TEA1552 [NXP]
GreenChipII SMPS control IC; GreenChipII SMPS控制IC
| 型号： | TEA1552 |
| 厂家： | 
NXP |
| 描述： | GreenChipII SMPS control IC |
| 文件： | 总24页 (文件大小：118K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
INTEGRATED CIRCUITS
DATA SHEET
TEA1552
GreenChip II SMPS control IC
Product specification
2002 Aug 27
Supersedes data of 2002 Jul 03
Philips Semiconductors
Product specification
GreenChip II SMPS control IC
TEA1552
FEATURES
APPLICATIONS
Distinctive features
Typical application areas are adapters and chargers (e.g.
for laptops, camcorders and printers) and all applications
that demand an efficient and cost-effective solution up to
250 W.
• Universal mains supply operation (70 to 276 V AC)
• High level of integration, giving a very low external
component count.
GENERAL DESCRIPTION
Green features
The GreenChip (1)II is the second generation of green
Switched Mode Power Supply (SMPS) control ICs
operating directly from the rectified universal mains. A high
level of integration leads to a cost effective power supply
with a very low number of external components.
• Valley or zero voltage switching for minimum switching
losses
• Efficient quasi-resonant operation at high power levels
• Frequency reduction at low power standby for improved
system efficiency (<3 W)
The special built-in green functions allow the efficiency to
be optimum at all power levels. This holds for
quasi-resonant operation at high power levels, as well as
fixed frequency operation with valley switching at medium
power levels. At low power (standby) levels, the system
operates at reduced frequency and with valley detection.
• Cycle skipping mode at very low loads. Pi < 300 mW at
no-load operation for a typical adapter application
• On-chip start-up current source
• Standby indication pin to indicate low output power
consumption.
The proprietary high voltage BCD800 process makes
direct start-up possible from the rectified mains voltage in
an effective and green way. A second low voltage
BICMOS IC is used for accurate, high speed protection
functions and control.
Protection features
• Safe restart mode for system fault conditions
• Continuous mode protection by means of
demagnetization detection (zero switch-on current)
Highly efficient, reliable supplies can easily be designed
using the GreenChipII control IC.
• Accurate and adjustable overvoltage protection
(latched)
• Short winding protection
• Undervoltage protection (foldback during overload)
• Overtemperature protection (latched)
• Low and adjustable overcurrent protection trip level
• Soft (re)start
• Mains voltage-dependent operation-enabling level
• General purpose input for lock protection.
(1) GreenChip is a trademark of Koninklijke Philips
Electronics N.V.
2002 Aug 27
2
Philips Semiconductors
Product specification
GreenChip II SMPS control IC
TEA1552
VCOadj
1
DEM
14
13
12
11
10
9
I
CTRL
LOCK
sense
2
STDBY
3
V
DRIVER
CC(5V)
4
TEA1552T
HVS
5
GND
n.c.
HVS
6
V
DRAIN
7
CC
8
MBL498
Fig.1 Basic application.
ORDERING INFORMATION
TYPE
PACKAGE
NUMBER
NAME
DESCRIPTION
VERSION
TEA1552T
SO14
plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
2002 Aug 27
3
Philips Semiconductors
Product specification
GreenChip II SMPS control IC
TEA1552
BLOCK DIAGRAM
8
7
SUPPLY
MANAGEMENT
START-UP
CURRENT SOURCE
V
DRAIN
CC
clamp
VALLEY
internal UVLO start
supply
5, 6
HVS
M-level
S1
14
VOLTAGE
CONTROLLED
OSCILLATOR
10
DEM
GND
LOGIC
100 mV
OVER-
VOLTAGE
PROTECTION
3
1
FREQUENCY
CONTROL
STDBY
VCOadj
4
LOGIC
DRIVER
DRIVER
I
ss
POWER-ON
RESET
LEB
0.5 V
S
R
Q
Q
soft
start
S2
13
CTRL
−1
blank
UVLO
2
I
sense
OCP
MAXIMUM
ON-TIME
TEA1552
PROTECTION
12
LOCK
short
winding
S
Q
Q
300 Ω
0.88 V
2.5 V
OVER-
TEMPERATURE
PROTECTION
lock
detect
11
R
5.6 V
V
< 4.5 V
V
CC
CC(5V)
5 V/1 mA
(max)
OVER-POWER
PROTECTION
MBL499
Fig.2 Block diagram.
2002 Aug 27
4
Philips Semiconductors
Product specification
GreenChip II SMPS control IC
TEA1552
PINNING
FUNCTIONAL DESCRIPTION
The TEA1552 is the controller of a compact flyback
converter, with the IC situated at the primary side.
An auxiliary winding of the transformer provides
demagnetization detection and powers the IC after
start-up.
