MSC7128-XXGS-BK [OKI]

Dot Matrix LCD Driver, 16 X 36 Dots, CMOS, PQFP64, 14 X 20 MM, 1 MM PITCH, PLASTIC, QFP-64;
MSC7128-XXGS-BK
型号: MSC7128-XXGS-BK
厂家: OKI ELECTRONIC COMPONETS    OKI ELECTRONIC COMPONETS
描述:

Dot Matrix LCD Driver, 16 X 36 Dots, CMOS, PQFP64, 14 X 20 MM, 1 MM PITCH, PLASTIC, QFP-64

CD
文件: 总27页 (文件大小:200K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
E2C0029-27-Y4  
This version: Nov. 1997  
Previous version: Jul. 1996  
¡ Semiconductor  
MSC7128-xx  
5 ¥ 7-Dot Character ¥ 16-Digit Display Controller/Driver  
GENERAL DESCRIPTION  
The MSC7128-xx is a general purpose display controller for vacuum fluorescent display tube.  
The MSC7128-xx drives displays with up to 35 anodes (dots) and up to 16 grids (characters) plus  
a cursor.  
The controller accepts command and display data input words on a clocked serial input line.  
Commands control the on/off duty cycle, starting character position, number of characters to  
display and display modes (PLA mode and Lamp Test mode). An internal PLA-type character  
generator provides character decoding and dot pattern generation for the full 128 characters.  
A 35 ¥ 128-bit PLA (ROM) code is programmable.  
FEATURES  
• Logic supply voltage (V  
)
:+5V  
:–55V  
DD  
• VF driver supply voltage (V  
• Driver output current  
– VF grid driver  
)
EE  
:–30mA  
:–2mA  
– VF anode driver  
– VF cursor driver  
:–10mA  
• Direct drive capability for vacuum fluorescent display (no pull-down resistor is required)  
• Built-in oscillation circuit  
• Built-in power-on-reset circuit with external C  
• Serial host interface (data in, clock, chip select)  
• Serial data input for 8-bit control and display data words  
• Command functions  
– On/off duty cycle  
: 0/16 to 15/16  
: 0 to 15  
:1 to 16  
– Character display position  
– Number of display digits  
– Display modes  
: PLA mode, and Lamp Test mode  
• Built-in 35 x 128-bit PLA-type character generator  
– Character font  
– Number of characters  
– Programmable PLA code  
:5 ¥ 7  
:128  
• Package options:  
64-pin plastic SDIP (SDIP64-P-750-1.78) (Product name : MSM7128-xxSS)  
64-pin plastic QFP (QFP64-P-1420-1.00-BK) (Product name : MSM7128-xxGS-BK)  
xx indicates the code number.  
1/27  
SEG  
DRIVER  
RAM  
LATCH  
PLA  
LATCH  
VDD  
DA  
8-BIT  
DISPLAY  
DATA  
SEG1  
SEG2  
SHIFT REGISTER  
CHARACTER  
GENERATOR  
35 ¥ 128 BITS  
BUFFER  
8
8
8
7
35  
36  
CS  
CS  
8BITS ¥  
16 WORDS  
b0-7  
SEG34  
SEG35  
SEG36  
L R  
L R S  
OE  
ROM ROM  
PC1 PC2  
CP  
CP  
COMMAND  
LT  
RESET  
fSEG  
DECODER  
fW RAMPC fR  
DECODER  
3
5
4
RESET  
R L  
b4-6  
COM  
DRIVER  
RESET  
RESET  
ADDRESS  
SELECTOR  
W/R  
COM1  
COM2  
LATCH  
4
4
4
4
16  
CONTROL  
TIMING  
GENERATOR  
OSCI  
OSCO  
OSC  
4
CP  
b0-3  
WRITE  
READ  
ADDRESS  
COUNTER  
RESET  
ADDRESS  
COUNTER  
COM14  
COM15  
COM16  
W.A.C. LOAD  
W.A.C. COUNT  
CS  
RESET  
RESET  
TEST  
STEP  
fDIG  
OE  
W.A.C. COUNT  
RESET  
4
TEST  
b0-3  
4
COUNT  
A = B  
4
b0-3  
DIGIT  
