MSM6404VS [OKI]
High speed and High performance 4-Bit Microcontroller; 高速，高性能的4位微控制器
| 型号： | MSM6404VS |
| 厂家： | 
OKI ELECTRONIC COMPONETS |
| 描述： | High speed and High performance 4-Bit Microcontroller |
| 文件： | 总25页 (文件大小：200K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
E2E0013-38-93
This version: Sep. 1998
Previous version: Mar. 1996
¡ Semiconductor
MSM6404A/6404VS
High speed and High performance 4-Bit Microcontroller
GENERAL DESCRIPTION
The MSM6404A microcontroller is a low-power device implemented in complementary metal-
oxide semiconductor technology. The MSM6404A is optimized for high-speed processing and
complicated-control applications.
The MSM6404VS is a CMOS 4-bit microcontroller that employs an external EPROM using a
piggy-back package in place of the program memory (ROM) internal to the MSM6404A.
The MSM6404VS can be used for program development verification because the programs can
be modified by programming an external EPROM 2732 equivalent or 2764A equivalent.
FEATURES
• Mask ROM (MSM6404A)
External ROM (MSM6404VS)
• RAM (including the stack area)
• I/O port
: 4000 words ¥ 8 bits
: 8196 words ¥ 8 bits
: 256 words ¥ 4 bits
Input-output port
Input port
: 8 ports ¥ 4 bits
: 1 port ¥ 4 bits
4 bits are for input ports having a latch; the other 32 bits are input/output ports that allow
bit manipulation
• Three built-in counters
: 12-bit time-base counter
12-bit programmable timer
8-bit high-speed programmable timer/event
counter
• Built-in 8-bit serial I/O register (with 3-bit counter)
• Five interrupts with five priority levels (4 internal, 1 external)
• 32 stacks (in RAM)
• Power-down features
• Minimum instruction execution time
• Instruction systems suitable for control
• Fully static operation
: 952 ns @ 4.2 MHz clock
• Low power consumption
• Single 5 V supply
• Package options:
MSM6404A
42-pin plastic DIP (DIP42-P-600-2.54)
: (Product name : MSM6404A-¥¥¥RS)
44-pin plastic QFP (QFP44-P-910-0.80-K) : (Product name : MSM6404A-¥¥¥GS-K)
44-pin plastic QFP (QFP44-P-910-0.80-2K) : (Product name : MSM6404A-¥¥¥GS-2K)
MSM6404VS
42-pin ceramic piggyback (ADIP42-C-600-2.54) : (Product name : MSM6404VS)
¥¥¥ indicates a code number.
1/25
RAM
ROM
16 ¥ 16 ¥ 4 bits
INSTR
DEC
4000 ¥ 8 bits
ACC
ALU
DEC
H
DEC
C
SP
L
F
PC
11
0
PC INTE
PD IRQ
Interrupt
Control
PB
12-bit Timer
P9 8-bit T/C
PA 8-bit SR
OSC0
OSC1
TEST
RESET
Timing
&
Control
12-bit TBC
VDD
P8
P7
P6
P5
P4
P3
P2
P1
P0
GND
3 2 1 0 3 2 1 0 3 2 1 0
3 2 1 0
3 2 1 0
3 2 1 0
3 2 1 0
3 2 1 0 3 2 1 0
INT
CIN
SCK, CTO, CLK
SO
SI
TMO
TCK
RAM
I0 to I7
RV
DV
16 ¥ 16 ¥ 4 bits
INSTR
DEC
ACC
ALU
DEC
H
A0 to A12
C