SYMBOL PIN
DESCRIPTION
VCO adjustment input
VCOadj
Isense
1
2
3
4
5
programmable current sense input
standby indication or control output
gate driver output
STDBY
DRIVER
HVS
The TEA1552 operates in multi modes (see Fig.4).
high voltage safety spacer, not
connected
The next converter stroke is started only after
demagnetization of the transformer current (zero current
switching), while the drain voltage has reached the lowest
voltage to prevent switching losses (green function). The
primary resonant circuit of primary inductance and drain
capacitor ensures this quasi-resonant operation. The
design can be optimized in such a way that zero voltage
switching can be reached over almost the complete
universal mains range.
HVS
6
7
high voltage safety spacer, not
connected
DRAIN
drain of external MOS switch, input for
start-up current and valley sensing
VCC
8
9
supply voltage
not connected
n.c.
GND
VCC(5V)
LOCK
CTRL
DEM
10 ground
11 5 V output
12 lock input
13 control input
To prevent very high frequency operation at lower loads,
the quasi-resonant operation changes smoothly in fixed
frequency PWM control.
At very low power (standby) levels, the frequency is
controlled down, via the VCO, to a minimum frequency of
approximately 25 kHz.
14 input from auxiliary winding for
demagnetization timing, OVP and OPP
Start-up, mains enabling operation level and
undervoltage lock-out (see Figs 11 and 12)
Initially, the IC is self supplying from the rectified mains
voltage via pin DRAIN. Supply capacitor CVCC is charged
by the internal start-up current source to a level of
approximately 4 V or higher, depending on the drain
voltage. Once the drain voltage exceeds the M-level
(mains-dependent operation-enabling level), the start-up
current source will continue charging capacitor CVCC
(switch S1 will be opened); see Fig.2. The IC will activate
the power converter as soon as the voltage on pin VCC
passes the level VCC(start). The IC supply is taken over by
the auxiliary winding as soon as the output voltage
reaches its intended level and the IC supply from the
mains voltage is subsequently stopped for high efficiency
operation (green function).
handbook, halfpage
VCOadj
1
2
3
4
5
6
7
14 DEM
13 CTRL
12 LOCK
I
sense
STDBY
DRIVER
HVS
11
V
TEA1552T
CC(5V)
10 GND
HVS
9
8
n.c.
V
DRAIN
CC
The moment the voltage on pin VCC drops below the
undervoltage lock-out level VUVLO, the IC stops switching
and enters a safe restart from the rectified mains voltage.
Inhibiting the auxiliary supply by external means causes
the converter to operate in a stable, well defined burst
mode.
MBL497
Supply management
Fig.3 Pin configuration.
All (internal) reference voltages are derived from a
temperature compensated, on-chip band gap circuit.
2002 Aug 27
5
Philips Semiconductors
Product specification
GreenChip II SMPS control IC
TEA1552
The maximum fixed frequency of the oscillator is set by an
internal current source and capacitor. The maximum
frequency is reduced once the control voltage enters the
VCO control window. Then, the maximum frequency
changes linearly with the control voltage until the minimum
frequency is reached (see Figs 5 and 6).
f
MBL500
handbook, halfp(akgHe z)
VCO
fixed
quasi resonant
125
MBL501
25
f
handbook, halfpage
(kHz)
125 kHz
P (W)
125
Fig.4 Multi mode operation.
25
V
VCO
VCO
1
level
sense(max) (V)
2
Current mode control
level
Current mode control is used for its good line regulation
behaviour.
Fig.6 VCO frequency as a function of Vsense(max)
.
The ‘on-time’ is controlled by the internally inverted control
pin voltage, which is compared with the primary current
information. The primary current is sensed across an
external resistor. The driver output is latched in the logic,
preventing multiple switch-on.
VCO adjustment
The VCOadj pin can be used to set the VCO operation
point. As soon as the peak voltage on the sense resistor is
controlled below half the voltage on the VCOadj pin (VCO1
level), frequency reduction will start. The actual peak
voltage on sense will be somewhat higher due to switch-off
delay (see Fig.7). The frequency reduction will stop
approximately 25 mV lower (VCO2 level), when the
minimum frequency is reached.
The internal control voltage is inversely proportional to the
external control pin voltage, with an offset of 1.5 V. This
means that a voltage range from 1 to 1.5 V on pin CTRL
will result in an internal control voltage range from
0.5 to 0 V (a high external control voltage results in a low
duty cycle).
Cycle skipping
Oscillator
At very low power levels, a cycle skipping mode will be
activated. A high control voltage will reduce the switching
frequency to a minimum of 25 kHz. If the voltage on the
control pin has raised even more, switch-on of the external
power MOSFET will be inhibited until the voltage on the
control pin has dropped to a lower value again (see Fig.7).
MGU233
V
sense(max)
handbook, halfpage
0.52 V
For system accuracy, it is not the absolute voltage on the
control pin that will trigger the cycle skipping mode, but a
signal derived from the internal VCO will be used.