D.G  
DUTYCYCLE REGISTER  
COUNT  
A
B
LOAD  
R
D.G  
LOAD  
REGISTER  
ADDRESS  
COMP  
4
RESET  
b0-3  
VEE  
VSS  
RESET  
BLANK  
DUTYCYCLE  
COUNTER  
DUTY AND  
BLANK  
DUTY AND BLANK  
GENERATOR  
RESET  
¡ Semiconductor  
MSC7128-xx  
INPUT AND OUTPUT CONFIGURATION  
• INPUT PIN  
VDD  
DA  
CS  
CP  
OSCI  
VDD  
VDD  
R
TEST COUNT  
TEST STEP  
RESET  
GND  
• OUTPUT PIN  
VDD  
OSCO  
VDD  
SEG1 - 35  
VEE  
VDD  
SEG36  
COM1-16  
VEE  
3/27  
¡ Semiconductor  
MSC7128-xx  
PIN CONFIGURATION (TOP VIEW)  
1
2
3
4
5
6
7
8
64 CS  
OSC0  
OSCI  
TEST COUNT  
TEST STEP  
VSS  
63  
62  
61  
60  
59  
58  
57  
DA  
CP  
RESET  
VDD  
1
VEE  
VDD 2  
COM 1  
COM 2  
COM 3  
SEG 1  
SEG 2  
9
56 SEG 3  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
29  
30  
31  
32  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
COM 4  
COM 5  
COM 6  
COM 7  
COM 8  
COM 9  
COM10  
COM11  
COM12  
COM13  
COM14  
COM15  
COM16  
SEG 36  
SEG 35  
SEG 34  
SEG 33  
SEG 32  
SEG 31  
SEG 30  
SEG 29  
SEG 28  
SEG 27  
SEG 4  
SEG 5  
SEG 6  
SEG 7  
SEG 8  
SEG 9  
SEG 10  
SEG 11  
SEG 12  
SEG 13  
SEG 14  
SEG 15  
SEG 16  
SEG 17  
SEG 18  
SEG 19  
SEG 20  
SEG 21  
SEG 22  
SEG 23  
SEG 24  
SEG 25  
SEG 26  
64-Pin Plastic Shrink DIP  
4/27  
¡ Semiconductor  
MSC7128-xx  
PIN CONFIGURATION (TOP VIEW)  
1
2
51  
50  
COM 2  
COM 3  
COM 4  
COM 5  
COM 6  
COM 7  
COM 8  
COM 9  
COM 10  
COM 11  
COM 12  
COM 13  
COM 14  
COM 15  
COM 16  
SEG 36  
SEG 35  
SEG 34  
SEG 33  
SEG 1  
SEG 2  
3
49 SEG 3  
48 SEG 4  
47 SEG 5  
46 SEG 6  
45 SEG 7  
44 SEG 8  
43 SEG 9  
42 SEG 10  
41 SEG 11  
40 SEG 12  
39 SEG 13  
38 SEG 14  
37 SEG 15  
36 SEG 16  
35 SEG 17  
34 SEG 18  
33 SEG 19  
4
5
6
7
8
9
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
64-Pin Plastic QFP  
5/27  
¡ Semiconductor  
MSC7128-xx  
PIN DESCRIPTION  
Symbol  
VDD1  
VDD2  
VSS  
Type  
I
Connected to  
Description  
VDD1 – VSS: Internal logic supply voltage  
Power source  
V
DD2 – VEE: VF tube driving circuit supply voltage  
VEE  
DA  
Microcomputer  
Microcomputer  
Serial data input from LSB (positive logic)  
Shift clock input. Data is shifted at the leading edge of  
CP  
CS  
I
I
the CP.  
Chip select input. When the PIN is High, the serial data  
transfer is inhibited.  
Microcomputer  
OSCI  
I
RC oscillation, external RC pin. fOSC = 250kHz at  
C = 100pF and R = 47kW.  
OSCO  
O
Reset input (pull-up resistor built in). When the pin is  
Low, the internal logic is reset, and the outputs of SEG1  
to SEG36 and COM1 to COM16 are Low.  
RESET  
I
VF tube grid electrode driving outputs. This pin can be  
COM1  
O
VF tube grid electrode connected directly to the VF tube. No pull-down resistor  
is required. IOH > –30mA  
COM16  
SEG1  
VF tube 5 ¥ 7 -dot anode electrode driving outputs.  
VF tube anode electrode This pin can be connected directly to the VF tube. No  
pull-down resistor is required. IOH > –2mA  
O
SEG35  
SEG36  
VF tube cursor anode electrode driving output.  
