
dB
−54
−50
Transfer function
ILE
DC integral linearity error
−
−
−
−
±0.7
±0.3
±0.9
7.5
±1.0
±0.5
±1.5
−
LSB
LSB
LSB
bits
DLE
AILE
EB
DC differential linearity error
AC integral linearity error
effective bits
note 3
fi = 4.43 MHz, full scale;
Iref = 45 mA; note 4;
f
clk = 100 MHz; Fig.5
fi = 100 MHz, full scale;
Iref = 45 mA; note 4;
fclk = 500 MHz; Fig.6
−
−
6.5
−
−
bits
BER
bit error rate
f
clk = 500 MHz;
10−11
times/
fi = 100 MHz;
samples
Vi = ±8 LSB at code
128; 50% clock duty
cycle
Timing (fclk = 500 MHz; RL = 50 Ω; CL = 5 pF) note 5
tds
th
sampling delay
output hold time
output delay time
−
−
300
−
ps
ps
ps
400
−
700
1300
td
1500
June 1994
7
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
Notes to the “Characteristics”
1. Voltage offset BOTTOM (VosB) is the difference between the analog input which produces data outputs equal to 00
and the reference voltage BOTTOM (VRB) at Tamb = 25 °C. Voltage offset TOP (VosT) is the difference between
reference voltage TOP (VRT) and the analog input which produces data outputs equal to FF, at Tamb = 25 °C.
2. The analog input is not internally biased. It should be externally biased between VRT and VRB levels.
3. Full-scale sine wave; fi = 4.43 MHz; fclk = 100 MHz.
4. Effective bits are obtained via a Fast Fourier Transform (FFT) treatment taking 4K acquisition points per period.
The calculation takes into account all harmonics and noise up to half of the clock frequency (NYQUIST frequency).
Conversion to signal-to-noise ratio: S/N = EB × 6.02 + 1.76 dB.
5. TDA8718 can only withstand one or two 100K ECL loads in order to work out timings at the maximum sampling
frequency. It is recommended to minimize the printed circuit-board load by implementing the load device as close as
possible to the TDA8718.
Table 1 Output coding and input voltage (typical values; referenced to AGND.
BINARY OUTPUT BITS
STEP
Underflow
VI
O/UF
D5
D4
0
D3
D2
D1
D0
< −40 Ω × IRT
1
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
0
.
0
0
1
.
0
−40 Ω × IRT
0
1
.
0
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
.
254
.
0
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
0
1
1
255
−8 Ω × IRT
> −8 Ω × IRT
Overflow
50 %
CLK
sample N
sample N + 1
sample N + 2
V
I
t
h
t
ds
DATA
OF/UF
DATA
N - 2
DATA
N - 1
DATA
N
DATA
N + 1
50 %
MSA666
Fig.4 Timing diagram.
8
June 1994
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
MBD879
0
amplitude
(dB)
20
40
60
80
100
120
0
6.27
12.5
18.8
25.1
31.3
37.6
43.9
50.2
f (MHz)
Effective bits: 7.53; THD = −54.56 dB.
Harmonic levels (dB): 2nd = −77.28; 3rd = −54.76; 4th = −71.43; 5th = −71.85; 6th = −105.50.
Fig.5 Fast Fourier Transform (fclk = 100 MHz; fi = 4.43 MHz).
MBD880
0
amplitude
(dB)
20
40
60
80
100
120
0
31.2
62.4
93.5
125.0
156.0
187.0
218.0
249.0
f (MHz)
Effective bits: 6.60; THD = −48.60 dB.
Harmonic levels (dB): 2nd = −64.81; 3rd = −51.10; 4th = −65.05; 5th = −58.33; 6th = −54.07.
Fig.6 Fast Fourier Transform (fclk = 500 MHz; fi = 100 MHz).
9
June 1994
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
APPLICATION INFORMATION
V
V
V
RM
AGND
RB
EEA
22
nF
22
nF
22
nF
22
nF
V
I
n.c.
n.c.
4
28
3
2
1
27
26
V
5
25
24
23
22
21
20
19
n.c.
RT
22 nF
n.c.
6
DGND
OF
V
7
EED
22 nF
8
n.c.
UF
CLK
CLK
TDA8718
9
D7
D0
D1
10
11
V
BB
16
12
13
14
15
17
18
OGND1
D6
D5
D4
D3
D2
OGND2
–2 V
MBB852 - 2
Fig.7 Application diagram.
June 1994
10
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
PACKAGE OUTLINE
12.57
12.32
11.58
11.43
0.53
max
S
0.18 M
1.27
0.10 S
(24 x)
0.81
max
1.14
0.64
R
19
25
26
18
12
28
1
10.92
9.91
11.58
11.43
12.57
12.32
2.16
max
A
4
o
45
5
11
0.51
max
1.22
1.07
(3x)
0.32
max
4.57
max
3.04
max
0.51 min
detail A
MBC654
Dimensions in mm.