Remark: If the no-load requirement of the system is such
that the output voltage can be regulated to its intended
level at a switching frequency of 25 kHz or above, the
cycle skipping mode will not be activated.
1 V
(typ)
1.5 V
(typ)
V
CTRL
Fig.5 Vsense(max) as a function of VCTRL
.
2002 Aug 27
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Philips Semiconductors
Product specification
GreenChip II SMPS control IC
TEA1552
f
osc
dV
dV
2
1
1.5 V − V
current
comparator
CTRL
X2
f
max
CTRL
DRIVER
DRIVER
f
min
I
sense
V
CC(5V)
dV
V
(mV)
3
x
V
STDBY
(V)
V
5 V
dV
x
4
V
VCO
VCOadj
OSCILLATOR
adj
I
5
0
V
(mV)
x
cycle
skipping
1
0
MBL502
V
(mV)
x
The voltage levels dV1, dV2, dV3 and dV4 are fixed in the IC to typically 50 mV, 18 mV, 40 mV and 15 mV respectively.
The level at which VCO mode of operation starts or ends can be externally controlled with the VCOadj pin.
Fig.7 A functional implementation of the standby and cycle skipping circuitry.
Standby output
Demagnetization recognition is suppressed during the first
time (tsuppr). This suppression may be necessary in
applications where the transformer has a large leakage
inductance and at low output voltages/start-up.
The STDBY output pin (VSTDBY = 5 V) can be used to drive
an external NPN transistor or FET in order to e.g.
switch-off a PFC circuit. The STDBY output is activated by
the internal VCO: as soon as the VCO has reduced the
switching frequency to (almost) the minimum frequency of
25 kHz, the STDBY output will be activated (see Fig.7).
The STDBY output will go low again as soon as the VCO
allows a switching frequency close to the maximum
frequency of 125 kHz.
OverVoltage Protection (OVP)
An OVP mode is implemented in the GreenChip series.
For the TEA1552, this works by sensing the auxiliary
voltage via the current flowing into pin DEM during the
secondary stroke. The auxiliary winding voltage is a
well-defined replica of the output voltage. Any voltage
spikes are averaged by an internal filter.
Demagnetization
The system will be in discontinuous conduction mode all
the time. The oscillator will not start a new primary stroke
until the secondary stroke has ended.
If the output voltage exceeds the OVP trip level, the OVP
circuit switches off the power MOSFET. The controller
then waits until the UVLO level is reached on pin VCC
.
When VCC drops to UVLO, capacitor CVCC will be
Demagnetization features a cycle-by-cycle output
short-circuit protection by immediately lowering the
frequency (longer off-time), thereby reducing the power
level.
recharged to the Vstart level, however the IC will not start
switching again. Subsequently, VCC will drop again to the
UVLO level, etc.
2002 Aug 27
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Philips Semiconductors
Product specification
GreenChip II SMPS control IC
TEA1552
Operation only recommences when the VCC voltage drops
below a level of approximately 4.5 V (practically when the
Vmains has been disconnected for a short period).
Valley switching (see Fig.8)
A new cycle starts when the power switch is switched on.
After the ‘on-time’ (which is determined by the ‘sense’
voltage and the internal control voltage), the switch is
opened and the secondary stroke starts.
The output voltage (VOVP) at which the OVP function trips,
can be set by the demagnetization resistor RDEM
Ns
:
After the secondary stroke, the drain voltage shows an
oscillation with a frequency of approximately
VOVP
=
× [I OVP(DEM) × RDEM + Vclamp(DEM)(pos)]
-----------
Naux
1
---------------------------------------------------
where Ns is the number of secondary turns and Naux is the
number of auxiliary turns of the transformer.
(2 × π × (Lp × Cd))
where Lp is the primary self inductance of the transformer
and Cd is the capacitance on the drain node.
Current IOVP(DEM) is internally trimmed.
The value of the demagnetization resistor (RDEM) can be
adjusted to the turns ratio of the transformer, thus making
an accurate OVP possible.
primary
stroke
secondary
stroke
secondary
ringing
drain
valley
secondary
stroke
B
A
oscillator
MGU235
A: Start of new cycle at lowest drain voltage.
B: Start of new cycle in a classical PWM system at high drain voltage.
Fig.8 Signals for valley switching.
2002 Aug 27
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Philips Semiconductors
Product specification
GreenChip II SMPS control IC
TEA1552
As soon as the oscillator voltage is high again and the
secondary stroke has ended, the circuit waits for the
lowest drain voltage before starting a new primary stroke.
This method is called valley detection. Figure 8 shows the
drain voltage together with the valley signal, the signal
indicating the secondary stroke and the oscillator signal.