This pin can be connected directly to the VF tube. No  
pull-down resistor is required. IOH > –10mA  
VF tube anode electrode  
O
TEST STEP  
I
I
Test mode setting input (normally open)  
Test clock input (normally open)  
TEST COUNT  
6/27  
¡ Semiconductor  
MSC7128-xx  
ABSOLUTE MAXIMUM RATINGS  
Parameter  
Power Supply Voltage (1)  
Power Supply Voltage (2)  
Input Voltage  
Symbol  
VDD–VSS  
VDD–VEE  
VIN–VSS  
PD  
Condition  
Rating  
Unit  
–0.3 to +6.5  
0 to 65  
V
V
–0.3 to VDD + 0.3  
Up to 1.0  
–55 to +150  
–40  
V
Power Dissipation  
Ta £ 25°C  
W
Storage Temperature  
TSTG  
°C  
mA  
mA  
mA  
IO1  
COM1 to COM16  
SEG1 to SEG35  
SEG36  
Output Current  
IO2  
–4  
IO3  
–15  
RECOMMENDED OPERATING CONDITIONS  
Parameter  
Power Supply Voltage (1)  
Power Supply Voltage (2)  
High Level Input Voltage  
Low Level Input Voltage  
CP Frequency  
Symbol  
VDD–VSS  
VDD–VEE  
VIH–VSS  
VIL–VSS  
fCP  
Condition  
Min.  
4.5  
Typ.  
Max. Unit  
5.5  
60  
V
V
10  
0.7VDD  
V
0.3VDD  
500  
270  
+75  
V
100pF, 47kW  
kHz  
kHz  
°C  
OSC Frequency  
fOSC  
170  
–20  
220  
Operating Temperature  
Top  
7/27  
¡ Semiconductor  
MSC7128-xx  
ELECTRICAL CHARACTERISTICS  
DC Characteristics  
(VDD–Vss = 5V 10ꢀ, VDD–VEE = 60V, Ta = –20 to +75°C)  
Parameter  
High Level Input Voltage  
Low Level Input Voltage  
Symbol  
VIH  
Condition  
Min.  
0.7VDD  
Max. Unit  
V
V
VIL  
0.3VDD  
DA, CP, CS  
VDD = 5.5V  
IN = 5V  
IIH1  
IIH2  
–5  
5
1
mA  
RESET  
V
High Level Input Current  
TEST STEP  
TEST COUNT  
VDD = 5.5V  
0.25  
mA  
VIN = 5V  
DA, CP, CS  
TEST STEP  
TEST COUNT  
IIL1  
V
V
DD = 5.5V  
IH = 0.5V  
–5  
5
mA  
mA  
Low Level Input Current  
RESET  
VDD = 5.5V  
IH = 0.5V  
IIL2  
–25  
–100  
V
VOH1  
VOH2  
VOH3  
VOH4  
VOL1  
VOL2  
VOL3  
VOL4  
VDD–0.6  
VDD–4  
VDD–3  
VDD–4  
V
V
V
V
V
V
V
V
OSCO  
IOH = –500mA  
OH = –30mA  
IOH = –2mA  
OH = –10mA  
IOL = 500mA  
OL = 100mA  
IOL = 100mA  
OL = 100mA  
COM1~16  
SEG1~35  
SEG36  
I
High Level Output Voltage  
Low Level Output Voltage  
I
VSS+0.6  
VEE+3  
VEE+3  
VEE+3  
OSCO  
COM1~16  
SEG1~35  
SEG36  
I
I
All SEGs on, 16-digit display, duty  
cycle 15/16, no load  
ISS1  
ISS2  
IEE1  
IEE2  
15  
1.5  
1.0  
15  
mA  
mA  
mA  
mA  
All SEGs Low, all COMs High  
Current Consumption  
All SEGs on, 16-digit display, duty  
cycle 15/16, no load  
All SEGs Low, all COMs High  
8/27  
¡ Semiconductor  
MSC7128-xx  
AC Characteristics  
(VDD–VSS = 5V 10ꢀ, Ta = –20 to +75°C)  
Parameter  
CP Cycle Time  
Symbol  
tCP  
Condition  
Min.  