SP
L
F
PC
12
0
PC INTE
PD IRQ
Interrupt
Control
PB
12-bit Timer
P9 8-bit T/C
PA 8-bit SR
OSC0
OSC1
TEST
Timing
&
Control
12-bit TBC
RESET
VDD
P8
P7
P6
P5
P4
P3
P2
P1
P0
GND
3 2 1 0 3 2 1 0 3 2 1 0
3 2 1 0
3 2 1 0
3 2 1 0
3 2 1 0
3 2 1 0 3 2 1 0
INT
CIN
SCK, CTO, CLK
SO
SI
TMO
TCK
¡ Semiconductor
MSM6404A/6404VS
PIN CONFIGURATION (TOP VIEW)
P4.0
P4.1
P4.2
P4.3
P3.0
P3.1
P3.2
P3.3
OSC0
OSC1
RESET 11
TEST 12
P2.0 13
P2.1 14
P2.2 15
P2.3 16
P0.0 17
P0.1 18
P0.2 19
P0.3 20
GND 21
1
2
42 VDD
41 P5.3
40 P5.2
39 P5.1
38 P5.0
3
4
5
6
37 P6.3
36 P6.2
35 P6.1
34 P6.0
33 P7.3
32 P7.2
31 P7.1
30 P7.0
29 P8.3
28 P8.2
27 P8.1
26 P8.0
25 P1.3
24 P1.2
23 P1.1
22 P1.0
7
8
9
10
42-Pin Plastic DIP
4/25
¡ Semiconductor
MSM6404A/6404VS
PIN CONFIGURATION (TOP VIEW) (continued)
P3.1
P3.2
P6.2
P6.1
P6.0
NC
1
2
33
32
31
30
29
28
27
26
25
24
23
P3.3
3
OSC0
OSC1
RESET
TEST
P2.0
4
P7.3
P7.2
P7.1
P7.0
P8.3
P8.2
P8.1
5
6
7
8
P2.1
9
P2.2
10
11
P2.3
NC: No-connection pin
44-Pin Plastic QFP
5/25
¡ Semiconductor
MSM6404A/6404VS
PIN CONFIGURATION (TOP VIEW) (continued)
1
2
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
24
23
22
P4.0
P4.1
VDD
VDD
PGM/VDD
VDD
@
@
@
qVPP/VDD
wA12
eA7
rA6
tA5
yA4
uA3
iA2
oA1
!A0
!I0
P5.3
P5.2
P5.1
3
P4.2
4
P4.3
A8@
A9@
5
P3.0
P5.0
P6.3
P6.2
6
P3.1
A11@
OE/GND@
A10@
CE/GND@
I7!
7
P3.2
8
P3.3
P6.1
9
OSC0
OSC1
RESET
TEST
P6.0
10
11
12
13
14
15
16
17
18
19
20
21
P7.3
P7.2
I6!
P7.1
I5!
!I1
P2.0/INT
P2.1
P7.0
I4!
!I2
P8.3
I3!
!GND
P2.2
P8.2
P2.3
P8.1
P0.0
P8.0
P0.1/SCK
P0.2/SO
P0.3/SI
GND
P1.3
P1.2/TCK
P1.1/TMO
P1.0/CIN
42-Pin Ceramic Piggyback
6/25
¡ Semiconductor
MSM6404A/6404VS
PIN DESCRIPTIONS
Symbol
P0.0
Type
Description
During reset
P0.1/SCK
P0.2/SO
P0.3/SI
P0.1 is shared with serial clock (SCK) input/output.
P0.2 is shared with serial data (SO) output.
P0.3 is shared with serial data (SI) input.
P1.0 is shared with counter input (CIN).
P1.1 is shared with timer output (TMO).
P1.2 is shared with timer clock input (TCK).
I/O
"1"
P1.0/CIN
P1.1/TMO
P1.2/TCK
P1.3
I/O
I
"1"
P2.0/INT
P2.1
P2.0 is shared with external interrupt input (INT).
The latch is
reset.
P2.2
Input port with a latch, built-in pull-up resistor
P2.3
P3.0 to 3.3
P4.0 to 4.3
P5.0 to 5.3
P6.0 to 6.3
P7.0 to 7.3
P8.0 to 8.3
OSC0
I/O
I/O
I/O
I/O
I/O
I/O
I
—
"1"
"0"
8-bit output ports (at OPT instruction execution)
—
—
—
"0"
"0"
"0"
Oscillation
waveform
Crystal connection pins for clock oscillation
(Test pin for manufacturer)
OSC1
O
TEST
O
I
Pulse output
RESET
Input pin for system reset
—
—
VDD
—
Power supply voltage pins
GND
Note: 1. The ports except for pins P2.0 to P2.3 are pseudo bidirectional ports.