MGU236
handbook, halfpage
V
sense(max)
0.52 V
(typ)
In an optimum design, the reflected secondary voltage on
the primary side will force the drain voltage to zero. Thus,
zero voltage switching is very possible, preventing large
0.3 V
(typ)
1
capacitive switching losses P = × C × V2 × f , and
--
2
−100 µA
(typ)
−24 µA
(typ)
allowing high frequency operation, which results in small
and cost effective inductors.
I
DEM
Fig.9 OPP correction curve.
OverCurrent Protection (OCP)
The cycle-by-cycle peak drain current limit circuit uses the
external source resistor to measure the current accurately.
This allows optimum size determination of the transformer
core (cost issue). The circuit is activated after the leading
edge blanking time tleb. The OCP protection circuit limits
the ‘sense’ voltage to an internal level.
Minimum and maximum ‘on-time’
The minimum ‘on-time’ of the SMPS is determined by the
Leading Edge Blanking (LEB) time. The IC limits the
‘on-time’ to 50 µs. When the system desires an ‘on-time’
longer than 50 µs, a fault condition is assumed, and the IC
will stop switching and enter the safe restart mode.
OverPower Protection (OPP)
During the primary stroke, the rectified mains input voltage
is measured by sensing the current drawn from pin DEM.
This current is dependent on the mains voltage, according
Short winding protection
After the leading edge blanking time, the short winding
protection circuit is also activated. If the ‘sense’ voltage
exceeds the short winding protection voltage Vswp, the
converter will stop switching. Once VCC drops below the
UVLO level, capacitor CVCC will be recharged and the
supply will restart again. This cycle will be repeated until
the short-circuit is removed (safe restart mode).
Vaux N × Vmains
to the following formula: IDEM
≈
≈
-------------- --------------------------
RDEM
RDEM
Naux
where: N =
-----------
Np
The current information is used to adjust the peak drain
current, which is measured via pin Isense. The internal
compensation is such that an almost mains independent
maximum output power can be realized.
The short winding protection will also protect in case of a
secondary diode short-circuit.
The OPP curve is given in Fig.9.
2002 Aug 27
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Philips Semiconductors
Product specification
GreenChip II SMPS control IC
TEA1552
LOCK input
Since the soft start current ISS is subtracted from pin VCC
charging current, the RSS value will affect the VCC charging
current level by a maximum of 60 µA (typical value).
Pin LOCK is a general purpose (high-impedance) input
pin, which can be used to switch off the IC. As soon as the
voltage on this pin is raised above 2.5 V, switching will stop
immediately. The voltage on the VCC pin will cycle between
VCC(start) and VCC(UVLO), but the IC will not start switching
again until the latch function is reset. The latch is reset as
soon as the VCC drops below 4.5 V (typical value). The
internal OVP and OTP will also trigger this latch (see
Fig.2).
handbook, halfpage
I
SS
0.5 V
start-up
The detection level of this input is related to the VCC(5V) pin
voltage in the following way: 0.5 × VCC(5V) ± 4%.
An internal Zener diode clamp of 5.6 V will protect this pin
from excessive voltages. No internal filtering is done on
this input.
R
C
I
SS
sense
2
R
sense
V
SS
ocp
OverTemperature Protection (OTP)
MBL503
An accurate temperature protection is provided in the
circuit. When the junction temperature exceeds the
thermal shutdown temperature, the IC will stop switching.
When VCC drops to UVLO, capacitor CVCC will be
recharged to the Vstart level, however the IC will not start
switching again. Subsequently, VCC will drop again to the
UVLO level, etc.
Fig.10 Soft start-up.
5 V output
Pin VCC(5V) can be used for supplying external circuitry.
The maximum output current must be limited to 1 mA.
If higher peak currents are required, an external RC
combination should limit the current drawn from this pin to
1 mA maximum.
Operation only recommences when the VCC voltage drops
below a level of approximately 4.5 V (practically when the
Vmains has been disconnected for a short period).
The 5 V output voltage will be available as soon as the
start-up voltage is reached. As the high voltage supply can
not supply the 5 V pin during start-up and/or shutdown,
during latched shutdown (via pin LOCK or other latched
protection such as OVP or OTP), the voltage is switched
to zero.
Soft start-up
To prevent transformer rattle during hiccup, the
transformer peak current is slowly increased by the soft
start function. This can be achieved by inserting a resistor
and a capacitor between pin Isense and the sense resistor
(see Fig.10). An internal current source charges the
capacitor to V = ISS × RSS, with a maximum of
approximately 0.5 V.
Driver
The driver circuit to the gate of the power MOSFET has a
current sourcing capability of typically 170 mA and a
current sink capability of typically 700 mA. This permits
fast turn-on and turn-off of the power MOSFET for efficient
operation. A low driver source current has been chosen to
limit the ∆V/∆t at switch-on. This reduces Electro Magnetic
Interference (EMI) and also limits the current spikes
The start level and the time constant of the increasing
primary current level can be adjusted externally by
changing the values of RSS and CSS
.