2
Max. Unit  
ms  
ms  
ms  
ms  
ms  
s
CP Pulse Width  
Data Set-up Time  
Data Hold Time  
CS Set-up Time  
CS Hold Time  
tWCP  
tDS  
1
0.5  
0.5  
1
tDH  
tCSS  
tCSH  
fOSC  
32T*  
170  
OSC Frequency  
R = 47kW, C = 100pF  
270  
kHz  
*T = 1/f  
OSC  
TIMING DIAGRAM  
Data Timing  
0.3  
tCP  
tWCP  
tCSH  
0.3  
0.7  
0.3  
0.3  
tCSS  
0.3  
tDS tDH  
0.7  
VALID  
0.3  
VALID  
VALID  
9/27  
¡ Semiconductor  
MSC7128-xx  
Data LSB/MSB Timing  
END OF  
NEXT  
DATA WORD  
DATA WORD  
CP  
MSB  
LSB  
tDOFF  
DATA INPUT OFF TIME tDOFF = 32Tmin (T=1/fOSC  
)
Digit Timing (16-Digit Display)  
t1 = Frame count  
t2 = Display timing  
t3 = Blank timing  
When fOSC = 245kHz  
t1 = 4.096ms  
t2 = 240ms  
t3 = 16ms  
T = 1/fOSC  
10/27  
¡ Semiconductor  
MSC7128-xx  
Reset Timing  
VDD  
tRESET ON  
tRESET OFF  
RESET  
DATA VALID  
DA  
OPTION 1  
When a capacitor is connected between the RESET pin and V ,  
SS  
RESET ON TIME t  
RESET OFF TIME t  
(External capacitor  
ON : 250ms typ.  
OFF : 50ms min.  
: 1mF)  
RESET  
RESET  
OPTION 2  
When a RESET signal is externally input,  
RESET ON TIME t  
RESET OFF TIME t  
ON : 50ms min.  
OFF : 50ms min.  
RESET  
RESET  
11/27  
¡ Semiconductor  
MSC7128-xx  
FUNCTIONAL DESCRIPTION  
Data Transfer Method and Command Write Method  
A display control command or data is written by the 8-bit serial transfer method. The figure  
below shows the write timing. When the CS pin is Low, data can be transferred. Data of 8 bits  
in length is input to the DA pin sequentially starting with the LSB. (LSB first)  
Data is shifted at the rising edge of a shift clock pulse which is input to the CP pin as shown in  
the figure below. When 8-bit data is entered, an inner LOAD signal is automatically generated,  
and data is written into the registers and RAM. Therefore, there is no need to input an external  
LOAD signal.  
If the CS pin is changed from Low to High, the serial transfer is inhibited, and data, which is  
entered after the CS pin is changed from High to Low, is recognized in units of 8 bits.  
The first 8 bits become the first byte, and the second 8 bits become the second byte and the next  
8 bits become either the first byte or the second byte depending on the selected command.  
CS  
CP  
tDOFF*1  
tCSH*2  
b0 b1 b2 b3 b4 b5 b6 b7  
b0 b1 b2 b3 b4 b5 b6 b7  
Second Byte MSB  
DA  
LSB First Byte MSB LSB  
*1 t  
*2 t  
: Refer to Data LSB/MSB Timing.  
: Refer to AC Characteristics and Data Timing.  
DOFF  
CSH  
Command Type  
First Byte  
Second Byte  
No.  
Command  
b7 b6 b5 b4 b3 b2 b1 b0 b7 b6 b5 b4 b3 b2 b1 b0  
0
1
2
3
4
Address Set  
1
1
1
1
1
0
0
0
0
1
0
0
1
1
0
0
1
0
1
0
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X3 X2 X1 X0  
Character Code Set  
Display Duty Set  
CU CH6 CH5 CH4 CH3 CH2 CH1 CH0  
X
X
X
X
X
X
X
X
X
X
X
X
DC3 DC2 DC1 DC0  
DG3 DG2 DG1 DG0  
Number of Display Digits Set  
Lamp Test  
X
X
X
LT  
*1 When character codes are to be continuously transferred, addresses are automatically  
incremented (internally). Accordingly, neither the Address Set command nor the first byte  
oftheCharacterCodeSetcommandarerequiredtosetthesecondandthefollowingcharacter  
codes.  
*2 X : Don’t care  
12/27  
¡ Semiconductor  
MSC7128-xx  
Command Description  
• Address set command  
When the code of a display character is to be set, this command is used to specify the display  
location (digit number) of the character.  