2. When each port is used for output, the MSM6404A can drive one TTL (one input) and
the MSM6404VS can drive one LS TTL (one input).
Upper Pins for MSM6404VS
Symbol
A0 to A12
I0 to I7
CE/GND
OE/GND
PGM/VDD
VDD
Type
Description
O
I
Address output
Data input
I
Chip enable input
Output enable input
Program input
I
I
—
—
Power supply voltage pins
GND
VPP/VDD
Programed power supply voltage pin
7/25
¡ Semiconductor
MSM6404A/6404VS
ABSOLUTE MAXIMUM RATINGS (MSM6404A)
Parameter
Power Supply Voltage
Input Voltage
Symbol
VDD
Condition
Rating
Unit
V
–0.3 to +7
–0.3 to VDD
–0.3 to VDD
200 max.
VI
Ta = 25°C
V
Output Voltage
VO
V
Ta = 25°C per package
Ta = 25°C per output
—
mW
mW
°C
Power Dissipation
PD
50 max.
Storage Temperature
TSTG
–55 to +150
RECOMMENDED OPERATING CONDITIONS (MSM6404A)
Parameter
Symbol
Condition
fOSC £ 1 MHz
fOSC £ 4.2 MHz
fOSC = 0 Hz
—
Range
3 to 6
Unit
V
Power Supply Voltage
VDD
4.5 to 5.5
2 to 6
V
Data-Hold Voltage
VDDH
Top
V
Operating Temperature
–40 to +85
15
°C
MOS load
TTL load
Fan Out
N
—
1
Note: Refer to the f
-V
OSC DD
characteristic in OPERATING CHARACTERISTICS for the
relation-ship between power supply voltage and operating frequency.
8/25
¡ Semiconductor
MSM6404A/6404VS
ELECTRICAL CHARACTERISTICS (MSM6404A)
DC Characteristics
(VDD = 5 V 10ꢀ, Ta = –40 to +85°C)
Parameter
"H" Input Voltage*1, *2
"H" Input Voltage*3, *4
"L" Input Voltage
Symbol
VIH
Condition
—
Min.
2.4
3.6
–0.3
4.2
—
Typ.
—
—
—
—
—
—
—
—
—
—
5
Max.
VDD
VDD
+0.8
—
Unit
V
VIH
—
V
VIL
—
V
"H" Output Voltage*1, *5
"L" Output Voltage*1
"L" Output Voltage*5
Input Current*3
VOH
VOL
VOL
IIH/IIL
IIH/IIL
IOH
IO = –15 mA
IO = 1.6 mA
IO = 15 mA
VI = VDD/0 V
VI = VDD/0 V
VO = 2.4 V
VO = 0.4 V
V
0.4
V
—
0.4
V
—
15/–15
1/–30
—
mA
mA
mA
mA
Input Current*2, *4
"H" Output Current*1
"H" Output Current*1
Input Capacitance
—
–0.1
—
IOH
–1.2
—
CI
—
f = 1 MHz, Ta = 25°C
pF
Output Capacitance
Power Supply Current
(In Stop Mode)
CO
—
7
—
VDD = 2 V, no load, Ta = 25°C
No load
—
0.2
1
5
mA
mA
IDDS
IDD
—
100
Crystal oscillation
Power Supply Current
—
6
12
mA
f = 4.194304 MHz, no load
*1 Applied to P0, P1, P3, P4, P5, P6, P7 and P8.
*2 Applied to P2.
*3 Applied to OSC .
0
*4 Applied to RESET.
*5 Applied to OSC .
1
9/25
¡ Semiconductor
MSM6404A/6404VS
AC Characteristics (MSM6404A)
(VDD = 5 V 10ꢀ, Ta = –40 to +85°C)
Parameter
Clock (OSC0) Pulse Width
Cycle Time
Symbol
tfW
Condition
Min.
119
Typ.
—
Max.
