TDA8722M [NXP]

I2C-bus programmable modulator for negative video modulation and FM sound; I2C总线可编程调制负视频调制和FM声音
TDA8722M
型号: TDA8722M
厂家: NXP    NXP
描述:

I2C-bus programmable modulator for negative video modulation and FM sound
I2C总线可编程调制负视频调制和FM声音

商用集成电路 光电二极管
文件: 总28页 (文件大小:200K)
中文:  中文翻译
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INTEGRATED CIRCUITS  
DATA SHEET  
TDA8722  
I2C-bus programmable modulator  
for negative video modulation and  
FM sound  
1998 Jun 23  
Product specification  
Supersedes data of 1995 Mar 21  
File under Integrated Circuits, IC02  
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
FEATURES  
Video amplifier with clamp and white clip circuits  
FM sound modulator  
Asymmetrical and symmetrical RF outputs available  
Symmetrical RF oscillator using only a few external  
components  
GENERAL DESCRIPTION  
External adjusting of modulation depth and level of the  
sound subcarrier  
I2C-bus receiver for frequency setting and test-mode  
selection  
The TDA8722 is a programmable modulator which  
generates an RF TV channel from a baseband video  
signal and a baseband audio signal in the event of  
negative video and FM sound standards (PAL B/G, I, D/K  
and NTSC).  
One I2C programmable output port  
On-chip Phase-Locked Loop (PLL) frequency  
synthesizer  
It is especially suited for satellite receivers, video  
recorders and cable converters. The video carrier  
frequency is set exactly to the correct channel frequency  
by a PLL synthesizer which is programmed in accordance  
with the I2C-bus format.  
On-chip power supply regulator  
Bus switchable oscillator  
On-chip Test Pattern Signal Generator (TPSG).  
APPLICATIONS  
Video recorders  
Cable converters  
Satellite receivers.  
ORDERING INFORMATION  
TYPE  
PACKAGE  
NUMBER  
NAME  
DESCRIPTION  
plastic small outline package; 20 leads; body width 7.5 mm  
SSOP20 plastic shrink small outline package; 20 leads; body width 4.4 mm  
VERSION  
TDA8722T  
TDA8722M  
SO20  
SOT163-1  
SOT266-1  
1998 Jun 23  
2
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
QUICK REFERENCE DATA  
VDDA = VDDD = 5 V; Tamb = 25 °C after the IC has reached thermal equilibrium; unless otherwise specified.  
SYMBOL  
PARAMETER  
analog supply voltage  
digital supply voltage  
total supply current  
CONDITIONS  
MIN.  
4.5  
TYP.  
5.0  
MAX.  
5.5  
UNIT  
VDDA  
VDDD  
IDD  
V
4.5  
41  
5.0  
52  
5.5  
63  
90  
V
normal mode  
mA  
%
m  
typical modulation depth range video level (pin 19) = 0.5 V (p-p); 65  
note 1; see Fig.10  
P/S  
VRF  
δf  
typical picture-to-sound level  
range  
note 2; see Fig.11  
18  
10  
83  
dB  
RF output voltage level  
asymmetrical on a 75 load  
frequency between  
471.25 and 855.25 MHz  
77  
80  
25  
dBµV  
kHz  
FM deviation on audio  
subcarrier  
fi = 400 Hz; V1 = 0.5 V (RMS);  
before pre-emphasis filter  
20  
30  
Notes  
1. Value depends on value of resistor R17 (see Fig.7).  
2. Value depends on value of capacitor C17 (see Fig.7).  
1998 Jun 23  
3
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
BLOCK DIAGRAM  
V
VIDEO  
19  
ADJUST  
17  
AGND  
18  
DDA  
20  
RFA  
16  
RFB  
15  
ASYMMETRICAL  
OUTPUT  
TDA8722  
VOLTAGE  
REGULATOR  
CLAMP  
CLIP  
BUFFER  
VIDEO AMP  
1
2
3
AUDIO  
MIXER  
PC  
TPSG  
SWITCH  
SOSCA  
SOSCB  
AUDIO  
FM MODULATOR  
TPSG on  
balance test  
6
5
UOSCA  
OGND  
PRESCALER  
(8)  
UHF  
OSCILLATOR  
13  
12  
SDA  
SCL  
4
12-BIT  
DIVIDER  
(N)  
2
I C-BUS  
UOSCB  
RECEIVER  
10 bits  
RF oscillator on  
enable/  
select  
8
7
14  
P0  
CP  
f
DIV  
PHASE  
DETECTOR  
CHARGE  
PUMP  
AMP  
LOGIC  
AMP  
f
ref  
enable  
9
DIVIDER  
(M = 128)  
4 MHz  
OSCILLATOR  
XTAL  
31.25 kHz  
11  
10  
DGND  
MBE401  
V
DDD  
Fig.1 Block diagram.  