The relation between the digit number X and common outputs COM1 to COM16 is as follows:  
X
0
COM Input  
COM1  
1
COM2  
15  
COM16  
Command format  
LSB  
X
1
0
0
0
X
X
X
1st byte  
2nd byte  
LSB  
X0  
X
X
X
X
X3  
X2  
X1  
Digit number ¥ (0 to 15)  
• Character code set command  
This command is used to specify the character to be displayed in the digit place specified by the  
Address Set command. Bits 0 to 6 of the second byte are used to specify the character code, and  
bit 7 is used to specify "Yes" or "No" of cursor display.  
Command format  
LSB  
1
0
0
1
X
X
X
X
1st byte  
2nd byte  
CU  
CH6  
CH5  
CH4  
CH3  
CH2  
CH1  
CH0  
7-bit character code  
Select one of 128 codes  
0: Without cursor (SEG36 OFF)  
1: With cursorout (SEG36 ON)  
13/27  
¡ Semiconductor  
MSC7128-xx  
Anautomaticaddressincrementfunctionisbuiltin. Towritemultidigitdisplaycharactercodes,  
issue the Address Set command. To transfer the second and later digit display character codes,  
the first byte (operation code) of the Character Code command is not required. Input the second  
byte.  
Whenthiscommandisexecuted, 8-bitdataforthesecondbyteandlaterbytes, whichisprovided  
before the CS pin is turned High, is all treated as display character data.  
Transfer examples of the Address Set command and the Character Set command  
CS  
1st 2nd 1st 2nd 2nd  
2nd 2nd  
DATA  
Address Set command Character Set command  
Example 1: The display for COM3 and the following is changed.  
LSB  
1
X
1
0
X
0
0
X
0
0
X
1
X
0
X
X
0
X
X
1
X
X
Specify the digit  
number X=2  
(COM3)  
LSB  
0
LSB  
X
Write the first  
character code  
LSB  
CU CH6 CH5 CH4 CH3 CH2 CH1 CH0  
CU CH6 CH5 CH4 CH3 CH2 CH1 CH0  
CU CH6 CH5 CH4 CH3 CH2 CH1 CH0  
Write the character  
code to be displayed  
ON COM4  
Write the character  
code to be displayed  
ON COM5  
X=15 (COM16) is followed by X= 0 (COM1)  
14/27  
¡ Semiconductor  
MSC7128-xx  
Number of Display Digits Set Command  
This command is used to set the digit count register and the number of display digits. The  
number of digits to be set ranges from 1 to 16.  
Command format  
LSB  
1st byte  
2nd byte  
1
0
1
1
X
X
X
X
LSB  
DG0  
X
X
X
X
DG3  
DG2  
DG1  
Number of digits DG (0 to 15)  
The relation between the value of DG to be set and COM under display control is as follows:  
DG  
0
COM Displayed  
COM1 - COM16  
COM1  
DG  
8
COM Displayed  
COM1 - COM8  
COM1 - COM9  
COM1 - COM10  
COM1 - COM11  
COM1 - COM12  
COM1 - COM13  
COM1 - COM14  
COM1 - COM15  
1
9
2
COM1 - COM2  
COM1 - COM3  
COM1 - COM4  
COM1 - COM5  
COM1 - COM6  
COM1 - COM7  
10  
11  
12  
13  
14  
15  
3
4
5
6
7
15/27  
¡ Semiconductor  
MSC7128-xx  
Display Duty Set Command  
AssumingtheoriginaloscillationcycleasT,thetimeallocatedto1-digitdisplayis64T. Theactual  
display time may be specified as 0 to 60T in increments of 4T. Assuming the number of display  
digits as n and the parameter provided by the Display Duty Set command as DC, the resultant  
display duty cycle ratio is as follows:  
(DC)  
16n  
4 (DC)  
64n  
=
Command format  
LSB  
X
1
0
1
0
X
X
X
1st byte  
2nd byte  
LSB  
DG0  
X
X
X
X
DG3  
DG2  
DG1  
DC value (0 to 15)  
Lamp Test Command  
This command is used to set the All-Segment Display mode. If this occurs, the 36 segments for  
each digit to be displayed are put into the ON state. The number of display digits and the display  
duty cycle depend on the contents of the digit count register and of the duty register.  
The contents of the internal RAM are not affected by this command. When the command is  
released, the original display appears once again.  