—
Unit
ns
—
—
—
—
—
tCY
952
—
—
ns
Input Data Setup Time
Input Data Hold Time
SR/TM Clock Pulse Width
tDS
120
—
—
ns
tDH
120
—
—
ns
tWS/tWT
120
—
—
ns
2/8 tCY
+ 120
120
CT Clock Pulse Width
tWC
—
—
—
ns
P2 Input Data Clock Pulse Width
SR Data Setup Time
SR Data Hold Time
Data Delay Time
tWP
tSS
tSH
tDR
—
—
—
—
—
—
—
—
ns
ns
ns
ns
120
—
120
—
CL = 15 pF
—
tCY + 300
7/8 tCY
+ 300
6/8 tCY
+ 300
7/8 tCY
+ 300
2/8 tCY
+ 360
Data Delay Time at Mode
Switching
tDCR
tDI1
CL = 15 pF
CL = 15 pF
CL = 15 pF
CL = 15 pF
CL = 15 pF
CL = 15 pF
CL = 15 pF
CL = 15 pF
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
ns
ns
Data Delay Time at OPT
Instruction
Data Delay Time at OPT
Instruction
tDI2
CT/TM Data Delay Time Using
TBC Clock
tCT/tTT
tSR/tTR
tCR
SR/TM Data Delay Time Using
PORT Clock
tCY + 480
CT Data Delay Time Using
PORT Clock
10/8 tCY
+ 480
CT Data Delay Time Using
External Clock
2/8 tCY
+ 360
tCP
SR/TM Data Delay Time Using
External Clock
tSP/tTP
360
SR Clock Invalid Time
INT Invalid Time
tSINH
tIINH
—
—
2/8 tCY
1/8 tCY
—
—
—
—
ns
ns
10/25
¡ Semiconductor
MSM6404A/6404VS
Timing Diagrams (MSM6404A)
Output Conditions
1MC
tCY
OSC0
P0, P1, P3
P4, P5, P6
P7, P8
0, 1, 3
4, 5, 6
7 or 8
PA =
tDR
P0.1
P0.2
P0.3
PA = 9 or A
OPT INST.
OPT INST.
TBC clock
tDCR
P4
P5
tDI1
tDI2
P0.1
P1.1
CT
TM
tCT
tTT
P0.2 P0.1 clock* SR
P1.1 P1.2 clock* TM
tSR
tTR
P0.1 P1.0 clock* CT
tCR
P0.1
EXT clock
P1.0 P1.2 EXT clock
P0.1 CT
tCP
P0.2 SR
P1.1 TM
tSP
tTP
*
Output data to port is clock for SR, TM or CT.
11/25
¡ Semiconductor
MSM6404A/6404VS
Input Conditions
1MC
OSC0
tf
tf
W
W
P0, P1, P2
P3, P4, P5
P6, P7, P8
INPUT
DATA
tDS tDH
P0.1 SR clock
P1.2 TM clock
P2
tWS
tWT
tWP
P1.0 CT clock
tWC
P0.1 SR clock
P0.3 SI
INPUT
DATA
tSS tSH
1MC
OSC0
tIINH
tSINH
t
t
:
:
P0.1 (SR clock) INH period during LMSR INST.
(Note : P0.1 is used for clock of SR.)
P2.0 (interrupt) INH period during RPB and RPBD INST.
