TDA8725T [NXP]
Antenna signal processor; 天线信号处理器
| 型号： | TDA8725T |
| 厂家： | 
NXP |
| 描述： | Antenna signal processor |
| 文件： | 总10页 (文件大小：104K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TDA8725T
Antenna signal processor
1995 Mar 21
Product specification
File under Integrated Circuits, IC02
Philips Semiconductors
Philips Semiconductors
Product specification
Antenna signal processor
TDA8725T
For PIP applications, the antenna input signal is split and
fed to the main TV tuner and the PIP tuner. Good signal
suppression between the two outputs enables good quality
of the main picture when the PIP tuner is in use.
FEATURES
• 75 Ω antenna input stage
• 75 Ω VCR RF input stage
• 75 Ω VCR tuner output
• 75 Ω TV tuner output.
For VCR applications, the antenna input signal is split and
then fed directly to the VCR tuner and the TV tuner after
being combined with the VCR - RF signal. Good signal
suppression between the two outputs enables good quality
pictures when the TV and VCR tuners are both operating.
Good signal suppression between the VCR input and the
antenna input reduces the amount of unwanted signal on
the antenna.
GENERAL DESCRIPTION
The TDA8725T has been designed to split and combine
RF signals for Picture-In-Picture (PIP) and VCR
applications.
QUICK REFERENCE DATA
SYMBOL
VP
PARAMETER
CONDITIONS
MIN.
4.75
TYP.
5.0
MAX.
5.25
UNIT
supply voltage (pins 8 and 9)
supply current (pins 8 and 9)
input frequency
V
IP
fi
−
65
−
mA
40
−
860
MHz
Gp
power gain
from antenna to VCR
from antenna to TV
from VCR
3.5
4
5.0
5.5
0
6.5
7
dB
dB
−
−
dB
F
noise figure
6.5
137
119
121
108
9.0
140
124
124
111
10
−
dB
IP2
antenna linearity 2nd order
intercept point
at 40 MHz
dBµV
dBµV
dBµV
dBµV
at 860 MHz
at 40 MHz
at 860 MHz
−
IP3
antenna linearity 3rd order
intercept point
−
−
ssup
signal suppression
VCR input to antenna
0 to 1 GHz
32
25
35
22
35
22
37
30
40
27
40
27
−
−
−
−
−
−
dB
dB
dB
dB
dB
dB
1 to 3 GHz
VCR output to TV output
TV output to VCR output
0 to 300 MHz
300 to 860 MHz
0 to 300 MHz
300 to 860 MHz
VSWR
Pi(max)
voltage standing wave ratio
at the antenna input
at the outputs
−
−
−
2.5
1.5
−10
4
3
−
maximum input power on antenna
for 1 dB gain compression
dBm
1995 Mar 21
2
Philips Semiconductors
Product specification
Antenna signal processor
TDA8725T
ORDERING INFORMATION
PACKAGE
TYPE NUMBER
NAME
DESCRIPTION
VERSION
TDA8725T
SO16
plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
BLOCK DIAGRAM
(1)
(2)
(1) TV tuner or main tuner.
(2) VCR tuner or PIP tuner.
Fig.1 Block diagram.
1995 Mar 21
3
Philips Semiconductors
Product specification
Antenna signal processor
TDA8725T
PINNING
SYMBOL PIN
DESCRIPTION
TVOUT
1
output to TV tuner (VCR+TV) and to
main tuner (PIP)
AAGND1
AAGND2
AAGND3
ANTIN
2
3
4
5
6
7
8
antenna amplifier ground 1
antenna amplifier ground 2
antenna amplifier ground 3
antenna input
n.c.
not connected
AAGND4
VP1
antenna amplifier ground 4
power supply for the antenna
amplifier
VP2
9
power supply for the VCR output
amplifier
n.c.
10 not connected
VCROUT
11 output to VCR and PIP tuner
VCRGND1 12 VCR amplifier ground 1
VCRGND2 13 VCR amplifier ground 2
VCRIN
14 VCR RF input
TVGND1
TVGND2
15 TV amplifier ground 1
16 TV amplifier ground 2
Fig.2 Pin configuration.
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 134).
SYMBOL
VP
PARAMETER
supply voltage
CONDITIONS
MIN.
−0.3
MAX.
UNIT
6
V
Tstg
Tamb
Tj
storage temperature
−55
−10
−
+150
+80
°C
°C
°C
V
operating ambient temperature
junction temperature
+150
+2000
+200
Ves
electrostatic handling
note 1
note 2
−2000
−200
V
Notes
1. Human Body Model: UZW-BO/FQ-A302 (R = 1500 Ω, C = 100 pF). The IC withstands the ESD test class 2 (2000 V).
2. Machine Model: UZW-BO/FQ-B302 (R = 0 Ω, C = 200 pF). All pins withstand 200 V.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
VALUE
UNIT
Rth j-a
thermal resistance from junction to ambient in free air
115
K/W
1995 Mar 21
4
Philips Semiconductors
Product specification
Antenna signal processor
TDA8725T
CHARACTERISTICS
VP = 5 V; Tamb = 25 °C; measured in circuit of Fig.4; unless otherwise specified.
SYMBOL
VP
PARAMETER
CONDITIONS
MIN.
4.75
TYP.
5.0
MAX.