Command format  
LSB  
1st byte  
2nd byte  
1
1
0
0
X
X
X
X
X
X
X
LSB  
LT  
X
X
X
X
0: Normal mode  
1: Lamp test mode  
16/27  
¡ Semiconductor  
MSC7128-xx  
Power On Reset Operation  
Operations when the RESET pin is Low are as follows:  
a. All segment driver outputs are Low.  
b. All grid driver outputs are Low.  
c. The number of display digits is set to 16.  
d. The display duty cycle is set to 0.  
Test Step and Test Count  
These pins are used for inspection before shipment, and should not be used by the user.  
When this IC is mounted, leave them open or connect to V . If they are connected to other pins,  
SS  
a malfunction may be caused.  
17/27  
¡ Semiconductor  
MSC7128-xx  
Relation Between Segment Output and VF Tube Dots  
1-1  
2-1  
3-1  
4-1  
5-1  
SEG1  
SEG2  
SEG3  
SEG4  
SEG5  
1-2  
2-2  
3-2  
4-2  
5-2  
SEG6  
SEG7  
SEG8  
SEG9  
SEG10  
1-3  
2-3  
3-3  
4-3  
5-3  
SEG11  
SEG12  
SEG13  
SEG14  
SEG15  
1-4  
2-4  
3-4  
4-4  
5-4  
SEG16  
SEG17  
SEG18  
SEG19  
SEG20  
1-5  
2-5  
3-5  
4-5  
5-5  
SEG21  
SEG22  
SEG23  
SEG24  
SEG25  
1-6  
2-6  
3-6  
4-6  
5-6  
SEG26  
SEG27  
SEG28  
SEG29  
SEG30  
1-7  
2-7  
3-7  
4-7  
5-7  
SEG31  
SEG32  
SEG33  
SEG34  
SEG35  
Cursor  
SEG36  
18/27  
¡ Semiconductor  
MSC7128-xx  
Data Setup Flow  
Power on  
Address set  
Character set  
Display digit set  
Display duty set  
CS  
1st 2nd 1st 2nd 2nd 2nd 2nd  
1st 2nd 1st 2nd  
DA  
CP  
address set  
Number of Display  
character set  
display  
duty set  
digits set  
1st :  
the first byte  
2nd : the second byte  
Note: To avoid display malfunction due to external noise, re-set occasionally the number of  
display digits set and display duty set.  
19/27  
¡ Semiconductor  
MSC7128-xx  
MSC7128-01 ROM CODE  
ADDRESS 0(00H)  
ADDRESS 5(05H)  
ADDRESS 10(0AH)  
ADDRESS 15(0FH)  
ADDRESS 20(14H)  
ADDRESS 25(19H)  
ADDRESS 1(01H)  
ADDRESS 2(02H)  
ADDRESS 7(07H)  
ADDRESS 12(0CH)  
ADDRESS 17(11H)  
ADDRESS 22(16H)  
ADDRESS 27(1BH)  
ADDRESS 3(03H)  
ADDRESS 8(08H)  
ADDRESS 13(0DH)  
ADDRESS 18(12H)  
ADDRESS 23(17H)  
ADDRESS 28(1CH)  
ADDRESS 4(04H)  
ADDRESS 6(06H)  
ADDRESS 11(0BH)  
ADDRESS 16(10H)  
ADDRESS 21(15H)  
ADDRESS 26(1AH)  
ADDRESS 9(09H)  
ADDRESS 14(0EH)  
ADDRESS 19(13H)  
ADDRESS 24(18H)  
ADDRESS 29(1DH)  
20/27  
¡ Semiconductor  
MSC7128-xx  
ADDRESS 30(1EH)  
ADDRESS 35(23H)  
ADDRESS 40(28H)  
ADDRESS 45(2DH)  
ADDRESS 50(32H)  
ADDRESS 31(EFH)  
ADDRESS 32(20H)  
ADDRESS 37(25H)  
ADDRESS 42(2AH)  
ADDRESS 47(2FH)  
ADDRESS 52(34H)  
ADDRESS 33(21H)  
ADDRESS 38(26H)  
ADDRESS 43(2BH)  
ADDRESS 48(30H)  
ADDRESS 53(35H)  
ADDRESS 34(22H)  
ADDRESS 36(24H)  
ADDRESS 41(29H)  
ADDRESS 46(2EH)  
ADDRESS 51(33H)  
ADDRESS 39(27H)  
ADDRESS 44(2CH)  
ADDRESS 49(31H)  
ADDRESS 54(36H)  
21/27  
¡ Semiconductor  
MSC7128-xx  
ADDRESS 55(37H)  
ADDRESS 60(3CH)  
ADDRESS 65(41H)  
ADDRESS 70(46H)  
ADDRESS 75(4BH)  