1998 Jun 23  
4
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
PINNING  
SYMBOL PIN  
DESCRIPTION  
AUDIO  
SOSCA  
SOSCB  
UOSCB  
OGND  
UOSCA  
AMP  
1
2
3
4
5
6
7
8
9
audio input  
sound oscillator A  
sound oscillator B  
UHF oscillator B  
handbook, halfpage  
V
1
2
3
4
5
6
7
8
9
20  
19  
AUDIO  
DDA  
RF oscillator ground  
UHF oscillator A  
SOSCA  
SOSCB  
UOSCB  
OGND  
UOSCA  
AMP  
VIDEO  
18 AGND  
17  
tuning amplifier output  
charge pump output  
crystal oscillator  
ADJUST  
16 RFA  
15  
CP  
XTAL  
DGND  
VDDD  
TDA8722  
10 digital ground  
RFB  
14 P0  
13  
11 digital supply voltage  
SCL  
12 serial clock input (I2C-bus)  
13 serial data input (I2C-bus)  
14 NPN open-collector output Port  
15 asymmetrical RF output B  
16 asymmetrical RF output A  
CP  
SDA  
12 SCL  
SDA  
XTAL  
P0  
V
11  
DGND 10  
DDD  
RFB  
MBE394  
RFA  
ADJUST  
17 modulation depth and picture-to-sound  
distance adjustment pin  
AGND  
VIDEO  
VDDA  
18 analog ground  
19 video input  
Fig.2 Pin configuration.  
20 analog supply voltage  
and ground (R17). The value can change between 47 kΩ  
FUNCTIONAL DESCRIPTION  
and infinite (R17 removed); see Fig.10.  
The TDA8722 is a programmable modulator which can be  
divided into two main blocks:  
The video part also contains a test pattern signal generator  
to simplify the adjustment of the receiving channel of the  
TV set to the required channel of the modulator. The  
pattern consists of a synchronization pulse and two  
vertical white bars on screen (see Fig.3).  
A modulator for negative video modulation and  
FM sound TV standards  
A programmable PLL frequency synthesizer.  
The video part of the modulator consists of a clamping  
circuit which sets the internal reference voltage to the  
bottom of the synchronizing pulse, followed by a white clip  
which avoids over modulation in case the video signal is  
too strong. Typically, the IC starts to clip the video signal  
when the voltage at the video input (pin 19) is  
>560 mV (p-p) while the normal voltage at the video input  
is 500 mV (p-p). This clipping function ensures that the  
video modulation depth is not too high. The modulation  
depth is adjusted in the application between at least  
65 and 90% by changing the resistor value between pin 17  
The audio part of the modulator contains an FM sound  
modulator. The frequency of the sound subcarrier is set in  
the application by external components (C3, L3 and R3).  
The difference between the video carrier level and the  
sound subcarrier level is adjusted in the application by  
changing the value of the capacitor between pin 17 and  
ground (C17). The value can change between  
0 and 47 pF. The distance between the video carrier and  
the sound subcarrier can be adjusted between at least  
10 and 18 dB (see Fig.11).  
1998 Jun 23  
5
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
To bias the audio input it is necessary to put a resistor in  
the application between pin 1 and ground. The resistor  
has a typical value of 12 k.  
N is a 12-bit dividing number (10 bits are programmable  
by the I2C-bus).  
fref is the crystal frequency (4 MHz) divided by 128  
(31.25 kHz).  
The RF part of the oscillator consists of:  
An oscillator which operates at the required video  
carrier frequency. The range of the oscillator is  
determined in the application by C5, C6, L5 and D5.  
The circuit allows a step of 250 kHz but because only  
10 bits are programmable, the programming steps are  
1 MHz.  
When the PLL loop is locked, both inputs of the phase  
comparator are equal, which gives equation:  
An RF mixer. It first combines the video signal and the  
sound subcarrier to build a baseband TV channel.  
Then the baseband signal is mixed with the oscillator  
signal to get the RF TV channel. The mixer has two  
outputs which can be used as two independent  
asymmetrical outputs, or as one symmetrical output. In  
the event of asymmetrical use, the unused output must  
be loaded with a 75 resistor (see Fig.7).  
fosc  
f xtal  
fDIV  
=
=
= f ref  
-------------  
---------  
128  
8 × N  
During the test mode operation, fDIV and fref can be  
monitored on the output Port pin (pin 14).  
Software information  
The oscillator frequency is set by a programmable PLL  
frequency synthesizer in accordance with equation:  
The synthesizer is controlled via a two-wire I2C-bus  
receiver. For programming, the address byte (C8 HEX)  
has to be sent first. Then one or two data bytes are used  
to set the 10 programmable bits of the dividing number N,  
the test bits (see Table 1) and the output Port state. Note  
that after power-up of the IC, the two data bytes must be  
sent.  
f
osc = 8 × N × fref  
Where:  
fosc is the local oscillator frequency.  
MBE395  
0
10  
20  
30  
40  
50  
60  
70  
64  
t (µs)  
Fig.3 Test pattern signal.  
1998 Jun 23  
6
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
Table 1 Data format; notes 1 and 2  
BIT 7  
MSB  
BIT 0  
LSB  
BYTE  
BIT 6  
BIT 5  
BIT 4  
BIT 3  
BIT 2  
BIT 1  
ACKNOWLEDGE BIT  
Address byte C8  
Data byte 1  
1
0
1
1
0
0
1
0
0
0
ACK  
ACK  
ACK  
b11  
T0(3)  
b10  
T1(3)  
b9  
T2(3)  
b8  
P0(4)  
b7  
b4  
b6  
b3  
b5  
b2  
Data byte 2  
Notes  
1. The 10 programmable bits of N are: b2 to b11.  
2. Internal hardware sets: b1 = 0 and b0 = 1.  
3. T0, T1 and T2 are bits used for test purposes (see Table 5).  
4. P0 is a bit used for controlling the state of the output Port (see Table 6).  
Table 2 Structure of the dividing number N  
BITS(1)  
RESULT  
b11  
b10  
b9  
b8  
b7  
b6  
b5  
b4  
b3  
b2  
b1(2) b0(2)  
0.5 0.25  
Frequency (MHz)(3)  
512  
256  
128  
64  
32  
16  
8
4
2
1
Notes  
1. Bits b2 to b11 are programmable and represent the integer part of the frequency in MHz. Bits b1 and b0 are fixed  
internally to b1 = 0 and b0 = 1 to get the added 0.25 MHz, common for most TV channels.  