SINH
IINH
12/25
¡ Semiconductor
MSM6404A/6404VS
Operating Characteristics (MSM6404A)
Current(I )vsVoltage(V )forHighState
Output
Current (I ) vs Voltage (V ) for Low State
OL OL
Output
OH
OH
Ta = 25°C
Ta = 25°C
VDD = 5 V
–1.0
20
18
16
14
12
10
8
6 V
–0.9
–0.8
–0.7
–0.6
–0.5
–0.4
–0.3
–0.2
–0.1
0
VDD = 6 V
4 V
5 V
3 V
6
4 V
3 V
4
2
0
1
2
3
4
5
6
7
8
9
10
1
2
3
4
5
6
7
8
9 10
VOH (V)
VOL (V)
Maximum Clock Frequency (f
) vs Supply
OSC
Supply Current (I ) vs Supply Voltage
DD
Voltage (V
)
(V
)
DD
DD
Ta = 25°C, no load
fOSC = 4 MHz
2 MHz
Ta = 25°C, CL =1 5 pF
10 m
10
9
8
7
6
5
4
3
2
1
0
1 MHz
1 m
500 kHz
100 m
10 m
1 m
100 kHz
1
2
3
4
5
6
7
8
9 10
VDD (V)
0 Hz
Maximum Clock Frequency (f
Temperature (Ta)
) vs
OSC
CL = 15 pF
10
9
8
7
6
5
4
3
2
1
0
100 n
0
1
2
3
4
5
6
7
8
9 10
VDD (V)
VDD = 5 V
–40 –20 0 20 40 60 80 100120
Ta (°C)
13/25
¡ Semiconductor
MSM6404A/6404VS
ABSOLUTE MAXIMUM RATINGS (MSM6404VS)
Parameter
Power Supply Voltage
Input Voltage
Symbol
VDD
Condition
Rating
Unit
V
–0.3 to +7
–0.3 to VDD
–0.3 to VDD
200 max.
VI
Ta = 25°C
V
Output Voltage
VO
V
Ta = 25°C per package
Ta = 25°C per output
—
mW
mW
°C
Power Dissipation
PD
50 max.
Storage Temperature
TSTG
–55 to +150
RECOMMENDED OPERATING CONDITIONS (MSM6404VS)
Parameter
Symbol
Condition
fOSC £ 1 MHz
fOSC £ 4.2 MHz
fOSC = 0 Hz
—
Range
3 to 6
Unit
V
Power Supply Voltage
VDD
4.75 to 5.25
2 to 6
V
Data-Hold Voltage
VDDH
Top
V
Operating Temperature
0 to +40
15
°C
MOS load
Fan Out
N
—
LSTTL load
1
14/25
¡ Semiconductor
MSM6404A/6404VS
ELECTRICAL CHARACTERISTICS (MSM6404VS)
DC Characteristics
(VDD = 5 V 5ꢀ, Ta = 0 to +40°C)
Parameter
"H" Input Voltage*1, *2
"H" Input Voltage*3, *4
"L" Input Voltage
Symbol
VIH
Condition
—
Min.
3.6
3.6
–0.3
4.2
—
Typ.
—
—
—
—
—
—
—
—
—
—
5
Max.
VDD
VDD
+0.8
—
Unit
V
VIH
—
V
VIL
—
V
"H" Output Voltage*1, *5
"L" Output Voltage*1
"L" Output Voltage*5
Input Current*3
VOH
VOL
VOL
IIH/IIL
IIH/IIL
IOH
IO = –15 mA
IO = 0.4 mA
IO = 15 mA
VI = VDD/0 V
VI = VDD/0 V
VO = 2.4 V
VO = 0.4 V
V
0.4
V
—
0.4
V
—
15/–15
1/–30
—
mA
mA
mA
mA
Input Current*2, *4
"H" Output Current*1
"H" Output Current*1
Input Capacitance
—
–0.1
—
IOH
–1.2
—
CI
—
f = 1 MHz, Ta = 25°C
pF
Output Capacitance
Power Supply Current*6
(In Stop Mode)
CO
—
7
—
VDD = 2 V, no load, Ta = 25°C
No load
—
1
5
mA
mA
IDDS
IDD
—
10
100
Crystal oscillation
f = 4.2 MHz, no load
Power Supply Current*6
—
6
12
mA
*1 Applied to P0, P1, P3, P4, P5, P6, P7 and P8.
*2 Applied to P2.
*3 Applied to OSC .
0
*4 Applied to RESET.
*5 Applied to OSC .
1
*6 The EPROM current is not included.
15/25
¡ Semiconductor
MSM6404A/6404VS
AC Characteristics (MSM6404VS)
(VDD = 5 V 5ꢀ, Ta = 0 to +40°C)
Parameter
Clock (OSC0) Pulse Width
Cycle Time
Symbol
tfW
Condition
Min.
119
Typ.
—
Max.