V
ocp – (ISS × RSS)
Iprimary(max)
=
----------------------------------------------
Rsense
across Rsense
.
τ = R SS × CSS
The charging current ISS will flow as long as the voltage on
pin Isense is below approximately 0.5 V. If the voltage on
pin Isense exceeds 0.5 V, the soft start current source will
start limiting the current ISS. At the VCC(start) level, the ISS
current source is completely switched off.
2002 Aug 27
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Philips Semiconductors
Product specification
GreenChip II SMPS control IC
TEA1552
LIMITING VALUES
In accordance with the Absolute Maximum Rating System (IEC 60134); note 1.
SYMBOL
Voltages
PARAMETER
CONDITIONS
MIN.
MAX.
UNIT
VVCOadj
Vsense
VDRAIN
VCC
voltage on pin VCOadj
continuous
−0.4
+5
V
V
V
V
V
V
V
voltage on pin Isense
voltage on pin DRAIN
supply voltage
current limited
−0.4
−0.4
−0.4
−0.4
−0.4
−0.4
−
+650
+20
+7
continuous
continuous
VLOCK
VCTRL
VDEM
voltage on pin LOCK
voltage on pin CTRL
voltage on pin DEM
+5
current limited
−
Currents
Isense
current on pin Isense
current on pin STDBY
current on pin DRIVER
current on pin DRAIN
current on pin VCC(5V)
current on pin CTRL
current on pin DEM
−1
+10
−
mA
mA
A
ISTDBY
IDRIVER
IDRAIN
ICC(5V)
ICTRL
−1
d < 10%
−0.8
−
+2
+5
0
mA
mA
mA
µA
−1
−
+5
+250
IDEM
−250
General
Ptot
total power dissipation
storage temperature
junction temperature
Tamb < 70 °C
−
0.75
W
Tstg
−55
−20
+150
+145
°C
°C
Tj
ESD
Vesd
electrostatic discharge voltage
pins 1 to 6 and pins 9 to 14
pin 7
HBM class 1; note 2
HBM class 1; note 2
MM; note 3
−
−
−
2000
1500
400
V
V
V
any other pin
Notes
1. All voltages are measured with respect to ground; positive currents flow into the chip; pin VCC may not be current
driven. The voltage ratings are valid provided other ratings are not violated; current ratings are valid provided the
maximum power rating is not violated.
2. Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor.
3. Equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 Ω resistor.
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
VALUE
UNIT
Rth(j-a)
thermal resistance from junction to ambient
in free air; note 1
100
K/W
Note
1. With pin GND connected to sufficient copper area on the printed-circuit board.
2002 Aug 27
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Philips Semiconductors
Product specification
GreenChip II SMPS control IC
TEA1552
QUALITY SPECIFICATION
In accordance with ‘SNW-FQ-611D’.
CHARACTERISTICS
Tamb = 25 °C; VCC = 15 V; all voltages are measured with respect to ground; currents are positive when flowing into
the IC; unless otherwise specified.
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
Start-up current source (pin DRAIN)
IDRAIN
supply current from pin DRAIN
VCC = 0 V; VDRAIN > 100 V 1.0
1.2
1.4
mA
with auxiliary supply;
−
100
300
µA
VDRAIN > 100 V
BVDSS
breakdown voltage
650
60
−
−
−
V
V
M-level
mains-dependent
100
operation-enabling level
Supply voltage management (pin VCC
)
VCC(start)
VCC(UVLO)
VCC(hys)
ICC(h)
start-up voltage on VCC
10.3 11
11.7
9.3
V
V
V
undervoltage lock-out on VCC
hysteresis voltage on VCC
8.1
2.0
8.7
2.3
V
CC(start) − VCC(UVLO)
2.6
pin VCC charging current (high)
pin VCC charging current (low)
VDRAIN > 100 V; VCC < 3V −1.2 −1
−0.8 mA
−0.45 mA
ICC(l)
VDRAIN > 100 V;
−1.2 −0.75
3 V < VCC < VCC(UVLO)
ICC(restart)
ICC(oper)
pin VCC restart current
VDRAIN > 100 V;
VCC(UVLO) < VCC < VCC(start)
−650 −550
−450 µA
supply current under normal
operation
no load on pin DRIVER
1.1
1.3
1.5
mA
Demagnetization management (pin DEM)
Vth(DEM)
demagnetization comparator
threshold voltage on pin DEM
50
100
150
mV
nA
Iprot(DEM)
protection current on pin DEM
VDEM = 50 mV
−50(1)
−
−10
Vclamp(DEM)(neg) negative clamp voltage on pin DEM IDEM = −150 µA