2. Bits b1 and b0 are not programmable.  
3. fosc = 512b11 + 256b10 + 128b9 + 64b8 + 32b7 + 16b6 + 8b5 + 4b4 + 2b3 + b2 + 0.25 (MHz).  
Table 3 Dividing number N for programming channel 21 (471.25 MHz)  
BITS  
RESULT  
b11  
0
b10  
1
b9  
1
b8  
1
b7  
0
b6  
1
b5  
0
b4  
1
b3  
1
b2  
1
b1(1) b0(1)  
Value  
Frequency (MHz)(2)  
0
0
1
0
256  
128  
64  
0
16  
0
4
2
1
0.25  
Notes  
1. Bits b1 and b0 are not programmable.  
2. fosc = 0 + 256 + 128 + 64 + 0 + 16 + 0 + 4 + 2 + 1 + 0.25 (MHz) = 471.25 MHz.  
Table 4 Content of the data bytes to program channel 21 (471.25 MHz)  
BIT 7  
MSB  
BIT 0  
LSB  
BYTE  
BIT 6  
BIT 5  
BIT 4  
BIT 3  
BIT 2  
BIT 1  
ACKNOWLEDGE BIT  
Address byte C8  
Data byte 1  
1
0
1
1
0
0
0
1
0
0
1
0
1
1
0
0
0
1
0
1
1
0
0
1
ACK  
ACK  
ACK  
Data byte 2  
It is possible to change only one data byte. The circuit will recognize which one is received with the value of MSB  
(0 for data byte 1 and 1 for data byte 2). It is possible to change the frequency by 1 MHz with data byte 2. It is easy to  
increment the channel frequency when its frequency width is 8 MHz by simply incrementing data byte 1.  
1998 Jun 23  
7
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
The bits T0 to T2 are available for test purposes and the possibilities are shown in Table 5.  
Table 5 Test modes  
T0  
T1  
T2  
OPERATIONAL MODE  
0
0
0
0
1
1
1
1
0
0
1
1
0
0
1
1
0
1
0
1
0
1
0
1
normal operation  
Test Pattern Signal Generator (TPSG) on; note 1  
RF oscillator off; note 2  
balance test; note 3  
f
ref out (if p0 = 0); note 4  
high-impedance test; note 5  
DIV out (if p0 = 0); note 4  
phase detector disabled; baseband signals on RF outputs; note 6  
f
Notes  
1. In ‘TPSG on’ mode the video carrier is modulated by the test signal consisting of a synchronization pulse and two  
vertical white bars on a black screen. This mode should be selected to adjust the TV set receiving the modulated  
signal to the right frequency.  
2. In ‘RF oscillator off’ mode, the RF oscillator and the RF mixer are switched-off and there is no RF carrier coming out  
of the device. This mode can be selected to avoid RF radiation to other parts when the modulator output is not used.  
3. In ‘balance test’, the video carrier is over modulated. This simplifies residual carrier measurements.  
4. In ‘fref’ and ‘fDIV’ modes, the reference frequency fref in the phase comparator or the divided RF oscillator frequency  
fDIV is available on the output Port pin. This mode requires that bit P0 = 0.  
5. The ‘high-impedance test’ mode may be used to inject an external tuning voltage to the RF tank circuit, to test the  
oscillator. In this mode, the phase detector is disabled and the external transistor of the tuning amplifier is  
switched-off. The AMP output (pin 7) is LOW (<200 mV).  
6. In the ‘phase detector disabled’ mode, it is possible to measure the leakage current at the input of the tuning amplifier,  
on the CP pin. In this mode the RF oscillator is off, and the baseband TV channel signal is present on the RF outputs  
for testing the audio and video parts.  
The possibilities of bit P0, which controls the output Port  
(pin 14) are given in Table 6.  
Table 6 Output Port programming  
P0  
OUTPUT PORT STATE  
The Port is an NPN open-collector type. For monitoring the  
fref or fDIV frequency on the output Port, the P0 bit must be  
logic 0 to let the output Port free.  
0
1
off; high impedance  
on; sinking current  
1998 Jun 23  
8
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
LIMITING VALUES  
In accordance with the Absolute Maximum Rating System (IEC 134).  
SYMBOL  
VDDA  
PARAMETER  
MIN.  
0.3  
MAX.  
UNIT  
analog supply voltage  
digital supply voltage  
+6  
V
VDDD  
VDD  
0.3  
4.5  
+6  
V
operating supply voltage  
maximum voltage on all pins  
IC storage temperature  
5.5  
V
Vmax  
Tstg  
0.3  
40  
20  
VDD  
+125  
+85  
V
°C  
°C  
Tamb  
operating ambient temperature  
HANDLING  
Inputs and outputs are protected against electrostatic discharge in normal handling. However, to be completely safe, it  
is desirable to take normal precautions appropriate to handling integrated circuits. Every pin withstands the ESD test in  
accordance with “MIL-STD-883C category B” (2000 V). Every pin withstands the ESD test in accordance with Philips  
Semiconductors Machine Model (MM) 0 , 200 pF (200 V).  