Fig.8 Plastic leaded chip carrier, 28-leads; SOT261-2.
11
June 1994
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.
SOLDERING
Plastic leaded chip carriers
BY WAVE
Several techniques exist for reflowing; for example,
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.
During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.
REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE-HEATED SOLDER TOOL)
Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between
270 and 320 °C. (Pulse-heated soldering is not
recommended for SO packages.)
A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.
For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.
BY SOLDER PASTE REFLOW
Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
June 1994
12
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
NOTES
June 1994
13
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
NOTES
June 1994
14
Philips Semiconductors
Product specification
8-bit high-speed analog-to-digital converter
TDA8718
NOTES
June 1994
15
Philips Semiconductors – a worldwide company
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Tel. (662)398-0141, Fax. (662)398-3319.
Turkey:Talatpasa Cad. No. 5, 80640 GÜLTEPE/ISTANBUL,
Tel. (01)4099 6161, Fax. (01)4099 6427
Germany: PHILIPS COMPONENTS UB der Philips G.m.b.H.,
P.O. Box 10 63 23, 20043 HAMBURG,
Tel. (040)3296-0, Fax. (040)3296 213.
Greece: No. 15, 25th March Street, GR 17778 TAVROS,
Tel. (0212)279 2770, Fax. (0212)269 3094
Tel. (01)4894 339/4894 911, Fax. (01)4814 240
United Kingdom: Philips Semiconductors Limited, P.O. Box 65,
Philips House, Torrington Place, LONDON, WC1E 7HD,
Tel. (071)436 41 44, Fax. (071)323 03 42
Hong Kong: PHILIPS HONG KONG Ltd., Components Div.,
6/F Philips Ind. Bldg., 24-28 Kung Yip St., KWAI CHUNG, N.T.,
Tel. (852)424 5121, Fax. (852)428 6729
India: Philips INDIA Ltd, Components Dept,
Shivsagar Estate, A Block ,
Dr. Annie Besant Rd. Worli, Bombay 400 018
Tel. (022)4938 541, Fax. (022)4938 722
Indonesia: Philips House, Jalan H.R. Rasuna Said Kav. 3-4,
P.O. Box 4252, JAKARTA 12950,
United States:INTEGRATED CIRCUITS:
811 East Arques Avenue, SUNNYVALE, CA 94088-3409,
Tel. (800)234-7381, Fax. (708)296-8556
DISCRETE SEMICONDUCTORS: 2001 West Blue Heron Blvd.,
P.O. Box 10330, RIVIERA BEACH, FLORIDA 33404,
Tel. (800)447-3762 and (407)881-3200, Fax. (407)881-3300
Uruguay: Coronel Mora 433, MONTEVIDEO,
Tel. (021)5201 122, Fax. (021)5205 189
Ireland: Newstead, Clonskeagh, DUBLIN 14,
Tel. (02)70-4044, Fax. (02)92 0601
For all other countries apply to: Philips Semiconductors,
International Marketing and Sales, Building BAF-1,
P.O. Box 218, 5600 MD, EINDHOVEN, The Netherlands,
Telex 35000 phtcnl, Fax. +31-40-724825
Tel. (01)640 000, Fax. (01)640 200
Italy: PHILIPS COMPONENTS S.r.l.,
Viale F. Testi, 327, 20162 MILANO,
Tel. (02)6752.3302, Fax. (02)6752 3300.
Japan: Philips Bldg 13-37, Kohnan2-chome, Minato-ku, TOKYO 108,
SCD31
© Philips Electronics N.V. 1994
Tel. (03)3740 5028, Fax. (03)3740 0580
Korea: (Republic of) Philips House, 260-199 Itaewon-dong,
All rights are reserved. Reproduction in whole or in part is prohibited without the
prior written consent of the copyright owner.
Yongsan-ku, SEOUL, Tel. (02)794-5011, Fax. (02)798-8022
Malaysia: No. 76 Jalan Universiti, 46200 PETALING JAYA,
SELANGOR, Tel. (03)750 5214, Fax. (03)757 4880
Mexico: Philips Components, 5900 Gateway East, Suite 200,
The information presented in this document does not form part of any quotation
or contract, is believed to be accurate and reliable and may be changed without
notice. No liability will be accepted by the publisher for any consequence of its
use. Publication thereof does not convey nor imply any license under patent- or
other industrial or intellectual property rights.
EL PASO, TX 79905, Tel. 9-5(800)234-7381, Fax. (708)296-8556
Printed in The Netherlands
Netherlands: Postbus 90050, 5600 PB EINDHOVEN, Bldg. VB
Tel. (040)783749, Fax. (040)788399
533061/1500/04/pp16
Date of release: June 1994
9397 734 40011
New Zealand: 2 Wagener Place, C.P.O. Box 1041, AUCKLAND,
Tel. (09)849-4160, Fax. (09)849-7811
Document order number:
Philips Semiconductors
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