—
Unit
ns
—
—
—
—
—
tCY
952
—
—
ns
Input Data Setup Time
Input Data Hold Time
SR/TM Clock Pulse Width
tDS
120
—
—
ns
tDH
120
—
—
ns
tWS/tWT
120
—
—
ns
2/8 tCY
+ 120
120
CT Clock Pulse Width
tWC
—
—
—
ns
P2 Input Data Clock Pulse Width
SR Data Setup Time
SR Data Hold Time
Data Delay Time
tWP
tSS
tSH
tDR
—
—
—
—
—
—
—
—
ns
ns
ns
ns
120
—
120
—
CL = 15 pF
—
tCY + 300
7/8 tCY
+ 300
6/8 tCY
+ 300
7/8 tCY
+ 300
2/8 tCY
+ 360
Data Delay Time at Mode
Switching
tDCR
tDI1
tDI2
CL = 15 pF
CL = 15 pF
CL = 15 pF
CL = 15 pF
CL = 15 pF
CL = 15 pF
CL = 15 pF
CL = 15 pF
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
ns
ns
ns
ns
ns
ns
ns
ns
Data Delay Time at OPT
Instruction
Data Delay Time at OPT
Instruction
CT/TM Data Delay Time Using
TBC Clock
t
CT/tTT
SR/tTR
tCR
SR/TM Data Delay Time Using
PORT Clock
t
tCY + 480
CT Data Delay Time Using
PORT Clock
10/8 tCY
+ 480
CT Data Delay Time Using
External Clock
2/8 tCY
+ 360
tCP
SR/TM Data Delay Time Using
External Clock
t
SP/tTP
360
SR Clock Invalid Time
INT Invalid Time
tSINH
tIINH
—
—
2/8 tCY
1/8 tCY
—
—
—
—
ns
ns
16/25
¡ Semiconductor
MSM6404A/6404VS
Timing Diagrams (MSM6404VS)
Output Conditions
1MC
tCY
OSC0
P0, P1, P3
P4, P5, P6
P7, P8
tDR
P0.1
P0.2
P1.1
tDCR
P4
P5
OPT INST.
OPT INST.
TBC clock
tDI1
tDI2
P0.1/CTO
P1.1/TMO
tCT
tTT
P0.2/SO
P1.1/TMO
P0.1 clock
P1.2 clock
tSR
tTR
P0.1/CTO P1.0 clock
tCR
P0.1
EXT clock
P1.0, P1.2 EXT clock
P0.1/CTO
tCP
P0.2/SO
P1.1/TMO
tSP
tTP
1MC
OSC0
tIINH
tSINH
t
t
:
:
P0.1/SCK inhibit period during LMSR INST.
P2.0/INT inhibit period during RPB and RPBD INST.
SINH
IINH
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¡ Semiconductor
MSM6404A/6404VS
Input Conditions
1MC
OSC0
tf
W
tf
W
P0, P1, P2
P3, P4, P5
P6, P7, P8
INPUT
DATA
tDS tDH
P0.1 SR clock
P1.2 TM clock
P2
tWS
tWT
tWP
P1.0 CT clock
tWC
P0.1/SCK
INPUT
DATA
P0.3/SI
tSS tSH
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¡ Semiconductor
MSM6404A/6404VS
Operating Characteristics (MSM6404VS)
Current(I )vsVoltage(V )forHighState
Output
Current (I ) vs Voltage (V ) for Low State
OL
Output
OH
OH
OL
Ta = 25°C, excluding pins A0-A12
Ta = 25°C
–1.0
20
18
16
14
12
10
8
–0.9
–0.8
–0.7
–0.6
–0.5
–0.4
–0.3
–0.2
–0.1
0
VDD = 6 V
5 V
VDD = 6 V
6
4 V
3 V
5 V
4
4 V
2
3 V
0
1
2
3
4
5
6
7
8
9
10
1
2
3
4
5
6
7
8
9 10
VOH (V)
VOL (V)
Maximum Clock Frequency (f
) vs Supply
Supply Current (I ) vs Supply Voltage
DD
OSC
Voltage (V
)
(V
)
DD
DD
Ta = 25°C, no load,
excluding EPROM current
Ta = 25°C, CL = 15 pF
10 m
5 m
10
9
8
7
6
5
4
3
2
1
0
fOSC = 4 MHz
2 MHz
1 MHz
500 kHz
100 kHz
1 m
500 m
100 m
50 m
0 Hz
10 m
5 m
1
2
3
4
5
6
7
8
9 10
VDD (V)
1 m
Maximum Clock Frequency (f
Temperature (Ta)
) vs
OSC
500 n
VDD = 5 V, CL = 15 pF
10
9
8
7
6
5
4
3
2
1
0
100 n
0
1
2
3
4
5
6
7
8
9 10
VDD (V)
–40 –20 0 20 40 60 80 100120
Ta (°C)
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¡ Semiconductor
MSM6404A/6404VS
FUNCTIONAL DESCRIPTION
MSM6404VS Interface to EPROM
EPROM insertion method
2732
2764A
2732 EPROM
2764A EPROM
EPROM read timing
1MC
T1
T2
T3
T4
T1
OSC0
tfW tfW
Address
A0 to A12
CE, OE
Read Data
I0 to 7
I
tACC
Use EPROM with t
of less than 357 ns.