THERMAL RESISTANCE  
SYMBOL  
Rth j-a  
PARAMETER  
VALUE  
UNIT  
thermal resistance from junction to ambient in free air  
SO20; SOT163-1  
85  
K/W  
K/W  
SSOP20; SOT266-1  
120  
1998 Jun 23  
9
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
CHARACTERISTICS  
VDDA = VDDD = 5 V; Tamb = 25 °C; valid over the whole UHF band; measured in circuit of Fig.7;  
unless otherwise specified.  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX. UNIT  
Supply  
IDD  
supply current  
normal mode  
41  
52  
38  
63  
mA  
mA  
RF off test mode  
30  
46  
Video characteristics  
I19  
z19  
m
input current (AC)  
V19 = 3.2 V  
V19 = 3.2 V  
0.5  
2.0  
µA  
kΩ  
%
video input impedance  
modulation depth  
30  
77  
V19 = 500 mV (p-p) EBU  
82  
87  
colour bars; R17 = 120 k;  
see Fig.7  
during clipping condition;  
note 1  
85  
98  
92  
%
%
%
%
TPSG mode;  
R17 = 120 kΩ  
72  
82  
balance test mode;  
R17 = 120 kΩ  
110  
65  
m  
modulation depth range  
V19 = 500 mV (p-p) EBU  
90  
colour bars;  
47 kΩ ≤ R17 ≤ ∞  
mAPL  
variation of modulation depth with  
change of APL between 10 and 90%  
referenced to the value for 2  
APL = 50%;  
V19 = 500 mV (p-p)  
+2  
%
V
Vclip(p-p)  
video input level where clipping starts  
(peak-to-peak value)  
video level on pin 19;  
note 2  
0.56  
S/N video video signal-to-noise ratio  
fRF < 700 MHz; note 3  
48  
46  
8  
8  
52  
50  
dB  
dB  
%
fRF > 700 MHz; note 3  
Gdiff  
φdiff  
V/S  
differential gain  
note 4  
note 4  
+8  
differential phase  
video-to-sync ratio  
+8  
deg  
V19 = 500 mV (p-p);  
V/S = 7/3  
6.9/3.1 7/3  
7.1/2.9  
fvideo  
frequency response for the video signal note 5  
1  
+1  
dB  
Audio characteristics (for PAL G standard; audio subcarrier at 5.5 MHz)  
Z1  
audio input impedance  
modulation deviation  
30  
20  
kΩ  
δm  
f1 = 400 Hz;  
25  
30  
kHz  
V1 = 0.5 V (RMS) before  
pre-emphasis filter  
δmmax  
maximum modulation deviation  
total harmonic distortion  
f1 = 400 Hz;  
V1 = 2.0 V (RMS) before  
pre-emphasis filter  
60  
85  
kHz  
%
THD  
f1 = 1 kHz;  
0.4  
1.5  
V1 = 0.5 V (RMS) before  
pre-emphasis filter  
1998 Jun 23  
10  
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
45  
TYP.  
MAX. UNIT  
S/N audio audio signal-to-noise ratio  
note 6  
note 7  
50  
dB  
dB  
dB  
faudio  
P/S  
frequency response of the audio signal  
1  
+1  
picture-to-sound ratio  
no audio signal;  
FM = 5.5 MHz;  
C17 = 15 pF  
16  
13  
10  
P/S  
picture-to-sound ratio range  
no audio signal;  
FM = 5.5 MHz;  
18  
10  
dB  
0 pF C17 39 pF  
Channel characteristics  
fRF  
RF frequency range  
using tank circuit of Fig.7  
471.25  
77  
855.25 MHz  
VRF  
output level on RFA and RFB  
asymmetrical output  
loaded with 75 ;  
80  
83  
dBµV  
f = 471.25 to 855.25 MHz  
VRF  
difference between the level of  
modulated carrier and the level of the  
unmodulated carrier  
measurement is made  
during synchronization  
pulse for the modulated  
carrier  
0
1
2
dB  
SPO  
RFsh  
spurious outside channel  
note 8  
62  
30  
20  
65  
dBc  
dBc  
dBc  
dBc  
RF second harmonic level on  
asymmetrical output  
fRF = 471.25 MHz  
25  
15  
60  
fRF = 855.25 MHz  
SCsh  
sound carrier second harmonic level  
fs = 5.5 MHz;  
C17 = 15 pF;  
fRF < 700 MHz  
fs = 5.5 MHz;  
C17 = 15 pF;  
fRF > 700 MHz  
63  
58  
dBc  
SCth  
sound carrier third harmonic level  
video signal harmonics  
fs = 5.5 MHz; C17 = 15 pF  
note 9  
65  
60  
65  
65  
60  
55  
60  
60  
dBc  
dBc  
dBc  
dBc  
fref  
IM  
reference frequency spurious  
chrominance beat  
fp + 31.25 kHz  
note 10  
Charge pump output (CP)  
I8  
output current  
±100  
µA  
V
V7  
IOZ  
output voltage  
in lock  
1.5  
2.5  
10  
OFF-state leakage current  
VCP = 2 V; T0 = 1; T1 = 1;  
T2 = 1  
nA  
Amplifier output (AMP)  
G
amplifier current gain  
output saturation voltage  
V
CP = 2 V; IAMP = 10 µA  
4000  
140  
V7sat  
VCP = 0 V; T0 = 1; T1 = 0;  
T2 = 1  
200  
mV  
Crystal oscillator characteristics (XTAL)  
Z9  
oscillator input impedance  
500  
1998 Jun 23  
11  
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
SYMBOL  
PARAMETER  
CONDITIONS  
MIN.  
TYP.  