5.25
UNIT
supply voltage (pins 8 and 9)
supply current (pins 8 and 9)
input frequency
V
IP
fi
55
40
65
75
mA
−
860
MHz
Gp
power gain
40 to 860 MHz
from antenna to VCR
from antenna to TV
from VCR
3.5
4
5.0
5.5
0
6.5
7
dB
dB
−
−
dB
F
noise figure
6.5
137
119
121
108
9.0
140
124
124
111
10
−
dB
IP2
antenna linearity 2nd order
intercept point
at 40 MHz
at 860 MHz
at 40 MHz
at 860 MHz
dBµV
dBµV
dBµV
dBµV
−
IP3
antenna linearity 3rd order
intercept point
−
−
ssup
signal suppression
VCR input to antenna
0 to 1 GHz
32
25
35
22
35
22
37
30
40
27
40
27
−
−
−
−
−
−
dB
dB
dB
dB
dB
dB
1 to 3 GHz
VCR output to TV output
TV output to VCR output
0 to 300 MHz
300 to 860 MHz
0 to 300 MHz
300 to 860 MHz
VSWR
Pi(max)
voltage standing wave ratio
at the antenna input
at the outputs
−
−
−
2.5
1.5
−10
4
3
−
maximum input power on antenna
for 1 dB gain compression
dBm
1995 Mar 21
5
Philips Semiconductors
Product specification
Antenna signal processor
TDA8725T
Fig.3 Reflection coefficient (S11) antenna input.
1995 Mar 21
6
Philips Semiconductors
Product specification
Antenna signal processor
TDA8725T
APPLICATION INFORMATION
Fig.4 Picture-in-picture (PIP) application.
1995 Mar 21
7
Philips Semiconductors
Product specification
Antenna signal processor
TDA8725T
Fig.5 VCR and TV application.
1995 Mar 21
8
Philips Semiconductors
Product specification
Antenna signal processor
TDA8725T
PACKAGE OUTLINE
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A
X
c
y
H
v
M
A
E
Z
16
9
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
8
e
w
M
detail X
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
10.0
9.8
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.27
0.050
1.05
0.041
1.75
0.25
0.01
0.25
0.01
0.25
0.1
8o
0o
0.0098 0.057
0.0039 0.049
0.019 0.0098 0.39
0.014 0.0075 0.38
0.16
0.15
0.24
0.23
0.039 0.028
0.016 0.020
0.028
0.012
inches
0.069
0.01 0.004
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
91-08-13
95-01-23
SOT109-1
076E07S
MS-012AC
1995 Mar 21
9
Philips Semiconductors
Product specification
Antenna signal processor
TDA8725T
Several techniques exist for reflowing; for example,
SOLDERING
thermal conduction by heated belt, infrared, and
vapour-phase reflow. Dwell times vary between 50 and
300 s according to method. Typical reflow temperatures
range from 215 to 250 °C.
Plastic small-outline packages
BY WAVE
During placement and before soldering, the component
must be fixed with a droplet of adhesive. After curing the
adhesive, the component can be soldered. The adhesive
can be applied by screen printing, pin transfer or syringe
dispensing.
Preheating is necessary to dry the paste and evaporate
the binding agent. Preheating duration: 45 min at 45 °C.
REPAIRING SOLDERED JOINTS (BY HAND-HELD SOLDERING
IRON OR PULSE-HEATED SOLDER TOOL)
Maximum permissible solder temperature is 260 °C, and
maximum duration of package immersion in solder bath is
10 s, if allowed to cool to less than 150 °C within 6 s.
Typical dwell time is 4 s at 250 °C.
Fix the component by first soldering two, diagonally
opposite, end pins. Apply the heating tool to the flat part of
the pin only. Contact time must be limited to 10 s at up to
300 °C. When using proper tools, all other pins can be
soldered in one operation within 2 to 5 s at between 270
and 320 °C. (Pulse-heated soldering is not recommended
for SO packages.)
A modified wave soldering technique is recommended
using two solder waves (dual-wave), in which a turbulent
wave with high upward pressure is followed by a smooth
laminar wave. Using a mildly-activated flux eliminates the
need for removal of corrosive residues in most
applications.
For pulse-heated solder tool (resistance) soldering of VSO
packages, solder is applied to the substrate by dipping or
by an extra thick tin/lead plating before package
placement.
BY SOLDER PASTE REFLOW
Reflow soldering requires the solder paste (a suspension
of fine solder particles, flux and binding agent) to be
applied to the substrate by screen printing, stencilling or
pressure-syringe dispensing before device placement.
DEFINITIONS
Data sheet status
Objective specification
Preliminary specification
Product specification
This data sheet contains target or goal specifications for product development.
This data sheet contains preliminary data; supplementary data may be published later.
This data sheet contains final product specifications.
Limiting values
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or
more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation
of the device at these or at any other conditions above those given in the Characteristics sections of the specification
is not implied. Exposure to limiting values for extended periods may affect device reliability.
Application information
Where application information is given, it is advisory and does not form part of the specification.
LIFE SUPPORT APPLICATIONS
These products are not designed for use in life support appliances, devices, or systems where malfunction of these
products can reasonably be expected to result in personal injury. Philips customers using or selling these products for
use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such
improper use or sale.
1995 Mar 21
10
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