ACC
Read data is read into the instruction register in the first half of the T1 state.
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¡ Semiconductor
MSM6404A/6404VS
Differences between MSM6404A and MSM6404VS (PIGGYBACK)
Item
MSM6404A
MSM6404VS (Piggyback)
1. Port
Ports P0, 1, 3 are set to "1" and ports P2, 4, Ports P0, 1, 3 are set to "1" and ports P2, 4,
5, 6, 7, 8 are reset to "0" directly by the reset 5, 6, 7, 8 are initialized during reset cycle.
input signal.
initialization
during reset
2. Timer
After being reset, the timer continues to stop It is undefined whether the timer starts or
operation
until data is set in it.
not after being reset. Therefore, the timer
should be initialized by software.
3. Shift register
Serial out F/F (SOF/F) is set to "0" after being It is undefined whether serial out F/F
reset.
(SOF/F) is "0" or "1" after being reset.
Therefore the serial out F/F should be
initialized by software.
4. Port
Internal clock
Internal clock
input/output
timing
Data are input
at this time.
Data are input
Input
Input
at this time.
Synchronized
with falling edge
Internal clock
Internal clock
Output
Output
Data are output
at this time.
Data are output
at this time.
5. Port
TTL FO = "1"
LSTTL FO = "1"
input/output
characteristics
(IOL = 1.6 mA @ 0.4 V)
(IOL = 0.4 mA @ 0.4 V)
VDD VDD
VDD
P2.0-3
P2.0-3
TTL compatible input
(Except P2.0-3)
CMOS input
P0.0-P8.3
P0.0-P8.3
(Except P2.0-3)
6. Available ROM
capacity
Up to 4 Kbytes
Not available
Up to 8 Kbytes accessible
7. LJP a13, LCAL a13
instruction
Available
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¡ Semiconductor
PACKAGE DIMENSIONS
DIP42-P-600-2.54
MSM6404A/6404VS
(Unit : mm)
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
6.20 TYP.
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¡ Semiconductor
MSM6404A/6404VS
(Unit : mm)
QFP44-P-910-0.80-K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.35 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
23/25
¡ Semiconductor
MSM6404A/6404VS
(Unit : mm)
QFP44-P-910-0.80-2K
Mirror finish
Package material
Lead frame material
Pin treatment
Solder plate thickness
Package weight (g)
Epoxy resin
42 alloy
Solder plating
5 mm or more
0.41 TYP.
Notes for Mounting the Surface Mount Type Package
The SOP, QFP, TSOP, SOJ, QFJ (PLCC), SHP and BGA are surface mount type packages, which
are very susceptible to heat in reflow mounting and humidity absorbed in storage.
Therefore, before you perform reflow mounting, contact Oki’s responsible sales person for the
product name, package name, pin number, package code and desired mounting conditions
(reflow method, temperature and times).
24/25
¡ Semiconductor
MSM6404A/6404VS
(Unit : mm)
42-PIN CERAMIC PIGGYBACK
ADIP42-C-600-2.54
25/25
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