MAX. UNIT  
Output Port characteristics (P0)  
VOL  
LOW level output voltage  
OFF-state leakage current  
maximum Port current  
P0 = 1; I14 = 5 mA  
P0 = 0; VDD = 5.5 V  
P0 = 1  
150  
400  
10  
mV  
µA  
IOZ  
I14(max)  
10  
mA  
I2C-bus receiver characteristics (SDA and SCL)  
VIH  
VIL  
IIH  
HIGH level input voltage  
LOW level input voltage  
HIGH level input current  
LOW level input current  
output voltage on SDA  
3
0
5.5  
1.5  
10  
V
V
VIH = 5 V; VDD = 0 or 5 V  
VIL = 0 V; VDD = 0 or 5 V  
µA  
µA  
V
IIL  
10  
Vo  
during acknowledge  
pulse; IIL = 3 mA  
0.4  
Notes  
1. Modulation depth when the video signal is between 560 and 1000 mV (peak-to-peak value) at pin 19. R17 = 120 kΩ  
in the application.  
2. For application information only.  
3. Ratio between the CCIR 17 line bar amplitude (corresponding to the level difference between black and white;  
see Fig.4 and the RMS value of the noise on a black line (line 22 or 335) measured on the video signal after  
demodulation for PAL G standard. Measurement is unweighted, done between 200 kHz and 5 MHz.  
4. Measured for PAL G standard on 4 first steps of CCIR 330 line, corresponding to a 5 step staircase with  
300 mV (peak-to-peak value) chrominance carrier when the level between synchronization pulse and white is 1 V;  
see Fig.5.  
5. Measured with a spectrum analyzer with ‘peak hold’ function, applying a 500 mV (peak-to-peak value) sine wave at  
the video input of the IC, with a frequency of 0.5, 2.0, 4.0 and 4.8 MHz. The reference is the value measured for  
1.0 MHz.  
6. Measured using CCIR 468-3 weighting filter and quasi-peak detection, with an audio frequency of 1 kHz and a  
deviation of 50 kHz. Video signal is EBU colour bars of 500 mV (peak-to-peak value) on pin 19.  
7. Measured in PAL G standard with no pre-emphasis on the audio input and no de-emphasis in the receiver. Audio  
input level is adjusted for having a deviation of 25 kHz at 1 kHz audio frequency. Measurement is done for  
frequencies between 50 Hz and 15 kHz, reference is the level measured for 1 kHz.  
8. Except for the harmonics of the RF oscillator frequency and for the combinations between the RF oscillator  
frequency and the sound oscillator frequency (fRF + 2fs, 2fRF + fs, etc.). This measurement includes the spurious at  
the 14fRF, 12fRF and 34fRF  
.
9. Corresponding to the harmonics of the video signal. Measured by putting a 1 MHz sine wave of  
500 mV (peak-to-peak value) at the video input (pin 19) and checking the level at fRF + 2 MHz, fRF + 3 MHz, etc.  
10. Measured with a 4.43 MHz sine wave of 350 mV (peak-to-peak value) at the video input. Measurement is the  
difference between the level of the unmodulated picture carrier and the level of the spike appearing at the frequency  
of the picture carrier plus 1.07 MHz. C17 = 15 pF in the application diagram of Fig.7.  
1998 Jun 23  
12  
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
MBE396  
1 V  
0.3 V  
0 V  
0
10  
20  
30  
40  
50  
60  
70  
64  
t (µs)  
Fig.4 CCIR insertion line N.17.  
MBE397  
1 V  
0.3 V  
0 V  
0
10  
20  
30  
40  
50  
60  
70  
64  
t (µs)  
Fig.5 CCIR insertion line N.330.  
1998 Jun 23  
13  
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
INTERNAL PIN CONFIGURATION  
20  
VOLTAGE  
REGULATOR  
V
DDA  
1
AUDIO  
19  
VIDEO  
2
SOSCA  
18  
17  
AGND  
3
SOSCB  
4
ADJUST  
UOSCB  
16  
RFA  
15  
14  
5
RFB  
P0  
OGND  
6
UOSCA  
7
AMP  
13  
SDA  
8
CP  
9
XTAL  
12  
SCL  
10  
DGND  
11  
V
DDD  
MBE402  
ESD protection components are not shown in the diagram.  
Fig.6 Pin equivalent circuit for each pin.  
1998 Jun 23  
14  
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
APPLICATION INFORMATION  
RF  
75 Ω  
R20  
470 Ω  
100 nF  
C19  
VIDEO  
R15  
R18  
82 Ω  
R19  
470 Ω  
PORT  
75 Ω  
1 kΩ  
R14  
100 pF  
C16  
100 pF  
C15  
15 pF  
C17  
R17  
120 kΩ  
SCL  
SDA  
100 nF  
C20  
20  
19 18  
17  
16  
15  
14 13 12 11  
Q9  
4 MHz  
10 nF  
C11  
TDA8722  
27 pF  
C9  
1
2
3
4
5
6
7
8
9
10  
(2)  
L5  
150 nF  
C8  
(1)  
33 pF  
C5  
33 pF  
C6  
K1  
C1  
C3  
D5  
R8  
12 kΩ  
56 pF  
AUDIO  
BB215  
R5  
R3  
R9  
33 V  
5 V  
R6  
22 kΩ  
22 k  
15 kΩ  
220 pF  
R1  
22 kΩ  
(3)  
L3  
R7  
12 kΩ  
220 kΩ  
C21  
C30  
C31  
15 µH  
10 nF  
2.2 µF  
2.2 µF  
R4  
R2  
12 kΩ  
10 nF  
C7  
220 Ω  
T8  
(4)  
K2  
BC547B  
GND  
MBE403  
(1) K1: switches the pre-emphasis filter on or off.  