Vclamp(DEM)(pos) positive clamp voltage on pin DEM IDEM = 250 µA
−0.5 −0.25
−0.05 V
0.5
1.1
0.7
1.5
0.9
1.9
V
tsuppr
suppression of transformer ringing
at start of secondary stroke
µs
Pulse width modulator
ton(min) minimum on-time
ton(max)
−
tleb
50
−
ns
maximum on-time
latched
40
60
µs
Oscillator
fosc(l)
oscillator low fixed frequency
oscillator high fixed frequency
VCTRL > 1.5 V
VCTRL < 1 V
20
100
−
25
30
150
−
kHz
kHz
mV
fosc(h)
125
VCO1
Vvco(start)
peak voltage on pin Isense, where
frequency reduction starts
see Figs 6 and 7
2002 Aug 27
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Philips Semiconductors
Product specification
GreenChip II SMPS control IC
TEA1552
SYMBOL
Vvco(max)
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
peak voltage on pin Isense, where
the frequency is equal to fosc(l)
−
VCO1 − 25
−
mV
Duty cycle control (pin CTRL)
VCTRL(min) minimum voltage on pin CTRL for
−
−
1.0
1.5
−
−
V
V
maximum duty cycle
VCTRL(max)
maximum voltage on pin CTRL for
minimum duty cycle
5 V output (pin VCC(5V)
)
VCC(5V)
ICC(5V)
output voltage
IO = 1 mA
4.75 5.0
−1.0
5.25
V
current capability of pin VCC(5V)
−
−
mA
LOCK input (pin LOCK)
VLOCK
LOCK trip level
2.37 2.5
2.63
V
V
VCC(reset)
voltage level on pin VCC which
resets the latch
VLOCK < 2.3 V
−
4.5
−
RELLOCK,5V
relation to 5 V output (pin VCC(5V)
)
VLOCK = 0.5 × VCC(5V)
−4
−
+4
%
Valley switch (pin DRAIN)
∆V/∆tvalley
valley recognition voltage change
−85
−
+85
V/µs
tvalley-swon
delay from valley recognition to
switch-on
−
150(1)
−
ns
Overcurrent and short winding protection (pin Isense
)
Vsense(max)
tPD
maximum source voltage OCP
∆V/∆t = 0.1 V/µs
∆V/∆t = 0.5 V/µs
0.48 0.52
140
0.56
185
V
propagation delay from detecting
Vsense(max) to switch-off
−
ns
Vswp
tleb
short winding protection voltage
0.83 0.88
0.96
440
V
blanking time for current and short
winding protection
300
370
ns
ISS
soft start current
Vsense < 0.5 V
45
60
75
66
µA
µA
Overvoltage protection (pin DEM)
IOVP(DEM) OVP level on pin DEM
set by resistor RDEM; see
Section “OverVoltage
Protection (OVP)”
54
60
Overpower protection (pin DEM)
IOPP(DEM)
OPP current on pin DEM to start
OPP correction
set by resistor RDEM; see
Section “OverPower
Protection (OPP)”
−
−
−24
−
−
µA
µA
IOPP50%(DEM)
OPP current on pin DEM, where
maximum source voltage is limited
to 0.3 V
−100
2002 Aug 27
13
Philips Semiconductors
Product specification
GreenChip II SMPS control IC
TEA1552
SYMBOL
PARAMETER
CONDITIONS
MIN.
TYP.
MAX. UNIT
Standby output (pin STDBY)
VSTDBY
Isource
Isink
standby output voltage
4.75 5.0
5.25
24
−
V
source current capability
sink current capability
VSTDBY = 1 V
20
2
22
µA
mA
VSTDBY = 1 V
−
Driver (pin DRIVER)
Isource source current capability of driver
Isink
VCC = 9.5 V; VDRIVER = 2 V
VCC = 9.5 V; VDRIVER = 2 V
−
−170
300
−88
−
mA
mA
mA
sink current capability of driver
−
VCC = 9.5 V;
400
700
−
VDRIVER = 9.5 V
Vo(driver)(max)
maximum output voltage of driver
VCC > 12 V
−
11.5
12
V
Temperature protection
Tprot(max) maximum temperature protection
130
140
8(1)
150
°C
°C
level
Tprot(hys)
hysteresis for the temperature
protection level
−
−
Note
1. Guaranteed by design.
2002 Aug 27
14
Philips Semiconductors
Product specification
GreenChip II SMPS control IC
TEA1552
APPLICATION INFORMATION
A converter with the TEA1552 consists of an input filter, a transformer with a third winding (auxiliary), and an output stage
with a feedback circuit.
Capacitor CVCC (at pin VCC) buffers the supply voltage of the IC, which is powered via the high voltage rectified mains
during start-up and via the auxiliary winding during operation.
A sense resistor converts the primary current into a voltage at pin Isense. The value of this sense resistor defines the
maximum primary peak current.