ADDRESS 56(38H)  
ADDRESS 57(39H)  
ADDRESS 62(3EH)  
ADDRESS 67(43H)  
ADDRESS 72(48H)  
ADDRESS 77(4DH)  
ADDRESS 58(3AH)  
ADDRESS 63(3FH)  
ADDRESS 68(44H)  
ADDRESS 73(49H)  
ADDRESS 78(4EH)  
ADDRESS 59(3BH)  
ADDRESS 61(3DH)  
ADDRESS 66(42H)  
ADDRESS 71(47H)  
ADDRESS 76(4CH)  
ADDRESS 64(40H)  
ADDRESS 69(45H)  
ADDRESS 74(4AH)  
ADDRESS 79(4FH)  
22/27  
¡ Semiconductor  
MSC7128-xx  
ADDRESS 80(50H)  
ADDRESS 85(55H)  
ADDRESS 90(5AH)  
ADDRESS 95(5FH)  
ADDRESS 81(51H)  
ADDRESS 82(52H)  
ADDRESS 87(57H)  
ADDRESS 92(5CH)  
ADDRESS 97(61H)  
ADDRESS 83(53H)  
ADDRESS 88(58H)  
ADDRESS 93(5DH)  
ADDRESS 98(62H)  
ADDRESS 84(54H)  
ADDRESS 86(56H)  
ADDRESS 91(5BH)  
ADDRESS 96(60H)  
ADDRESS 89(59H)  
ADDRESS 94(5EH)  
ADDRESS 99(63H)  
ADDRESS 100(64H) ADDRESS 101(65H) ADDRESS 102(66H) ADDRESS 103(67H) ADDRESS 104(68H)  
23/27  
¡ Semiconductor  
MSC7128-xx  
ADDRESS 105(69H) ADDRESS 106(6AH) ADDRESS 107(6BH) ADDRESS 108(6CH) ADDRESS 109(6DH)  
ADDRESS 110(6EH) ADDRESS 111(6FH) ADDRESS 112(70H) ADDRESS 113(71H) ADDRESS 114(72H)  
ADDRESS 115(73H) ADDRESS 116(74H) ADDRESS 117(75H) ADDRESS 118(76H) ADDRESS 119(77H)  
ADDRESS 120(78H) ADDRESS 121(79H) ADDRESS 122(7AH) ADDRESS 123(7BH) ADDRESS 124(7CH)  
ADDRESS 125(7DH) ADDRESS 126(7EH) ADDRESS 127(7FH)  
24/27  
¡ Semiconductor  
MSC7128-xx  
APPLICATION CIRCUIT  
Heater Transformer  
VF Display  
GRID (DIGIT)  
VDD  
VDD  
DA  
SEG1 - 36  
COM1 - 16  
MCU  
CP  
CS  
MSC7128-xx  
+5V  
TEST TEST  
+
GND  
VSS  
RESET OSCI OSCO VEE  
STEP COUNT  
R
+
C
R1  
+60V  
+
ZD  
25/27  
¡ Semiconductor  
PACKAGE DIMENSIONS  
SDIP64-P-750-1.78  
MSC7128-xx  
(Unit : mm)  
Package material  
Lead frame material  
Pin treatment  
Solder plate thickness  
Package weight (g)  
Epoxy resin  
Cu alloy  
Solder plating  
5 mm or more  
8.70 TYP.  
Notes for Mounting the Surface Mount Type Package  
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which  
are very susceptible to heat in reflow mounting and humidity absorbed in storage.  
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the  
product name, package name, pin number, package code and desired mounting conditions  
(reflow method, temperature and times).  
26/27  
¡ Semiconductor  
MSC7128-xx  
(Unit : mm)  
QFP64-P-1420-1.00-BK  
Mirror finish  
Package material  
Lead frame material  
Pin treatment  
Solder plate thickness  
Package weight (g)  
Epoxy resin  
42 alloy  
Solder plating  
5 mm or more  
1.25 TYP.  
Notes for Mounting the Surface Mount Type Package  
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which  
are very susceptible to heat in reflow mounting and humidity absorbed in storage.  
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the  
product name, package name, pin number, package code and desired mounting conditions  
(reflow method, temperature and times).  
27/27  

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