(2) L5: air coil; 1.5 turns; diameter of 2 mm.  
(3) L3: to adjust the application to the right sound carrier frequency (5.5 MHz for PAL G).  
(4) K2: Switches the FM sound oscillator on or off.  
Fig.7 Reference measuring set-up.  
1998 Jun 23  
15  
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
Application design  
RF  
75 Ω  
R20  
100 nF  
C19  
VIDEO  
470 Ω  
R15  
75 Ω  
R18  
82 Ω  
R19  
470 Ω  
PORT  
SCL  
100 kΩ  
82 kΩ  
R17  
100 pF  
C16  
100 pF  
C15  
(1)  
RV1  
15 pF  
100 nF  
C20  
SDA  
C17  
5 V  
Q9  
20  
19 18  
17  
16  
15  
14 13 12 11  
4 MHz  
10 nF  
C11  
TDA8722  
27 pF  
C9  
1
2
3
4
5
6
7
8
9
10  
L5  
150 nF  
C8  
33 pF  
C5  
33 pF  
C6  
C3  
D5  
R8  
56 pF  
R3  
12 kΩ  
C1  
AUDIO  
BB215  
R5  
R9  
33 V  
R6  
22 kΩ  
15 kΩ  
22 kΩ  
220 pF  
R1  
22 kΩ  
L3  
R7  
12 kΩ  
220 kΩ  
C30  
10 nF  
15 µH  
R2  
12 kΩ  
10 nF  
C7  
T8  
BC547B  
GND  
MBE405  
(1) RV1 allows fine adjustment of the modulation depth between 70 and 90%.  
Fig.8 Application using an asymmetrical output.  
1998 Jun 23  
16  
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
RF  
75 Ω  
VIDEO  
R20  
470 Ω  
100 nF  
C19  
TOKO - B4F  
617DB - 1010  
6
1
4
3
TR1  
2
R18  
82 Ω  
R19  
470 Ω  
PORT  
SCL  
SDA  
5 V  
R17  
120 kΩ  
R15  
300 Ω  
100 nF  
C20  
C17  
100 pF  
C16  
100 pF  
C15  
15 pF  
20  
19 18  
17  
16  
15  
14 13 12 11  
Q9  
10 nF  
C11  
4 MHz  
TDA8722  
27 pF  
C9  
1
2
3
4
5
6
7
8
9
10  
150 nF  
C8  
L5  
C3  
33 pF  
C5  
33 pF  
C6  
R8  
12 kΩ  
56 pF  
C1  
AUDIO  
D5  
R3  
R9  
33 V  
220 pF  
R1  
15 kΩ  
BB215  
R5  
22 kΩ  
R6  
22 kΩ  
L3  
R7  
22 kΩ  
220 kΩ  
12 kΩ  
15 µH  
10 nF  
C7  
R2  
12 kΩ  
C30  
10 nF  
T8  
BC547B  
GND  
MBE404  
Fig.9 Application using a symmetrical output with a balun transformer.  
In the design of the application, it is highly recommended  
to separate the part of the RF oscillator as much as  
possible from the part of the RF outputs in order to avoid  
parasitic coupling between these two parts.  
similar as possible to the load connected to the used pin,  
see Fig.8.  
A good improvement in performance is obtained using a  
1 : 4 symmetrical to asymmetrical transformer  
(balun; balance-to-unbalance) connected between the  
two outputs. In this event both outputs have their loads  
matched. The level of the RF second harmonic, and the  
spurious outside channel is decreasing. The parasitic  
coupling between RF outputs and RF oscillator is also  
reduced (see Fig.9).  
A good solution is shielding the RF oscillator part to avoid  
radiation from and to this part. The pin 5 (OGND) must be  
connected to the shielding box and to ground.  
RF outputs  
For inexpensive applications, it is possible to use the IC  
with an asymmetrical output (pins 15 or 16). In this event,  
the unused output pin must be loaded with a load as  
1998 Jun 23  
17  
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
Modulation depth  
Table 7 Value of resistor for several Q factor ranges  
With 500 mV (peak-to-peak value) video input signal, the  
wanted modulation depth must be set by the value of R17  
(resistor between pin 17 and ground) as shown Fig.10. For  
a good accuracy, it is recommended to use a 1% type  
resistor.  
COIL QUALITY  
FACTOR  
PROPOSED VALUE FOR R3  
(k)  
30 to 40  
40 to 50  
50 to 60  
60 to 80  
80 to >100  
82 to 33  
33 to 27  
27 to 22  
22 to 18  
18 to 15  
It is also possible to use an adjustable resistor, see Fig.8.  
Depending on the layout of the PCB, it may be necessary  
to slightly change the value of R17 from the one given in  
Fig.10 to get the wanted modulation depth.  
The use of a coil with a quality factor <30 may result in a  
non operating oscillator. For safety, it is recommended to  
use a coil with a quality factor 50.  
Sound oscillator design  
The frequency of the sound subcarrier is fixed by the tank  
circuit connected between pins 2 and 3. This frequency  
can be adjusted between 4.5 and 6.5 MHz covering all  
existing standards in the world.  
Picture-to-sound ratio  
The picture-to-sound ratio can be adjusted in the  
application by changing the value of C17 (capacitor  
between pin 17 and ground); see Fig.11.  
The damping resistor R3 between pins 2 and 3 is  
necessary to decrease the quality factor of the tank circuit  
allowing the frequency to be modulated by the audio  
signal. The value of this resistor is calculated for several  
Q factor ranges of the coil for a sound frequency of  
5.5 MHz (see Table 7).  
Figure 11 shows us that the picture-to-sound ratio will  
change for a constant value of C17 when the sound  
subcarrier frequency will change.  