V
mains
D
o
V
N
i
PFC
V
o
N
p
s
V
DRAIN
HVS
CC
8
7
6
5
4
3
2
1
C
o
C
VCC
n.c.
GND
9
power
MOSFET
HVS
10
11
12
13
14
V
DRIVER
STDBY
CC(5V)
LOCK
CTRL
DEM
TEA1552T
−
t
C
R
SS
I
Rs2
SS
sense
C
R
CTRL
R
sense
VCOadj
CTRL
R
DEM
N
aux
R
R
reg1
reg2
MBL504
The LOCK pin is used in this example for an additional external overtemperature protection.
If this pin is not used, it must be tied to ground.
Fig.11 Configuration with controlled PFC.
2002 Aug 27
15
Philips Semiconductors
Product specification
GreenChip II SMPS control IC
TEA1552
V
i
V
D
(power
MOSFET)
V
o
V
CC
V
gate
M-level
V
µC
start-up
sequence
normal
operation
overvoltage
protection
normal
operation
output
short-circuit
MBL505
Fig.12 Typical waveforms.
16
2002 Aug 27
Philips Semiconductors
Product specification
GreenChip II SMPS control IC
TEA1552
PACKAGE OUTLINE
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
H
v
M
A
E
Z
8
14
Q
A
2
A
(A )
3
A
1
pin 1 index
θ
L
p
L
1
7
e
detail X
w
M
b
p
0
2.5
scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
A
(1)
(1)
(1)
UNIT
A
A
A
b
c
D
E
e
H
L
L
p
Q
v
w
y
Z
θ
1
2
3
p
E
max.
0.25
0.10
1.45
1.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
6.2
5.8
1.0
0.4
0.7
0.6
0.7
0.3
mm
1.75
1.27
0.050
1.05
0.25
0.01
0.25
0.1
0.25
0.01
8o
0o
0.010 0.057
0.004 0.049
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.244
0.228
0.039 0.028
0.016 0.024
0.028
0.012
inches
0.041
0.01 0.004
0.069
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
REFERENCES
OUTLINE
EUROPEAN
PROJECTION
ISSUE DATE
VERSION
IEC
JEDEC
EIAJ
97-05-22
99-12-27
SOT108-1
076E06
MS-012
2002 Aug 27
17
Philips Semiconductors
Product specification
GreenChip II SMPS control IC
TEA1552
SOLDERING
If wave soldering is used the following conditions must be
observed for optimal results:
Introduction to soldering surface mount packages
• Use a double-wave soldering method comprising a
turbulent wave with high upward pressure followed by a
smooth laminar wave.
This text gives a very brief insight to a complex technology.
A more in-depth account of soldering ICs can be found in
our “Data Handbook IC26; Integrated Circuit Packages”
(document order number 9398 652 90011).
• For packages with leads on two sides and a pitch (e):
– larger than or equal to 1.27 mm, the footprint
longitudinal axis is preferred to be parallel to the
transport direction of the printed-circuit board;
There is no soldering method that is ideal for all surface
mount IC packages. Wave soldering can still be used for
certain surface mount ICs, but it is not suitable for fine pitch
SMDs. In these situations reflow soldering is
recommended.
– smaller than 1.27 mm, the footprint longitudinal axis
must be parallel to the transport direction of the
printed-circuit board.
Reflow soldering
The footprint must incorporate solder thieves at the
downstream end.
Reflow soldering requires solder paste (a suspension of
fine solder particles, flux and binding agent) to be applied
to the printed-circuit board by screen printing, stencilling or
pressure-syringe dispensing before package placement.
• For packages with leads on four sides, the footprint must
be placed at a 45° angle to the transport direction of the
printed-circuit board. The footprint must incorporate
solder thieves downstream and at the side corners.
Several methods exist for reflowing; for example,
convection or convection/infrared heating in a conveyor
type oven. Throughput times (preheating, soldering and
cooling) vary between 100 and 200 seconds depending
on heating method.
During placement and before soldering, the package must
be fixed with a droplet of adhesive. The adhesive can be
applied by screen printing, pin transfer or syringe
dispensing. The package can be soldered after the
adhesive is cured.
Typical reflow peak temperatures range from
215 to 250 °C. The top-surface temperature of the
packages should preferable be kept below 220 °C for
thick/large packages, and below 235 °C for small/thin
packages.
Typical dwell time is 4 seconds at 250 °C.
A mildly-activated flux will eliminate the need for removal
of corrosive residues in most applications.
Manual soldering
Wave soldering
Fix the component by first soldering two
diagonally-opposite end leads. Use a low voltage (24 V or
less) soldering iron applied to the flat part of the lead.
Contact time must be limited to 10 seconds at up to
300 °C.