RF harmonics  
This IC has been designed to have the lowest level of  
unwanted RF harmonics at the frequencies where these  
are the hardest to be filtered out, especially for the second  
harmonic of the RF carrier at the lowest frequencies of the  
UHF band.  
MBE398  
100  
handbook, halfpage  
modulation  
depth  
The level of the second and third RF harmonic is shown in  
Fig.12 for an asymmetrical application. This chart gives a  
typical value while the level of these harmonics can vary  
depending on the design of the application.  
(%)  
90  
80  
70  
It is possible to reduce the level of the second harmonic by  
using a wide band transformer at the output of the IC and  
create a symmetrical application (see Fig.9).  
To reduce the out-of-band harmonics and especially the  
third one, it is necessary to use a low-pass filter at the  
output of the IC.  
60  
10  
2
3
10  
10  
R17 (k)  
Fig.10 Typical modulation depth as a function of  
the value of R17.  
1998 Jun 23  
18  
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
MBE399  
MBE400  
8
14  
handbook, halfpage  
handbook, halfpage  
RF  
harmonics  
(dBc)  
P/S  
(dB)  
third harmonic  
18  
22  
26  
12  
16  
(1)  
(2)  
(3)  
(4)  
second harmonic  
650  
20  
30  
450  
0
10  
20  
30  
40  
550  
750  
850  
C17 (pF)  
RF (MHz)  
R17 = 120 k.  
(1) 4.5 MHz.  
(2) 5.5 MHz.  
(3) 6.0 MHz.  
(4) 6.5 MHz.  
Fig.11 Typical picture-to-sound ratio as a function  
of the value of C17.  
Fig.12 Typical level of RF harmonics for an  
asymmetrical application.  
The input impedance on pin 17 is approximately 3500 ,  
the incoming signal must be capacitive coupled, the  
resistor R17 between pin 17 and ground must remain to  
adjust the modulation depth, the capacitor C17 between  
pin 17 and ground may be changed depending on the  
capacitance brought on by the incoming network. If this  
capacitance is large, it is possible to remove C17.  
Figure 13 shows a possible application for injecting such  
kind of signal into the modulator IC.  
VHF operation  
This IC can operate on frequencies as low as 200 MHz  
(and especially for VHF 3 band) provided the impedance  
of the tuned circuit between pins 4 and 6 is >1 k.  
NICAM and stereo  
Because of the fact that the ADJUST pin (pin 17) is an  
access point to the RF mixer, it is possible to use this pin  
to inject an external modulated subcarrier into the IC.  
Following this application, to get a picture-to-second  
sound carrier ratio of 20 dB, it is necessary to apply a  
level of approximately 800 mV (peak-to-peak value) at  
the second carrier input, when the picture-to-first sound  
carrier ratio is approximately 13 dB.  
This is especially interesting when it is necessary to  
transmit a second frequency modulated audio subcarrier  
for stereo sound (f = 5.72 MHz) or a NICAM QPSK  
modulated carrier for digital audio transmission  
(f = 5.85 or 6.552 MHz).  
In addition, the internal FM sound modulator can be  
switched off by short-circuiting pins 2 and 3.  
The incoming signal must be externally modulated either  
in FM with the desired signal corresponding to PAL B/G  
specification for stereo sound transmission, or in QPSK in  
accordance with the NICAM transmission system.  
1998 Jun 23  
19  
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
RF 75 Ω  
R15  
75 Ω  
SECOND  
CARRIER  
10 pF  
C21  
R21  
10 kΩ  
R20  
470 Ω  
100 nF  
C19  
R17  
120 kΩ  
VIDEO  
100 pF  
C16  
100 pF  
C15  
R18  
82 Ω  
R19  
470 Ω  
C17  
PORT  
100 nF  
C20  
20  
19  
18  
17  
16  
15  
14  
TDA8722  
MGC419  
Fig.13 Possible application for a second sound subcarrier.  
1998 Jun 23  
20  
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
PACKAGE OUTLINES  
SO20: plastic small outline package; 20 leads; body width 7.5 mm  
SOT163-1  
D
E
A
X
c
y
H
E
v
M
A
Z
20  
11  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
10  
w
detail X  
e
M
b
p
0
5
10 mm  
scale  
DIMENSIONS (inch dimensions are derived from the original mm dimensions)  
A
max.  
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
Q
v
w
y
θ
1
2
3
p
E
p
Z
0.30  
0.10  
2.45  
2.25  
0.49  
0.36  
0.32  
0.23  
13.0  
12.6  
7.6  
7.4  
10.65  
10.00  
1.1  
0.4  
1.1  
1.0  
0.9  
0.4  
mm  
2.65  
0.25  
0.01  
1.27  
0.050  
1.4  
0.25 0.25  
0.01  
0.1  
8o  
0o  
0.012 0.096  
0.004 0.089  
0.019 0.013 0.51  
0.014 0.009 0.49  
0.30  
0.29  
0.419  
0.394  
0.043 0.043  
0.016 0.039  
0.035  
0.016  
inches 0.10  
0.055  
0.01 0.004  
Note  
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
95-01-24  
97-05-22  
SOT163-1  
075E04  
MS-013AC  
1998 Jun 23  
21  
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
SSOP20: plastic shrink small outline package; 20 leads; body width 4.4 mm  
SOT266-1  
D
E
A
X
c
y
H
v
M
A
E
Z
11  
20  
Q
A
2
A
(A )  
3
A
1
pin 1 index  
θ
L
p
L
1
10  
detail X  
w
M
b
p
e
0
2.5  
5 mm  
scale  
DIMENSIONS (mm are the original dimensions)  
A
(1)  
(1)  
(1)  
UNIT  
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.  
10o  
0o  
0.15  
0
1.4  
1.2  
0.32  
0.20  
0.20  
0.13  
6.6  
6.4  
4.5  
4.3  
6.6  
6.2  
0.75  
0.45  
0.65  
0.45  
0.48  
0.18  
mm  
1.5  
0.65  
1.0  
0.2  
0.25  
0.13  
0.1  
Note  
1. Plastic or metal protrusions of 0.20 mm maximum per side are not included.  
REFERENCES  
OUTLINE  
EUROPEAN  
PROJECTION  
ISSUE DATE  
VERSION  
IEC  
JEDEC  
EIAJ  
90-04-05  
95-02-25  
SOT266-1  
1998 Jun 23  
22  
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
SOLDERING  
Introduction  
SSOP  
Wave soldering is not recommended for SSOP packages.  
This is because of the likelihood of solder bridging due to  
closely-spaced leads and the possibility of incomplete  
solder penetration in multi-lead devices.  
There is no soldering method that is ideal for all IC  
packages. Wave soldering is often preferred when  
through-hole and surface mounted components are mixed  
on one printed-circuit board. However, wave soldering is  
not always suitable for surface mounted ICs, or for  
printed-circuits with high population densities. In these  
situations reflow soldering is often used.  
If wave soldering cannot be avoided, the following  
conditions must be observed:  
A double-wave (a turbulent wave with high upward  
pressure followed by a smooth laminar wave)  
soldering technique should be used.  
This text gives a very brief insight to a complex technology.  
A more in-depth account of soldering ICs can be found in  
our “IC Package Databook” (order code 9398 652 90011).  
The longitudinal axis of the package footprint must  
be parallel to the solder flow and must incorporate  
solder thieves at the downstream end.  
Reflow soldering  
Even with these conditions, only consider wave  
soldering SSOP packages that have a body width of  
4.4 mm, that is SSOP16 (SOT369-1) or  
SSOP20 (SOT266-1).  
Reflow soldering techniques are suitable for all SO and  
SSOP packages.  
Reflow soldering requires solder paste (a suspension of  
fine solder particles, flux and binding agent) to be applied  
to the printed-circuit board by screen printing, stencilling or  
pressure-syringe dispensing before package placement.  
METHOD (SO AND SSOP)  
During placement and before soldering, the package must  
be fixed with a droplet of adhesive. The adhesive can be  
applied by screen printing, pin transfer or syringe  
dispensing. The package can be soldered after the  
adhesive is cured.  
Several techniques exist for reflowing; for example,  
thermal conduction by heated belt. Dwell times vary  
between 50 and 300 seconds depending on heating  
method. Typical reflow temperatures range from  
215 to 250 °C.  
Maximum permissible solder temperature is 260 °C, and  
maximum duration of package immersion in solder is  
10 seconds, if cooled to less than 150 °C within  
Preheating is necessary to dry the paste and evaporate  
the binding agent. Preheating duration: 45 minutes at  
45 °C.  
6 seconds. Typical dwell time is 4 seconds at 250 °C.  
A mildly-activated flux will eliminate the need for removal  
of corrosive residues in most applications.  
Wave soldering  
SO  
Repairing soldered joints  
Wave soldering techniques can be used for all SO  
packages if the following conditions are observed:  
Fix the component by first soldering two diagonally-  
opposite end leads. Use only a low voltage soldering iron  
(less than 24 V) applied to the flat part of the lead. Contact  
time must be limited to 10 seconds at up to 300 °C. When  
using a dedicated tool, all other leads can be soldered in  
one operation within 2 to 5 seconds between  
270 and 320 °C.  
A double-wave (a turbulent wave with high upward  
pressure followed by a smooth laminar wave) soldering  
technique should be used.  
The longitudinal axis of the package footprint must be  
parallel to the solder flow.  
The package footprint must incorporate solder thieves at  
the downstream end.  
1998 Jun 23  
23  
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
DEFINITIONS  
Data sheet status  
Objective specification  
Preliminary specification  
Product specification  
This data sheet contains target or goal specifications for product development.  
This data sheet contains preliminary data; supplementary data may be published later.  
This data sheet contains final product specifications.  
Limiting values  
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or  
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation  
of the device at these or at any other conditions above those given in the Characteristics sections of the specification  
is not implied. Exposure to limiting values for extended periods may affect device reliability.  
Application information  
Where application information is given, it is advisory and does not form part of the specification.  
LIFE SUPPORT APPLICATIONS  
These products are not designed for use in life support appliances, devices, or systems where malfunction of these  
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for  
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such  
improper use or sale.  
PURCHASE OF PHILIPS I2C COMPONENTS  
Purchase of Philips I2C components conveys a license under the Philips’ I2C patent to use the  
components in the I2C system provided the system conforms to the I2C specification defined by  
Philips. This specification can be ordered using the code 9398 393 40011.  
1998 Jun 23  
24  
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
NOTES  
1998 Jun 23  
25  
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
NOTES  
1998 Jun 23  
26  
Philips Semiconductors  
Product specification  
I2C-bus programmable modulator for  
negative video modulation and FM sound  
TDA8722  
NOTES  
1998 Jun 23  
27  
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© Philips Electronics N.V. 1998  
SCA60  
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Date of release: 1998 Jun 23  
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