Conventional single wave soldering is not recommended
for surface mount devices (SMDs) or printed-circuit boards
with a high component density, as solder bridging and
non-wetting can present major problems.
When using a dedicated tool, all other leads can be
soldered in one operation within 2 to 5 seconds between
270 and 320 °C.
To overcome these problems the double-wave soldering
method was specifically developed.
2002 Aug 27
18
Philips Semiconductors
Product specification
GreenChip II SMPS control IC
TEA1552
Suitability of surface mount IC packages for wave and reflow soldering methods
SOLDERING METHOD
PACKAGE(1)
WAVE
not suitable
REFLOW(2)
BGA, LBGA, LFBGA, SQFP, TFBGA, VFBGA
suitable
HBCC, HBGA, HLQFP, HSQFP, HSOP, HTQFP, HTSSOP, HVQFN, not suitable(3)
HVSON, SMS
suitable
PLCC(4), SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
suitable
suitable
not recommended(4)(5) suitable
not recommended(6)
suitable
Notes
1. For more detailed information on the BGA packages refer to the “(LF)BGA Application Note” (AN01026); order a copy
from your Philips Semiconductors sales office.
2. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum
temperature (with respect to time) and body size of the package, there is a risk that internal or external package
cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the
Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods”.
3. These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder
cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side,
the solder might be deposited on the heatsink surface.
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction.
The package footprint must incorporate solder thieves downstream and at the side corners.
5. Wave soldering is suitable for LQFP, TQFP and QFP packages with a pitch (e) larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
2002 Aug 27
19
Philips Semiconductors
Product specification
GreenChip II SMPS control IC
TEA1552
DATA SHEET STATUS
PRODUCT
DATA SHEET STATUS(1)
STATUS(2)
DEFINITIONS
Objective data
Development This data sheet contains data from the objective specification for product
development. Philips Semiconductors reserves the right to change the
specification in any manner without notice.
Preliminary data
Qualification
This data sheet contains data from the preliminary specification.
Supplementary data will be published at a later date. Philips
Semiconductors reserves the right to change the specification without
notice, in order to improve the design and supply the best possible
product.
Product data
Production
This data sheet contains data from the product specification. Philips
Semiconductors reserves the right to make changes at any time in order
to improve the design, manufacturing and supply. Changes will be
communicated according to the Customer Product/Process Change
Notification (CPCN) procedure SNW-SQ-650A.
Notes
1. Please consult the most recently issued data sheet before initiating or completing a design.
2. The product status of the device(s) described in this data sheet may have changed since this data sheet was
published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com.
DEFINITIONS
DISCLAIMERS
Short-form specification
The data in a short-form
Life support applications
These products are not
specification is extracted from a full data sheet with the
same type number and title. For detailed information see
the relevant data sheet or data handbook.
designed for use in life support appliances, devices, or
systems where malfunction of these products can
reasonably be expected to result in personal injury. Philips
Semiconductors customers using or selling these products
for use in such applications do so at their own risk and
agree to fully indemnify Philips Semiconductors for any
damages resulting from such application.
Limiting values definition Limiting values given are in
accordance with the Absolute Maximum Rating System
(IEC 60134). Stress above one or more of the limiting
values may cause permanent damage to the device.
These are stress ratings only and operation of the device
at these or at any other conditions above those given in the
Characteristics sections of the specification is not implied.
Exposure to limiting values for extended periods may
affect device reliability.
Right to make changes
Philips Semiconductors
reserves the right to make changes, without notice, in the
products, including circuits, standard cells, and/or
software, described or contained herein in order to
improve design and/or performance. Philips
Semiconductors assumes no responsibility or liability for
the use of any of these products, conveys no licence or title
under any patent, copyright, or mask work right to these
products, and makes no representations or warranties that
these products are free from patent, copyright, or mask
work right infringement, unless otherwise specified.
Application information
Applications that are
described herein for any of these products are for
illustrative purposes only. Philips Semiconductors make
no representation or warranty that such applications will be
suitable for the specified use without further testing or
modification.
2002 Aug 27
20
Philips Semiconductors
Product specification
GreenChip II SMPS control IC
TEA1552
NOTES
2002 Aug 27
21
Philips Semiconductors
Product specification
GreenChip II SMPS control IC
TEA1552
NOTES
2002 Aug 27
22
Philips Semiconductors
Product specification
GreenChip II SMPS control IC
TEA1552
NOTES
2002 Aug 27
23
Philips Semiconductors – a worldwide company
Contact information
For additional information please visit http://www.semiconductors.philips.com.
Fax: +31 40 27 24825
For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com.
© Koninklijke Philips Electronics N.V. 2002
SCA74
All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner.
The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed
without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license
under patent- or other industrial or intellectual property rights.
Printed in The Netherlands
613502/02/pp24
Date of release: 2002 Aug 27
Document order number: 9397 750 10259
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